Category Archives: Applications

Leti, a research institute at CEA Tech, and Cellmic LLC, a company dedicated to improving patient healthcare with smartphones and biophotonics, today announced that they joined forces to accelerate the market adoption of lens-free imaging and sensing techniques by growing Leti’s patent portfolio with a core patent from Cellmic.

Pioneered by Aydogan Ozcan, UCLA’s chancellor’s professor, and his research group, this patented computational lens-free imaging approach reconstructs detailed images of specimens from their holographic shadows that contain unique 3D information of samples, such as tissue sections, blood smears and cell cultures. Cellmic LLC, a UCLA spin-off, holds some of the core patents of this important computational imaging technique.

Lens-free microscopy has emerged as a powerful imaging and sensing platform that replaces bulky and expensive optical components that are found in standard optical microscopy systems with dedicated algorithms. Leti developed a lens-free microscope in 2012. Today the technology offers an ultra-wide field-of-view, tracking more than 10,000 biological, microscopic objects at a time per image, providing lab techs with a cost-effective, highly compact and robust solution. The Cellmic patent complements Leti’s IP portfolio and accelerates its ongoing valorization of its lens-free technology for diagnostics, biomedical sensing and related applications.

“Lens-free, on-chip imaging offers a very unique opportunity to bring advanced microscopy and sensing tools into your pocket with a fraction of the cost of existing technologies,” said Ozcan, who is also a co-founder of Cellmic LLC. “We are proud to have made fundamental contributions to establish this technique, which has been benefiting researchers in both academia and industry at a global scale.”

“Our partnership with Leti will help this powerful imaging and sensing technology to reach different markets through Leti’s powerful collaborations with other companies in various industries,” added Neven Karlovac, the CEO and co-founder of Cellmic LLC.

“Ozcan’s research lab and Cellmic have done ground-breaking work in developing lens-free imaging techniques,” said Jean-Marc Dinten, Leti Imaging department manager and international expert. “This core patent complements our lens-free technology development, such as point-of-care diagnosis for spinal meningitis.”

By Emmy Yi, SEMI Taiwan Marketing

Emboldened by advances in self-driving and Internet of Vehicles (IoV) technologies, Taiwan’s microelectronics sector is investing heavily in manufacturing processes and equipment as engines of innovation and growth for autonomous driving, the world’s next market goldmine. But breaking into the self-driving vehicle industry can be an uphill struggle. Semiconductor players bent on securing their piece of the potentially massive market must know how to navigate the automotive industry’s unique ecosystem of suppliers, not to mention its lofty standards for safety and reliability.

To explore opportunities and challenges in the automotive semiconductor market, SEMI recently organized Mobility Tech Talk – a gathering of invited professionals from Strategy Analysis, Yole Développement, Renesas, X-FAB and IHS Markit to examine the evolution of sensors for autonomous cars, advanced driver-assisted system (ADAS) applications, and new energy vehicles (NEVs) in China. Nearly 200 participants exchanged in-depth, forward-looking insights and perspectives as the event successfully reinforced connections among different segments. Here are four key takeaways from the event.

Lidar: The hottest sensing technology for smart automotive

Lidar, mmWave radar, cameras and inertial measurement units (IMUs) are the most important sensing devices for autonomous cars. As sensor and high-speed computing technologies mature, 2018 may mark the beginning for an era of autonomous cars, with 350,000 self-driving vehicles expected to hit the road by 2027. But before a single car takes to the roadways, self-driving technology must become expert at monitoring a vehicle’s environment.

That’s where Lidar, the hottest of all sensing technologies and the key to the holy grail of safe self-driving, comes into the picture. Lidar’s versatility supports multiple essential functions such as mapping, object detection and object movement, but mass production is still impossible due to its high cost. What’s more, technical issues must still be sorted out with solid-state lidar, mechanical lidar and MEMS. Both startups and traditional tier-1 semiconductor players have aggressively invested in related research and development, all hoping to pre-position themselves for the new opportunity.

Smart automotive sets new quality and safety standards

As cars become smarter, so too must silicon. Chips must support vastly more data generated by in-vehicle connectivity, ADAS, electrification, autonomous driving and a multitude of other functions that rely on advanced automotive electronics components. Demand for smarter silicon is prompting Taiwan companies to directly tap the automotive chip market or serve as OEMs for major automakers.

