Category Archives: Device Architecture

SiFive, a provider of commercial RISC-V processor IP, today announced the appointment of Mohit Gupta as vice president of SoC IP. Mohit will play a key role in leadership and business development of the company’s SoC IP portfolio, including the DesignShare program, an IP ecosystem which has been instrumental in lowering the cost of bringing chips from design to silicon realization. He will report to Shafy Eltoukhy, senior vice president and general manager of SiFive’s Custom SoC Division.

“SiFive’s SoC IP, and its popular DesignShare program, has contributed significantly to the entire semiconductor ecosystem by leveling the playing field and democratizing access to custom silicon, which previously was not possible due to upfront IP cost,” said Mohit. “I’m very proud to be joining this team as we work toward expanding innovation through shared knowledge and innovation.”

Mohit has extensive expertise in semiconductor IP across product marketing, business development and engineering. He recently served as senior director of product marketing for the high speed SerDes and interface IP cores portfolio at Rambus. Prior to that, he was the director of ASIC IP development at Open-Silicon, a SiFive company, where he was instrumental in managing various SoC/ASIC and IP projects. Mohit has also held various positions in design and applications engineering at Infineon Technologies and STMicroelectronics.

“Mohit brings a deep understanding of the SoC IP ecosystem, as well as a reputation for business development and strong IP partner engagement,” said Shafy Eltoukhy SVP and GM of SiFive’s Custom SoC Division. “His experience and leadership will be instrumental in fostering the continued growth and expansion of our DesignShare program and continuing the mission of our SoC IP growth to meet the high quality and reliability expectations of our customers and ecosystem partners.”

Mohit earned an executive MBA degree from the Indian Institute of Management in Calcutta, India. He also holds a master’s degree in microelectronics from the Birla Institute of Technology and Science in India, and a bachelor’s degree in electronics and communication from Thapar University in India.

Applied Materials, Inc. today announced plans for the Materials Engineering Technology Accelerator (META Center), a major expansion of the company’s R&D capabilities aimed at creating new ways for Applied and its customers to drive innovation as classic Moore’s Law scaling becomes more challenging.

The primary goal of the META Center is to speed customer availability of new chipmaking materials and process technologies that enable breakthroughs in semiconductor performance, power and cost. The new center will complement and extend the capabilities of Applied’s Maydan Technology Center in Silicon Valley.

The META Center will be a hub for innovation, delivering on a call to action by Applied CEO Gary Dickerson for increased collaboration and speed across the technology ecosystem.

“Realizing the full potential of Artificial Intelligence and Big Data will require significant improvements in performance, power consumption and cost both at the edge and in the cloud,” said Gary Dickerson, president and CEO of Applied Materials. “The industry needs new computing architectures and chips enabled by innovative materials and scaling approaches. The META Center creates a new platform for working with customers to accelerate innovation from materials to systems.”

Scheduled to open in 2019, the META Center will be a first-of-its kind facility, spanning 24,000 square feet of cleanroom. It will be furnished with a broad suite of Applied’s most advanced process systems along with complementary technologies needed for new chip materials and structures to be piloted for high-volume production at customer sites.

To be located at the State University of New York Polytechnic Institute (SUNY Poly) campus in Albany, New York, the META Center will be created under agreements to be entered into with New York State, The Research Foundation for The State University of New York and SUNY Poly, that have been approved by the Empire State Development Board of Directors and are subject to further approval by The New York State Public Authorities Control Board.

“SUNY Poly provides an ideal combination of infrastructure, capabilities and talent in a thriving academic and entrepreneurial setting with deep roots in the semiconductor industry,” said Steve Ghanayem, senior vice president of New Markets and Alliances at Applied Materials. “The technology ecosystem will benefit from the acceleration of materials innovation through collaboration at the META Center.”

According to Samsung R&D, “We value our collaboration with Applied Materials on process development. The industry needs new innovations beyond traditional device scaling including the exploration of new materials. We are very pleased to see Applied Materials’ effort to expand its advanced R&D capabilities to provide added resources to customers and accelerate chip development.”

“TSMC welcomes closer collaboration with critical suppliers like Applied Materials in both equipment and materials,” said J.K. Lin, TSMC’s Vice President of Information Technology and Risk Management & Materials Management. “Working together to accelerate the industry’s innovation and address high-growth opportunities is very much in the spirit of TSMC’s Grand Alliance, the largest ecosystem in the semiconductor industry.”

