Applications

APPLICATIONS ARTICLES



Researchers boost efficiency and stability of optical rectennas

01/29/2018  The research team that announced the first optical rectenna in 2015 is now reporting a two-fold efficiency improvement in the devices — and a switch to air-stable diode materials. The improvements could allow the rectennas – which convert electromagnetic fields at optical frequencies directly to electrical current – to operate low-power devices such as temperature sensor

Quantum race accelerates development of silicon quantum chip

01/26/2018  The worldwide race to create more, better and reliable quantum processors is progressing fast, as a team of TU Delft scientists led by Professor Vandersypen has realised yet again. In a neck-and-neck race with their competitors, they showed that quantum information of an electron spin can be transported to a photon, in a silicon quantum chip.

New sensor for measuring electric field strength

01/26/2018  TU Wien has developed a sensor for measuring the strength of electric fields, which is much smaller, simpler and less prone to distortion than comparable devices.

Imec demonstrates shortwave infrared range hyperspectral imaging camera

01/25/2018  Imec today announced that it will demonstrate its very first shortwave infrared (SWIR) range hyperspectral imaging camera at next week’s SPIE Photonics West in San Francisco.

Growth of IoT to drive the global reset IC market

01/23/2018  Technavio market research analysts forecast the global reset IC market to grow at a CAGR of close to 12% during the forecast period, according to their latest report.

Researchers use sound waves to advance optical communication

01/23/2018  Illinois researchers have demonstrated that sound waves can be used to produce ultraminiature optical diodes that are tiny enough to fit onto a computer chip.

Ultra-thin memory storage device paves way for more powerful computing

01/18/2018  A team of electrical engineers at The University of Texas at Austin, in collaboration with Peking University scientists, has developed the thinnest memory storage device with dense memory capacity, paving the way for faster, smaller and smarter computer chips for everything from consumer electronics to big data to brain-inspired computing.

2018FLEX highlights opportunities, advances in flexible hybrid electronics

01/18/2018  2018FLEX, the Flexible Hybrid Electronics (FHE) Conference and Exhibition, will bring together more than 600 experts from around the world for business-critical insights and the latest technology in both flexible electronics and MEMS and sensors.

Worldwide PC shipments declined 2% in 4Q17 and 2.8% for the year

01/12/2018  Amid market consolidation, the top four PC vendors accounted for 64% of shipments in 2017.

Luc Van den hove to receive SEMI Sales and Marketing Excellence Award

01/11/2018  SEMI today announced that Luc Van den hove, president and CEO of imec, has been selected as the 2018 recipient of the SEMI Sales and Marketing Excellence Award, inspired by Bob Graham. He will be honored for outstanding achievement in semiconductor equipment and materials marketing during ceremonies at ISS 2018 on January 17 in Half Moon Bay, California.

Talent pipeline key to enabling industry growth: Takeaways from SEMI Member Forum

01/10/2018  These were key highlights from a SEMI Member Forum in December that brought together industry representatives and students in Dresden to weigh in on job-skills challenges facing the electronics manufacturers and solutions for the industry to consider.

Making the Internet of Things possible with a new breed of 'memristors'

01/10/2018  Easily printable, organic thin films can retain data for more than 10 years without power, work with low voltages -- and become the building block of future computers that mimic the human brain.

Semtech enables IoT of the future with next generation LoRa platform

01/08/2018  Semtech Corporation, a supplier of high performance analog and mixed-signal semiconductors and advanced algorithms, announced its next generation LoRa devices and wireless radio frequency (RF) technology (LoRa Technology) chipsets enabling innovative LPWAN use cases for consumers with its advanced technology.

ON Semiconductor joins CharIN Ecosystems in development of electric mobility standards

01/05/2018  ON Semiconductor has joined the global Charging Interface Initiative e.V. (CharIN) ecosystem with the goals of promoting standards for charging systems in electric vehicles.

NRL improves optical efficiency in nanophotonic devices

01/05/2018  A team of physicists, headed by the U.S. Naval Research Laboratory (NRL), have demonstrated the means to improve the optical loss characteristics and transmission efficiency of hexagonal boron nitride devices, enabling very small lasers and nanoscale optics.

Global semiconductor sales increase 21.5% year-to-year in November

01/03/2018  Worldwide market notches highest-ever monthly sales of $37.7 billion; sales increase 1.6 percent compared to October.

New Vivid Color HDR technology, for thinner, brighter, more colorful experience

01/03/2018  An alternative for power-efficient portable HDR displays, in Notebook, Tablet, SmartPhone, Monitor, TV, AR, and VR applications.

STMicroelectronics and USound deliver first advanced MEMS silicon micro-speakers

01/03/2018  STMicroelectronics (NYSE:STM) and USound, a fast-growing audio company, have delivered the first silicon micro-speakers resulting from their technology collaboration announced last year.

Acoustic device makes piezoelectrics sing to a different tune

12/20/2017  New embedded transducer approach allows surface acoustic wave device to transmit signals with six times the speed of most commercially used devices.

The coldest chip in the world

12/20/2017  Physicists at the University of Basel have succeeded in cooling a nanoelectronic chip to a temperature lower than 3 millikelvin.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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