With quality and safety top priorities for automotive applications, in-vehicle semiconductors must meet strict requirements across areas including vehicle control, robustness, liability, cost and quality management to conform to the automotive specifications necessary to securing certifications. Smart silicon must also pass all AEC-Q liability standards promoted by automakers in North America, and score “zero defect” for the ISO/TS 16949 Automotive Quality Management System.

China’s new energy vehicles to fuel semiconductor growth

To promote NEVs and thus reduce fuel consumption by cars with internal combustion engines (ICEs), late last year the Chinese government introduced the Measures for the Parallel Administration of the Average Fuel Consumption and New Energy Vehicle Credits of Passenger Vehicle Enterprises. With China the world’s largest market for NEVs, the policy is forcing automakers in Japan, the U.S. and Europe to accelerate moves towards NEVs that, in turn, will fuel growth in the semiconductor and automotive battery industries. NEVs in China are expected to number 2 million by 2020 before more than doubling to 4.9 million by 2025. Today, most cars still run on ICEs as environmentally friendly motor drives are still under development. In unit shipments, motor drives are expected to exceed ICEs by 2025.

Cross-field collaboration is the key

The rise of smarter, fully autonomous vehicles – a disruptive “Car 2.0” – is unlikely to happen overnight. The global automotive semiconductor market will continue rapid growth, with safety and powertrain applications driving the strongest chip demand. Meanwhile, automakers are focusing more on innovations from startups and non-traditional suppliers, and some have even started developing their own IP and solutions. These paradigm industry shifts are diversifying the automotive supply chain into a cross-domain collaborative network of suppliers, pushing the closed, one-way automotive supply chain into lesser relevance. In the near future, rivals and partners may become indistinguishable as traditional turf wars begin to wane.

As ADAS and autonomous cars evolve, and the era of electric cars nears, automotive semiconductors are rising as the engine of growth for the global semiconductor industry. The automotive semiconductor market is expected to grow at a CAGR of 5.8 percent, reaching US$48.78 billion by 2022.

To help the semiconductor and automotive industries thrive in the era of self-driving vehicles, SEMI has established the Smart Automotive special interest group, a platform for better connecting elite professionals from the microelectronics and automotive sectors. Focusing on trends and innovation in the global autonomous semiconductor industry, the SEMI Smart Automotive SIG promotes industry development and cross-domain collaboration so members can create more business opportunities.

Originally published on the SEMI blog.

Graphene has many properties; it is e.g. an extremely good conductor. But it does not absorb light very well. To remedy this limiting aspect of what is an otherwise amazing material, physicists resort to embedding a sheet of graphene in a flat photonic crystal, which is excellent for controlling the flow of light. The combination endows graphene with substantially enhanced light-absorbing capabilities. In a new study published in EPJ B, Arezou Rashidi and Abdolrahman Namdar from the University of Tabriz, Iran demonstrate that, by altering the temperature in such a hybrid cavity structure, they can tune its capacity for optical absorption. They explain that it is the thermal expansion and thermo-optical effects which give the graphene these optical characteristics. Potential applications include light sensors, ultra-fast lasers, and systems capable of modulating incoming optical beams.

The authors study the light absorption of the material as a function of temperature, the chemical energy potential, the light polarisation and its incidence angles. To do so, they use a modelling method called the transfer matrix method. They find that for normal light incidence, there is enhanced absorption at room temperature, while the absorption peak is shifted toward the red as the temperature increases.

Absorption on the plane of incident angle and wavelength. Credit: Springer

Absorption on the plane of incident angle and wavelength. Credit: Springer

As light comes in at an angle, the authors show that the absorption peaks are sensitive to the incident angles as well as the polarisation state of the light. They also find that by increasing the incident angle, the peak wavelength is shifted toward the blue.

They conclude that the peak wavelength can be controlled by varying either the temperature or incident angle, as well as the chemical energy potential of graphene. This shows that there are a number of tunable features that could be exploited for the design of graphene-based nano-devices, such as temperature-sensitive absorbers and sensors.