“IBM and Applied Materials have a long history of collaboration in materials engineering to advance semiconductor industry breakthroughs,” said Dr. Mukesh V. Khare, IBM Research Vice President. “AI is one of the biggest opportunities of our time and will require innovations across materials, devices and architectures. We are pleased to see Applied expanding its capabilities to support the industry through the AI journey with its new META Center in Albany, New York.”

“As complexity increases and costs rise, traditional device scaling is slowing for the latest technology nodes,” said Tom Caulfield, CEO GLOBALFOUNDRIES. “It’s great to see Applied Materials investing in a broad range of advanced R&D capabilities to bring new and new combinations of materials into chip manufacturing, and I look forward to our continued collaborative efforts as we develop more differentiated solutions for our clients.”

“Delivering the improvements in performance and efficiency that allow Arm partners to continue to advance compute will mean overcoming the challenges presented by scaling transistors and interconnect in the deep nanometer process nodes,” said Greg Yeric, fellow, Arm. “There are many novel ideas being explored in this area, but the timeline from concept to production needs to be accelerated, and the expansion of Applied Materials’ R&D capabilities will help enable this research to advance at a faster pace.”

“Applied Materials is the world leader in semiconductor process and tools,” said Kurt Busch, CEO of Syntiant Corp. “We strongly value our relationship with Applied Materials and look forward to the benefits their latest technology will bring to breakthrough edge device machine learning products.”

FormFactor, Inc. (NASDAQ: FORM), an electrical test and measurement supplier to the semiconductor industry, announced that it has been recognized for supplier excellence by SK hynix, a manufacturer of DRAM, Flash and CMOS image sensor technology. FormFactor supplies SK hynix with advanced wafer probe cards for high bandwidth memory (HBM) and high-throughput, one-touchdown DRAM testing, as well as engineering probe systems that enable measurements in extreme environments to support cutting edge semiconductor devices.

“We are proud to be recognized as an outstanding supplier by SK hynix, and especially honored to be selected for our leadership in Technology Innovation,” said FormFactor’s CEO, Mike Slessor. “With a relationship of more than a decade, we continue to deliver innovative technologies to help them achieve their test objectives from their analytical labs to production test in their fabs. These innovations include high-parallelism, high-speed wafer probe test technologies that deliver on the quality and reliability that our customers demand. We’ve also provided probe system technology that pushes next generation devices to new limits in extreme conditions. These examples demonstrate FormFactor’s unique ability to support customers’ most demanding applications across the spectrum of electrical test and measurement.”

The SK hynix awards are given to a select few suppliers who demonstrate commitment to exceptional performance in support of the company’s development and manufacturing objectives.

In its annual customer survey earlier this year, FormFactor was recognized by VLSIresearch for its high customer satisfaction. “FormFactor’s high rankings reflect the company’s close partnerships with its customers,” said G. Dan Hutcheson, CEO of VLSIresearch. “Technical leadership, partnering and trust are all key to achieving consistently high results. These factors combined with excellent support and quality help FormFactor to stand out year after year in its categories.”

MIRPHAB, a European Commission project to create a pilot line to fabricate mid-infrared (MIR) sensors by 2020, is accepting proposals from companies that want to develop and prototype new MIR devices that operate in gas-and-liquid media.

The project produces MIR photonic devices via assembled and/or packaged devices for laser-based, analytical MIR sensors, and expert design for sensor components that are fabricated on the pilot line. The platform is organized so that development of novel sensors and sensing systems is based on MIR integrated optic components and modules already incorporated in MIRPHAB’s portfolio.

The aim of the MIRPHAB pilot line is to provide each customer with a unique chemical spectroscopic system by combining sources, photonic circuits and detectors in standard packaging.

“European industry requires more efficient control processes to gain greater productivity and operational efficiency, and this project will deliver the devices required to improve those processes,” said CEA-Leti’s Sergio Nicoletti, who is coordinating the project. “MIRPHAB also will develop new sensor technology that provides novel analytical tools for companies to help improve people’s overall quality of life via environmental monitoring (e.g to measure VOC), food quality control (e.g. food spoilage or  adulteration ) and fast clinical diagnoses (e.g. provide cancer cells images). These are some of the areas where MIR sensors will play an increasingly significant role.”

