Issue



Table of Contents

Solid State Technology

Year 2006
Issue 2

DEPARTMENTS

Editorial Board


OEM Strategy: Buy, Build, or Partner?

The term “Original Equipment Manufacturer” (OEM) was coined when most companies in the electronics industry designed, developed, and manufactured nearly everything in their end products.


New Products


SEMICON China 2006


Notable Developments


Application of Industrial Inkjet Technology to Packaging

Piezoelectric inkjet technology has advanced to become a key enabler for the digital revolution in manufacturing, and will transform analog production processes just as digital technology replaced analog in telecommunications.


New Products


APEX PRODUCT SHOWCASE


Industry Voices


Honey, I Shrunk the Process Window

With the electronics industry making its move to lead-free manufacturing, attention is focused on solder.


Editorial


Cooperating with Nature

I’ve always thought capitalism worked well in the world economy because it aligned perfectly with human nature.


News


In the News


FEATURES

Ingenious Assembly Of Mi


Ingenious Assembly of Micro-optical Components

New manufacturing methods


The Back End Process


Advances in Metal Deposition for Wafer Bumping

Increasing Complexity and Functionality of Packages


3 D Stacked Ics With Cop


3-D-stacked ICs with Copper Nails

Allows System Size Reduction


Measuring 3 D Semiconduc


Measuring 3-D Semiconductor Packages

Meeting the Challenge


High Performance Thermal


High-Performance Thermal Management Materials

Crucial for future packaging


Cover Story


The IC Package

Missing Link between Nanometer Silicon and Multi-gigabit PCB systems