Applications

APPLICATIONS ARTICLES



Colibrys relocates to new premises with $10M investment

02/09/2012 

MEMS maker Colibrys SA will relocate locally, to the Y-Parc at Yverdon-les-Bains, Canton Vaud, Switzerland. The new location will enable Colibrys to branch out into new application sectors.

MEMS supplier Si-Ware Systems launches US subsidiary

02/08/2012 

Si-Ware Systems (SWS) launched a US subsidiary, Si-Ware Systems Inc. Scott Smyser, a new EVP for worldwide marketing and business development, will manage the US business.

UPDATED: Record semiconductor sales in 2011, 2012 outlook

02/08/2012 

The SIA shows 2011 worldwide semiconductor sales hit $299.5 billion, a 0.4% year-on-year increase and new record. Semico Research's forecast for 2012 shows a 10.11% growth in semiconductors revenues over 2011. Barclays Capital and Strategy Analytics also weigh in.

Tessera expects MEMS optics design win in smartphones early in 2012

02/01/2012 

Tessera Technologies Inc. (NASDAQ:TSRA) expects a mobile phone design win for its MEMS optical imaging technology in H1 2012, reported Robert A. Young, president and CEO.

Automotive MEMS grew 16% in 2011

02/01/2012 

The market for automotive MEMS expanded after natural disasters in Japan and Thailand last year, with car electronic systems makers seeking to expand their supply chains to mitigate risk. Auto MEMS revenue in 2011 amounted to $2.2 billion.

Qualcomm MEMS Technologies brings color display to Jin Yong e-reader

01/31/2012 

Qualcomm MEMS Technologies Inc. and e-reader provider Koobe announced the next-generation Jin Yong Reader uses MEMS display technology. The original Jin Yong Reader had a black and white display.

Murata closes VTI buy

01/31/2012 

Murata completed its acquisition of VTI Technologies Oy. VTI's core micro electro mechanical systems (MEMS) technology will enable smaller, more accurate, more reliable, lower-power devices, Murata noted.

Implantable MEMS sensor gets jiggy with self-powering design

01/27/2012 

Straight outta Purdue University, a miniaturized implantable medical micro electro mechanical (MEMS) pressure sensor chip can be recharged with the block-rockin beats -- acoustic waves -- of rap music.

imec engineers bio-compatible silicon photonics sensors

01/27/2012 

Genalyte developed and produced a set of disposable silicon photonics biosensor chips with research body imec, for use in its diagnostic and molecular detection equipment. The chips use imec’s standard silicon photonic waveguide devices, modified for bio-compatibility.

Apple iPhone 4S steals smartphone show in Q4 2011; Samsung wins the year

01/27/2012 

While Apple's release of the iPhone 4S in Q4 2011 "unleashed tremendous pent-up demand" from consumers, Samsung used its broad range of smartphones to take the top spot, reports IHS.

Nanomechanical loudspeaker could detect faint electrical signals

01/26/2012 

The JQI, the Neils Bohr Institute in Copenhagen, and Harvard University researchers developed a theoretical method for detecting weak electrical signals, using a nanomechanical "loudspeaker" and laser-based photon signals.

USPTO seeks nominees for National Medal of Technology and Innovation

01/24/2012 

The USPTO is looking to increase the diversity of honorees for its annual National Medal of Technology and Innovation (NMTI), honoring "this nation's creative geniuses."

New biochip measures glucose in saliva, not blood

01/23/2012 

Researchers at Brown University are working on a new sensor, based on plasmaonic interferometers, that can check blood sugar levels by measuring glucose concentrations in saliva instead.

Texas Instruments (TI) debuts DLP evaluation module

01/23/2012 

Texas Instruments (TI, NASDAQ:TXN) DLP Products released DLP LightCrafter, an advanced, compact evaluation module for TI's spatial light steering DLP technology. The evaluation kit is built around the reference design for TI’s 0.3" WVGA resolution DLP chipset.

MEMS panel, tablet teardown, smart grid talk highlights of upcoming Sensors in Design

01/19/2012 

Sensors in Design 2012 takes place March 28-29 in San Jose, CA. With speakers from Texas Instruments and Intel, InvenSense, Analog Devices, and more, the event is designed for attendees to better understand sensor technologies and their applications.

Apple buys most MEMS microphones in 2011: First time atop the rankings

01/18/2012 

In 2011, Apple Inc. became the world’s largest purchaser of MEMS microphones, passing Samsung Electronics Co. Ltd. Apple’s share of MEMS buying amounted to 27% for the year, compared to 20% for Samsung.

IBM fabs microfluidic probe on silicon for tissue staining apps

01/17/2012 

IBM scientists have developed a flexible, non-contact, silicon microfluidic probe to accurately stain tissue sections at the micrometer scale for drug discovery and disease diagnostics research.

MEMS microphones make noise in 2012

01/17/2012 

MEMS microphones will find continued strong implementation in phones, laptops, and tablets in the future, shows Jeremie Bouchaud, IHS, sharing shipment and revenue forecasts through 2015.

Energy harvesting powers up commercialization in 2012

01/16/2012 

The analysts at IDTechEx look at the year past and the year ahead for energy harvesting devices, such as rising power in piezoelectric harvesters, and new energy harvester products.

Apple shares list of suppliers

01/13/2012 

For the first time, Apple Inc. has publicly published a list of over 150 companies that the electronics giant says represent 97% of its procurement expenditures for materials, manufacturing, and assembly of products worldwide.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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