In addition to providing device-design services for customers, the MIRPHAB team will help them develop sound business cases and strong business plans to commercialize their new devices. Potential cost-and-performance breakthroughs will be shown for reliable MIR sensing products based on building blocks provided by MIRPHAB. MIRPHAB also will be a sustainable source of key components for new and highly competitive MIR sensors, and will support their successful market introduction, while strengthening the competitiveness of European industry.

Mid-infrared light interacts strongly with molecular vibrations as each molecule gives a unique absorption spectrum that provides a simple solution for sensing. The sensors’ reduced size and flexible design make them ideal candidates for integration into already existing equipment for in-line/on-line detection.

The MIRPHAB team will host a booth, #ZB24, at the Sensors USA event in Santa Clara, Calif., Nov. 14-15, 2018.

MIRPHAB is funded by the Photonics Public Private Partnership. The project brings together 18 leading European organizations and is coordinated by CEA-Leti. For more information visit the project’s website.

Micron Technology, Inc., (Nasdaq: MU) today announced at Electronica 2018 that it will collaborate with the BMW Group to further advance the development of automotive memory solutions used in vehicles. Memory and storage are key components in accelerating the intelligence and user experience of next-generation systems in vehicles, including in-cabin infotainment as well as advanced driver-assistance systems (ADAS) technology, which together play an important role in making self-driving autonomous cars a reality.

Micron and the BMW Group will intensify their existing efforts toward testing and development of automotive memory solutions at Micron’s state-of-the-art lab in Munich, Germany. Using the Test Automation Framework of the BMW Group as a car emulator platform, the two companies will work together to define and validate memory and storage solutions for next-generation platforms. The collaborative effort will leverage Micron’s memory and storage technology expertise, along with its broad portfolio of DRAM, NAND, and NOR technologies, including LPDRAM, e.MMC, UFS and SSD storage solutions.

As a proven memory partner for automotive manufacturers, Micron recognizes the importance of validating and testing new automotive memory technologies for robustness and reliability before releasing them into the market. Micron’s customer lab expertise in developing innovative automotive memory technologies will enable the BMW Group to raise the quality of the driving experience in automobiles of the future.

“The incorporation of new features and capabilities in advanced in-vehicle infotainment (IVI) and ADAS, such as voice recognition, hand gesturing and image recognition, are driving an explosive growth in both volatile and nonvolatile memory embedded in vehicles, accelerating intelligence at the edge,” said Giorgio Scuro, vice president of Micron’s automotive division. “Micron has a long-standing record working with automotive industry partners, and this joint initiative with the BMW Group is a testament to our expertise in bringing innovative automotive memory technologies to market.”

As a leading memory partner with more than 25 years of experience, Micron provides advanced automotive memory solutions that meet stringent quality, reliability and compliance requirements. Micron’s broad portfolio of volatile and nonvolatile memory products are optimized for automotive and supported by a formal product longevity program.

Micron Technology, Inc., (Nasdaq: MU) today announced that its GDDR6 memory, Micron’s fastest and most powerful graphics memory, will be the high-performance memory of choice supporting Achronix’s next-generation stand-alone FPGA products built on TSMC 7nm process technology. GDDR6 is optimized for a variety of demanding applications, including machine learning, that require multi-terabit memory bandwidth and will enable Achronix to offer FPGAs at less than half the cost of FPGAs with comparable memory solutions.

Achronix’s high-performance FPGAs, combined with GDDR6 memory, are the industry’s highest-bandwidth memory solution for accelerating machine learning workloads in data center and automotive applications.

This new joint solution addresses many of the inherent challenges in deep neural networks, including storing large data sets, weight parameters and activations in memory. The underlying hardware needs to store, process and rapidly move data between the processor and memory. In addition, it needs to be programmable to allow more efficient implementations for constantly changing machine learning algorithms. Achronix’s next-generation FPGAs have been optimized to process machine learning workloads and currently are the only FPGAs that offer support for GDDR6 memory.

“From GPUs and beyond, Micron delivers high-performance memory solutions that meet the needs of today’s most demanding applications, including artificial intelligence (AI) and machine learning — most recently demonstrated by achieving throughput of up to 16 Gb/s on our GDDR6 solutions,” said Andreas Schlapka, director of Micron’s networking segment. “In addition to offering increased performance, Micron has developed an ecosystem to support companies like Achronix whose FPGAs with GDDR6 will enable rapid creation of designs. This, in effect, translates into faster time to market for customers using this powerful new memory technology.”

