Category Archives: Applications

STMicroelectronics and Sigfox have announced a collaboration agreement to support and accelerate the growing demand for connected devices for a broad range of applications, including supply-chain management, building and equipment maintenance, water and gas metering, security, transportation, agriculture, mining and home automation. ST will include the Sigfox networking software in its development tools that enable developers to bring their LPWAN-based products and solutions to market faster.

To speed customer adoption of Sigfox as a standard low-power wide-area network (LPWAN) for securely connecting physical devices to the Cloud and the IoT, ST will now offer the Sigfox networking software as part of ST’s MCU software package, including STM32 tool compatibility. The collaboration agreement ensures tool compatibility for the industry-leading STM32 family of general-purpose microcontrollers, as well as with ST’s unique portfolio of technologies and products suitable for Sigfox technology. These include the S2-LP, a high performance and ultra-low-power sub-GHz radio transceiver, the highly secure, Sigfox-compatible STSAFE-A1SX secure element, a wide range of motion, environmental, and audio sensors, and power and power-management devices.

 

Microsemi Corporation (Nasdaq: MSCC), a provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the ZL70123, a new radio frequency (RF) base station module for implantable devices utilizing the Medical Implant Communication Service (MICS) RF band. The new module was developed specifically for external controllers and monitors of implantable medical devices.

Microsemi’s ZL70123 base station module, when combined with the company’s existing ZL70323 implant module, provides a complete solution for achieving the highest performance in next-generation medical networks (Med-Net). Both modules are based on the latest generation of Microsemi’s ultralow power (ULP), MICS-band, radio transceiver chip, which has been deployed in more than three million implantable devices over the last 10 years.

Radio frequency technology is increasingly being used in a wide variety of medical implantable applications, including cardiac care, physiological monitoring (e.g., insulin monitoring), pain management and obesity treatments. According to a recent report from P&S Research, the market for active implantable devices, which includes pacemakers, defibrillators and neurostimulators, is expected to grow at an eight percent compound annual growth rate (CAGR) over the next five years, reaching nearly $29 billion by 2023. Microsemi’s new ZL70123 base station module is ideally suited for the unique needs of this growing market.

“RF engineering is a highly specialized discipline, and leveraging Microsemi’s deep expertise in this area allows our customers to reduce design times and minimize project risk,” said Martin McHugh, Microsemi’s product line manager for implant modules. “With Microsemi’s two-module radio link, companies can now focus research dollars and development efforts on new therapies that enable a better quality of life.”

Creating the perfect wearable device to monitor muscle movement, heart rate and other tiny bio-signals without breaking the bank has inspired scientists to look for a simpler and more affordable tool.

Now, a team of researchers at UBC’s Okanagan campus have developed a practical way to monitor and interpret human motion, in what may be the missing piece of the puzzle when it comes to wearable technology.

What started as research to create an ultra-stretchable sensor transformed into a sophisticated inter-disciplinary project resulting in a smart wearable device that is capable of sensing and understanding complex human motion, explains School of Engineering Professor Homayoun Najjaran.

The sensor is made by infusing graphene nano-flakes (GNF) into a rubber-like adhesive pad. Najjaran says they then tested the durability of the tiny sensor by stretching it to see if it can maintain accuracy under strains of up to 350 per cent of its original state. The device went through more than 10,000 cycles of stretching and relaxing while maintaining its electrical stability.

“We tested this sensor vigorously,” says Najjaran. “Not only did it maintain its form but more importantly it retained its sensory functionality. We have further demonstrated the efficacy of GNF-Pad as a haptic technology in real-time applications by precisely replicating the human finger gestures using a three-joint robotic finger.”

The goal was to make something that could stretch, be flexible and a reasonable size, and have the required sensitivity, performance, production cost, and robustness. Unlike an inertial measurement unit–an electronic unit that measures force and movement and is used in most step-based wearable technologies–Najjaran says the sensors need to be sensitive enough to respond to different and complex body motions. That includes infinitesimal movements like a heartbeat or a twitch of a finger, to large muscle movements from walking and running.

School of Engineering Professor and study co-author Mina Hoorfar says their results may help manufacturers create the next level of health monitoring and biomedical devices.

“We have introduced an easy and highly repeatable fabrication method to create a highly sensitive sensor with outstanding mechanical and electrical properties at a very low cost,” says Hoorfar.