STMicroelectronics (NYSE:STM), a global semiconductor leader serving customers across the spectrum of electronics applications, and Jorjin Technologies Inc., a Taipei, Taiwan based company established in 1997 to design and supply modules worldwide, today announced the certification of the dual-radio modules that combine Sigfox wireless-network technology with Bluetooth low energy (BLE).

Jorjin’s WS211x Sigfox/BLE modules benefit from the market-leading performance and energy efficiency of ST’s BlueNRG-1 BLE System-on-Chip (SoC) and the S2-LP sub-1GHz RF transceiver. These advantages have enabled Jorjin’s modules to deliver cutting-edge connectivity and great battery lifetime, targeting coin-cell -operated or energy-harvesting IoT applications.

Fully programmable devices, Jorjin’s new Sigfox modules exploit the ultra-low power Arm® Cortex®-M0 technology embedded in ST’s BLE SoC to act as independent IoT connectivity nodes. The combination of BLE with Sigfox’ low-power wide-area network (LPWAN) provides key benefits to IoT systems, such as firmware update over-the-air, which is not possible with conventional ‘Sigfox-only’ modules. Other benefits of having an IoT device connected both remotely through the Sigfox network and locally through BLE include the possibility to modify device settings during installation or maintenance, or to trace assets, which often change their position inside an area covered with BLE beacon stations.

“We are excited to achieve certification for our first Sigfox-compatible modules,” said Jorjin Technologies chairman Tom Liang. “STMicroelectronics and Sigfox teams’ support has been very helpful and we are looking forward to keeping expanding our collaboration with both partners.”

“The successful certification marks a significant milestone in our cooperation with Jorjin, delivering high-performance, ultra-low-power dual-radio Sigfox modules,” said Maria Rosa Borghi, Low Power RF BU Senior Director, Analog, MEMS and Sensors Group, STMicroelectronics. “Designers now get a cutting-edge solution for building high-mobility products with versatile connectivity and low power budget across all IoT segments.”

“We are glad to welcome Jorjin to our ever-expanding ecosystem and to partner once again with ST for the acceleration of the adoption of the IoT among the different verticals. The certification of the Jorjin module will allow us to boost the production of Sigfox-enabled devices answering a growing demand from our clients,” said Raouti Chehih, Sigfox Chief Adoption Officer.

The evaluation board for the WS211x modules uses the Arduino interface to ease customer development and is compatible with ST’s Arduino shield boards featuring MEMS motion sensors, environmental sensors, or Time-of-Flight (ToF) ranging sensors. An SDK is available from Jorjin enabling customers to develop applications using WS211x modules with ST’s sensor shield boards, as well as an AT command list facilitating customers test of the modules’ BLE and Sigfox functions.

Johan Lodenius is joining the Board of JonDeTech, a Swedish company that develops and markets IR sensor technology based on nanotechnology aimed at consumer electronics and mobile phone mass markets. Mr. Lodenius is former Senior Vice President Marketing and Product Management of the American semiconductor and telecom corporation Qualcomm, a position in which he defined the company’s hugely successful strategy of marketing turn-key chip and software solutions to other cellphone manufacturers, one of the world’s most profitable services today.

”As a result of a breakthrough in nanotechnology research, JonDeTech has developed and patented a completely new type of IR sensor that has the potential to become leading in the global marketplace”, said Mr. Johan Lodenius. “I look forward to contribute to this. JonDeTech’s IR sensors are down to a tenth as thick as conventional sensors, and can be manufactured in high volumes at low cost, which opens for a multitude of applications.”

Johan Lodenius also has an entrepreneurial background, leading the Swedish microprocessor company Coresonic to an exit as Taiwanese semiconductor giant MediaTek acquired it in 2012. Mr. Lodenius was part of MediaTek’s executive management team as Chief Marketing Officer until last year. Today he is self employed as business advisor and now also a Board Member of JonDeTech.
”Johan Lodenius brings exceptional technology know-how coupled with deep international business experience from global top-level cellphone and electronics markets to our company”, said JonDeTech’s CEO Robert Ekström. ”He has a deep understanding of how our markets function and act, and will be very valuable for us in our upcoming global expansion.”

