Category Archives: Applications

STMicroelectronics (NYSE: STM) today revealed its contributions to an intelligent toothbrush system from Oral-B. ST’s motion-sensing and control chip inside the toothbrush help develop healthier brushing habits.

Brushing incorrectly can negatively affect oral health. To help people brush like their dental professional recommends and avoid these common oral-health issues, the Oral-B GENIUS intelligent toothbrush system combines revolutionary Position Detection technology with Triple Pressure Control and a Professional Timer.

ST’s low-power 3-axis accelerometer captures permanently the orientation of the toothbrush handle while the user is brushing. ST’s 8-bit STM8 microcontroller performs pre-processing of the accelerometer data and other housekeeping functions on the GENIUS toothbrush and leverages ST’s advanced packaging technologies for miniaturization.

“Our contribution to improving personal healthcare through an electronic toothbrush that brushes like your dental professional recommends is yet another example of how semiconductor technologies help people get more from life,” said Kevin Gagnon, Vice President of Central Sales, Americas Region, STMicroelectronics. “A powerful demonstration of the exceptional creativity of the Oral-B technology team, the GENIUS smart electronic toothbrush is a testament to the variety of highly innovative products that ST’s solutions can be used to develop and bring to market.”

Leti, an institute of CEA Tech, announced today it has joined the Stanford SystemX Alliance, a network of 100 renowned Stanford University professors and 27 world-class companies, joining forces in a pre-competitive environment to define tomorrow’s research strategies. Leti’s participation bridges the gap between two worlds – academia and industry. 

The alliance is a collaboration between Stanford researchers and over two-dozen leading global technology companies – such as Google, Huawei, Xilinx, Intel, Qualcomm, Toshiba, Infineon, and many more – that focuses on hardware and software at all levels of the system stack. Topics range from materials and devices to systems and applications in electronics, networks, energy, mobility, bio-interfaces, sensors and other technological domains.

Together, the SystemX partners are working on research strategies that should lead to a wide range of next generation applications, including the highly anticipated self-driving car and future artificial-intelligence systems that will improve performance and operation of our mobile, medical, smart-home solutions and devices.

Following his recent visit to Leti, Stanford System X Director Rick Bahr said, “Leti’s extensive, advanced clean room facilities and expertise are truly impressive, and I can see now that Stanford and Leti are very complementary. It makes real sense for us to find more ways to work together on developing new technologies and their demonstrators.”

“The alliance provides an avenue for worldwide strategic discussions and, more importantly, allows both research partners and industry leaders to stay ahead of the game,” said Barbara De Salvo, Leti’s scientific director.

“Leti brings its scientific excellence and expertise on technology transfer, and will have access to Stanford’s top-notch upstream research and network,” she added. “Stanford’s dynamic culture will inspire Leti on the road to new scientific territories and lead to strong programs with the Silicon Valley ecosystem.”

Leti will share its innovative research results during several SystemX events and explore ambitious, innovative and collaborative projects together with other partners of the Alliance.

Cypress Semiconductor Corp. (Nasdaq:  CY) and Hackster today announced a global design competition that gives engineers the opportunity to prototype their innovative ideas that sense the world around us for use in the growing Internet of Things (IoT) market, home appliances, and consumer and industrial applications. The Sensing the World Challenge will use Cypress’s easy-to-use CY8CKIT-048 PSoC Analog Coprocessor Pioneer Kit as the development hardware platform. Hackster will select a winner from three regions—the Americas, Asia Pacific and Australia, and Europe and Africa—and each will receive an Oculus Rift virtual reality headset and development kit. Designers can sign up and find more information at www.hackster.io/contests/cypress-sensing-the-world-contest.

“People generally associate the IoT with connectivity, but most next-gen applications start with the ability to sense real-world conditions,” said Adam Benzion, co-founder and CEO of Hackster. “This new design challenge unleashes the imaginations of the worldwide Hackster community. Thanks to the Cypress PSoC Analog Coprocessor, they can develop a huge range of innovative applications with its mix of sensor input combinations.”

“I can’t wait to see what the creative minds of the Hackster community will develop with the rich, flexible analog resources they have to work with in this design contest,” said John Weil, vice president of MCU marketing at Cypress. “The PSoC Analog Coprocessor allows engineers to simply create cost-effective systems with precise, highly sensitive analog sensors. And our intuitive PSoC Creator integrated design environment enables rapid prototyping and design iterations with hardware and software flexibility.”

