Issue

The expectation that embedded passives technology would be required to meet size, performance, and cost requirements of devices has been a driver of considerable R&D activity in laboratories of many material suppliers.

In response to market needs For 300mm process equipment capabilities to demonstrate 3D processes, SUSS MicroTec has introduced The XBC300.

Cellular handsets and mobile handheld products are defining a new application space that goes beyond the realm of traditional flip chip and 3D packaging.

SANTA CLARA, CA — Two years ago, the EMC3D Consortium, an open consortia of equipment and materials manufacturers, established itself and set out to develop a process flow and cost model for 3D integration.

A packaging engineer living in this Information Age has an obligation to keep on top of everything that’s happening.

In semiconductor manufacturing, there’s a lot of talk about ends. First, there’s the front-end and the back-end.

With the development of environmentally friendly ICs at reduced thickness, the manufacturing of thermally reliable products becomes more demanding.

Simple Testing to Evaluate Ball Attach Fluxes.

Traditional socket manufacturing methods are limited in the ability to meet contact methods of the test socket market, especially those related to semiconductor packages.

The increased price of gold is making gold ball bonding, a mainstay process in package assembly, cost prohibitive.

While moving towards tomorrow’s high-performance 3D packages with through-silicon vias (TSV) has captured most of the attention in the industry, stacked packages and similar established approaches have many 3D advantages and are making substantial, if quieter, technical and market progress.