Category Archives: Applications

Graphene quantum dots made from coal, introduced in 2013 by the Rice University lab of chemist James Tour, can be engineered for specific semiconducting properties in either of two single-step processes.

Vials hold solutions with graphene quantum dots that fluoresce in different colors depending on the dots' size. Techniques to produce the dots in specific sizes using coal as a source were developed at Rice University. Credit: Tour Group/Rice University

Vials hold solutions with graphene quantum dots that fluoresce in different colors depending on the dots’ size. Techniques to produce the dots in specific sizes using coal as a source were developed at Rice University.
Credit: Tour Group/Rice University

In a new study this week in the American Chemical Society journal Applied Materials & Interfaces, Tour and colleagues demonstrated fine control over the graphene oxide dots’ size-dependent band gap, the property that makes them semiconductors. Quantum dots are semiconducting materials that are small enough to exhibit quantum mechanical properties that only appear at the nanoscale.

Tour’s group found they could produce quantum dots with specific semiconducting properties by sorting them through ultrafiltration, a method commonly used in municipal and industrial water filtration and in food production.

The other single-step process involved direct control of the reaction temperature in the oxidation process that reduced coal to quantum dots. The researchers found hotter temperatures produced smaller dots, which had different semiconducting properties.

Tour said graphene quantum dots may prove highly efficient in applications ranging from medical imaging to additions to fabrics and upholstery for brighter and longer-lasting colors.

“Quantum dots generally cost about $1 million per kilogram and we can now make them in an inexpensive reaction between coal and acid, followed by separation. And the coal is less than $100 per ton.”

The dots in these experiments all come from treatment of anthracite, a kind of coal. The processes produce batches in specific sizes between 4.5 and 70 nanometers in diameter.

Graphene quantum dots are photoluminescent, which means they emit light of a particular wavelength in response to incoming light of a different wavelength. The emitted light ranges from green (smaller dots) to orange-red (larger dots). Because the emitted color also depends on the dots’ size, this property can also be tuned, Tour said. The lab found quantum dots that emit blue light were easiest to produce from bituminous coal.

The researchers suggested their quantum dots may also enhance sensing, electronic and photovoltaic applications. For instance, catalytic reactions could be enhanced by manipulating the reactive edges of quantum dots. Their fluorescence could make them suitable for metal or chemical detection applications by tuning to avoid interference with the target materials’ emissions.

Building on the highly successful inaugural program Innovation Village, SEMICON Europa 2015 (October 6-8) will prominently feature second edition of this very successful program connecting early-stage companies with strategic investors, venture capitalists and other relevant stakeholders. The SEMICON Europa technology and business program agenda addresses the critical issues and challenges facing the microelectronics industries and provides information, education, and guidance for industry professional to move innovations and products to market. This year’s Innovation Village will bring together the most innovative European start-up and growth companies with leading investors from semiconductor and related industries.  New in 2015 is cooperation with the incubator “HighTech Startbahn” from Dresden with their Investors Congress “HighTech Venture Days.” As a result, the Innovation Village program has expanded to a four-day event with 60 selected companies, six high-tech sectors, speed presentations (pitches) and 60+ investors.

The goal of Innovation Village is to encourage exchanges between high-tech ventures and industry relevant investors. Participating start-up and growth companies have the opportunity to exhibit for three days at individual kiosks in the Innovation Village exhibition hall, presenting their innovations in a series of short pitches.  The Innovation Village features 40 private pitches to investors only, plus 20 public pitches — focusing on Information Communication Technology (ICT), Micro- and Nanotechnology and related applications, Materials Science, Environment and Energy Technology, Machinery and Plant Engineering, Industry 4.0 and Life Science and Automotive.

With a dedicated conference program on innovation and a live demonstration day for innovation products and applications, Innovation Village provides a uniquely valuable platform for both high-tech ventures as well as investors. The Innovation Village exhibition hall will also host several key industry companies and investors in exclusive booths with private meeting space.

“Saxony has gained a reputation for being one of Europe’s leading regions in innovative research,” says Heinz Kundert, president of SEMI Europe. “With the Innovation Village coming to Dresden for the first time, it is an excellent occasion to demonstrate the region’s capabilities for innovative technologies and products.”