To demonstrate its practicality, researchers built three wearable devices including a knee band, a wristband and a glove. The wristband monitored heartbeats by sensing the pulse of the artery. In an entirely different range of motion, the finger and knee bands monitored finger gestures and larger scale muscle movements during walking, running, sitting down and standing up. The results, says Hoorfar, indicate an inexpensive device that has a high-level of sensitivity, selectivity and durability.

Global sales of smartphones to end users totaled nearly 408 million units in the fourth quarter of 2017, a 5.6 percent decline over the fourth quarter of 2016, according to Gartner, Inc. This is the first year-on-year decline since Gartner started tracking the global smartphone market in 2004.

“Two main factors led to the fall in the fourth quarter of 2017,” said Anshul Gupta, research director at Gartner. “First, upgrades from feature phones to smartphones have slowed down due to a lack of quality “ultra-low-cost” smartphones and users preferring to buy quality feature phones. Second, replacement smartphone users are choosing quality models and keeping them longer, lengthening the replacement cycle of smartphones. Moreover, while demand for high quality, 4G connectivity and better camera features remained strong, high expectations and few incremental benefits during replacement weakened smartphone sales.”

Samsung Retains No. 1 Spot in Fourth Quarter of 2017

Samsung saw a year-on-year unit decline of 3.6 percent in the fourth quarter of 2017, but this did not prevent it from defending its No. 1 global smartphone vendor position against Apple (see Table 1).

Table 1

Worldwide Smartphone Sales to End Users by Vendor in 4Q17 (Thousands of Units)

Vendor

4Q17

Units

4Q17 Market Share (%)

4Q16

Units

4Q16 Market Share (%)

Samsung

74,026.6

18.2

76,782.6

17.8

Apple

73,175.2

17.9

77,038.9

17.8

Huawei

43,887.0

10.8

40,803.7

9.4

Xiaomi

28,187.8

6.9

15,751.3

3.6

OPPO

25,660.1

6.3

26,704.7

6.2

Others

162,908.8

39.9

195,059.1

45.1

Total

407,845.4

100.0

432,140.3

100.0

Source: Gartner (February 2018)

Despite the start of a slowdown in sales of Samsung’s Galaxy S8 and S8+, the overall success of those models has helped Samsung improve overall average selling price. Samsung is poised to announce the successors to its Galaxy series of smartphones at Mobile World Congress (MWC) this year. The launches of its next flagship devices are likely to boost Samsung’s smartphone sales in the first quarter of 2018. Although Samsung’s significant sales volumes lean toward midprice and entry-level models, which now face extreme competition and reducing contribution, its profit and average selling price may further improve if these next flagship smartphones are successful.

While Apple’s market share stabilized in the fourth quarter of 2017 compared to the same quarter in 2016, iPhone sales fell 5 percent. “Apple was in a different position this quarter than it was 12 months before,” said Mr. Gupta. “It had three new smartphones — the iPhone 8, iPhone 8 Plus and iPhone X — yet its performance in the quarter was overshadowed by two factors. First, the later availability of the iPhone X led to slow upgrades to iPhone 8 and 8 Plus, as users waited to try the more-expensive model. Second, component shortages and manufacturing capacity constraints preceded a long delivery cycle for the iPhone X, which returned to normal by early December 2017. We expect good demand for the iPhone X to likely bring a delayed sales boost for Apple in the first quarter of 2018,” added Mr. Gupta.

Huawei and Xiaomi — The Big Winners in Fourth Quarter of 2017

Huawei and Xiaomi were the only smartphone vendors to achieve year-on-year unit growth (7.6 and 79 percent, respectively) and grew market share in the quarter. With Huawei’s new smartphone additions in the quarter, including Mate 10 Lite, Honor 6C Pro and Enjoy 7S, the vendor broadened the appeal of its smartphones.

Xiaomi’s competitive smartphone portfolio, consisting of its Mi and Redmi models, helped accelerate its growth in the emerging Asia/Pacific (APAC) market. It also helped Xiaomi win back lost share in China.

“Future growth opportunities for Huawei will reside in winning market share in emerging APAC and the U.S.,” said Mr. Gupta. “Xiaomi’s biggest market outside China is India, where it will continue to see high growth. Increasing sales in Indonesia and other markets in emerging APAC will position Xiaomi as a strong global brand.”

