Applications

APPLICATIONS ARTICLES



MEMS Industry Group explores the “MEMS-enabled Life” at MEMS Executive Congress Europe 2014

01/28/2014  MEMS Industry Group (MIG) will host its third annual MEMS Executive Congress® Europe, 11 March, 2014 in Munich, Germany.

Semiconductors that detect cancer

01/23/2014  As exciting as it is to watch the semiconductor industry push to sub-10nm dimensions, 450mm wafers, finFETs, 3D ICs and the like, what’s even cooler is the potential of semiconductor technology to make a real difference in medicine.

Natural 3D counterpart to graphene discovered

01/21/2014  The discovery of what is essentially a 3D version of graphene promises exciting new things to come for the high-tech industry, including much faster transistors and far more compact hard drives.

STMicroelectronics reveals industry's best connected STM32 F0 microcontrollers

01/16/2014  STMicroelectronics has extended its STM32 F0 microcontrollers based on the ARM Cortex-M0 core with new models that support crystal-less USB design, accurate sensing and smart power management for next-generation smart devices and connectivity products.

Imec celebrates 30 years

01/14/2014  Nanotechnology research and development center imec, today announced the celebration of its 30th anniversary.

Nano-capsules show potential for more potent chemoprevention

01/13/2014  Researchers at the Winship Cancer Institute of Emory University have discovered a more effective drug delivery system using nanotechnology that could one day significantly affect cancer prevention.

The cyborgs era has started

01/13/2014  They are known from science fiction novels and films – technically modified organisms with extraordinary skills, so-called cyborgs.

Yole Développement addresses MEMS sensor challenges at January technology seminar

01/09/2014  Yole De?veloppement will host a MEMS & Imaging Technology Seminar in Korea on January 16, 2014.

New optical image stabilization gyroscope from STMicroelectronics targets tiny smartphones and cameras

01/08/2014  STMicroelectronics has introduced a new 2-axis gyroscope specifically optimized for optical image stabilization in smartphones and digital still cameras.

Toshiba announces "Bright Mode" for CMOS image sensors

01/07/2014  Toshiba Corporation today announced the development of “Bright Mode,” a CMOS image sensor technology that allows smartphones and tablets to record full HD video at 240 frames per second (fps), the industry’s highest frame rate. “Bright Mode” realizes high quality slow motion playback.

Oxford Instruments shares expertise with nanotechnology researchers in India

01/07/2014  Oxford Instruments has just completed its second series of successful and well attended seminars in India following its first in Bangalore in 2012.

STMicroelectronics reveals 9-axis movement/position sensor

01/07/2014  STMicroelectronics has revealed its most advanced module for 9-axis movement and position sensing in next-generation mobiles and tiny wearable devices.

Penn researchers grow liquid "flowers" that can be used as lenses

12/23/2013  A team of material scientists, chemical engineers and physicists from the University of Pennsylvania has made another advance in their effort to use liquid crystals as a medium for assembling structures.

SPTS named Supplier of the Year at the Annual MEMS Executive Congress

12/16/2013  SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, was named MEMS Supplier of the Year at the MEMS Executive Congress U.S. 2013 held in Napa last month

Low-power tunneling transistor for high-performance devices at low voltage

12/12/2013  A new type of transistor that could make possible fast and low-power computing devices for energy-constrained applications such as smart sensor networks, implantable medical electronics and ultra-mobile computing is feasible, according to Penn State researchers.

Graphene-based nano-antennas may enable networks of tiny machines

12/12/2013  Networks of nanometer-scale machines offer exciting potential applications in medicine, industry, environmental protection and defense, but until now there's been one very small problem: the limited capability of nanoscale antennas fabricated from traditional metallic components.

STMicroelectronics launches new advanced energy-harvesting IC

12/10/2013  STMicroelectronics is opening new avenues for energy-harvesting applications with its latest IC integrating all the functions needed to power electronic circuits and recharge batteries using either a solar cell or Thermo-Electric Generator (TEG).

STMicroelectronics imaging technology helps visually impaired

12/04/2013  STMicroelectronics announced that its 5.1 mega-pixel camera module and low-power digital image processor are being used in the revolutionary OrCam camera, a small device that clips on to eyeglasses and dramatically improves the mobility and ability of visually-impaired people to "read" signs, packaging and publications.

STMicroelectronics reveals advanced MEMS accelerometers

12/03/2013  Innovative design boosts the sensor's thermal and mechanical stability to deliver robust high performance in ultra space-saving footprint.

Leti announces MEMS research collaboration with OMRON

11/27/2013  CEA-Leti today announced a development agreement that will utilize Leti’s deep MEMS expertise and leading-edge infrastructure with OMRON, a global leader in factory automation and control solutions for the transportation, healthcare and consumer-goods industries.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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