12/04/2006  The University of Alberta's NanoFab chose SUSS MicroTec's ELAN CB6L wafer-bonding equipment for its research and production activities. The NanoFab is an open access micro- and nano-fabrication facility used by more than 130 research groups from the University of Alberta, other Canadian universities, and industry. The manual bonder will be used in nanotechnology research, RF MEMS switches for wireless applications, and other research activities.

11/14/2006  Discera, Inc., and Vectron International will work together to commercialize MEMS oscillators for electronics manufacturing. The companies announced during electronica 2006, November 14 – 17 in Munich, that quartz-crystal resonator company Vectron tested and approved the MEMS-based timing devices offered by Discera, and that they will work closely together to gain exposure for the MEMS devices and develop new products.

11/13/2006  Hot on the heels of a sale to the University of Rochester Medical Center, BioForce Nanosciences Inc. of Ames, Iowa, announced the completion of a Nano eNabler system sale to the Technology & Engineering Center at Harvard Medical School. Funding for the purchase was provided by an award from the National Human Genome Research Institute.

10/26/2006  October 26, 2006 - Automation and control technology firm Omron Corp. has agreed to acquire a 200mm CMOS semiconductor factory in Yasu, Shiga, Japan from Yasu Semiconductor Corp., a consolidated subsidiary of Seiko Epson. Terms of the deal were not disclosed.

10/24/2006  SiTime, a Sunnyvale, Calif., company bringing MEMS-based all silicon timing solutions to market, introduced what it claims is the smallest and thinnest megahertz resonator.

10/11/2006  October 11, 2006 - Silicon Microstructures, Inc. (SMI), a developer of silicon pressure sensors, says it has ramped to 40,000 sensors/day on a new 150mm MEMS manufacturing line.

10/06/2006  STMicroelectronics, a leading supplier of MEMS devices, introduced the first two devices in its new family of low-g linear accelerometers, distinguished by small form factor and low power consumption. The LIS302 sensors are intended to meet the growing demand for smart functionality, such as hard-disk drive protection and motion-controlled operation, in mobile phones, digital audio players, and laptops.

10/04/2006  DayStar Technologies Inc., a Halfmoon, N.Y., developer and manufacturer of CIGS Photovoltaic Foil products, announced it was named a recipient of a $1 million development award in the fiscal year 2007 Department of Defense Appropriations Act for the Advanced Photovoltaic Module Development for Lighter Than Air Vehicles. The award was part of the United States Air Force Research, Development, Test & Evaluation, Advanced Spacecraft Technology Program.

08/30/2006  A prototype magnetometer that could improve perimeter control in war zones and border control for various military organizations is currently under development at the New Jersey Nanotechnology Consortium's Laboratory, Murray Hill, NJ. The prototype, developed by mPhase Technologies, accurately locates a metal object more than 30 ft. away, using a MEMS device to sense changes in magnetic fields.

08/23/2006  Advanced Diamond Technologies Inc. announced that the company and its collaborators received a $1.4 million Phase II program award from the Defense Advanced Research Projects Agency (DARPA) to advance next-generation broadband communication devices based on Advanced Diamond's Ultrananocrystalline Diamond (UNCD).

08/17/2006  Applied MicroStructures, a San Jose, Calif., provider of molecular vapor deposition equipment and contract deposition services, announced it has delivered its first MVD150 automated production system to a leading global manufacturer of MEMS devices for use in the deposition of anti-stiction layers.

07/19/2006  July 19, 2006 - The Micromanipulator Co., Carson City, NV, a developer of analytical probe systems, said that venture capital firm Flywheel Ventures has purchased a majority ownership in the firm for an undisclosed amount, and will invest an extra $1 million in cash to support future growth and acquisitions.

06/29/2006  June 29, 2006 - sp3 Diamond Technologies Inc., Santa Clara, CA, a developer of diamond substrate technology for enhancing thermal management, has received a $750,000 Phase II contract from the Missile Defense Agency to develop gallium nitride (GaN) on silicon-on-diamond devices.

06/27/2006  InvenSense, a provider of motion sensing devices for mobile applications, announced a gyroscope-based solution for handsets intended to enable easier and more intuitive user interaction through hand motions.

06/01/2006  June 1, 2006 - Akustica Inc., a start-up that is developing acoustic components in silicon using micro-electromechanical systems (MEMS) manufacturing processes, has signed on with X-Fab Semiconductor Foundries AG to produce MEMS-based single-chip microphones.

06/01/2006  Akustica Inc. and X-FAB Semiconductor Foundries AG announced a strategic supplier partnership to focus on wafer processing of Akustica's AKU2000 Microphone Chip.

05/16/2006 

04/18/2006  April 18, 2006 - Sales growth for MEMS devices slowed dramatically in 2005 despite "very strong" unit shipments, with demand increasing for newer markets outside the mainstays, according to a new report by In-Stat.

04/17/2006  The AKU2000 surface-mountable complementary metal oxide semiconductor (CMOS) microelectromechanical systems (MEMS) microphone integrates an acoustic transducer, output amplifier, and 4^th-order sigma-delta modulator in a single chip.

04/05/2006