Applications

APPLICATIONS ARTICLES



School district of Osceola County first to deliver SEMI High Tech U program

07/26/2018  In a key move to inspire the next generation of innovators, the School District of Osceola County (SDOC) today became the first school district to join the SEMI High Tech U (HTU) Certified Partner Program (CPP), a curriculum that prepares high-school students to pursue careers in STEM fields.

Generation of random numbers by measuring phase fluctuations from a laser diode with a silicon-on-in

07/24/2018  Millimeter-scale chip uses less power to create quantum random numbers at high speeds.

Applied Materials team selected by DARPA to develop advanced technology for artificial intelligence

07/24/2018  Applied Materials, Inc. today announced it has been awarded a contract by the Defense Advanced Research Projects Agency (DARPA) to develop a new type of electronic switch for artificial intelligence that mimics the way the human brain works to enable dramatic improvements in performance and power efficiency.

Park Systems announces Park Nanoscience Lab at Indian Institute of Science in India

07/23/2018  Park Systems announced the opening of the Park Nanoscience Lab at the prestigious Indian Institute of Science (IISC) Bangalore India, which has been upgraded to the status of Institute of Eminence.

Toshiba Memory Corporation develops 96-layer BiCS FLASH with QLC technology

07/23/2018  Toshiba Memory will start to deliver samples to SSD and SSD controller manufacturers for evaluation from the beginning of September, and expects to start mass production in 2019.

Writing the future of rewritable memory

07/23/2018  Scientists have perfected a technique to exceed capacity of current hard drives 1000-fold.

Researchers move closer to completely optical artificial neural network

07/20/2018  Optical training of neural networks could lead to more efficient artificial intelligence.

IBM, Nissan and Toshiba talk computing and smart car innovations: Key takeaways from SEMI Japan Members Day

07/20/2018  The Japan semiconductor manufacturing supply chain is a global semiconductor industry workhorse, producing about one third of world's chip equipment and more than half of its semiconductor materials.

Electronic stickers to streamline large-scale 'internet of things'

07/17/2018  Researchers at Purdue University and the University of Virginia have developed a new fabrication method that makes tiny, thin-film electronic circuits peelable from a surface. The technique not only eliminates several manufacturing steps and the associated costs, but also allows any object to sense its environment or be controlled through the application of a high-tech sticker.

Tuning into quantum: Scientists unlock signal frequency control of precision atom qubits

07/16/2018  A team of researchers from the Centre of Excellence for Quantum Computation and Communication Technology (CQC2T) at UNSW Sydney have successfully implemented an atomic engineering strategy for individually addressing closely spaced spin qubits in silicon.

Nano-kirigami: 'Paper-cut' provides model for 3D intelligent nanofabrication

07/13/2018  Dr. LI Jiafang, from the Institute of Physics, Chinese Academy of Sciences, has recently formed an international team to apply kirigami techniques to advanced 3D nanofabrication.

Next on-chip: Human organs

07/11/2018  Many new innovations were discussed at imec’s U.S. International Technology Forum (ITF) on Monday at the Grand Hyatt in San Francisco, including quantum computing, artificial intelligence, sub-3nm logic, memory computing, solid-state batteries, EUV, RF and photonics, but perhaps the most interesting was new technology that enables human cells, tissues and organs to be grown and analyzed on-chip.

The outlook for new metrology approaches

07/10/2018  To keep up with Moore's Law, the semiconductor industry continues to push the envelope in developing new device architectures containing novel materials.

Proving the benefits of data analysis

07/10/2018  The semiconductor industry is collecting massive amounts of data from fab equipment and other sources. But is the trend toward using that data in a Smart Manufacturing or Industry 4.0 approach happening fast enough in what Mike Plisinski, CEO of Rudolph Technologies, calls a "very conservative" chip manufacturing sector?

Merging antenna and electronics boosts energy and spectrum efficiency

07/05/2018  Research could lead to longer talk time and higher data rates in 5G devices.

Ultimate precision for sensor technology using qubits and machine learning

07/05/2018  Extracting information quickly from quantum states is necessary for future quantum processors and super-sensitive detectors in existing technologies.

Leti, Transdev, IRT Nanoelec announce pilot program to assess new perception sensors for autonomous vehicles

07/05/2018  Leti, a research institute at CEA Tech, Transdev, a global provider of mobility services, and IRT Nanoelec, an R&D center focused on information and communication technologies (ICT) using micro- and nanoelectronics, today announced a pilot program to characterize and assess LiDAR sensors to improve performance and safety of autonomous vehicles.

Smart devices are critical entry point to IoT ecosystem

07/03/2018  As smart functionality makes its way into homes and businesses, two devices are gaining a foothold into broader ecosystems to maximize growth and revenue opportunities: smart speakers and smart meters.

Ultimate precision for sensor technology using qubits and machine learning

07/03/2018  Extracting information quickly from quantum states is necessary for future quantum processors and super-sensitive detectors in existing technologies.

Alta Devices breaks solar energy efficiency record

07/02/2018  Alta Devices has today announced that its most recent single junction solar cell has been certified by NREL (National Renewable Energy Laboratory) as being 28.9% efficient.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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