“Dresden has proven to be one of Europe’s leading cities for IC manufacturing and microelectronics driven technology. The region is also host to a high number of innovations based start-ups,” says Bettina Vossberg, Chairwoman of the Board of Directors, HighTech Startbahn. “With the enhancement of both our strong concepts, it is an excellent occasion to demonstrate Europe’s capabilities in innovation and commercialization of new technologies.”

Innovation Village will represent the most viable new technology in Europe. Interested start-ups and growth companies are invited to fill out a Request for Participation (RFP) form online at the SEMICON Europa website (www.semiconeuropa.org). The ventures are encouraged to apply as early as possible. RFPs will be judged by SEMICON Europa Innovation Village Committee and HighTech Startbahn experts in venture capitalism and new technology investment: Tobias Jahn (3M New Ventures); Tony Chao (Applied Ventures LLC), Claus Schmidt (Robert Bosch Venture GmbH), Jim Traynor (TEL Venture), Christophe Desrumeaux (CEA Investissement), Jong Sang Choi (Samsung Ventures), Jean-Marc Girard (Air Liquid Electronics), Jean-Marc Bally (ASTER Capital), Erkki Aaltonen (VTT Ventures) and Pascal Vanluchene (Capital-E).

To encourage visibility for both investors and early stage innovative ventures, Innovation Village conferences and the exhibition will be free-of-charge for all SEMICON Europa visitors. Speakers will attract diverse visitors, including large companies, SMEs, and start-ups to the Innovation Village area. Dedicated innovation lounge areas set amidst the exhibition kiosks will allow visitors, investors and start-ups to interact with each other.

Samsung, Apple and Chinese OEMs will drive revenue in the light sensor market to grow 16 percent between 2013 and 2016, according to a new report released today from IHS Inc., a global source of critical information and insight.

The latest MEMS & Sensors report from IHS, Shining a Light on a Colourful Market, found that revenues will reach $767 million in 2016, a 16 percent rise in three years (2013 to 2016).

“Between 2013 and 2015, there has been a rapid adoption of light sensor units, mostly thanks to Samsung,” said Marwan Boustany, senior analyst for MEMS and Sensors at IHS Technology. “Samsung has led the mass adoption of RGB sensors, gesture sensors, optical pulse sensors and even UV sensors in this timeframe.”

Apple and Samsung lead the pack, but Chinese firms are on their heels

In 2014, Samsung accounted for 43 percent of light sensor spending in handsets. The company spent $271.8 million on light sensors in 2014, with a sizeable portion of this coming from the apathetically received pulse sensor.

Apple is the second largest buyer of light sensors after Samsung and spent $129.5 million in 2014. Apple accounted for 19 percent of light sensor spending in handsets in 2014 because Apple uses custom and high performance parts. IHS forecasts that by 2017, Apple will adopt a 3-in-1 package because solutions that offer both the size and performance it seeks should be available by this time.

Chinese Original Equipment Manufacturers (OEMs) represented 23 percent of light sensor spending in 2014, mostly on standard low cost components and a small percentage of high cost, high performance parts.

“The Chinese market remains a place where anything and everything can be tried as companies try to find any and every means to differentiate or at least match flagships from Samsung and Apple,” Boustany said. “Chinese OEMs are also characterized by preferring to have several suppliers for their sensors, ranging from three to six or more suppliers. The Chinese market is very competitive with price being the key element for most OEMs.”

Top sensor suppliers and new champions

Ams claimed the top spot in terms of revenue and units thanks to its range of customers and its key design wins with Samsung flagships and its spread across Apple products. Ams shipped 744 million sensors in 2014.

Maxim followed in second place. “Maxim managed to be a top performer in the consumer light sensor market, with 132 million light sensors shipped in 2014, with the majority of these being optical pulse sensors going into Samsung’s flagship devices.

The important news in 2014 is the rapid rise of companies like Sitronix, Elan and Everlight. “Sitronix has been successful at being a second or third source to a range of top tier companies, which means it can grow safely and rapidly,” Boustany said. “In 2014, it achieved about $25 million for a 69 percent revenue growth.”

