Category Archives: Applications

STMicroelectronics (NYSE: STM) revealed its highly integrated mobile-security solution, the ST54J, a system-on-chip (SoC) containing an NFC (Near-Field Communication) controller, Secure Element, and eSIM. The SoC delivers performance-boosting integration for mobile and IoT devices, with the added benefit of ST’s software-partner ecosystem for smoother user experiences in mobile payments and e-ticketing transactions, as well as more convenient, remote, mobile provisioning to support multiple operator subscriptions.

“As mobile devices require more security and connectivity in an ever-shrinking PCB footprint, the ST54J will help designers simplify assembly and reduce bill-of-material costs,” said Laurent Degauque, Marketing Director, Secure Microcontroller Division, STMicroelectronics. “ST’s established ecosystem of third-party software partners provides access to eSIM and eSE solutions that are not only EMVCo and GSMA-SAS certifiable, but also tested for interoperability and validated with numerous Mobile Network Operators (MNOs), custom profiles and application providers worldwide.”

Spearheading the fourth generation of ST’s proven embedded Secure Element family, the single-chip ST54J ensures faster contactless interaction than a discrete chipset by eliminating performance-limiting off-chip data exchanges between the Secure Element and NFC controller. In addition, a faster, state-of-the-art core for each function further accelerates contactless transactions with mobile terminals and enhances roaming by supporting secure-element cryptographic protocols used worldwide, including FeliCa® and MIFARE®.

Packaging and design flexibility comes from the space savings of integrating three key functions onto a single chip. In addition, ST used its NFC booster technology to enhance the performance of the NFC controller, allowing it to establish robust contactless connections with a small-size antenna, allowing designers even more generous freedom to manage space inside the device and minimize the thickness of new smartphone generations.

ST delivers the ST54J to customers with NFC firmware and the GlobalPlatform V2.3 secure element Operating System, which provides best-in-class cryptographic performance and optimum eSIM interoperability. The OS also allows flexible configurations to support eSE-only or combined functionality. In addition, as the first chip maker accredited by the GSMA to personalize eSIMs for mobiles and connected IoT devices onto WLCSP packages, ST can shrink the supply chain and accelerate delivery to manufacturers.

A research team comprising members from City University of Hong Kong (CityU), Harvard University and renowned information technologies laboratory has successfully fabricated a tiny on-chip lithium niobate modulator, an essential component for the optoelectronic industry. The modulator is smaller, more efficient with faster data transmission and costs less. The technology is set to revolutionise the industry.

The new tiny modulator drives data at higher speeds and lower costs. Illustration credit: Second Bay Studios/Harvard SEAS

The electro-optic modulator produced in this breakthrough research is only 1 to 2 cm long and its surface area is about 100 times smaller than traditional ones. It is also highly efficient – higher data transmission speed with data bandwidth tripling from 35 GHz to 100 GHz, but with less energy consumption and ultra-low optical losses. The invention will pave the way for future high-speed, low power and cost-effective communication networks as well as quantum photonic computation.

The research project is titled “Integrated lithium niobate electro-optic modulators operating at CMOS-compatible voltages” and was published in the latest issue of the highly prestigious journal Nature.

Electro-optic modulators are critical components in modern communications. They convert high-speed electronic signals in computational devices such as computers to optical signals before transmitting them through optical fibres. But the existing and commonly used lithium niobate modulators require a high drive voltage of 3 to 5V, which is significantly higher than 1V, a voltage provided by a typical CMOS (complementary metal-oxide-semiconductor) circuitry. Hence an electrical amplifier that makes the whole device bulky, expensive and high energy-consuming is needed.

Dr Wang Cheng, Assistant Professor in the Department of Electronic Engineering at CityU and co-first author of the paper, and the research teams at Harvard University and Nokia Bell Labs have developed a new way to fabricate lithium niobate modulator that can be operated at ultra-high electro-optic bandwidths with a voltage compatible with CMOS.

“In the future, we will be able to put the CMOS right next to the modulator, so they can be more integrated, with less power consumption. The electrical amplifier will no longer be needed,” said Dr Wang.

Thanks to the advanced nano fabrication approaches developed by the team, this modulator can be tiny in size while transmitting data at rates up to 210 Gbit/second, with about 10 times lower optical losses than existing modulators.