Initial proposals for the Sensing the World Challenge will be accepted through 11:55 p.m. Pacific Time on October 30, 2016, and 100 entries will be selected to receive the PSoC Analog Coprocessor Pioneer Kit to create a prototype of their idea. Projects will be due by 11:55 p.m. Pacific Time on January 8, 2017 and the regional winners will be announced on January 18.

Cypress will be demonstrating its PSoC portfolio, including the PSoC Analog Coprocessor, at World Maker Faire from October 1-2, 2016 at the New York Hall of Science in booth number 3206 in Zone 3.

The PSoC Analog Coprocessor integrates efficient and powerful signal processing with an ARM® Cortex® M0+ core and programmable analog blocks, including a new Universal Analog Block (UAB) that can be configured with GUI-based software components. This combination simplifies the design of custom analog front ends for multiple sensor interfaces by allowing engineers to update sensor features quickly with no hardware or host processor software changes, while also reducing BOM costs. For example, in home automation applications, engineers can easily configure the device to continuously monitor multiple sensors, such as temperature, humidity, ambient light, motion and sound, allowing the host to stay in a standby low-power mode. Future design changes to support new sensor types can also be easily implemented by reconfiguring the programmable analog blocks. More information on the PSoC Analog Coprocessor is available at www.cypress.com/PSoCAnalog.

The design of custom sensor interfaces is enabled by Cypress’s free PSoC Creator Integrated Design Environment (IDE), which simplifies system design by enabling concurrent hardware and firmware development using PSoC Components—free embedded ICs represented by an icon in the IDE. Engineers can easily configure the programmable analog blocks in the PSoC Analog Coprocessor by dragging and dropping components on the PSoC Creator schematic and customizing them with graphical component configuration tools. The components offer fully engineered embedded initialization, calibration and temperature correction algorithms.

SiTime Corporation, a MEMS and analog semiconductor company and a wholly owned subsidiary of MegaChips Corporation (Tokyo Stock Exchange: 6875), today introduced an innovative Elite Platform encompassing Super-TCXOs (temperature compensated oscillators) and oscillators. These precision devices are engineered to solve long-standing timing problems in telecommunications and networking equipment.

“Network densification is driving rapid deployment of equipment in uncontrolled environments such as basements, curbsides, rooftops, and on poles. Precision timing components in these systems must now operate in the presence of high temperature, thermal shock, vibration and unpredictable airflow. Service providers are questioning if quartz technology is up to this challenge,” said Rajesh Vashist, CEO at SiTime. “Customers have enthusiastically validated SiTime’s MEMS-based Elite Platform, as it uniquely solves such environmental issues. We believe that our new Elite solutions will transform the $1.5 billiontelecommunications and networking timing market.”

Elite timing solutions are based on an innovative DualMEMS architecture with TurboCompensation. This architecture delivers exceptional dynamic performance with three key elements:

  • Robust, reliable, and proven TempFlat MEMS that eliminates activity dips and enables 30 times better vibration immunity than quartz
  • DualMEMS temperature sensing with 100% accurate thermal coupling that enables 40 times faster temperature tracking, which ensures the best performance under airflow and rapid temperature changes
  • Highly integrated mixed-signal circuits with on-chip regulators, a TDC (temperature to digital converter) and a low-noise PLL that deliver 5 times better immunity to power-supply noise, 30 uK temperature resolution that is 10 times better than quartz, and support for any frequency between 1 and 700 MHz

“New telecom infrastructure uses 4G/5G small cells and Synchronous Ethernet to increase network data capacity; the high-power components that are used in such systems will have high and constantly changing heat loads,” said Joe Madden, founder and principal analyst at Mobile Experts. “The dynamic performance of precision timing components during rapid temperature change will become a critical requirement in such equipment. MEMS technology inherently performs better in the presence of dynamic environmental conditions, and has become a very interesting alternative to quartz technology.”

MEMS & Sensors Industry Group (MSIG) today announced highlights of its twelfth annual business conference, MEMS & Sensors Executive Congress 2016 in Scottsdale, AZ on November 9-11, 2016. Spanning mobile & wireless, automotive, medical devices, energy, and the intersection of human-computer networks, speakers will share some of the most compelling examples of MicroElectroMechanical Systems (MEMS)/sensors technology with an executive audience from the MEMS and sensors supply chain.