In 2017 as a whole, smartphone sales to end users totaled over 1.5 billion units, an increase of 2.7 percent from 2016 (see Table 2). Huawei, ranked No. 3, raised its share in 2017, continuing to gain on Apple. At the same time, the combined market share of the Chinese vendors in the top five increased by 4.2 percentage points, while the market share of top two, Samsung and Apple, remained unchanged.

Table 2

Worldwide Smartphone Sales to End Users by Vendor in 2017 (Thousands of Units)

Vendor

2017

Units

2017 Market Share (%)

2016

Units

2016 Market Share (%)

Samsung

321,263.3

20.9

306,446.6

20.5

Apple

214,924.4

14.0

216,064.0

14.4

Huawei

150,534.3

9.8

132,824.9

8.9

OPPO

112,124.0

7.3

85,299.5

5.7

Vivo

99,684.8

6.5

72,408.6

4.8

Others

638,004.7

41.5

682,915.3

45.7

Total

1,536,535.5

100.0

1,495,959.0

100.0

Source: Gartner (February 2018)

In the smartphone operating system (OS) market, Google’s Android extended its lead by capturing 86 percent of the total market in 2017 (see Table 3). This is up 1.1 percentage points from a year ago. “The competition in the smartphone market is unabated at this time of the year,” said Mr. Gupta. “Ahead of MWC, several phone manufacturers such as Samsung, HMD (Nokia), Asus and LG have announced that they will launch new Android smartphones.”

Table 3

Worldwide Smartphone Sales to End Users by Operating System in 2017 (Thousands of Units)

Operating System

2017

Units

2017 Market Share (%)

2016

Units

2016 Market Share (%)

Android

1,320,118.1

85.9

1,268,562.7

84.8

iOS

214,924.4

14.0

216,064.0

14.4

Other OS

1,493.0

0.1

11,332.2

0.8

Total

1,536,535.5

100.0

1,495,959.0

100.0

Source: Gartner (February 2018)

Further information is available in the Gartner report titled “Market Share: Final PCs, Ultramobiles and Mobile Phones, All Countries, 4Q17.”

A global gathering of more than 650 industry and academic experts, including 140 speakers and 56 exhibitors, shared the latest advancements in both flexible hybrid electronics (FHE) and in microelectromechanical systems (MEMS) and sensors at 2018FLEX and MEMS & Sensors Technical Congress (MSTC). Hosted by SEMI strategic association partners, FlexTech and MEMS & Sensors Industry Group (MSIG), the events presented technologies, integration strategies and packaging/process methodologies that are advancing human-machine interaction in health monitoring and the treatment of illness, automotive systems, consumer electronics, Internet of Things (IoT) and industrial applications.

Speakers offered fascinating views of emerging FHE applications, including:

  • Cortera Neurotechnologies Co-founder and CTO Rikky Muller described how her company is replacing existing large wired sensors with small, minimally invasive thin biomaterials that interact more naturally with the neural cortex. Cortera Neurotechnologies’ devices will be used to treat neurological disease and psychiatric illnesses such as major depressive disorder. “I think we need biological invisibility,” said Muller. “We need materials and form factors that cause no reaction in the human body at all. We need stability and longevity, since we need these devices to outlive us.”
  • Auburn University MacFarlane Endowed Professor & Director Pradeep Lall called his department’s AU-CAVE3 Biometric Sensor Band with LifeSaver App a “guardian angel” that autonomously monitors patients without human interaction and can even call 9-1-1.
  • NASA Ames Research Center Chief Scientist for Exploration Technology Meyya Meyyappansaid that 3D printed electronics will support a multi-material “FabLab” on the International Space Station for repairing or replacing failed devices. “This will free scientists from having to send living supplies back and forth between the ISS and earth at a cost savings of up to $10,000 per pound,” he said.

Synergies and Integration Potential

SEMI for the first time co-located 2018FLEX with MSTC, which allowed attendees to explore potential synergies between the component-level technologies of MEMS/sensors and the more wide-reaching integration technologies of FHE. Longtime MSIG Members Mary Ann Maher, CEO of SoftMEMS, and Chip Spangler, president of Aspen Microsystems, offered a popular short-course on the integration of MEMS sensors and actuators with FHE electronics (FHE). “MEMS integrated with FHE offers distinct advantages for wearables and implantable devices, for example, which require conformal and flexible substrates and interconnections and small, accurate form-factor sensors,” said Maher.

