Issue

Various flip chip systems have been used for advanced packages, including chip scale packages (CSPs) and ball grid arrays (BGAs).

Ceramics’ unique properties such as low loss factor, high thermal stability, and hermeticity have secured their role for applications in RF, high-temperature, and high-reliability devices for decades.

It’s official - the nanos are coming. While not yet battering our packaging gates, they are within sight of our walls, and advancing rapidly.

When considering cleaning lead-free residues, what needs to be asked first: must I, should I, can I, can I afford to, or can I afford not to?

There’s a lot of talk in the electronics industry about the blurred lines between advanced packaging (AP) and surface mount technology (SMT), and nowhere was that more apparent than on the trade show floor at the IPC Printed Circuits Expo, APEX, and the Designers Summit, held February 7-10, 2006, at the Anaheim Convention Center in Anaheim, CA.

Throughout the electronics community, the accepted assumption is that packaging will save the industry.

An option for device-stacking applications

Reduces Time-to-Market

Expanding New Applications Development

METROLOGY TOOLS PROVIDE SOLUTIONS

Keeping up with electrical and mechanical requirements

Until recently, micro-systems technology resonant-mode inertial measurement units (IMUs) have had limited lifetime.