The company recently announced that it will apply for a listing on Nasdaq First North Stockholm during the second quarter of this year, and in connection with this, aiming to receive up to SEK 30 million in a public issue.

JonDeTech’s sensors are very small and thin (thickness 0.2 mm) compared to conventional sensors, which allows them to be easily integrated into many different products. JonDeTech is primarily targeting international customers who develop applications within consumer electronics and the Internet of Things.

Imec, a research and innovation hub in nanoelectronics, energy and digital technologies and partner in EnergyVille, has been named the coordinator of an ambitious 3-year European Union (EU) funded project, “ESPResSo” (Efficient Structures and Processes for Reliable Perovskite Solar Modules), that gathers known leaders in the field of perovskite PV technology to revolutionize Europe’s photovoltaics (PV) industry.

The ESPResSo consortium has been granted over 5M euro by the European Union to overcome the limitations of today’s state-of-the-art perovskite PV technology, bring perovskite solar cells to the next maturity level, and demonstrate their practical application. The members of the consortium include the fundamental research organizations Ecole Polytechnique Federale de Lausanne (EPFL), Switzerland and Consiglio Nazionale delle Ricerche (CNR), Italy; perovskite solar cell scale-up and industrialization members imec, Belgium, Universita degli Studi di Roma Tor Vergata (UNITOV-CHOSE), Italy and Fraunhofer Institute for Solar Energy Systems ISE, Germany;  and experts in sustainability and renewable energies CSGI (Consorzio Interuniversitario per lo Sviluppo dei Sistemi a Grande Interfase), Italy and University of Cyprus, Cyprus.  Members representing materials development include Dycotec Materials LTD, United Kingdom, Dyenamo AB, Sweden and Corning SAS, France; equipment manufacturer, M-Solv LTD, United Kingdom; along with perovskite solar cell technology developers Saule Technologies, Poland, and building-integrated photovoltaics developer, Onyx Solar Energy SL, Spain.

With its low-cost materials and low temperature deposition processes, perovskite-based PV technology has the potential to takes its place in the thin-film PV market. Perovskite solar cells have already demonstrated high efficiencies (above 22%) that rival those of established mainstream thin-film PV technologies like copper-indium-gallium-selenide (CIGS) and cadmium-telluride (CdTe). The challenge is now to transfer the unprecedented progress that the perovskite PV cell technology has made in recent years from its cell level into a scalable, stable, low-cost technology on module level.

“Every aspect of our lives – from our homes to our workplaces, hospitals, schools and farms – depends on the nonstop availability of energy,” stated Tom Aernouts, imec group leader of thin-film photovoltaics.  “Perovskite cells demonstrate clear potential to support world’s energy demands cost-effectively. The ultimate aim of the partners of the ESPResSo project is to achieve this by bringing perovskite photovoltaics from the lab to the fab.”

The ESPResSo team targets alternative cost effective materials, novel cell concepts and architectures, and advanced processing know-how and equipment to overcome the current limitations of this technology. The consortium aims to bring the cell performance close to its theoretical limit by demonstrating cell efficiency of more than 24% (on 1cm²) and less than 10% degradation in cell efficiency following thermal stress at 85°C, 85% RH for over 1000h. Scale up activities utilising solution processed slot-die coating and laser processing will additionally deliver modules with more than 17% efficiency showing long-term (>20 years) reliable performance as deduced from IEC-compliant test conditions.

The ESPResSo team also envisions integrating modules in façade elements demonstrating a levelised cost of electricity (LCoE) of ≤ 0.05€/kWh. Prototyping advanced, arbitrary-shaped architectures with specific materials and process combinations will emphasize that new highly innovative applications like on flexible substrates or with high semi-transparency are well accessible in the mid- to longer-term with this very promising thin-film PV technology.

In a new paper published by Nano Energy, experts from the Advanced Technology Institute (ATI) at the University of Surrey detail a new methodology that allows designers of smart-wearables to better understand and predict how their products would perform once manufactured and in use.

The technology is centred on materials that become electrically charged after they come into contact with each other, known as ‘triboelectric materials’ – for example, a comb through hair can create an electrical charge. ‘Triboelectric Nanogenerators (TENGs)’ use this static charge to harvest energy from movement through a process called electrostatic induction. Over the years, a variety of TENGs have been designed which can convert almost any type of movement into electricity. The University of Surrey’s tool gives manufacturers an accurate understanding of the output power their design would create once produced.