Spangler gave the example of a prosthetic eye, saying, “Because the device must fit the form factor of an eyeball, flex circuits are used to make the antenna that connects to an external camera — which is outside the field of view — as well as to the optic nerve. FHE both facilitates the manufacture of the prosthetic eye and allows it to fit within the confined space of the eye socket.”

Awards and Recognitions

SEMI announced the recipients of its annual FLEXI Awards on February 13, 2018, lauding innovators in categories of R&D Achievements, Product Innovation and Commercialization, Education Leadership, and Industry Leadership. (See press release, “2018 FLEXI Awards Innovation and Leadership in Flexible Hybrid Electronics, February 13, 2018.)

SEMI announced the appointment of Frank A. Shemansky, Jr., Ph.D., as executive director and chief technology officer (CTO) of MSIG. Shemansky brings more than 25 years’ experience in microelectronics to MSIG, where he will now direct global activities. (See press release, Frank Shemansky to Lead SEMI’s MEMS & Sensors Industry Group, February 13, 2018.)

SEMI also recognized the “Innovators of Tomorrow” with its student poster session competition: Jonathan Ting, UC Berkeley: “Fully Screen-printed NiO Thermister Arrays;” Telha Alcagyazi, North Carolina State University: “Multi-modal Array Sensing with Textiles;” and Levent E. Ayguh, Princeton University: “Sound Identification Using Physically Expansive Sensing System.”

Entering 2018 on solid ground


February 22, 2018

By Walt Custer, Custer Consulting Group

2017 finished on an upturn – both in the USA and globally.  Based on consolidated fourth-quarter actual and estimated revenues of 213 large, global electronic manufactures, sales rose in excess of 7 percent in 4Q’17 vs. 4Q’16 (Chart 1).  This was the highest global electronic equipment sales growth rate since the third quarter of 2011. Because some companies in our sample didn’t close their financial quarter until the end of January, final results will take a few more weeks – but all evidence points to a very strong fourth quarter of last year.

Custer1-Electronic-Equipment

 

Using regional (country specific) data (Chart 2), the normal, consumer electronics driven seasonal downturn began again in January.  However the recent year-over-year growth is still substantial.  On a total electronic equipment revenue basis, January 2018 was up almost 19.5 percent over January 2017.

Custer2-World-Electronic

Because this regional data in local currencies was converted to U.S. dollars at fluctuating exchange, the dollar denominated-growth was amplified by currency exchange effects.  At constant exchange the January growth was only 14 percent.   That is, when the stronger non-U.S. currencies were converted to weakening dollars, the dollar-denominated January 2018 fluctuating exchange growth was amplified by 5.5 percent.

Chart 3 shows 4Q’17/4Q’16 growth of the domestic electronic supply chain.  U.S. electronic equipment shipments were up 9.1 percent.  Only computer equipment and non-defense aircraft sales declined in the fourth quarter.  And of note, SEMI equipment shipments to North America rose almost 31 percent!

Custer3-US-Electronic-Supply

 

Chart 4 shows estimated fourth-quarter growth for the world electronic supply chain.  Only “Business & Office” equipment revenues declined in 4Q’17 vs. 4Q’16.

Custer4-Global-Electronic

Total global electronic equipment sales increased more than 7 percent in the fourth quarter and SEMI equipment revenues rose 32 percent.

2017 was a strong year and 2018 is off to a good start!  The 2017 lofty growth rates will temper, but this current expansion will likely continue.  Watch the monthly numbers!

Originally published on the SEMI blog.

The success and proliferation of integrated circuits has largely hinged on the ability of IC manufacturers to continue offering more performance and functionality for the money.  Driving down the cost of ICs (on a per-function or per-performance basis) is inescapably tied to a growing arsenal of technologies and wafer-fab manufacturing disciplines as mainstream CMOS processes reach their theoretical, practical, and economic limits. Among the many levers being pulled by IC designers and manufacturers are: feature-size reductions, introduction of new materials and transistor structures, migration to larger-diameter silicon wafers, higher throughput in fab equipment, increased factory automation, three-dimensional integration of circuitry and chips, and advanced IC packaging and holistic system-driven design approaches.

For logic-oriented processes, companies are fabricating leading-edge devices such as high-performance microprocessors, low-power application processors, and other advanced logic devices using the 14nm and 10nm generations (Figure 1).  There is more variety than ever among the processes companies offer, making it challenging to compare them in a fair and useful way.  Moreover, “plus” or derivative versions of each process generation and half steps between major nodes have become regular occurrences.