Light_sensor_units_-_IHS_Technology

A team of Columbia Engineering researchers has invented a technology–full-duplex radio integrated circuits (ICs)–that can be implemented in nanoscale CMOS to enable simultaneous transmission and reception at the same frequency in a wireless radio. Up to now, this has been thought to be impossible: transmitters and receivers either work at different times or at the same time but at different frequencies. The Columbia team, led by Electrical Engineering Associate Professor Harish Krishnaswamy, is the first to demonstrate an IC that can accomplish this. The researchers presented their work at the International Solid-State Circuits Conference (ISSCC) in San Francisco on February 25.

“This is a game-changer,” says Krishnaswamy. “By leveraging our new technology, networks can effectively double the frequency spectrum resources available for devices like smartphones and tablets.”

CoSMIC (Columbia high-Speed and Mm-wave IC) Lab full-duplex transceiver IC that can be implemented in nanoscale CMOS to enable simultaneous transmission and reception at the same frequency in a wireless radio. Image courtesy Jin Zhou and Harish Krishnaswamy, Columbia Engineering

CoSMIC (Columbia high-Speed and Mm-wave IC) Lab full-duplex transceiver IC that can be implemented in nanoscale CMOS to enable simultaneous transmission and reception at the same frequency in a wireless radio.
Image courtesy Jin Zhou and Harish Krishnaswamy, Columbia Engineering

In the era of Big Data, the current frequency spectrum crisis is one of the biggest challenges researchers are grappling with and it is clear that today’s wireless networks will not be able to support tomorrow’s data deluge. Today’s standards, such as 4G/LTE, already support 40 different frequency bands, and there is no space left at radio frequencies for future expansion. At the same time, the grand challenge of the next-generation 5G network is to increase the data capacity by 1,000 times.

So the ability to have a transmitter and receiver re-use the same frequency has the potential to immediately double the data capacity of today’s networks. Krishnaswamy notes that other research groups and startup companies have demonstrated the theoretical feasibility of simultaneous transmission and reception at the same frequency, but no one has yet been able to build tiny nanoscale ICs with this capability.

“Our work is the first to demonstrate an IC that can receive and transmit simultaneously,” he says. “Doing this in an IC is critical if we are to have widespread impact and bring this functionality to handheld devices such as cellular handsets, mobile devices such as tablets for WiFi, and in cellular and WiFi base stations to support full duplex communications.”

The biggest challenge the team faced with full duplex was canceling the transmitter’s echo. Imagine that you are trying to listen to someone whisper from far away while at the same time someone else is yelling while standing next to you. If you can cancel the echo of the person yelling, you can hear the other person whispering.

“If everyone could do this, everyone could talk and listen at the same time, and conversations would take half the amount of time and resources as they take right now,” explains Jin Zhou, Krishnaswamy’s PhD student and the paper’s lead author. “Transmitter echo or ‘self-interference’ cancellation has been a fundamental challenge, especially when performed in a tiny nanoscale IC, and we have found a way to solve that challenge.”

Krishnaswamy and Zhou plan next to test a number of full-duplex nodes to understand what the gains are at the network level. “We are working closely with Electrical Engineering Associate Professor Gil Zussman’s group, who are network theory experts here at Columbia Engineering,” Krishnaswamy adds. “It will be very exciting if we are indeed able to deliver the promised performance gains.”

Borrowing a trick from nature, engineers from the University of California at Berkeley have created an incredibly thin, chameleon-like material that can be made to change color — on demand — by simply applying a minute amount of force.

This new material-of-many-colors offers intriguing possibilities for an entirely new class of display technologies, color-shifting camouflage, and sensors that can detect otherwise imperceptible defects in buildings, bridges, and aircraft.

“This is the first time anybody has made a flexible chameleon-like skin that can change color simply by flexing it,” said Connie J. Chang-Hasnain, a member of the Berkeley team and co-author on a paper published today in Optica, The Optical Society’s (OSA) new high-impact journal.

By precisely etching tiny features — smaller than a wavelength of light — onto a silicon film one thousand times thinner than a human hair, the researchers were able to select the range of colors the material would reflect, depending on how it was flexed and bent.

