Issue

A variety of bumping technologies are in use today. Electroplating is used for fine-pitch (<250 μm) solder bumping, while robotic ball placement is used for larger pitch, lower (<100) I/O applications.

SHANGHAI — Fort Washington, PA-based Kulicke & Soffa Industries, Inc. launched two next-generation wire bonders just after SEMICON China opened for public viewing.

I love to sit in airports and imagine what people are like outside of travel. For instance, a fellow just walked by with fur-lined ear flaps on his camo hat and flip flops on his feet.

When it comes to semiconductor and MEMS devices, it is well-known that the industry is experiencing certain limitations – whether they are related to functionality, reliability or cost.

Mechanical saw dicing is the conventional technology used for dicing thick silicon wafers.

Die-attach technologies improve throughput

Throughout the past several years, various bonding methods for use in 3D integration have been undergoing evaluation.

A Cost-effective Solution
As high-volume MEMS production applications become a reality, device manufacturers are requiring low cost-of-ownership (COO) through high-yield at the wafer level and high overall equipment uptime. Several industrialized proprietary solutions have been developed to reach best performances.

The negatives of lead-free solders have triggered a growing renaissance in tried-and-true flip chip technologies, as improved equipment and new applications boost twentieth-century approaches.