AT&T VP of Product Development for Internet of Things (IoT) Solution Cameron Coursey will offer a carrier’s perspective on technologies advancing the IoT, including low-power wide-area cellular technologies, standard radio module configurations, embedded SIMs, cloud-based data storage and virtualized networks. As part of his keynote, Coursey will explain how MEMS/sensors suppliers can play a more pivotal role in IoT applications such as asset monitoring, wearables, connected cars and smart cities.

During his keynote, Local Motors General Manager Phillip Rayer will exhort Congress attendees to fearlessly embrace co-creation and open collaboration, which he believes could change the world of transportation. As a case in point, Rayer will share his company’s experiences working with a global network of inspired innovators as Local Motors prepares the first 3D-printed autonomous car for highway-ready certification.

“Invention, co-creation and collaboration will continue to fuel the greatest achievements in MEMS and sensors,” said Karen Lightman, executive director, MEMS & Sensors Industry Group. “Attendees of this year’s MEMS & Sensors Executive Congress will hear how both titans of industry and nimble innovators approach technological innovation holistically — leveraging internal and external ecosystems to introduce meaningful products to market. And for the first time, they can also delve deeper into current, near-term and future MEMS/sensors solutions during breakout sessions led by both business and academic experts.”

Other highlighted presentations include:

For the complete agenda, please visit: http://msigevents.org/msec2016/agenda/

EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is increasing its focus on bringing its high-volume manufacturing process solutions and services to the biotechnology and medical device market. EVG products supporting this market include the company’s substrate bonding, hot-embossing, micro contact printing and UV-based nanoimprint lithography (NIL) systems. In addition, EVG will offer its world-class applications support, rapid prototyping and pilot-line production services. Customers in the biotechnology and medical markets can now leverage these patterning and sealing solutions–which have been production-proven in other industrial markets such as semiconductors, MEMS and photonics–for volume production of next-generation biotechnology devices featuring micrometer or nanometer-scale patterns and structures on larger-format substrates.

EV Group nanoimprint lithography solutions enable parallel processing of biotechnology and medical devices on large-area substrates.

EV Group nanoimprint lithography solutions enable parallel processing of biotechnology and medical devices on large-area substrates.

Over the past several decades, miniaturization of biotechnology devices has significantly improved clinical diagnostics, pharmaceutical research and analytical chemistry. Modern biotechnology devices–such as biomedical MEMS (bioMEMS) for diagnostics, cell analysis and drug discovery–are often chip-based and rely on close interaction of biological substances at the micro- and nanoscale. According to the market research and strategy consulting firm Yole Développement, an increasing number of healthcare applications are using bioMEMS components, while the bioMEMS market is expected to triple from US$2.7 billion in 2015 to US$7.6 billion in 2021. Microfluidic devices will represent the majority (86 percent) of the total bioMEMS market in 2021, driven by applications such as Point-of-Need testing, clinical and veterinary diagnostics, pharmaceutical and life science research, and drug delivery*.

Precise and cost-effective micro-structuring technologies are essential to successfully commercialize these products in a rapidly growing market that has stringent requirements and high regulatory hurdles. Traditional process approaches such as injection molding are often unable to produce the extremely small structures and surface patterns with the precision, quality and repeatability increasingly required for these demanding applications, or they require extensive effort in process development. At the same time, solutions are needed to scale up from discrete production of devices to batch processing of multiple devices on a single substrate in order to achieve the economies of scale required to commercialize these products.

NIL has evolved from a niche technology to a powerful high-volume manufacturing method that is able to produce a multitude of structures of different sizes and shapes on a large scale–such as highly complex microfluidic channels and surface patterns–by imprinting either into a biocompatible resist or directly into the bulk material. In addition to structuring technologies, sealing and encapsulation is a central process for establishing confined microfluidic channels. Thus, bonding of different device layers, capping layers or interconnection layers is a key process that can be implemented together with NIL in a cost-effective large-area batch process. As the pioneer as well as market and technology leader in NIL and wafer bonding, EVG is leading the charge in supporting the infrastructure and growth of the biotechnology market by leveraging its products for use in biotechnology applications.

EVG’s NIL solutions can produce a wide range of small structures (from hundreds of micrometers down to 20 nm) on a variety of substrate materials used in biotechnology applications, including glass, silicon and a variety of polymers (e.g., COC, COP, PMMA and PS). Each EVG NIL solution is uniquely suited for different production applications. For example, hot-embossing allows precise imprinting of larger structures as well as combinations of micro- and nanostructures, and is superior when replicating high-aspect ratio features or when using very-thin substrates. UV-NIL provides very-high precision, pattern fidelity and throughput in the nanometer-range. Micro contact printing, which is another NIL option, can transfer materials such as biomolecules onto a substrate in a distinct pattern.