“The electrical and optical properties of lithium niobate make it the best material for modulator. But it is very difficult to fabricate in nanoscale, which limits the reduction of modulator size,” Dr Wang explains. “Since lithium niobate is chemically inert, conventional chemical etching does not work well with it. While people generally think physical etching cannot produce smooth surfaces, which is essential for optical transmission, we have proved otherwise with our novel nano fabrication techniques.”

With optical fibres becoming ever more common globally, the size, the performance, the power consumption and the costs of lithium niobate modulators are becoming a bigger factor to consider, especially at a time when the data centres in the information and communications technology (ICT) industry are forecast to be one of the largest electricity users in the world.

This revolutionary invention is now on its way to commercialisation. Dr Wang believes that those who look for modulators with the best performance to transmit data over long distances will be among the first to get in touch with this infrastructure for photonics.

Dr Wang began this research in 2013 when he joined Harvard University as a PhD student at Harvard’s John A. Paulson School of Engineering and Applied Sciences. He recently joined CityU and is looking into its application for the coming 5G communication together with the research team at the State Key Laboratory of Terahertz and Millimeter Waves at CityU.

“Millimetre wave will be used to transmit data in free space, but to and from and within base stations, for example, it can be done in optics, which will be less expensive and less lossy,” he explains. He believes the invention can enable applications in quantum photonics, too.

STMicroelectronics (NYSE: STM) and Leti, a research institute of CEA Tech, today announced their cooperation to industrialize GaN (Gallium Nitride)-on-Silicon technologies for power switching devices. This power GaN-on-Si technology will enable ST to address high-efficiency, high-power applications, including automotive on-board chargers for hybrid and electric vehicles, wireless charging, and servers.

The collaboration focuses on developing and qualifying advanced power GaN-on-Silicon diode and transistor architectures on 200mm wafers, a market that the research firm IHS Markit estimates to grow at a CAGR of more than 20 percent from 2019 to 2024[1]. Together, in the framework of IRT Nanoelec, ST and Leti are developing the process technology on Leti’s 200mm R&D line and expect to have validated engineering samples in 2019. In parallel, ST will set up a fully qualified manufacturing line, including GaN/Si hetero-epitaxy, for initial production running in ST’s front-end wafer fab in Tours, France, by 2020.

In addition, given the attractiveness of GaN-on-Si technology for power applications, Leti and ST are assessing advanced techniques to improve device packaging for the assembly of high power-density power modules.

“Recognizing the incredible value of wide-bandgap semiconductors, ST’s contributions in Power GaN-on-Si manufacturing and packaging technologies with CEA-Leti move to arm us with the industry’s most complete portfolio of GaN and SiC products and capabilities, on top of our proven competence to manufacture high-quality, reliable products in volume,” said Marco Monti, President Automotive and Discrete Group, STMicroelectronics.

“Leveraging Leti’s 200mm generic platform, Leti’s team is fully committed to supporting ST’s strategic GaN-on-Si power-electronics roadmap and is ready to transfer the technology onto ST’s dedicated GaN-on-Si manufacturing line in Tours. This co-development, involving teams from both sides, leverages the IRT Nanoelec framework program to broaden the required expertise and innovate from the start at device and system levels,” said Leti CEO Emmanuel Sabonnadiere.

Leti, a research institute of CEA Tech, today announced the launch of the REDFINCH consortium to develop the next generation of miniaturized, portable optical sensors for chemical detection in both gases and liquids. Initial target applications are in the petrochemical and dairy industries.

The consortium of eight European research institutes and companies will focus on developing novel, high-performance, cost-effective chemical sensors, based on mid-infrared photonic integrated circuits (MIR PICs). Silicon PICs — integrating optical circuits onto millimeter-size silicon chips — create extremely robust miniature systems, in which discrete components are replaced by on-chip equivalents. This makes them easier to use and reduces their cost dramatically, expected at least by a factor of 10.

To develop these chemical sensors, the consortium must overcome the significant challenge of implementing these capabilities in the important mid-infrared region (2-20 μm wavelength range), where many important chemical and biological species have strong absorption fingerprints. This allows both the detection and concentration measurement of a wide range of gases, liquids and biomolecules, which is crucial for applications such as health monitoring and diagnosis, detection of biological compounds and monitoring of toxic gases.