This follows the news earlier this year of the ATI announcing the creation of its £4million state-of-the-art Nano-Manufacturing Hub. The new facility will produce plastic nanoscale electronics for wearable sensors, electronic tags and other electronic devices.

Ishara Dharmasena, lead scientist on this project from the University of Surrey, said: “The future global energy mix will depend on renewable energy sources such as solar power, wind, motion, vibrations and tidal. TENGs are a leading technology to capture and convert motion energy into electricity, extremely useful in small scale energy harvesting applications. Our work will, for the first time, provide universal guidance to develop, compare and improve various TENG designs. We expect this technology in household and industrial electronic products, catering to a new generation of mobile and autonomous energy requirements.”

Professor Ravi Silva, Director of the Advanced Technology Institute, said: “This is truly an exciting area of research for our team – an area we have been working on over a number of years. We believe that our new tool will be of great help to a lot of researchers and designers who are investigating these materials.

“The world urgently needs new forms of affordable and renewable energy sources. TENGs not only present a wonderful opportunity for the consumer electronics industry, but they are an incredibly exciting material group that could be used in all countries and remote locations where the nation grid does not extend, particularly for radios, wireless communication devices and medical equipment.”

Global MEMS market for mobile devices to grow at a CAGR of 10.55% during the period 2017-2021.

The report has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

One trend in the market is advances in the manufacturing technology of MEMS pressure sensors. The OEMs in the global MEMS pressure sensors market are continually adding new features to their products, resulting in the launch of innovative products in the market on a regular basis. The accuracy of MEMS pressure sensors is increasing with these advances.

According to the report, one driver in the market is MEMS becoming an integral part of consumer electronic devices. MEMS devices are increasingly being used in consumer electronics and mobile devices such as smartphones, tablets, and gaming consoles. The mobile devices integrated with MEMS devices can be scrolled, tilted, rotated, and switched from horizontal and vertical displays. Applications such as GPS and gaming, which employ motion sensors, are popular among smartphone and tablet users. For instance, MEMS sensors, when used in GPS applications, help consumers get directions and estimate the distance even in remote locations.

Further, the report states that one challenge in the market is design-related challenges faced by optical MEMS manufacturers. MEMS manufacturers face a lot of difficulties while designing optical MEMS. The optimization of the switching speed of optical MEMS devices needs a clear understanding of the mode shapes and frequencies of oscillations. Optical MEMS devices need to be checked for parameters such as shock dynamics, temperature drift, contact dynamics, and power. Furthermore, the manufacturing of integrated MEMS wafers is very challenging for the manufacturers as the components are manufactured individually and are then assembled on a single chip. This increases the time to market and creates the need for the testing of components at the individual and assembled levels.

Key Vendors

  • Analog Devices
  • Robert Bosch
  • STMicroelectronics

Other Prominent Vendors

  • AAC Technologies
  • Goertek
  • Maxim Integrated
  • Murata Manufacturing
  • Sensata Technologies
  • Silicon Laboratories

Worldwide PC shipments totaled 61.7 million units in the first quarter of 2018, a 1.4 percent decline from the first quarter of 2017, according to preliminary results by Gartner, Inc. The PC market experienced a 14th consecutive quarter of decline, dating back to the second quarter of 2012.

Asia/Pacific and the U.S. experienced declining shipments, while other regions saw some minimal growth, but it was not enough to drive overall growth for the PC industry. In the first quarter of 2018, PC shipments in Asia/Pacific declined 3.9 percent compared with the same period last year, while shipments in the U.S. decreased 2.9 percent.

“The major contributor to the decline came from China, where unit shipments declined 5.7 percent year over year,” said Mikako Kitagawa, principal analyst at Gartner. “This was driven by China’s business market, where some state-owned and large enterprises postponed new purchases or upgrades, awaiting new policies and officials’ reassignments after the session of the National People’s Congress in early March.

“In the first quarter of 2018, there was some inventory carryover from the fourth quarter of 2017,” Ms. Kitagawa said. “At the same time, vendors were cautious in overstocking due to the upcoming release of new models in the second quarter of 2018 with Intel’s new eighth-generation core processors.”