For five decades, the industry has enjoyed exponential improvements in the productivity and performance of integrated circuit technology.  While the industry has continued to surmount obstacles put in front of it, the barriers are getting bigger.  Feature size reduction, wafer diameter increases, and yield improvement all have physical or statistical limits, or more commonly…economic limits.  Therefore, IC companies continue to wring every bit of productivity out of existing processes before looking to major technological advances to solve problems.

The growing design and manufacturing challenges and costs have divided the integrated circuit world into the haves and have-nots.  In the June 1999 Update to The McClean Report, IC Insights first described its “Inverted Pyramid” theory, where it was stated that the IC industry was in the early stages of a new era characterized by dramatic restructuring and change.  It was stated that the marketshare makeup in various IC product segments was becoming “top heavy,” with the shares held by top producers leaving very little room for remaining competitors. Although the Update described the emerging inverted pyramid phenomenon from a marketshare perspective, an analogous trend can be seen regarding IC process development and fabrication capabilities. The industry has evolved to the point where only a very small group of companies can develop leading-edge process technologies and fabricate leading-edge ICs.

Figure 1

Figure 1

Nanoscale light sources and nanoantennas already found a wide range of applications in several areas, such as ultra compact pixels, optical detection or telecommunications. However, the fabrication of nanostructure-based devices is rather complicated since the materials typically used have a limited luminescence efficiency. What is more, single quantum dots or molecules usually emit light non-directionally and weakly. An even more challenging task is placing a nanoscale light source precisely near a nanoantenna.

A research group from ITMO University managed to combine a nanoantenna and a light source in a single nanoparticle. It can generate, enhance and route emission via excited resonant modes coupled with excitons. “We used hybrid perovskite as a material for such nanoantennas,” says Ekaterina Tiguntseva, first author of the publication. “Unique features of perovskite enabled us to make nanoantennas from this material. We basically synthesized perovskite films, and then transferred material particles from the film surface to another substrate by means of pulsed laser ablation technique. Compared to alternatives, our method is relatively simple and cost-effective.”

While studying the obtained perovskite nanoparticles, the scientists discovered that their emission can be enhanced if its spectra match with the Mie-resonant mode. “Currently, scientists are particularly interested in Mie-resonances related to dielectric and semiconductor nanoparticles,” explains George Zograf, Engineer at the Laboratory of Hybrid Nanophotonics and Optoelectronics at ITMO University. “Perovskites used in our work are semiconductors with luminescence efficiency much higher than that of many other materials. Our study shows that combination of excitons with Mie resonance in perovskite nanoparticles makes them efficient light sources at room temperature.”

In addition, the radiation spectrum of the nanoparticles can be changed by varying the anions in the material. “The structure of the material remains the same, we simply use another component in the synthesis of perovskite films. Therefore, it is not necessary to adjust the method each time. It remains the same, yet the emission color of our nanoparticles changes,” says Ekaterina.

The scientists will continue research on light-emitting perovskite nanoantennas using various components for their synthesis. In addition, they are developing new designs of perovskite nanostructures which may improve ultra compact optical devices.

Computer algorithms might be performing brain-like functions, such as facial recognition and language translation, but the computers themselves have yet to operate like brains.

“Computers have separate processing and memory storage units, whereas the brain uses neurons to perform both functions,” said Northwestern University’s Mark C. Hersam. “Neural networks can achieve complicated computation with significantly lower energy consumption compared to a digital computer.”

This is the memtransistor symbol overlaid on an artistic rendering of a hypothetical circuit layout in the shape of a brain. Credit: Hersam Research Group

This is the memtransistor symbol overlaid on an artistic rendering of a hypothetical circuit layout in the shape of a brain. Credit: Hersam Research Group

In recent years, researchers have searched for ways to make computers more neuromorphic, or brain-like, in order to perform increasingly complicated tasks with high efficiency. Now Hersam, a Walter P. Murphy Professor of Materials Science and Engineering in Northwestern’s McCormick School of Engineering, and his team are bringing the world closer to realizing this goal.

The research team has developed a novel device called a “memtransistor,” which operates much like a neuron by performing both memory and information processing. With combined characteristics of a memristor and transistor, the memtransistor also encompasses multiple terminals that operate more similarly to a neural network.

Supported by the National Institute of Standards and Technology and the National Science Foundation, the research was published online today, February 22, in Nature. Vinod K. Sangwan and Hong-Sub Lee, postdoctoral fellows advised by Hersam, served as the paper’s co-first authors.

