MRSI Systems, a manufacturer of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems, is launching a new High Speed Die Bonder, MRSI-HVM3, to support photonics customers’ high volume manufacturing requirements. The MRSI-HVM3 is in full production and MRSI Systems is shipping to customers worldwide.
Scaling imperatives
Today, high volume manufacturing of photonic, sensor, and semiconductor devices demands a die bonding system that can deliver industry leading speed without sacrificing high precision and superior flexibility. The new MRSI-HVM3, a high speed, flexible, 3 micron die bonder, has been built to address this challenge. This new system leverages a well-defined set of MRSI’s core competencies, built up over 30 years, in the areas of system design, software development, machine vision, motion control, industrial automation, and process solutions.
Customer outcomes
As Dr. Yi Qian, Vice President of Product Management, states, “The new MRSI-HVM3 incorporates the latest hardware and software innovations. Equipped with ultrafast-ramp eutectic stations, it deploys multiple levels of parallel processing utilizing dual gantries, dual heads, dual bonding stages, and “on-the-fly” tool changes. Used across all products, MRSI’s platform software makes it easy for users to change process settings on their own for new parts, new processes, and new products. These features provide our customers with best-in-class throughput for capacity expansion; high accuracy for high-density packaging; and unmatched flexibility for multi-chip multi-process production in one machine. Ultimately the system will generate great ROIs for customers. The MRSI-HVM3 high speed die bonder supports many applications including chip-on-carrier (CoC), chip-on-submount (CoS), and chip-on-baseplate or board (CoB).”
“MRSI Systems has been serving optoelectronic and microelectronic customers for the past 33 years and understands their requirement to scale efficiently in today’s fast paced marketplace. MRSI is pleased to meet these needs with the launch of our new high speed die bonder for high volume manufacturing of photonics packaging,” said Mr. Michael Chalsen, President, MRSI Systems.
Private demonstrations at CIOE
MRSI Systems is exhibiting at CIOE with their Chinese Representative CYCAD Century Science and Technology (Booth #1C66) in Shenzhen, September 6-9, 2017. There will be private demonstrations of the MRSI-HVM3 performing CoC eutectic and epoxy bonding. Please reach out to your MRSI contact to ensure you have an opportunity to see the capabilities of this new product.
MRSI Systems is a manufacturer of fully automated, high-precision, high-speed die bonding and epoxy dispensing systems.