Applications

APPLICATIONS ARTICLES



ST opens sensors and electronics lab with China's Harbin Institute of Technology

07/02/2012 

STMicroelectronics (NYSE:STM) partnered with China’s Harbin Institute of Technology (HIT) to open a joint laboratory researching electronics.

Tessera: Adding Vista Point Technologies, losing Powertech Technology?

07/02/2012 

Tessera received notice from Powertech Technology Inc. (PTI) that it will terminate its license agreement with the semiconductor packaging and optics technology company. Tessera also completed phase 1 of its acquisition of camera module technologies from Flextronics.

Guide to MEMS at SEMICON West 2012

06/28/2012 

Paula Doe, SEMI Emerging Markets, shares the annual guide for navigating the MEMS events at SEMICON West, July 10-12 at Moscone Center in San Francisco, CA.

MEMSCAP (MEMS) frees up EUR2.9M selling non-core stake in INTUISKIN/ICOSMECEUTICALS

06/27/2012 

MEMSCAP (NYSE Euronext:MEMS), provider of micro electro mechanical system (MEMS) based technology, sold its 11.6% stake in INTUISKIN/ICOSMECEUTICALS.

Sensors Expo report: MEMS Pre-Conference Symposium

06/25/2012 

Karen Lightman, MEMS Industry Group (MIG), reports on the group's pre-Sensors Expo symposium on MEMS. The coordination of equipment vendors, materials suppliers, foundries, device manufacturers, end-users, and OEMs is "music to her ears."

Freescale partners with Movea to demonstrate platform-agnostic sensor fusion

06/22/2012 

Freescale will integrate Movea’s MotionCore motion processing software modules with its ColdFire-based processors, creating an intelligent motion-sensing platform. MotionCore software modules are optimized for mobile, motion-based applications.

Intel Capital leads Sand 9 funding round, joins Board

06/19/2012 

Timing device maker Sand 9 Inc. raised $23 million in its Series C financing round, led by Intel Capital and with significant participation from Vulcan Capital. Sand 9’s timing devices for wired and wireless applications use MEMS technology to ensure synchronicity and stable operation.

MEMS oscillators benefit fast-changing, mobile, price-conscious applications

06/14/2012 

MEMS oscillators are poised for steep growth in the next few years, says Semico. MEMS represented only 1.4% of all oscillator and clock generator circuits in 2011, but by the end of 2012, Semico expects to see at least a dozen vendors.

MEMS-based devices gain market share in fast-growing sensor sector

06/12/2012 

Semiconductor sensor sales will grow 18% in 2012 to a record $5.7 billion, and continue double-digit growth rates and record-high revenues each year through 2016, says IC Insights. MEMS-based devices now account for about 70% of total sensor revenues compared to 54% in 2005.

Top automotive MEMS supplier Bosch outgrew sector in 2011

06/07/2012 

Bosch GmbH Automotive Electronics of Germany retained its position as the world’s top supplier of automotive MEMS in 2011, according to an IHS iSuppli Automotive MEMS report.

ConFab interview: Ali Sebt advocates switch from On/Off to smart sensing and control

06/06/2012 

Ali Sebt, CEO of Renesas Electronics America, keynoted Day 2 of Solid State Technology’s The ConFab 2012. Here, he discusses the role of inexpensive sensors and microcontrollers in energy savings, in a video interview.

Semiconductors in the smart society: Next-generation connectivity @ The ConFab

06/05/2012 

Day 2 of The ConFab opened in Las Vegas with Ali Sebt, CEO of Renesas Electronics America, delivering “Smart Society, the Sensing Era and Signal Chain.”

The ConFab: Turning the technology knobs for system scaling

06/05/2012 

Chip scaling will go on for the foreseeable future, enabling new product with more compute power, more memory, faster on-chip communication. That was one of the conclusions put forth by imec’s An Steegen, speaking on technology trends at The ConFab 2012.

@ The ConFab: Semiconductor industry experts look to the future

06/04/2012 

The ConFab’s sessions opened with “The Economic Outlook for the Semiconductor Industry,” featuring Jackie Sturm of Intel, Dan Hutcheson of VLSIresearch, and Jim Feldhan of Semico.

MEMSIC (MEMS) names VP of marketing to target auto, industrial apps

06/01/2012 

MEMSIC Inc. (Nasdaq:MEMS), maker of MEMS sensing solutions, tapped John L. Newton to serve as VP of marketing.

MEMS sensor maker Qualtre closes $10M financing round

05/30/2012 

Inertial sensor maker Qualtré Inc. closed a $10 million round of financing with 2 equity finance partners and one debt financier, all from Massachusetts, where Qualtre is based.

MEMS isn't NEW

05/30/2012 

Karen Lightman, MEMS Industry Group (MIG), lets us in on the real meaning of MEMS new product development. MEMS are micro electro mechanical systems.

CrossFiber attains ISO 9001:2008 certification for photonic switch production

05/29/2012 

CrossFiber Inc. has been certified to ISO 9001:2008 standards by registrar PJR. CrossFiber provides all-optical photonic switching solutions for data centers and fiber optic telco networks.

Intel forms Collaborative Research Institutes to build global tech research community

05/26/2012 

Intel will invest more than $40 million over the next 5 years in a worldwide network of university research centers called "Intel Collaborative Research Institutes." Academia -- in hub and spoke universities -- will collaborate with industry on technology R&D.

Conference report: MEMS Business Forum

05/25/2012 

The first MEMS Business Forum, sponsored by MEMS Journal and MEPTEC (MicroElectronics Packaging and Test Engineering Council) was held May 24 at the Santa Clara Biltmore Hotel. Ten speakers presented on topics ranging from near- and mid-term business opportunities to roles of MEMS in broad visions for the future.




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Environment, Safety & Health

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The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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