The top three vendors — HP, Lenovo and Dell — accounted for 56.9 percent of global PC shipments in the first quarter of 2018, compared with 54.5 percent of shipments in the first quarter of 2017 (see Table 1). Dell experienced the strongest growth rate among the top six vendors worldwide, as its shipments increased 6.5 percent.

Table 1
Preliminary Worldwide PC Vendor Unit Shipment Estimates for 1Q18 (Thousands of Units)

Company

1Q18 Shipments

1Q18 Market Share (%)

1Q17 Shipments

1Q17 Market Share (%)

1Q18-1Q17 Growth (%)

HP Inc.

12,856

20.8

12,505

20.0

2.8

Lenovo

12,346

20.0

12,305

19.7

0.3

Dell

9,883

16.0

9,277

14.8

6.5

Apple

4,264

6.9

4,199

6.7

1.5

Asus

3,900

6.3

4,458

7.1

-12.5

Acer Group

3,828

6.2

4,189

6.7

-8.6

Others

14,609

23.7

15,637

25.0

6.6

Total

61,686

100.0

62,569

100.0

-1.4

Notes: Data includes desk-based PCs, notebook PCs and ultramobile premiums (such as Microsoft Surface), but not Chromebooks or iPads. All data is estimated based on a preliminary study. Final estimates will be subject to change. The statistics are based on shipments selling into channels. Numbers may not add up to totals shown due to rounding.
Source: Gartner (April 2018)

HP Inc.’s worldwide PC shipments increased 2.8 percent in the first quarter of 2018 versus the same period last year. In EMEA, HP Inc. recorded double-digit growth in both desktop and mobile PCs. This was contrasted with a small decline in other regions. HP Inc. was adversely impacted by declining demand in the U.S., which generally accounts for one-third of its total shipments.

Lenovo’s global PC shipments remained flat in the first quarter of 2018. Lenovo achieved 6 percent growth in EMEA and double-digit shipment growth in Latin America. However, in Asia/Pacific (its largest market), PC shipments declined 4 percent.

After record holiday sales for consumer and gaming products in the fourth quarter of 2017, Dell continued to perform well in the first quarter of 2018. With double-digit shipment increases in EMEA, North America and Latin America, Dell grew in all regions except Asia/Pacific. Desktop and mobile PCs grew in equal measures, showing Dell’s strength in the business segment.

Rising ASPs

The average selling prices (ASPs) of PCs continue to rise. Acknowledging deceleration in the smartphone market, and uncertainty in PC replacement demand, component companies remain cautious about expanding their production capabilities. Therefore, persistent component shortages and a rising bill of materials continue to create an environment conductive to higher prices.

“In contrast to other DRAM-related price spikes, PC vendors are not reacting by reducing DRAM content. Rather they have passed the cost increase to consumers,” Ms. Kitagawa said. “With fewer people buying new machines, manufacturers need to get the highest profit margin from each sale. To do that, they are raising the selling points and focusing on customer experience or perception of value.”

Regional Overview

In the U.S., PC shipments totaled 11.8 million units in the first quarter of 2018, a 2.9 percent decrease from the first quarter of 2017. Dell moved into the No. 1 position in the U.S. based on shipments, as its market share increased to 29.1 percent. HP Inc. moved into the No. 2 position as its shipments declined 4.8 percent, and its market share totaled 28.4 percent in the first quarter of 2018 (see Table 2).

Table 2
Preliminary U.S. PC Vendor Unit Shipment Estimates for 1Q18 (Thousands of Units)

Company

1Q18 Shipments

1Q18 Market Share (%)

1Q17 Shipments

1Q17 Market Share (%)

1Q18-1Q17 Growth (%)

Dell

3,440

29.1

3,198

26.2

7.6

HP Inc.