With its established wafer-scale bonding equipment, EVG can also offer sealing and bonding processes that are well-aligned with NIL structuring technologies. A variety of different bonding options are available, ranging from advanced room-temperature bonding techniques to plasma activated bonding as well as high-quality hermetic sealing and vacuum encapsulation. Examples of typical solutions include EVG’s thermal bonding equipment for glass and polymer substrates, which provides excellent results by enabling high-pressure and temperature uniformities over large areas. EVG also offers its room-temperature selective adhesive transfer technology, which eases incorporation of bio-molecules prior to the encapsulation of the device.

“EVG has a long history of providing products and solutions for biomedical R&D, having installed the first hot embossing system for emerging bioMEMS and microfluidic research applications more than 15 years ago,” stated Dr. Thomas Uhrmann, director of business development at EV Group. “The knowledge that EVG has built up in this space coupled with our experience in bringing innovative technologies into volume production in other markets has positioned us well to provide proven high-volume manufacturing processes and services to the bio-medical industry to support the production of next-generation biotechnology devices.”

In addition to equipment and process solutions, EVG also offers prototyping and pilot-line production services to customers out of its cleanroom facilities at its corporate headquarters in Austria as well as its subsidiaries in North America and Japan.

From the printing press to the jet engine, mechanical machines with moving parts have been a mainstay of technology for centuries. As U.S. industry develops smaller mechanical systems, they face bigger challenges — microscopic parts are more likely to stick together and wear out when they make contact with each other.

To help make microscopic mechanical (micromechanical) systems perform reliably for advanced technologies, researchers at the National Institute of Standards and Technology (NIST) are getting get back to basics, carefully measuring how parts move and interact.

For the first time, the NIST researchers have measured the transfer of motion through the contacting parts of a microelectromechanical system at nanometer and microradian scales. Their test system consisted of a two-part linkage, with the motion of one link driving the other. The team not only resolved the motion with record precision but also studied its performance and reliability.

(Top) Image showing the microelectromechanical linkage that converts translation (straight arrow) into rotation (curved arrow). The red box indicates the region of the rotating part that has fluorescent nanoparticles on it. (Bottom) Image showing the fluorescent nanoparticles on the rotating part of the linkage. Tracking the nanoparticles enables tests of the performance and reliability of the system. Credit: NIST

(Top) Image showing the microelectromechanical linkage that converts translation (straight arrow) into rotation (curved arrow). The red box indicates the region of the rotating part that has fluorescent nanoparticles on it. (Bottom) Image showing the fluorescent nanoparticles on the rotating part of the linkage. Tracking the nanoparticles enables tests of the performance and reliability of the system. Credit: NIST

Lessons learned from the study could impact the fabrication and operation of various micromechanical systems, including safety switches, robotic insects and manufacturing platforms.

The motion of micromechanical systems is sometimes too small — displacements of only a few nanometers, or one billionth of a meter, with correspondingly small rotations of a few microradians — for existing measurement methods to resolve. One microradian is the angle corresponding to the length of an arc of about 10 meters along the circumference of the earth.

“There has been a gap between fabrication technology and motion metrology — the processes exist to manufacture complex mechanical systems with microscopic parts, but the performance and reliability of these systems depends on motion that has been difficult to measure. We are closing that gap,” said Samuel Stavis, a project leader at NIST.

“Despite how simple this system appears, no one had measured how it moves at the length and angle scales that we investigated,” said researcher Craig Copeland of NIST and the University of Maryland. “Before commercial manufacturers can optimize the design of more complex systems such as microscopic switches or motors, it is helpful to understand how relatively simple systems operate under various conditions.”

The measurements, which the researchers report in Microsystems & Nanoengineering, rely on optical microscopy to track surface features on the moving parts. The manufacturer can build in the surface features during the fabrication process so that the system is ready for measurement right out of the foundry. Or, the researchers can apply fluorescent nanoparticles to the system after fabrication for improved precision. NIST researchers introduced this measurement method in a previous study and have used related methods to track the motion and interaction of other small systems. Importantly, the ability to simultaneously track the motion of multiple parts in a micromechanical system allowed the researchers to study the details of the interaction.

