Applications

APPLICATIONS ARTICLES



Motion control software releases from Hillcrest Labs, Sensor Platforms signal rise of sensor fusion

03/26/2012 

Hillcrest Labs made its Freespace motion control technology available to smartphone and tablet manufacturers, extending the product's reach beyond Smart TV, video game, and PC industries. Sensor Platforms Inc. debuted its sensor fusion software, FreeMotion, for this sector as well.

PVD Solutions for Next Generation MEMS and Sensors

03/26/2012 

As the industry is incorporating more MEMS devices with integrated magnetic sensors, they are encountering challenges that cannot be overcome with existing toolsets.  The deposition and magnetic alignment of these materials are critical for proper device performance and require special hardware configurations and process optimization.  

MEMS to see higher penetration in diverse applications through 2017

03/23/2012 

The global MEMS devices market will hit $11.3 billion by 2017, according to Global Industry Analysts Inc. (GIA). Manufacturing advances and economies of scale will help bring MEMS to more applications, and increase penetration in these markets.

SensorsCon highlights: MEMS in the Internet of Things, networks, and camera pills

03/22/2012 

Blogger Michael A. Fury, Techcet Group, shares presentations from SensorsCon 2012, covering MEMS applications in wireless sensor networks and personal devices, and other sensor developments.

Advantest manufactures piezoelectric MEMS for semiconductor testing

03/19/2012 

Advantest Corporation began producing MEMS relays for semiconductor testing equipment, high-speed communications devices, HF wave measurement equipment and their components.

Amplifier IC enables purely electronic nanopore measurement

03/19/2012 

Columbia Engineering and University of Pennsylvania researchers developed a way measure nanopores with less error, designing a custom IC using commercial semiconductor technology and building the nanopore measurement around the new amplifier chip.

Media tablets join top 5 semiconductor end-markets in 2012

03/09/2012 

Media tablets, experiencing "remarkably rapid ascension," will become the 4th largest application for semiconductors by 2014, up from 35th in 2010, according to IHS.

MEMSCAP ships 1M MEMS-based thermally actuated VOA

03/07/2012 

MEMSCAP (Paris:MEMS), provider of MEMS based products, topped 1 million units shipped of its Thermally Actuated Variable Optical Attenuator chips.

Tour MEMS lines and clinical bio-MEMS research labs in Grenoble

03/06/2012 

AEPI and CEA-Leti will co-host a site visit to CEA-Leti and other facilities on the MINATEC campus, Grenoble, following MEMS Executive Congress Europe on March 23.

Large-wafer MEMS thermopile production brings IR detectors to new applications

03/05/2012 

New MEMS thermopile players and applications are boosting market growth for infrared (IR) detectors, finds Yole Développement.

Gyroscope MEMS depose accelerometers in 2011 revenues

03/01/2012 

Gyroscopes generated more revenues in 2011 than any other consumer/mobile MEMS, the first time gyroscopes topped accelerometers, reports IHS.

Xsens sensor fusion software ready for motion sensing in consumer electronics

02/28/2012 

Xsens introduced a suite of sensor fusion software for smartphones, media tablets and other mobile devices.

MEMS oscillators occupy 1% of timing market, but lure more makers

02/22/2012 

MEMS oscillators represent <1% of the total ($6.3b) timing market, but that hasn't stopped new makers from entering the MEMS oscillator market, with even more on their way, says Semico.

MEMS for mobile electronics: Current and future devices to bring $6B+ by 2016

02/22/2012 

Annual revenues generated by micro electro mechanical system (MEMS) devices built into mobile devices -- including sensors, audio, displays and RF -- will exceed $6 billion by 2016, shows Juniper Research.

Texas Instruments MEMS imaging for new markets

02/20/2012 

Mariquita Gordon from Texas Instruments discusses the company's MEMS-based DLP technology. In its 4th-gen embedded DLP evalution module, the LightCrafter, TI is opening up the applications space to new imaging markets, such as security, dentistry, and more.

ISSYS, U-M awarded $1.5M NIH grant to develop pediatric cardiac miniature implants

02/16/2012 

MEMS maker ISSYS and the University of Michigan (U-M) received a $1.5M National Institute of Health grant, "Novel Micro-Implant To Measure Intracardiac Pressure In Congenital Heart Patients."

Droplet merger microfluidic chip enables massively parallel single-cell genetic analysis

02/15/2012 

Dolomite and GigaGen are collaborating on a novel Droplet Merger Chip for massively parallel single cell genetic analysis. The 15 x 22.5mm glass microfluidic chip merges 2 droplet streams consistently and quickly.

Konica Minolta moves to MEMS for OLED-printing inkjet head

02/14/2012 

In the company's first use of MEMS technology, Konica Minolta developed the KM128SNG-MB high-precision inkjet printhead for manufacturing printed electronics.

CMOS image sensors keep pushing CCDs out of the picture

02/13/2012 

CMOS image sensors in 2011 continued to push CCD sensors into a smaller, isolated section of the market. CMOS image sensors are growing on use in mobile electronics and emerging applications, shows analyst firm IHS, and will find more adoption as back-side illumination costs come down.

mPhase courts $2M+ investment

02/10/2012 

mPhase Technologies is in negotiations with an undisclosed private equity group, which could invest at least $2 million in mPhase. The investment would come with a new board me




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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