Achronix’s next-generation FPGAs include up to eight hardened GDDR6 memory interfaces that provide customers the flexibility to choose from multiple memory configurations for their end application. Customers can use from one to eight GDDR6 memory devices, which can offer over 4 Tb/s memory bandwidth and from 8Gb to 128Gb density. This type of flexibility allows customers to optimize cost and power for their application, which is not currently possible with alternate high-bandwidth memory solutions like HBM2.

“With more than 14 years’ experience in developing high-performance FPGAs, Achronix is the first FPGA company to support GDDR6 memory and deliver multi-terabit memory bandwidth at the lowest cost for data center, blockchain, networking and automotive applications that require the highest-performance programmable platform,” said Manoj Roge, vice president of strategic planning and business development at Achronix Semiconductor Corporation. “Achronix is excited to work closely with Micron and other ecosystem partners to accelerate time to market for GDDR6-based solutions for our customers’ most demanding workloads and applications.”

Micron works closely with partners like Achronix to accelerate engineering efforts to build robust models and toolsets and deliver board layout validation. Through this ecosystem approach, Micron delivers high-bandwidth memory technology that provides a path for engineers to incorporate GDDR6 in designs and bring bandwidth-intensive applications to market.

The Chinese Advance Semiconductor Association (CASA) recently hosted the 7th annual IASIC event in Shenzhen, China. Attendees at the event were able to get a look at some of the most leading edge innovations from companies from around the world as well as fellow Chinese companies. Among all the companies involved, NOWI was selected as the overall Innovation Winner for its energy harvesting power module.

The NOWI power module, a type of IC (integrated circuit) eliminates the need for frequent battery changes or impractical cables. Instead it enables any IoT or wearables company to use external ambient energy sources and thereby reduce the need for maintenance. We call this Plug & Forget. This is achieved with an energy harvesting PMIC with the worlds-highest efficiency and sensitivity. With the rise of the Internet of Things billions of wireless devices are required and this technology thereby solves a significant bottleneck in the industry.

Receiving the award, Simon van der Jagt, CEO of NOWI: “We are honored to receive the IASIC award and it has been a valuable experience to learn more about the Chinese semiconductor ecosystem. The Chinese Advanced Semiconductor Association (CASA) and the IASIC organization have recognized that the Internet of Things has a strong need for new power solutions to enable long maintenance-free product lifetimes. With new emerging energy harvesting and power management technology the Internet of Things is entering a new phase of maturity as connected devices become energy autonomous. This dramatically decreases the difficulty and cost of deploying and maintaining Internet of Things systems.”

“China has shown a clear ambition to be one of the leaders in the Internet of Things. As part of this visit, NOWI was also able to explore potential technology collaboration with leading global IoT companies”

During the two day event, a panel of international experts evaluated a range of leading semiconductor innovators. One such judge, former Intel and GE Senior Executive, IASIC Judge Mr Charles Zhang “The NOWI IC is a revolutionary product for the IoT industry, especially for devices like wearables or very power sensitive IoT sensors.  With the ability to capture and process tiny bits of energy from the environment, this innovation can benefit all types IoT sensor devices. The NOWI team did a great job to not only develop this technology but to already be working with customer for the real time deployment. That is why this is a winner.”

By Emir Demircan

Joining distinguished speakers from the European Commission, industry, academia and Member States, Laith Altimime, SEMI Europe president, will keynote on “European Competitiveness in the Context of the Global Digital Economy” on 20 November at the European Forum for Electronic Components and Systems (EFECS) in Lisbon, Portugal.

Players across the European electronics manufacturing value chain will gather 20-22 November, 2018, at EFECS to share the industry’s vision and set the future direction of technology innovation. Themed “Our Digital Future,” this year’s forum focuses on how rapid innovation in electronics components and systems-based applications are shaping Europe’s digital future. Start-ups, SMEs, research institutes, academia, large and medium enterprises and public authorities will learn about new collaboration initiatives and the latest developments in European funding instruments while offering their expectations for future funding programmes.

Organized by AENEAS, ARTEMIS-IA, EPoSS, ECSEL Joint Undertaking and the European Commission, in association with EUREKA, EFECS will also highlight the impact and results of various European funding instruments.