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A Material that’s a Horse of a Different Color

The colors we typically see in paints, fabrics, and other natural substances occur when white, broad spectrum light strikes their surfaces. The unique chemical composition of each surface then absorbs various bands, or wavelengths of light. Those that aren’t absorbed are reflected back, with shorter wavelengths giving objects a blue hue and longer wavelengths appearing redder and the entire rainbow of possible combinations in between. Changing the color of a surface, such as the leaves on the trees in autumn, requires a change in chemical make-up.

Recently, engineers and scientists have been exploring another approach, one that would create designer colors without the use of chemical dyes and pigments. Rather than controlling the chemical composition of a material, it’s possible to control the surface features on the tiniest of scales so they interact and reflect particular wavelengths of light. This type of “structural color” is much less common in nature, but is used by some butterflies and beetles to create a particularly iridescent display of color.

Controlling light with structures rather than traditional optics is not new. In astronomy, for example, evenly spaced slits known as diffraction gratings are routinely used to direct light and spread it into its component colors. Efforts to control color with this technique, however, have proved impractical because the optical losses are simply too great.

The authors of the Optica paper applied a similar principle, though with a radically different design, to achieve the color control they were looking for. In place of slits cut into a film they instead etched rows of ridges onto a single, thin layer of silicon. Rather than spreading the light into a complete rainbow, however, these ridges — or bars — reflect a very specific wavelength of light. By “tuning” the spaces between the bars, it’s possible to select the specific color to be reflected. Unlike the slits in a diffraction grating, however, the silicon bars were extremely efficient and readily reflected the frequency of light they were tuned to.

Flexibility Is the Key to Control

Since the spacing, or period, of the bars is the key to controlling the color they reflect, the researchers realized it would be possible to subtly shift the period — and therefore the color — by flexing or bending the material.

“If you have a surface with very precise structures, spaced so they can interact with a specific wavelength of light, you can change its properties and how it interacts with light by changing its dimensions,” said Chang-Hasnain.

Earlier efforts to develop a flexible, color shifting surface fell short on a number of fronts. Metallic surfaces, which are easy to etch, were inefficient, reflecting only a portion of the light they received. Other surfaces were too thick, limiting their applications, or too rigid, preventing them from being flexed with sufficient control.

The Berkeley researchers were able to overcome both these hurdles by forming their grating bars using a semiconductor layer of silicon approximately 120 nanometers thick. Its flexibility was imparted by embedding the silicon bars into a flexible layer of silicone. As the silicone was bent or flexed, the period of the grating spacings responded in kind.

The semiconductor material also allowed the team to create a skin that was incredibly thin, perfectly flat, and easy to manufacture with the desired surface properties. This produces materials that reflect precise and very pure colors and that are highly efficient, reflecting up to 83 percent of the incoming light.

Their initial design, subjected to a change in period of a mere 25 nanometers, created brilliant colors that could be shifted from green to yellow, orange, and red – across a 39-nanometer range of wavelengths. Future designs, the researchers believe, could cover a wider range of colors and reflect light with even greater efficiency.

Chameleon Skin with Multiple Applications

For this demonstration, the researchers created a one-centimeter square layer of color-shifting silicon. Future developments would be needed to create a material large enough for commercial applications.

“The next step is to make this larger-scale and there are facilities already that could do so,” said Chang-Hasnain. “At that point, we hope to be able to find applications in entertainment, security, and monitoring.”

For consumers, this chameleon material could be used in a new class of display technologies, adding brilliant color presentations to outdoor entertainment venues. It also may be possible to create an active camouflage on the exterior of vehicles that would change color to better match the surrounding environment.

More day-to-day applications could include sensors that would change color to indicate that structural fatigue was stressing critical components on bridges, buildings, or the wings of airplanes.

“This is the first time anyone has achieved such a broad range of color on a one-layer, thin and flexible surface,” concluded Change-Hasnain. “I think it’s extremely cool.”

