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This well-worn axiom from a top military planner, General Dwight D. Eisenhower, describes the mindset necessary to survive and prevail in the melee of business.

In a ceremony on July 18, 2007, Advanced Packaging celebrated the 7th Annual APA awards.

Whether the topic of discussion was yield management, reducing cost of production and test, the next area of industry expansion, or where a company is realizing the greatest revenue, back-end assembly and test was the focus at SEMICON West 2007.

Semiconductor Packaging Materials, Armonk, NY

At SEMICON West this year, steps towards efficiency, collaboration, and relationship-building were evident everywhere.

Silicone adhesives are becoming more widely used in microelectronic hybrid assemblies due to their inherently low elastic modulus, which relieves stress between substrates with different coefficients of thermal expansion (CTE) during thermal cycling.

Since their introduction nearly 20 years ago, the benefits of integrating flip chips into modern devices have been well proven.

Demand for continuous reductions in semiconductor package height are coming from several directions, most notably memory chip vendors seeking increased density to meet aggressive price-performance roadmaps.

The need for back-side metal adhesion and solder contact for ultra-thin, discrete, high-power semiconductor devices has increased significantly over the past several years.