For more information about the event, please click here.

Emir Demircan senior manager for advocacy and public policy at SEMI Europe. 

GLOBALFOUNDRIES and indie Semiconductor today announced the release of a new generation of customized microcontrollers on GF’s 55nm Low Power Extended (55LPx) automotive-qualified platform, which includes embedded non-volatile memory (SuperFlash®) technology. indie Semiconductor’s new Nigel products are based on ARM Cortex-M4 microcontroller cores, capable of supporting advanced functionalities in IoT, medical and automotive markets. indie Semi is already shipping products, manufactured on GF’s 55LPx process, to automotive customers in volume.

indie’s custom microcontrollers integrate in a single device mixed-signal functionality for sensing, processing, controlling and communicating. GF’s 55LPx platform, with SST’s SuperFlash® memory technology, enables the use of high-density memory and high-performance processing combined with mixed-signal functions in indie’s Nigel M4 controllers, delivering a highly integrated automotive solution at 55nm node.

“indie’s Nigel controller is designed to support high performance computing for automotive system architectures,” said Paul Hollingworth, executive vice president of sales and marketing at indie Semiconductor. “As automotive system requirements get more complex, our customers need solutions to perform complex processing while combining multiple functions into a single chip to minimize size and weight. We chose GF’s automotive-qualified 55LPx platform for its combination of density, performance and cost.”

“GF is pleased to be working with indie Semiconductor, a leader in state-of-the-art SoC technology,” said Rajesh Nair, vice president of mainstream offering management at GF. “indie Semiconductor joins our rapidly growing client base for GF’s 55LPx platform, which offers a combination of superior low-power logic, embedded non-volatile memory, extensive IP, and superior reliability for consumer, industrial and automotive grade 1 applications.”

The 55LPx RF-enabled platform provides a fast path-to-product solution that includes silicon-qualified RF IP and Silicon Storage Technology’s (SST) highly reliable embedded SuperFlash® memory. The platform is in volume production on GF’s 300mm line in Singapore. In addition to Nigel, indie Semiconductor is currently developing several products on the technology, many of which are for automotive applications.

Process design kits and an extensive offering of silicon proven IP are available now. For more information on GF’s mainstream CMOS solutions, contact your GF sales representative or go to globalfoundries.com.

Micron Technology, Inc. today announced the company has joined CERN openlab, a unique public-private partnership, by signing a three-year agreement. Under the agreement, Micron will provide CERN with advanced next-generation memory solutions to further machine learning capabilities for high-energy physics experiments at the laboratory. Micron’s memory solutions that combine neural network capabilities will be tested in the data-acquisition systems of experiments at CERN.

High-energy physics scientists are looking to deploy leading-edge technologies that can support their experiments’ computing and data processing requirements. Memory plays a vital role in accelerating intelligence by processing vast amounts of data, helping researchers gain valuable insights from data generated by high-energy physics experiments.

As part of the work with CERN, Micron will develop and introduce a specially designed Micron memory solution that will be tested by researchers at CERN for use in rapidly combing through the vast amount of data generated by experiments. The project will feature FPGA-based boards with Micron’s most advanced high-performance memory combined with an advanced neural network technology developed in collaboration between Micron and FWDNXT, a provider of deep learning and AI solutions.

“Micron is committed to pushing the limits of innovation by providing high-performance memory and storage solutions to solve the world’s greatest computing and data processing challenges in data analytics and machine learning,” said Steve Pawlowski, vice president of advanced computing solutions at Micron Technology. “We’re proud to work with CERN to deliver machine learning capabilities that will enable high-energy physics scientists to make advances in their science and research experiments.”

“CERN collaborates openly with both the public and private sector, and working with technology partners like Micron helps ensure that members of the research community have access to the advanced computing technologies needed to carry out our groundbreaking work,” said Maria Girone, CTO at CERN openlab. “It is critical to the success of the Large Hadron Collider that we are able to examine the petabytes of data generated in a fast and intelligent manner that enables us to unlock new scientific discoveries. These latest-generation memory solutions from Micron and machine learning solutions from FWDNXT offer significant potential in terms of enabling us to process more data at higher speeds.”

Micron will demonstrate its high-performance memory solutions running FWDNXT’s Machine Learning SDK at SC18, November 12-15, in Dallas, Texas.