Initially, REDFINCH will focus on three specific applications:

  • Process gas analysis in refineries
  • Gas leak detection in petrochemical plants and pipelines
  • Protein analysis in liquids for the dairy industry.

Silicon photonics leverages the advantages of high-performance CMOS technology, providing low-cost mass manufacturing, high-fidelity reproduction of designs and access to high-refractive index contrasts that enable high-performance nanophotonics.

“Despite the mid-infrared wavelength region’s importance for a wide range of applications, current state-of-the-art sensing systems in the MIR tend to be large and delicate. This significantly limits their spreading in real-world applications,” said Jean-Guillaume Coutard, an instrumentation engineer at Leti, which is coordinating the project. “By harnessing the power of photonic integrated circuits, using hybrid and monolithic integration of III-V diode and interband cascade and quantum cascade materials with silicon, the consortium will create high-performance, cost-effective sensors for a number of industries.” 

In addition to Leti, whose expertise includes the design and manufacture of PICs on a 200mm pilot line and integrated photoacoustic cells on silicon, the consortium members and contributions include:

  • Cork Institute of Technology (Ireland) – PIC design & fabrication, hybrid integration
  • Université de Montpellier (France) – Laser growth on Si, photodetector growth
  • Technische Universität Wien (Austria) – Liquid spectroscopy, assembly/test of sensors
  • mirSense (France) – MIR sensor products, laser module integration
  • Argotech a.s. (Czech Republic) Assembly/packaging of PICs
  • Fraunhofer IPM (Germany) – Gas spectroscopy, instrument design/assembly
  • Endress+Hauser (Germany) Process gas analysis and expertise, testing validation.

SEMI announced today the September 18 deadline for presenters to submit abstracts for the annual SEMI Flexible Hybrid Electronics (FLEX) and MEMS and Sensors Technical Conference (MSTC). The co-located gathering, February 18-21, 2019, in Monterey, California, will feature technical presentations of more than 135 peer-reviewed manuscripts covering leading materials and methods that can enhance an expanding range of markets for microelectronics.

FLEX 2019 sessions will feature demonstrations of flexible hybrid and printed electronics products, equipment, and materials, as well as the unique electronics applications they enable.

MSTC 2019 sessions will address wearables, point of care medical devices, food delivery, and agriculture platforms, remote monitoring systems and other trending applications.

Both events will present opening day keynotes and a panel discussion, networking events, technical sessions on emerging and advanced electronics, tech courses and the annual FLEXI Awards Ceremony.  The conference will feature a special student poster session to highlight student projects related to either flexible electronics or MEMS and sensors and will conclude with an awards ceremony.

NextFlex, The Flex Group, Nano Bio Manufacturing Consortium and MEMS & Sensors Industry Group will hold several leadership meetings throughout the week in Monterey.

Selected FLEX and MSTC speakers will present to more than 700 executives, product marketing managers, business development professionals, researchers and engineers from the flexible, hybrid and printed electronics value chain, as well as the MEMS and Sensors industries; 400 companies, universities, R&D labs and government agencies; and, leading industry analysts and media from around the world. Technical abstracts are due September 28, 2018, and can be submitted here for FLEX and here for MSTCSubmissions are FREE and notifications of acceptance will be issued October 19.

FLEX 2019 will cover the following topics:

1. Application market segments and IOT for:

  • Agriculture
  • Consumer Electronics and Agriculture
  • Consumer Electronics: Appliances, Wearables & Textiles
  • Smart Infrastructure: Buildings, Surfaces & Lighting
  • Smart Manufacturing
  • Smart MedTech: Health and Wellness & Human Performance Monitoring
  • Smart Transportation: Automotive, Aircraft & Public Transit

2. Flexible electrical components for:

  • Advanced Packaging
  • Batteries & Energy Sources
  • Flexible Displays
  • Lighting
  • Other Hybrid Devices
  • Sensors
  • TFTs, Memory & Logic
  • User Interface

3. Materials for:

  • Barrier Films
  • Conductors, Insulators & Semiconductors
  • Electronic Fibers & Fabrics
  • Functional Inks
  • ITO & ITO Replacements
  • Substrates & Substrate Treatments