IC Insights’ March Update to the 2015 McClean Report (being released later this month) refreshes the forecasts for 33 major IC product categories through 2019.  The complete list of all 33 major IC product categories ranked by the updated forecast growth rates for 2015 is shown in Figure 1.  Eleven product categories (led by Automotive Special Purpose Logic, DRAM, and Automotive Application-Specific Analog devices) are expected to exceed the 7 percent growth rate forecast for the total IC market this year.  Five of the eleven categories are forecast to see double-digit growth in 2015.  The total number of IC categories forecast to register sales growth in 2015 drops slightly to 27 products from 28 in 2014.

IC Insights forecasts a solid growth year for automotive-specific ICs.  In addition to Automotive Special Purpose Logic and Automotive Application-Specific Analog, “intelligent” cars are contributing to growth in the 32-bit MCU market. Driver information systems, throttle control, and semi-autonomous driving features such as self-parking, advanced cruise control, and collision-avoidance are some of the systems that rely on 32-bit MCUs.  In the next few years, complex 32-bit MCUs are expected to account for over 25 percent of the processing power in vehicles.

Automotive is forecast to be among the strongest electronic systems market in 2015.  The automotive segment is expected to register a compound annual growth rate of 6.5 percent in the 2014-2019 timeperiod compared to projected CAGRs of 6.8 percent for communications, 4.3 percent for consumer, 4.2 percent for computer, 4.5 percent for industrial, and 2.7 percent for government/military.  Despite automotive being one of the fastest growing electronic system markets over the next five years, automotive’s share of the total IC market is forecast to be only 8 percent in 2015 and remain less than 10 percent through 2019.

Big gains in the DRAM average selling price (ASP) the past two years resulted in greater-than-30 percent growth for the DRAM market in both 2013 and 2014.  DRAM ASP growth is expected to subside this year but demand for mobile DRAM is forecast to help this memory market category grow another 14 percent, placing it second among the 33 IC product categories shown, according to the newly refreshed forecast.

IC Insights 0312 Fig 1

 

Growth of Cellphone Application MPUs (10 percent) is forecast to remain near the top on the growth list for a fifth consecutive year. Meanwhile, the previously high-flying Tablet MPU market is forecast to sputter to just 3 percent growth in 2015 as demand for tablets slows and ASPs decline. Other IC categories that support mobile systems are expected to see better-than-industry-average growth in 2015, including gains of 9 percent for NAND flash and 8 percent for Power Management Analog.

Increased sales of medical/personal health electronic systems and the growth of the Internet of Things will help the markets for Industrial/Other Application-Specific Analog and 32-bit MCU devices outpace total IC market growth in 2015, as well.

Cypress Semiconductor Corp., in conjunction with its strategic partner IDEX ASA, today introduced a fingerprint reader solution designed to bring reliable, easy-to-use user authentication to smartphones, tablets, wearables and other mobile devices. The TrueTouch Fingerprint Reader uses proprietary sensing circuitry and a unique touch sensor design to provide best-in-class fingerprint image quality and pattern matching accuracy—improving security and delivering a superior user experience. The flexible solution enables designers to create custom home buttons with specialized shapes and sizes or to integrate the sensor into any mobile device’s industrial design or home button.

Consumers have increasingly embraced fingerprint readers as an alternative to keying in complex usernames, PINs and passwords. Mobile device OEMs and companies that sell via the Internet have gravitated toward the technology as the most secure way to validate a user’s identity. Demand for fingerprint readers in mobile devices is forecast to grow at a compound annual rate of 47 percent through 2019, reaching annual shipments of more than 700 million units.

Cypress will showcase its TrueTouch Fingerprint Reader, along with its extensive portfolio of capacitive touchscreen and touch-sensing solutions, at Mobile World Congress 2015 from March 2-5 in Hall 2, Stand 2C26MR at Fira Gran Via in Barcelona.

TrueTouch Fingerprint Reader block diagram

“The barriers to entry are considerable in the emerging market for fingerprint readers, in part because of the highly specialized IP and complete solution that is required to compete,” said T.J. Rodgers, President and CEO of Cypress. “Our relationship with IDEX will enable us to provide our top-tier mobile customers with a globally deployable fingerprint sensing solution, including a sensor, Android drivers and a software stack. With our industry-leading CapSense capacitive touch-sensing controllers, and our TrueTouch touchscreen solutions, Cypress will have an unmatched portfolio for mobile user interfaces.”