In their experiment, the researchers studied the transfer of motion through a mechanical linkage, which is a system of parts connected in order to control forces and movement in machines. The test system had two links that connected and disconnected through a joint, which is the point at which the links apply forces to each other. The electrical heating and thermal expansion of one link drove the rotation of the other link around a pivot. The researchers developed a model of how the system should move under ideal operating conditions, and used that model to understand their measurements of how the system moved under practical operating conditions. The team found that play in the joint between the links, which is necessary to allow for fabrication tolerances and prevent the parts from jamming, had a central role in the motion of the system. Specifically, the amount of play was an important factor in determining precisely how the links coupled and uncoupled, and how repeatable this transfer of motion could be.

As long as the electrical input driving the system was relatively free of noise, the system worked surprisingly well, transferring the motion from one part to another very consistently for thousands of operating cycles. “It was perfectly repeatable within measurement uncertainty,” said Copeland, “and reasonably consistent with our ideal model.”

That is important, he notes, because some researchers expect that the friction between small parts would degrade the performance and reliability of such a system. Many engineers have even abandoned the idea of making micromechanical systems out of moving parts that make contact, switching to micromechanical systems with parts that move by flexing to avoid making contact with each other.

The results suggest that micromechanical systems that transfer motion through contacting parts “may have underexplored applications,” said Stavis.

However, the researchers found that when they added a normal amount of electrical noise to the driving mechanism, the system became less reliable and did not always succeed in transferring motion from one link to the other. Further, exposure of the system to atmospheric humidity for several weeks caused the parts to stick together, although the researchers could break them loose and get them moving again.

These findings indicate that while micromechanical systems have the potential to transfer motion between contacting parts with unexpectedly precise performance, the driving signal and operating environment are critical to the reliable output of motion.

The team now plans to improve their measurements and extend their work to more complex systems with many moving parts.

“Micromechanical systems have many potential commercial applications,” said Stavis. “We think that innovative measurements will help to realize that potential.”

Solid State Technology announced today that its premier semiconductor manufacturing conference and networking event, The ConFab, will be held at the iconic Hotel del Coronado in San Diego on May 14-17, 2017. A 30% increase in attendance in 2016 with a similar uplift expected in 2017, makes the venue an ideal meeting location as The ConFab continues to expand.

    

For more than 12 years, The ConFab, an invitation-only executive conference, has been the destination for key industry influencers and decision-makers to connect and collaborate on critical issues.

“The semiconductor industry is maturing, yet opportunities abound,” said Pete Singer, Editor-in-Chief of Solid State Technology and Conference Chair of The ConFab. “The Internet of Things (IoT) is exploding, which will result in a demand for “things” such as sensors and actuators, as well as cloud computing. 5G is also coming and will be the key technology for access to the cloud.”

The ConFab is the best place to seek a deeper understanding on these and other important issues, offering a unique blend of market insights, technology forecasts and strategic assessments of the challenges and opportunities facing semiconductor manufacturers. “In changing times, it’s critical for people to get together in a relaxed setting, learn what’s new, connect with old friends, make new acquaintances and find new business opportunities,” Singer added.

Dave Mount

David Mount

Solid State Technology is also pleased to announce the addition of David J. Mount to The ConFab team as marketing and business development manager. Mount has a rich history in the semiconductor manufacturing equipment business and will be instrumental in guiding continued growth, and expanding into new high growth areas.

Mainstream semiconductor technology will remain the central focus of The ConFab, and the conference will be expanded with additional speakers, panelists, and VIP attendees that will participate from other fast growing and emerging areas. These include biomedical, automotive, IoT, MEMS, LEDs, displays, thin film batteries, photonics and advanced packaging. From both the device maker and the equipment supplier perspective, The ConFab 2017 is a must-attend networking conference for business leaders.

The ConFab conference program is guided by a stellar Advisory Board, with high level representatives from GLOBALFOUNDRIES, Texas Instruments, TSMC, Cisco, Samsung, Intel, Lam Research, KLA-Tencor, ASE, NVIDIA, the Fab Owners Association and elsewhere.

Details on the invitation-only conference are at: www.theconfab.com. For sponsorship inquiries, contact Kerry Hoffman at [email protected]. For details on attending as a guest or qualifying as a VIP, contact Sally Bixby at [email protected].

By Zvi Or-Bach, President & CEO, MonolithIC 3D Inc.

As we have predicted two and a half years back, the industry is bifurcating, and just a few products pursue scaling to 7nm while the majority of designs stay on 28nm or older nodes.