4. Processes and manufacturing for:

  • Equipment & Metrology
  • Failure & Lifetime Reliability
  • Hybrid Printing Processes
  • Integrated Manufacturing
  • Integration of Hybrid Devices
  • Multi-layer Additive Printing
  • Roll to Roll & Web Processing
  • System Interconnects
  • Testing

5. Standards for:

  • Design & Modeling File Format
  • Processes & Manufacturing
  • Reliability & Qualifications

MSTC 2019 will cover wearables, point-of-care medical devices, food delivery and agriculture platforms and remote monitoring systems such as environmental, weather, energy, industrial IoT and more. The conference will focus on the technical aspects of system-level solutions for these areas incorporating MEMS/Sensor and Actuators, Unique Applications and Innovative Technologies.

The co-location of FLEX and MSTC is organized by SEMI Americas to connect more than 2,000 member companies and 1.3 million professionals worldwide to advance the technology and business of flexible electronics and MEMS and Sensors.

Leti, a research institute of CEA Tech, and EFI Automotive, an international supplier of sensors, actuators and embedded smart modules for the automotive industry, today announced a project to dramatically improve reliability and response time of low-cost automotive components by equipping the devices with sophisticated model predictive control techniques.

Model predictive control (MPC) is an advanced method of process control that makes use of a model of the system to predict its behavior. The control law is based on an optimization technique that computes the system inputs, taking into account the reference that the system output has to follow, together with the effort (energy) that is applied on the system inputs and some constraints that may exist within the system, typically saturation of the system inputs.

MPC also allows electronics equipment to perform at levels that are not possible with standard control laws, e.g. proportional-integral-derivative (PID) controllers. But this sophisticated technique is rarely used on low-cost, low-capability computing units, because it requires solving optimization problems under constraints, which is a complex computational task.

Leti and EFI Automotive are evaluating the implementation of MPC on low-cost, low-computational-capability computing platforms, such as microcontrollers or low-cost digital signal processors (DSPs). The goal is to improve the dynamics of the systems considered, because automotive certification is easier when the control law is implemented on a DSP or a microcontroller. An example of EFI Automotive product, which will benefit from the MPC implementation, is the Air Loop Actuator (Figure 1).

Figure 1: EFI Air Loop Actuator Prototype (200ms response time). Numerical command and power stage integrated

“The control community, including academic researchers and process control experts in industry, is trying to make MPC available for these systems by resolving the underlying optimization problem on a low computational-capability computing platform,” said Marie-Sophie Masselot, business development manager, Leti. “This shortcoming usually leads to suboptimal performance for the controlled system. Our project with EFI Automotive will take into account specifics to offset the drop in performance, or response time, introduced when solving the model predictive control problem on this low computational-capability computing platform.”

In addition to transferring its expertise in MPC to EFI Automotive, Leti will develop software-automation tools dedicated to a given problem as a feasibility demonstration for the MPC project, and then make the tools easily expandable to similar control challenges.

For example, Leti and EFI will develop an MPC law for a given system and, with its increased expertise, EFI will expand this control technique to other systems.

“By combining Leti’s MPC expertise with our know-how in real-time processing on low-cost, low-computational capability computing units, we expect to dramatically improve the response time and reliability of our devices that are key to operating today’s complex vehicles,” said Vincent Liebart, innovation engineer at EFI Automotive.

 

With the MEMS and sensors industry on the cusp of explosive growth, MITRE Corp. cyber security expert Cynthia Wright will urge industry executives to lay the groundwork for securing  hundreds of billions of autonomous mobility devices in her keynote at the 14th annual MEMS & Sensors Executive Congress (October 29-30, 2018 in Napa Valley, Calif.). Wright, a retired military officer with over 25 years of experience in national security and cyber strategy and policy, will highlight the critical importance of device security and privacy in ensuring reliability and end-user safety.

Hosted by MEMS & Sensors Industry Group (MSIG), a SEMI technology community, the event also features DARPA’s Ron Polcawich, who will introduce his agency’s innovation and production program, a government-industry collaboration that aims to dramatically speed design-to-development of MEMS.