“We are extremely pleased with the performance of our new generation touch sensor developed in record time through our partnership with Cypress,” said Dr. Hemant Mardia, CEO of IDEX ASA. “The combination of IDEX’s breakthrough imaging performance, matching algorithm and patented sensor IP with Cypress’s award-winning programmable system-on-chip technology delivers best in class fingerprint matching. This product has been designed based on fundamentally new technology to meet our OEM customers’ demands for usability and security strength from small touch sensors.”

Today, at the 2015 International Solid State Circuits Conference (ISSCC), imec and Panasonic presented a transceiver chip for phase-modulated continuous-wave radar at 79GHz. This achievement demonstrates the potential of downscaled CMOS for cheap millimeter-wave (mm-wave) radar systems that can be used for accurate presence and motion detection.

Mm-wave radar technology is used in advanced driver assistance systems (ADAS) to improve safety in blurry conditions such as dust, fog and darkness, where image-based driver assistance systems lack robustness. It also offers longer range, higher precision and invisible mounting capabilities compared to ultrasound sensors. Imec’s 79GHz radar solution is based on advanced (28nm) CMOS technology, and it is an attractive alternative to the current SiGe-based technology as it offers a path to a low-power, compact and integrated solution. Moreover, at the expected high manufacturing volumes, CMOS technology is intrinsically low-cost.

Imec’s and Panasonic’s transceiver chip contains a control loop to suppress the spillover from the transmitter into the receiver without affecting the RF performance. With a power consumption of 260mW, the output power of the transmitter is 11dBm, while the RX gain is 35dB with a noise figure below 7dB and a TX-to-RX spillover suppression of 15dB. Thanks to the wide modulation bandwidth, the achievable depth resolution is 7.5cm.

“We are pleased with these excellent performance results on 28nm CMOS technology, and excited about the new opportunities they present for mm-wave radar systems, not only for automotive radar, but also for other applications such as smart homes, unmanned aerial vehicles (UAVs), robotics and others.” stated Wim Van Thillo, program director Perceptive Systems for the Internet of Things at imec. “This transceiver chip is an important milestone we have realized in our pursuit of a complete high-performance radar system fully integrated onto a single chip.”

Interested companies have access to imec’s CMOS-based 79GHz radar technology by joining imec’s industrial affiliation program or through IP licensing.

As the Internet of Things (IoT) continues to gain momentum, Freescale Semiconductor and its partners are tackling the most dire challenge the young movement has faced to date – the alarming lack of unified guidelines for ensuring the security of IoT applications.

Gartner, Inc. forecasts that 4.9 billion connected things will be in use in 2015, up 30 percent from 2014, and the figure will reach 25 billion by 2020. The analyst firm also projects that by 2017, 50 percent of IoT solutions will originate in startups that are less than three years old.

Meanwhile, the specter of an insecure and dangerous IoT is becoming increasingly worrisome; last month, the U.S. Federal Trade Commission publicly raised concerns of security risks associated with the rising number of interconnected systems and devices, and a top U.S. news organization reported that DARPA had wirelessly hacked into a major automotive OEM’s braking system. Additionally, a recent report from tech giant HP found that many IoT end-nodes are inherently insecure, with 70 percent of evaluated devices transmitting data via unencrypted network services.

Intent on applying its extensive expertise and proven technologies to address these trends, Freescale today announced several landmark programs intended to help establish standards and drive industry metrics for IoT security assurance. These initiatives include:

  • Teaming with the Embedded Microprocessor Benchmarking Consortium (EEMBC) to identify critical embedded security gaps and collaborate with other consortium members to establish guidelines that help IoT OEMs and system designers better secure IoT transactions and endpoints. Founding members of this coalition will convene in May at the second annual IoT Developers Conference in Santa Clara, California.
  • Establishing Freescale Security Labs – Centers of Excellence (CoEs) at Freescale’s headquarters and other locations worldwide, where the company, its partners and customers will focus on enhancement of IoT security technologies spanning from the cloud to the end-node. Alongside these CoEs is the commitment to allocate up to 10 percent of the company’s annual R&D budget on IoT security technologies.
  • Creating a program dedicated to educating startups on IoT security best practices and providing best-in-class security support through Freescale’s partner ecosystem.

