Applications

APPLICATIONS ARTICLES



Intermolecular and Russian nanocenter sign joint development agreement

10/04/2013  Intermolecular, Inc. and RUSNANO, the Fund for Infrastructure and Educational Programs, today announced the signing of a joint development agreement between Intermolecular and Ulnanotech, the leading Russian Federation nanocenter based in Ulyanovsk.

CU, MIT breakthrough in photonics could lead to faster electronics

10/02/2013  A pair of breakthroughs in the field of silicon photonics by researchers at the University of Colorado Boulder, the Massachusetts Institute of Technology and Micron Technology Inc. could allow for the trajectory of exponential improvement in microprocessors that began nearly half a century ago—known as Moore's Law—to continue well into the future, allowing for increasingly faster electronics, from supercomputers to laptops to smartphones.

Method developed at UT Arlington allows quantitative nanoscopic imaging through silicon

10/02/2013  A team of scientists from The University of Texas at Arlington and MIT has figured out how to quantitatively observe cellular processes taking place on so-called “lab on a chip” devices in a silicon environment.

STMicroelectronics receives Innovation Management Award for chip manufacturing tech

10/02/2013  STMicroelectronics announced on Tuesday it has won a prestigious BearingPoint Innovation Management Award for its FD-SOI technology in the "Innovation Ecosystem" category.

InvenSense opens Korean design center

10/02/2013  InvenSense, Inc., the provider of MotionTracking system on chip devices, announced the opening of a new design center in Seoul, Korea.

From smart cars to smart cities: Shaping the future of microelectronics at ITPC 2013

10/02/2013  Experts in aerospace, automotive, mobile communications, Smart Cities and more join semiconductor leaders to shape the future of microelectronics at the International Technology Partners Conference (ITPC), to be held in Maui, Hawaii, on November 10-13.

All ST’s front-end manufacturing sites achieves ISO 50001 energy-management certification

10/01/2013  STMicroelectronics this week has announced that all six of its front-end manufacturing sites have achieved certification to the latest, most stringent ISO 50001 energy-management standard.

Researchers demonstrate 'accelerator on a chip'

09/27/2013  Technology could spawn new generations of smaller, less expensive devices for science, medicine

Renesas introduces R-Car M2 automotive SoC with increased performance

09/26/2013  Renesas Electronics Corporation today announced the availability of the R-Car M2 automotive Systems-on-Chip (SoC), designed to address growing integrated dashboard and information device market demands.

With carbon nanotubes, a path to flexible, low-cost sensors

09/25/2013  Researchers at the Technische Universitaet Muenchen (TUM) are showing the way toward low-cost, industrial-scale manufacturing of a new family of electronic devices.

MEMS accelerometer from STMicroelectronics part of newly-launched brain sentry impact sensor

09/23/2013  Practical impact sensor identifies players who have received hits to the head and should be further evaluated for possible concussion.

STMicroelectronics and Movea collaborate to bring ultra-low-power, context-aware motion-recognition platform

09/20/2013  STMicroelectronics and Movea today announced their agreement to integrate Movea’s SmartMotion technology into the STM32F401 microcontroller operating as a low-power sensor-hub controller.

STMicroelectronics chip controls Pebble Smartwatch

09/18/2013  STMicroelectronics announced this week that its STM32 microcontroller is the brain controlling the innovative Pebble Smartwatch for iPhone and Android.

Sensors market for automotive applications worth $33.59 billion by 2022

09/18/2013  The total automotive sensor market is expected to reach $33.59 billion by 2022 at a CAGR of 7.8 percent.

Bruker announces acquisition of Prairie Technologies

09/13/2013  Bruker Corporation today announced that it has acquired Prairie Technologies, Inc. (Prairie), a provider of life science fluorescence microscopy products.

New Intel CEO, president talk product plans and future of computing

09/10/2013  From data centers to ultra-mobile devices such as tablets, phones and wearables, computing segments are undergoing exciting and even game-changing transitions, said new Intel CEO Brian Krzanich during today’s opening session of the Intel Developer Forum.

Tailored gyroscopes from STMicroelectronics target shake-free images on mobiles and cameras

09/10/2013  STMicroelectronics has introduced a new family of gyroscopes specifically optimized for optical image stabilization in smartphones and digital still cameras.

STMicroelectronics and X2 Biosystems celebrate shipment of 5,000th concussion sensor system

09/06/2013  As millions of fall sports participants take to the field to kick off the 2013 sports season, players in a wide range of activities are wearing electronic head-impact monitoring patches developed by X2 Biosystems with advanced technology from STMicroelectronics.

Next level of MEMS industry development to be examined at SEMICON Europa

09/05/2013  Driven by value-creating applications in mobile phones, automotive, displays and other systems, the global MEMS industry has grown to over $11 billion in 2012, a 10 percent compound annual average growth rate since 2008.

Sand 9 launches new MEMS timing products

09/03/2013  Sand 9, Inc. today announced the first MEMS timing products specifically designed to meet the stringent performance, cost, size and reliability requirements of high-volume mobile applications




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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