Spurred by surging growth in autonomous mobility devices such as smartphones, smart speakers, autonomous cars, and fitness and healthcare wearables, the global market for MEMS and sensors is expected to double in the next five years, reaching $100B by 2023.[1] Featured speakers at MEMS & Sensors Executive Congress will examine the enabling role of MEMS and sensors in these diverse intelligent applications.

  • Autonomous and Electric Cars: What’s in for Conventional MEMS & Sensors? – Jérémie Bouchaud, IHS Markit
  • Status, Challenges and Opportunities of the 2018 MEMS & Sensors Industry – Guillaume Girardin, Yole Développement
  • Smart Ear: Will Innovation Lead to Technology with Human-like Audio Capabilities? – Andreas Kopetz, Infineon Technologies AG
  • Sensors in Food and Agriculture – David Mount, ULVAC
  • Environmental Sensor Systems Enabling Autonomous Mobility – Marcellino Gemelli, Bosch Sensortec
  • It’s Time for Wearables to Revolutionize Healthcare – Craig Easson and Sudir Mulpuru, Maxim Integrated

Special Events

  • Technology Showcase – Finalists will compete for audience votes as they demo their MEMS/sensors-enabled mobility products.
  • Alquimista Cellars Wine Tasting and Dinner on Monday, October 29

MSEC will take place October 29-30, 2018, at the Silverado Resort and Spa in Napa Valley, Calif.

By Serena Brischetto

SEMI’s Serena Brischetto caught up with Zimmer and Peacock Director Martin Peacock to discuss sensor opportunities and challenges ahead of the European MEMS & Sensors and Imaging & Sensors Summits.

SEMI: Sensors  enable  a  myriad  of  sensors  and  applications,  from  measuring  caffeine  in  coffee and  the  hotness  of  chillies  and  ions  in  the  blood  of  patients,  to  the  detecting sulfite  levels  in  wine. But  what is,  in  your  opinion,  is  the  hottest  application  today?

Peacock: The  hot  topic  now  is  point-of-care  testing  for  medical  diagnostics  and  wearable  biosensors  including  continuous  glucose  monitoring  sensors  for  Type  1  Diabetics.  At  the  moment,  there  are  three  CGM  market leaders:  Dexcom,  Abbott  and  Medtronic. But in  addition several  companies  are currently  developing  CGM  technologies.

SEMI: What are engineers working on to improve sensors’ efficiency?

Peacock: Though  many  groups  are  working  on  increasing  sensor  sensitivity,  the  big  issues  are  manufacturing  and  the  repeatability  of  manufacturing.  Our  engineers  are  currently  working  on  making  our  manufacturing  repeatable.

The  issue  with  biosensors  and  medical  diagnostics  is  that  the  volumes  of  sensors  are  much  lower  than  the  manufacturing  volumes  traditionally  experienced  in  the  semi-conductor  industry. This  is  simply  due  to  the  fact  the  human  health  market  is  a  very  fragmented  market  and  so,  outside  of  diabetes,  it  is  hard  to  identify  a  high-volume  biosensor  or  medical  diagnostic  that  is  required  at  the  volumes  that  the  semiconductor  industry  would  consider  high  volume.

SEMI: And what are the main challenges?

Peacock: Making  biosensors  at  high  volume,  with  a  tight  tolerance  and  at  a  low  cost.  As  discussed  above,  the  issue  with  biosensors  is  they  are  not  necessarily  required  art  high  volumes,  so  a  manufacture  is  trying  to  produce  high-quality  products  but  where  the  manufacturing  volumes  are  relatively  low – all  the  while trying  to  do  this  at  a  price  point  that  the  market  can  bear.  To  summarise,  the  main  challenge  in  biosensors  one  would  say  ‘this  is  a  very  fragmented  market.’

SEMI: What techniques are currently being deployed by Zimmer and Peacock to overcome those challenges?

Peacock: Zimmer  and  Peacock  has  a  proprietary  database  system  for  organizing  our  development  and  manufacturing  data  so  we  can  track  manufacturing  quality  and  determine  how  we  are  performing. We are  dealing  with  the  fragmented  market  by  having  a  platform  approach  where  we  are  ensuring  that  all  our  clients  are  sharing  the  same  supply  chain  up  to  the  point  where  we  functionalise the  biosensors  with  their  specific  biochemistry. This  means  that  our  clients  are  getting  the  economies  of  scale,  even  though  they  require  their  products  in  relatively  small  volume.