Security challenges represent nothing less than an existential threat to the IoT movement, before it really has a chance to take off,” said Gregg Lowe, President and CEO of Freescale Semiconductor. “Freescale is addressing these challenges head-on to help ensure a future where secure solutions power every node of the IoT — from end devices to the network to the cloud.”

At this year’s Consumer Electronics Show in Las Vegas, the big theme was the “Internet of things” — the idea that everything in the human environment, from kitchen appliances to industrial equipment, could be equipped with sensors and processors that can exchange data, helping with maintenance and the coordination of tasks.

Realizing that vision, however, requires transmitters that are powerful enough to broadcast to devices dozens of yards away but energy-efficient enough to last for months — or even to harvest energy from heat or mechanical vibrations.

“A key challenge is designing these circuits with extremely low standby power, because most of these devices are just sitting idling, waiting for some event to trigger a communication,” explains Anantha Chandrakasan, the Joseph F. and Nancy P. Keithley Professor in Electrical Engineering at MIT. “When it’s on, you want to be as efficient as possible, and when it’s off, you want to really cut off the off-state power, the leakage power.”

This week, at the Institute of Electrical and Electronics Engineers’ International Solid-State Circuits Conference, Chandrakasan’s group will present a new transmitter design that reduces off-state leakage 100-fold. At the same time, it provides adequate power for Bluetooth transmission, or for the even longer-range 802.15.4 wireless-communication protocol.

“The trick is that we borrow techniques that we use to reduce the leakage power in digital circuits,” Chandrakasan explains. The basic element of a digital circuit is a transistor, in which two electrical leads are connected by a semiconducting material, such as silicon. In their native states, semiconductors are not particularly good conductors. But in a transistor, the semiconductor has a second wire sitting on top of it, which runs perpendicularly to the electrical leads. Sending a positive charge through this wire — known as the gate — draws electrons toward it. The concentration of electrons creates a bridge that current can cross between the leads.

But while semiconductors are not naturally very good conductors, neither are they perfect insulators. Even when no charge is applied to the gate, some current still leaks across the transistor. It’s not much, but over time, it can make a big difference in the battery life of a device that spends most of its time sitting idle.

Going negative

Chandrakasan — along with Arun Paidimarri, an MIT graduate student in electrical engineering and computer science and first author on the paper, and Nathan Ickes, a research scientist in Chandrakasan’s lab — reduces the leakage by applying a negative charge to the gate when the transmitter is idle. That drives electrons away from the electrical leads, making the semiconductor a much better insulator.

Of course, that strategy works only if generating the negative charge consumes less energy than the circuit would otherwise lose to leakage. In tests conducted on a prototype chip fabricated through the Taiwan Semiconductor Manufacturing Company’s research program, the MIT researchers found that their circuit spent only 20 picowatts of power to save 10,000 picowatts in leakage.

To generate the negative charge efficiently, the MIT researchers use a circuit known as a charge pump, which is a small network of capacitors — electronic components that can store charge — and switches. When the charge pump is exposed to the voltage that drives the chip, charge builds up in one of the capacitors. Throwing one of the switches connects the positive end of the capacitor to the ground, causing a current to flow out the other end. This process is repeated over and over. The only real power drain comes from throwing the switch, which happens about 15 times a second.

Turned on

To make the transmitter more efficient when it’s active, the researchers adopted techniques that have long been a feature of work in Chandrakasan’s group. Ordinarily, the frequency at which a transmitter can broadcast is a function of its voltage. But the MIT researchers decomposed the problem of generating an electromagnetic signal into discrete steps, only some of which require higher voltages. For those steps, the circuit uses capacitors and inductors to increase voltage locally. That keeps the overall voltage of the circuit down, while still enabling high-frequency transmissions.

What those efficiencies mean for battery life depends on how frequently the transmitter is operational. But if it can get away with broadcasting only every hour or so, the researchers’ circuit can reduce power consumption 100-fold.