Applications

APPLICATIONS ARTICLES



4 billion MEMS sensors to enable augmented reality location services by 2016

04/30/2012 

Mobile augmented reality and location-based services will be powered by more than 4 billion MEMS sensor devices by 2016, reports Juniper Research. However, unit prices for MEMS devices are declining rapidly, reaching a lowest possible price point over the medium term in the next few years.

100 millionth MEMS device ships from SiTime

04/30/2012 

SiTime Corporation has shipped 100 million units of its MEMS devices, including oscillators, clock generators and resonators.

Audio Pixels moves to OTCQX as ADPXY

04/24/2012 

Merriman Capital, Inc. will serve as the Principal American Liaison for Audio Pixels Holdings Limited (OTCQX:ADPXY, ASX) as it is now trading on the OTC market's highest tier, OTCQX.

Telcordia qualifies MEMSCAP MEMS VOA to 2 passive optical component standards

04/20/2012 

MEMSCAP qualified its high-voltage electrostatic MEMS variable optical attenuator (VOA) with Telcordia standards GR-1209 and GR-1221 for passive optical components.

MOEMS grow with new applications in displays

04/20/2012 

The market for MOEMS is poised for exponential growth, reports Semico. MEMS devices are established in projection applications, and MEMS for direct view displays are emerging.

EPIC names new director general, promises closer ties with EU

04/19/2012 

EPIC, the European Photonics Industry Consortium, announced at its annual general meeting that Carlos Lee has been appointed as director general, succeeding Thomas Pearsall, who has led the association since its founding in 2003.

Conference Report: MRS Spring 2012, Day 3

04/12/2012 

Blogger Mike Fury reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the third day: leakage and TDDB in low- ? dielectrics, flexible energy storage and conversion, Mn capping layers and diffusion barriers, hard masks for Cu interconnects, nanogenerators, Cu in RF, flexible temperature sensors, NEMS and MEMS in HDD, ZnO nanostructures, and various aspects of CMP.

Tegal focuses MEMS and semiconductor experience on healthcare technologies

04/11/2012 

Tegal Corporation (TGAL) formed a partnership with HealthTech Capital (HTC), an investing group for emerging healthcare technology in Silicon Valley.

Attend joint sessions at VLSI Technology and Circuits

04/10/2012 

The 2012 Symposia on VLSI Technology and Circuits, this June in Honolulu, HI, will foster joint interactions among device technologists and circuit/system designers with overlapping technical programs of both symposia, and joint focus sessions on important topics.

ST MEMS revenues nearly double with Apple in customer roster

04/05/2012 

IHS iSuppli Research reveals the top 10 consumer and mobile MEMS suppliers by revenue for 2011. STMicroelectronics outsold its competition thanks in part to Apple, which made up about half of STM's revenues for the sector.

Photonic MEMS switch maker CALIENT names engineering head

04/04/2012 

CALIENT Technologies Inc. promoted Jitender K. Miglani to vice president of engineering, reporting to Gregory Koss, chief development officer.

Sensor fusion enables "connected, intelligent devices," says Maxim (MXIM) exec

04/03/2012 

Combining sensors with analog technology to enable sensor fusion will create intelligent devices for automotive, consumer, and industrial markets, said Vijay Ullal at Maxim Integrated Products (MXIM).

MEMS improve diverse range of end-market applications

04/03/2012 

The innaugural MEMS Industry Group (MIG) MEMS Executive Congress Europe, held in March in Zurich, included keynotes on automotive, healthcare, and consumer MEMS applications.

Conference Report: MEMS Executive Congress Europe

04/02/2012 

Karen Lightman, the Managing Director of the MEMS Industry Group, blogs from the MEMS Executive Congress Europe, which was held March 20th, in Zurich, Switzerland.

 

Movea joins fabless semiconductor company on motion-enabled remote control designs

03/30/2012 

Movea formed a technology partnership with Nordic Semiconductor to develop motion-enabled 2.4GHz RF remote control reference designs.

RF tunability gains acceptance in flagship products

03/29/2012 

Tunability is a hot new topic for radio frequency (RF) front-end modules, shows Yole Développement's report, "RF filters, PAs, Antenna Switches & Tunability for Cellular Handsets."

Field Report: Sensors in Design 2012

03/29/2012 

Sensors in Design 2012 was opened March 28 at the San Jose McEnery Convention Center, in conjunction with Design West. Blogger Mike Fury reports.

Digital MEMS microphones to overtake analog

03/28/2012 

Digital MEMS microphones see widespread use in mass-market consumer electronics, pushing revenues high enough to overtake the analog segment by 2013.

Optoelectronics, sensors, and discretes saw record year in 2011, beat IC growth

03/28/2012 

Strong demand for MEMS sensors, CMOS image sensors, LEDs, fiber-optic laser transmitters, and power transistors enabled the OSD semiconductors market to grow by 8% in 2011, hitting a new record revenue and beating out the overall IC market, according to IC Insights.

ARM’s Segars sees changing requirements for electronics driven by mobile

03/26/2012 

At the recent Common Platform Technology Forum -- produced by Global Foundries, Samsung and IBM -- Simon Segars, executive vice president and general manager of the physical IP division at ARM, spoke about the impact of the internet of things and mobile computing on the way electronics are designed and used.




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Environment, Safety & Health

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The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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