SEMI: What do you expect from SEMI European MEMS & Sensors Summit 2018 and why do you recommend attending in Grenoble?

Peacock: Zimmer  and  Peacock  expects  to  meet  inspiring  experts  who  share  our  own  vision. This  vision  is  that  MEMs  and  Sensors  are  a  critical  part  of  a  number  of  social  and  commercial  revolutions,  including  the  Internet  of  Things  (IoT),  Sensor  Web  and  the  growth  of  the  Invitro  Diagnostics  Market  (IVD). We  are  also  interested  in  finding  supplier  who  can  be  part  of  our  supply  chain.

Serena is a marketing and communications manager at SEMI Europe.

A new wearable ultrasound patch that non-invasively monitors blood pressure in arteries deep beneath the skin could help people detect cardiovascular problems earlier on and with greater precision. In tests, the patch performed as well as some clinical methods to measure blood pressure.

Applications include real-time, continuous monitoring of blood pressure changes in patients with heart or lung disease, as well as patients who are critically ill or undergoing surgery. The patch uses ultrasound, so it could potentially be used to non-invasively track other vital signs and physiological signals from places deep inside the body.

A team of researchers led by the University of California San Diego describe their work in a paper published Sept. 11 in Nature Biomedical Engineering.

Wearable ultrasound patch tracks blood pressure in a deep artery or vein. Credit:
Chonghe Wang/Nature Biomedical Engineering

“Wearable devices have so far been limited to sensing signals either on the surface of the skin or right beneath it. But this is like seeing just the tip of the iceberg,” said Sheng Xu, a professor of nanoengineering at the UC San Diego Jacobs School of Engineering and the corresponding author of the study. “By integrating ultrasound technology into wearables, we can start to capture a whole lot of other signals, biological events and activities going on way below the surface in a non-invasive manner.”

“We are adding a third dimension to the sensing range of wearable electronics,” said Xu, who is also affiliated with the Center for Wearable Sensors at UC San Diego.

The new ultrasound patch can continuously monitor central blood pressure in major arteries as deep as four centimeters (more than one inch) below the skin.

Physicians involved with the study say the technology would be useful in various inpatient procedures.

“This has the potential to be a great addition to cardiovascular medicine,” said Dr. Brady Huang, a co-author on the paper and radiologist at UC San Diego Health. “In the operating room, especially in complex cardiopulmonary procedures, accurate real-time assessment of central blood pressure is needed–this is where this device has the potential to supplant traditional methods.”

A convenient alternative to clinical methods

The device measures central blood pressure–which differs from the blood pressure that’s measured with an inflatable cuff strapped around the upper arm, known as peripheral blood pressure. Central blood pressure is the pressure in the central blood vessels, which send blood directly from the heart to other major organs throughout the body. Medical experts consider central blood pressure more accurate than peripheral blood pressure and also say it’s better at predicting heart disease.

Measuring central blood pressure isn’t typically done in routine exams, however. The state-of-the-art clinical method is invasive, involving a catheter inserted into a blood vessel in a patient’s arm, groin or neck and guiding it to the heart.

A non-invasive method exists, but it can’t consistently produce accurate readings. It involves holding a pen-like probe, called a tonometer, on the skin directly above a major blood vessel. To get a good reading, the tonometer must be held steady, at just the right angle and with the right amount of pressure each time. But this can vary between tests and different technicians.

“It’s highly operator-dependent. Even with the proper technique, if you move the tonometer tip just a millimeter off, the data get distorted. And if you push the tonometer down too hard, it’ll put too much pressure on the vessel, which also affects the data,” said co-first author Chonghe Wang, a nanoengineering graduate student at UC San Diego. Tonometers also require the patient to sit still–which makes continuous monitoring difficult–and are not sensitive enough to get good readings through fatty tissue.

The UC San Diego-led team has developed a convenient alternative–a soft, stretchy ultrasound patch that can be worn on the skin and provide accurate, precise readings of central blood pressure each time, even while the user is moving. And it can still get a good reading through fatty tissue.

The patch was tested on a male subject, who wore it on the forearm, wrist, neck and foot. Tests were performed both while the subject was stationary and during exercise. Recordings collected with the patch were more consistent and precise than recordings from a commercial tonometer. The patch recordings were also comparable to those collected with a traditional ultrasound probe.