The memtransistor builds upon work published in 2015, in which Hersam, Sangwan, and their collaborators used single-layer molybdenum disulfide (MoS2) to create a three-terminal, gate-tunable memristor for fast, reliable digital memory storage. Memristor, which is short for “memory resistors,” are resistors in a current that “remember” the voltage previously applied to them. Typical memristors are two-terminal electronic devices, which can only control one voltage channel. By transforming it into a three-terminal device, Hersam paved the way for memristors to be used in more complex electronic circuits and systems, such as neuromorphic computing.

To develop the memtransistor, Hersam’s team again used atomically thin MoS2 with well-defined grain boundaries, which influence the flow of current. Similar to the way fibers are arranged in wood, atoms are arranged into ordered domains – called “grains” – within a material. When a large voltage is applied, the grain boundaries facilitate atomic motion, causing a change in resistance.

“Because molybdenum disulfide is atomically thin, it is easily influenced by applied electric fields,” Hersam explained. “This property allows us to make a transistor. The memristor characteristics come from the fact that the defects in the material are relatively mobile, especially in the presence of grain boundaries.”

But unlike his previous memristor, which used individual, small flakes of MoS2, Hersam’s memtransistor makes use of a continuous film of polycrystalline MoS2 that comprises a large number of smaller flakes. This enabled the research team to scale up the device from one flake to many devices across an entire wafer.

“When length of the device is larger than the individual grain size, you are guaranteed to have grain boundaries in every device across the wafer,” Hersam said. “Thus, we see reproducible, gate-tunable memristive responses across large arrays of devices.”

After fabricating memtransistors uniformly across an entire wafer, Hersam’s team added additional electrical contacts. Typical transistors and Hersam’s previously developed memristor each have three terminals. In their new paper, however, the team realized a seven-terminal device, in which one terminal controls the current among the other six terminals.

“This is even more similar to neurons in the brain,” Hersam said, “because in the brain, we don’t usually have one neuron connected to only one other neuron. Instead, one neuron is connected to multiple other neurons to form a network. Our device structure allows multiple contacts, which is similar to the multiple synapses in neurons.”

Next, Hersam and his team are working to make the memtransistor faster and smaller. Hersam also plans to continue scaling up the device for manufacturing purposes.

“We believe that the memtransistor can be a foundational circuit element for new forms of neuromorphic computing,” he said. “However, making dozens of devices, as we have done in our paper, is different than making a billion, which is done with conventional transistor technology today. Thus far, we do not see any fundamental barriers that will prevent further scale up of our approach.”

A silicon-based quantum computing device could be closer than ever due to a new experimental device that demonstrates the potential to use light as a messenger to connect quantum bits of information — known as qubits — that are not immediately adjacent to each other. The feat is a step toward making quantum computing devices from silicon, the same material used in today’s smartphones and computers.

In a step forward for quantum computing in silicon -- the same material used in today's computers -- researchers successfully coupled a single electron's spin, represented by the dot on the left, to light, represented as a wave passing over the electron, which is trapped in a double-welled silicon chamber known as a quantum dot. The goal is to use light to carry quantum information to other locations on a futuristic quantum computing chip. Credit: Image courtesy of Emily Edwards, University of Maryland.

In a step forward for quantum computing in silicon — the same material used in today’s computers — researchers successfully coupled a single electron’s spin, represented by the dot on the left, to light, represented as a wave passing over the electron, which is trapped in a double-welled silicon chamber known as a quantum dot. The goal is to use light to carry quantum information to other locations on a futuristic quantum computing chip. Credit: Image courtesy of Emily Edwards, University of Maryland.

The research, published in the journal Nature, was led by researchers at Princeton University in collaboration with colleagues at the University of Konstanz in Germany and the Joint Quantum Institute, which is a partnership of the University of Maryland and the National Institute of Standards and Technology.

The team created qubits from single electrons trapped in silicon chambers known as double quantum dots. By applying a magnetic field, they showed they could transfer quantum information, encoded in the electron property known as spin, to a particle of light, or photon, opening the possibility of transmitting the quantum information.

“This is a breakout year for silicon spin qubits,” said Jason Petta, professor of physics at Princeton. “This work expands our efforts in a whole new direction, because it takes you out of living in a two-dimensional landscape, where you can only do nearest-neighbor coupling, and into a world of all-to-all connectivity,” he said. “That creates flexibility in how we make our devices.”