3,363

28.4

3,532

29.0

-4.8

Lenovo

1,632

13.8

1,714

14.1

-4.8

Apple

1,491

12.6

1,484

12.2

0.5

Acer Group

321

2.7

429

3.5

-25.1

Others

1,586

13.4

1,836

15.1

-13.6

Total

11,833

100.0

12,193

100.0

-2.9

Notes: Data includes desk-based PCs, notebook PCs and ultramobile premiums (such as Microsoft Surface), but not Chromebooks or iPads. All data is estimated based on a preliminary study. Final estimates will be subject to change. The statistics are based on shipments selling into channels. Numbers may not add up to totals shown due to rounding.
Source: Gartner (April 2018)

PC shipments in EMEA totaled 18.6 million units in the first quarter of 2018, a 1.7 percent increase year over year. Enterprise shipments increased as many Windows 10 projects that were put on hold in 2017 began to be implemented. The fast approach of the compliance deadline for the General Data Protection Regulation (GDPR) in Europe, as well as earlier reports of cybersecurity breaches, made security a strong priority in the hardware refresh cycle among enterprises. Eurasia continued to be a bright spot for EMEA, as several countries, such as Russia, Ukraine and Kazakhstan, saw strong demand in the first quarter of 2018.

PC shipments in Asia/Pacific totaled 21.9 million units in the first quarter of 2018, a 3.9 percent decline from the first quarter of 2017. As previously mentioned, the PC market in China drove the decline in Asia/Pacific. There is no significant sign of strong upgrading to the special version of Windows 10 from the Chinese government institutions. Consumer demand was weak as most buyers already took advantage of the aggressive promotions offered in the fourth quarter of 2017.

These results are preliminary. Final statistics will be available soon to clients of Gartner’s PC Quarterly Statistics Worldwide by Region program. This program offers a comprehensive and timely picture of the worldwide PC market, allowing product planning, distribution, marketing and sales organizations to keep abreast of key issues and their future implications around the globe.

 

What makes the Vivo X20 Plus UD smartphone so important is that it is the first smartphone to use Synaptics’ under-display fingerprint sensor, and it has the potential to bite into Apple’s face recognition technology, announced the Teardowns service of ABI Research, a market-foresight advisory firm providing strategic guidance on the most compelling transformative technologies.

(PRNewsfoto/ABI Research)

(PRNewsfoto/ABI Research)

Traditional fingerprint sensors are either embedded under the home key on the front of the mobile phone or on the back of the phone. Placing the fingerprint sensor under the display on the front of the mobile phone should allow for a borderless display on three sides of the display. The top still requires room for the front camera, proximity sensor, and receiver, etc. However, Vivo did not take full advantage of the new fingerprint technology from Synaptics. Vivo retained a significant border below the display along the bottom of the phone.

“Vivo may have been cautious to fully commit to the new technology and left room to fall back to a traditional sensor below the display,” said Jim Mielke, ABI Research’s vice president of the Teardowns service. “The performance of this first implementation does warrant some caution as the sensor seemed less responsive and required increased pressure to unlock the phone.”

Smartphone manufacturers are continually trying to achieve the truly borderless phone, and currently there are only three ways to achieve and still maintain biometric security: fingerprint sensor on the back of the phone, fingerprint sensor under the display, and facial/retina-based recognition. Despite the non-optimal capabilities, the Vivo X20 Plus UD is well ahead of Apple’s face recognition technology.

“Face recognition on smartphones is five times easier to spoof than fingerprint recognition,” stated ABI Research Industry Analyst Dimitrios Pavlakis (“Executive Foresights: Did Apple Miss the Bus – The Display – Integrated Fingerprint Sensor Gives the Industry a Much-Needed Push“). “Despite the decision to forgo its trademark sapphire sensor in the iPhone X in favor of face recognition (FaceID,) Apple may be now forced to return to fingerprints in the next iPhone,” added Pavlakis.

Fingerprint sensors are increasingly becoming more relevant with a host of new banking, financial institution and payment service providers getting behind the technology.

Vivo, a 9-year-old company based in China, was smart to partner with California-based Synaptics, which has 30-plus years of experience in the “human interface revolution” by offering touch, display and biometrics products.

ABI Research’s Teardowns reports feature ultra-high-resolution imaging, pinpoint power measurements, detailed parts list with fully costed BOMs (bill of materials), block diagrams and x-rays. ABI Research performs the highest resolution imagery in the teardown industry, providing unprecedented competitive analysis on components, cost, and chip system functionality.