Our March 2014 blog Moore’s Law has stopped at 28nm has recently been re-confirmed. At the time we wrote: “From this point on we will still be able to double the amount of transistors in a single device but not at lower cost. And, for most applications, the cost will actually go up.” This reconfirmation can be found in the following IBS cost analysis table slide, presented at the early Sept FD-SOI event in Shanghai.

Gate costs continue to rise each generation for FinFETs, IBS predicts.

Gate costs continue to rise each generation for FinFETs, IBS predicts.

As reported by EE Times – Chip Process War Heats Up, and quoting Handel Jones of IBS “28nm node is likely to be the biggest process of all through 2025”.

IBS prediction was seconded by “Samsung executive showed a foil saying it believes 28nm will have the lowest cost per transistor of any node.” The following chart was presented by Samsung at the recent SEMICON West (2016).

Zvi 2

And even Intel has given up on its “every two years” but still claims it can keep reducing transistor cost. Yet Intel’s underwhelming successes as a foundry suggests otherwise. We have discussed it in a blog titled Intel — The Litmus Test, and it was essentially repeated by SemiWiki’s Apple will NEVER use Intel Custom Foundry!

This discussion seems academic now, as the actual engineering costs of devices in advanced nodes have shown themselves to be too expensive for much of the industry. Consequently, and as predicted, the industry is bifurcating, with a few products pursuing scaling to 7nm while the majority of designs use 28nm or older nodes.

The following chart derived from TSMC quarterly earnings reports was published last week by Ed Sperling in the blog Stepping Back From Scaling:

Zvi 3

Yes, the 50-year march of Moore’s Law has ended, and the industry is now facing a new reality.

This is good news for innovation, as a diversity of choices helps support new ideas and new technologies such as 3D NAND, FDSOI, MEMS and others. These technologies will enable new markets and products such as the emerging market of IoT.

A good opportunity to learn more about these new scaling technologies is the IEEE S3S ’16, to be held in the Hyatt Regency San Francisco Airport, October 10th thru 13th, 2016. It starts with 3D and FDSOI tutorials, the emerging technologies for the IC future. CEA Leti is scheduled to give an update on their CoolCube program, Qualcomm will present some of their work on monolithic 3D, and three leading researchers from an imec, MIT, and Korea university collaboration will present their work on advanced monolithic 3D integration technologies. Many other authors will discuss their work on monolithic 3DIC and its ecosystem, in addition to tracks focused on SOI, sub-VT and dedicated sessions on IoT.

Thorlabs has expanded its piezoelectric line to include new types of piezoelectric actuators, low‐voltage piezoelectric chips, and discrete stacks with through holes, enabling a higher level of flexibility when integrating the actuators into other devices. These chips are ideal for laser tuning, micro‐ dispensing, and life‐science applications.

The chips can be manufactured with or without pre‐attached wires, with holes ranging from Ø2.0 mm to Ø6.0 mm, cross sections ranging from 5.0 mm × 5.0 mm to 10.0 mm × 10.0 mm, and thicknesses under 5.0 mm. Stacks are available in lengths from 5 mm to 100 mm, providing free stroke displacements up to 100 μm. Their in‐house manufacturing facility can also be deployed to provide custom dimensions, voltage ranges, and coatings upon request.

The piezoelectric chips are driven under a maximum voltage of 150 V, providing maximum free stroke displacements from 1.8 μm to 3.0 μm with sub‐millisecond response time. Through a precision grinding process, the accuracy of the design height is ensured to better than ±5 μm. The high accuracy makes it significantly easier to design devices around our piezoelectric chips, as it allows the users to have a loose tolerance when choosing their other components, and helps guarantee a better parallelism when employing multiple chips between two substrates.

“Reliability and durability of multilayer piezoelectric actuators are becoming increasingly important as the piezo application fields expand,” commented Cary Zhang, Piezo Product Line Manager. “Thorlabs’ multilayer piezo actuators are based on modified PZT‐5H ceramics, which are sintered at low temperatures (<1000 °C) to possess improved characteristics such as low electrical capacity, large displacement, and high stiffness.”

Besides the newly released piezo chips/stacks, Thorlabs manufactures a wide range of high quality piezo actuators, including chips, stacks, tubes, shear piezo and bimorphs. Modular, screw, and replaceable‐tip piezo actuators, including single axis, multi‐axis, closed‐loop and open‐loop actuators are also available.

Thorlabs, a vertically integrated photonics products manufacturer, was founded in 1989 to serve the laser and electro‐optics research market.

2016_09-16_Piezo-1