Applications

APPLICATIONS ARTICLES



Semiconductors and healthcare converging

10/08/2012 

At the recent imec International Technology Forum Press Gathering in Leuven, Belgium, imec CEO Luc Van den hove outlined uses in blood cell sorting, mobile apps for personalized medicine (such as brain monitoring of EEG activity), and advanced bio research.

TEL and imec extend partnership into life science related research

10/08/2012 

Tokyo Electron (TEL) and imec announce the participation of TEL in imec’s bio-research program Human++. The agreement includes collaboration on bio-sensors and specialty imaging.   

EEG headset prototype developed

10/08/2012 

Imec, Holst Centre and Panasonic have developed a new prototype of a wireless EEG (electroencephalogram) headset.

Sensirion debuting tiniest humidity/temperature sensor

10/08/2012 

Sensirion AG says it will debut at Electronica 2012 (Nov. 13-16, Munich, Germany) what it says is the world's smallest humidity and temperature sensor: a 2mm × 2mm × 0.8mm in size, based on its CMOSens technology that combines the sensor and signal processing on a single chip.

Industrial magnetic sensors get a boost from green energy

10/05/2012 

The market for semiconductor magnetic sensors used in industrial and medical applications expanded by 6% in 2011 to $118.2 million, with green energy initiatives acting as a major growth driver, according to IHS iSuppli.

SIA: Chip sales essentially flat in August

10/03/2012 

Macroeconomic malaise continues to weigh down global semiconductor sales, although there's a possible ray of hope for a boost by year's end thanks to introduction of much-desired electronics devices (hello iPhone 5).

Micro-rheometer, microdevice adsorbtion get nods in Sandia student MEMS design contest

09/27/2012 

A device that measures very thin quantities of liquid, such as the synovial fluid in knee joints, and a device that measures change in mass when a microdevice adsorbs small amounts of material, earned top honors in Sandia National Labs' annual student MEMS design contest.

RRAM synapses mimic the brain

09/20/2012 

At this year’s IEDM, a team led by Korea’s Gwangju Institute of Science and Technology will detail a high-speed pattern-recognition system comprising CMOS “neurons” and an array of resistive-RAM (RRAM)-based “synapses,” which demonstrated STDP, a brain-like function.

On-board heaters can self-heal flash memories

09/20/2012 

At the upcoming International Electron Device Meeting, Macronix researchers will describe how they built flash memories that could heal themselves by means of tiny onboard heaters that provide thermal annealing just at the spots where it is needed.

CrossFiber buys assets of MEMS photonic switch maker OMM

09/20/2012 

CrossFiber, a San Diego, CA maker of photonic switches that incorporate microelectromechanical system (MEMS) technology, has acquired substantially all the assets of 2D MEMS switch firm OMM.

X-Fab offering MEMS 3D inertial sensor process

09/19/2012 

X-Fab Silicon Foundries has debuted an open-platform MEMS 3D inertial sensor process, what it claims is the first to be made available directly from a high-volume pure-play foundry.

CrossFiber lands $13M funding for 3D MEMS photonics switches

09/17/2012 

CrossFiber, a San Diego, CA maker of photonic switches that incorporate MEMS technology, says it has completed the final tranche of a Series D round of funding, which closes totaling $13.4 million.

MEMS timing firm Sand 9 lands $3M investment from mobile gear giant Ericsson

09/07/2012 

Sand 9, a Cambridge, MA-based provider of precision MEMS products for wireless and wired applications, has secured a $3M investment from telecommunications giant Ericsson.

Analyst: A new player in MEMS timing

09/05/2012 

The recent partnership between Vectron International, Knowles Electronics, and SiTime could create a new force in the emerging market for MEMS timing devices, notes Semico Research

Fraunhofer develops new silicon photomultiplier

08/30/2012 

Scientists at Fraunhofer Research Institution for Modular Solid State Technologies EMFT, together with Ketek GmbH, have developed a novel, silicon-based optical sensor component called a silicon photomultiplier (SiPM).

Attend the MEMS & NANO live seminar program in the UK

08/23/2012 

The MEMS & NANO free 2-day conference, presented by JEMI, Nanotechnology KTN, and MANCEF, will cover advances in MEMS and nanoscale processes for electronics, industrial and biomedical applications.

Silex names sales leader to drive aggressive growth

08/21/2012 

Silex Technology, maker of wired and wireless networking technologies, appointed Joseph Virginia to vice president of sales and a member of the company's executive team.

How to participate in SensorsCon 2013

08/20/2012 

The second annual SensorsCon 2013, the conference for Sensors Technology, Design and Applications, March 6, 2013, Techmart Center, Santa Clara, CA, is accepting applications for exhibitors, sponsors and speakers.

Focus on MEMS at SEMICON Taiwan

08/20/2012 

SEMICON Taiwan 2012, held September 5-7, will feature both Taiwan MEMS suppliers and global MEMS elites -- including Asia Pacific Microsystems, Freescale, InvenSense, and STMicroelectronics -- who will discuss innovation in MEMS design, manufacture, packaging, testing and equipment.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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