Quantum devices offer computational possibilities that are not possible with today’s computers, such as factoring large numbers and simulating chemical reactions. Unlike conventional computers, the devices operate according to the quantum mechanical laws that govern very small structures such as single atoms and sub-atomic particles. Major technology firms are already building quantum computers based on superconducting qubits and other approaches.

“This result provides a path to scaling up to more complex systems following the recipe of the semiconductor industry,” said Guido Burkard, professor of physics at the University of Konstanz, who provided guidance on theoretical aspects in collaboration with Monica Benito, a postdoctoral researcher. “That is the vision, and this is a very important step.”

Jacob Taylor, a member of the team and a fellow at the Joint Quantum Institute, likened the light to a wire that can connect spin qubits. “If you want to make a quantum computing device using these trapped electrons, how do you send information around on the chip? You need the quantum computing equivalent of a wire.”

Silicon spin qubits are more resilient than competing qubit technologies to outside disturbances such as heat and vibrations, which disrupt inherently fragile quantum states. The simple act of reading out the results of a quantum calculation can destroy the quantum state, a phenomenon known as “quantum demolition.”

The researchers theorize that the current approach may avoid this problem because it uses light to probe the state of the quantum system. Light is already used as a messenger to bring cable and internet signals into homes via fiber optic cables, and it is also being used to connect superconducting qubit systems, but this is one of the first applications in silicon spin qubits.

In these qubits, information is represented by the electron’s spin, which can point up or down. For example, a spin pointing up could represent a 0 and a spin pointing down could represent a 1. Conventional computers, in contrast, use the electron’s charge to encode information.

Connecting silicon-based qubits so that they can talk to each other without destroying their information has been a challenge for the field. Although the Princeton-led team successfully coupled two neighboring electron spins separated by only 100 nanometers (100 billionths of a meter), as published in Science in December 2017, coupling spin to light, which would enable long-distance spin-spin coupling, has remained a challenge until now.

In the current study, the team solved the problem of long-distance communication by coupling the qubit’s information — that is, whether the spin points up or down — to a particle of light, or photon, which is trapped above the qubit in the chamber. The photon’s wave-like nature allows it to oscillate above the qubit like an undulating cloud.

Graduate student Xiao Mi and colleagues figured out how to link the information about the spin’s direction to the photon, so that the light can pick up a message, such as “spin points up,” from the qubit. “The strong coupling of a single spin to a single photon is an extraordinarily difficult task akin to a perfectly choreographed dance,” Mi said. “The interaction between the participants — spin, charge and photon — needs to be precisely engineered and protected from environmental noise, which has not been possible until now.” The team at Princeton included postdoctoral fellow Stefan Putz and graduate student David Zajac.

The advance was made possible by tapping into light’s electromagnetic wave properties. Light consists of oscillating electric and magnetic fields, and the researchers succeeded in coupling the light’s electric field to the electron’s spin state.

The researchers did so by building on team’s finding published in December 2016 in the journal Science that demonstrated coupling between a single electron charge and a single particle of light.

To coax the qubit to transmit its spin state to the photon, the researchers place the electron spin in a large magnetic field gradient such that the electron spin has a different orientation depending on which side of the quantum dot it occupies. The magnetic field gradient, combined with the charge coupling demonstrated by the group in 2016, couples the qubit’s spin direction to the photon’s electric field.

Ideally, the photon will then deliver the message to another qubit located within the chamber. Another possibility is that the photon’s message could be carried through wires to a device that reads out the message. The researchers are working on these next steps in the process.

Several steps are still needed before making a silicon-based quantum computer, Petta said. Everyday computers process billions of bits, and although qubits are more computationally powerful, most experts agree that 50 or more qubits are needed to achieve quantum supremacy, where quantum computers would start to outshine their classical counterparts.

Daniel Loss, a professor of physics at the University of Basel in Switzerland who is familiar with the work but not directly involved, said: “The work by Professor Petta and collaborators is one of the most exciting breakthroughs in the field of spin qubits in recent years. I have been following Jason’s work for many years and I’m deeply impressed by the standards he has set for the field, and once again so with this latest experiment to appear in Nature. It is a big milestone in the quest of building a truly powerful quantum computer as it opens up a pathway for cramming hundreds of millions of qubits on a square-inch chip. These are very exciting developments for the field ¬– and beyond.”