Making ultrasound wearable

“A major advance of this work is it transforms ultrasound technology into a wearable platform. This is important because now we can start to do continuous, non-invasive monitoring of major blood vessels deep underneath the skin, not just in shallow tissues,” said Wang.

The patch is a thin sheet of silicone elastomer patterned with what’s called an “island-bridge” structure–an array of small electronic parts (islands) that are each connected by spring-shaped wires (bridges). Each island contains electrodes and devices called piezoelectric transducers, which produce ultrasound waves when electricity passes through them. The bridges connecting them are made of thin, spring-like copper wires. The island-bridge structure allows the entire patch to conform to the skin and stretch, bend and twist without compromising electronic function.

The patch uses ultrasound waves to continuously record the diameter of a pulsing blood vessel located as deep as four centimeters below the skin. This information then gets translated into a waveform using customized software. Each peak, valley and notch in the waveform, as well as the overall shape of the waveform, represents a specific activity or event in the heart. These signals provide a lot of detailed information to doctors assessing a patient’s cardiovascular health. They can be used to predict heart failure, determine if blood supply is fine, etc.

Next steps

Researchers note that the patch still has a long way to go before it reaches the clinic. Improvements include integrating a power source, data processing units and wireless communication capability into the patch.

“Right now, these capabilities have to be delivered by wires from external devices. If we want to move this from benchtop to bedside, we need to put all these components on board,” said Xu.

The team is looking to collaborate with experts in data processing and wireless technologies for the next phase of the project.

By Michael Droeger

Are you ready for a shared economy where your transportation needs are no longer met by an automaker, but rather a “mobility service provider”? While smart transportation news has mostly focused on the likes of electrification (Tesla) and autonomy (Waymo), the real changes in transportation may be more fundamental than self-driving electric cars. According to presenters at this week’s Smart Automotive Summit at SEMICON Taiwan, new technologies won’t just make cars smarter: they will transform the way we see and use transportation in myriad ways.

Constance Chen, public relations general manager for forum sponsor Mercedes Benz, opened with a brief overview of parent Daimler’s evolving approach to transportation, dubbed CASE, which stands for Connected, Autonomous, Shared and Services, and Electric.

“The fundamental value of vehicles is changing,” Chen said, and car ownership is one of the biggest changes. Ride-sharing services like Uber and Lyft, and shared car services like ZipCar and DriveNow, are already addressing the transportation needs of a growing urban population that eschews car ownership. Traffic congestion, parking challenges, and a desire to improve air quality are key drivers (no pun intended) moving people away from car ownership to embrace shared transportation solutions.

Indeed, societal considerations are as challenging as some technological hurdles facing autonomous vehicle development. Robert Brown, Taiwan operations manager for Magma Electronics, listed his top five challenges for autonomous transportation:

  1. Perception (vision, sensors)
  2. Assessment (ability of systems to analyze data)
  3. Control (need for faster-than-human response)
  4. Communication (vehicle-to-vehicle, vehicle-to-everything)
  5. Expectations—specifically people’s expectations of the value autonomous transportation should deliver

As people change the way they view transportation and begin to understand what is possible when they can relinquish control of their vehicle, they’re transportation needs and expectations are likely to change. The challenges are, of course, also an opportunity to deliver a wide range of services, including information, entertainment, and retail, which opens the door for traditional carmakers to position themselves more as service providers like Mercedes Benz.

For those who have grown up with traditional car ownership and the perceived freedom that owning allows one to go anywhere at anytime, the idea of giving up their car—one that they drive themselves—might seem beyond the pale. But as ride-sharing services are already showing, a growing portion of our population seems more than ready to embrace a shared and autonomous future.

The SEMICON Taiwan Smart Automotive Summit is part of SEMI’s Smart Transportation initiative focusing on automotive electronics, a top priority for SEMI and its 2,000+ members. SEMI’s industry standards, technology communities, roadmap efforts, EH&S/regulatory activities and other global platforms and communities bring together the automotive and semiconductor supply chains to collaborate, increase cross-industry efficiencies and shorten the time to better business results.

Michael Droeger is director of marketing at SEMI. 

Originally published on the SEMI blog.