Issue

Table of Contents Solid State Technology Year 2007 Issue 2	DEPARTMENTS Editorial Board Technology Investment Strategies to Meet Future Product Needs t the 2007 Consumer Electronics Show (CES), convergence, or the merging of PCs, TVs, cell phones, and other devices that enable access to diverse and growing content, was a key theme. New Products New Products News Meet the Press at BiTS Attendees at the 8th Annual Burn-in Test and Sockets Workshop (BiTS), March 11-14 in Mesa, AZ, are invited to Advanced Packaging’s Meet the Press, March 12th at 5pm to learn about general market trends in the sockets industry. News API Diversifies with MEMS TORONTO - API Nanotronics Corp. closed acquisition of National Hybrid Inc. News Synova Boosts Korea Presence SEOUL, South Korea- Synova received tool orders from a Korea-based organic LED (OLED) manufacturer and a U.S.-based semiconductor manufacturer’s Korea facility. Industry Voices Chips-first Approach to System-on-chip System-on-chip (SoC) is a concept that has been proposed and, to some extent, introduced into the electronics marketplace. Packaging Trends 3-D Integration Is the Way to Go The need for system-size reduction, high-performance interconnects, and heterogeneous integration of true system-on-chip (SoC) is driving the packaging world towards 3-D chip integration. News “Can I Order a Double Stack?” SINGAPORE - In a bid for the mobile handset market, STATS ChipPAC developed a method of stacking 3-D packages, creating a package-on-package (PoP) with up to seven stacked die. News The Thermal Management Equation Theories on thermal management rival, in number and variety, strategies for winning the Super Bowl or baking the perfect loaf of bread. Advanced Packaging Road Achtung Baby! Editorial Practical Electronics 101 This issue of Advanced Packaging stands out for me because I had a chance to get to know more about practical issues that revolve around sockets.

FEATURES The Back End Process Wafer Dicing: A Sticky Situation Wafer dicing processes are no longer limited to the basic principle of separating a silicon wafer into individual die. Nanotech X Ray Systems A Nanotech X-ray Systems: A Point of Focus The term “nanotechnology” is no longer new to most of us, thanks, in part, to the media. Developments recently made to open-type X-ray sources and X-ray imaging detectors may provide an end-user with the ability to image features in the nanometer range. Package Design Satisfying the Appetite of Power-hungry Chips Increasing complexity of chips - more transistors operating faster at lower and varied voltages with more I/O - is a well-known phenomenon. Wire Bond Technology The Wire Bond Technology: The Great Debate: Ball vs. Wedge Over the years, microelectronic wire bond process and packaging engineers have debated whether to use ball- or wedge-bond technologies. Cover Story Sockets Meet Future Technology Challenges: Part I Though the basic requirement of sockets remains unchanged - making a stable electrical contact from the device to the PCB - the future holds even more demands on this important electrical/mechanical device.

SUPPLEMENT Embedded Thermoelectric Embedded Thermoelectric Coolers for High-performance ICs: Taking the Edge off Hot Spots anufacturers and OEMs need a package-level cooling solution that provides cooling in close proximity to the chip, to cool hot spots and smooth out non-uniform power dissipation. Compact Thermal Modeling Compact Thermal Modeling: Impacting the industry Simulation tools for thermal modeling of semiconductor packages have become routine in most design processes. Taking The Heat Transfor Taking the Heat: Transforming Thermal Management through Phase Change Materials When it comes to electronic products, the more power, speed, and functionality jammed into a smaller package, the better. Cool Your Heels.html Cool Your Heels Have you ever taken a Latin dance class? At first glance, everyone comes off as shy, and then the movement heats up.

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