Category Archives: Device Architecture

While the charge and spin properties of electrons are widely utilized in modern day technologies such as transistors and memories, another aspect of the subatomic particle has long remained uncharted. This is the “valley” property which has potential for realizing a new class of technology termed “valleytronics” – similar to electronics (charge) and spintronics (spin). This property arises from the fact that the electrons in the crystal occupy different positions that are quantum mechanically distinct.

Now City College of New York physicists led by Vinod Menon have demonstrated how to manipulate the “valley” property using light by placing two-dimensional semiconductors in a light trapping structure called microcavity. This gave rise to half-light-half matter quasi-particles which have the fingerprint of the “valley” property. These quasi-particles were then optically controlled using a laser to access the electrons occupying specific “valley.” The research appears in the latest issue of Nature Photonics and is a major step towards realization of “valleytronic” devices for logic gates.

“Observing this property in traditional semiconductors was not easy. However with the advent of the new class of two-dimensional semiconductors, this property became accessible to manipulation,” said Zheng Sun, a graduate student in Menon’s research group and lead author of the paper.

The ‘wonder material’ graphene has many interesting characteristics, and researchers around the world are looking for new ways to utilise them. Graphene itself does not have the characteristics needed to switch electrical currents on and off and smart solutions must be found for this particular problem. “We can make graphene structures with atomic precision. By selecting certain precursor substances (molecules), we can code the structure of the electrical circuit with extreme accuracy,” explains Peter Liljeroth from Aalto University, who conceived the research project together with Ingmar Swart from Utrecht University.

Seamless integration

The electronic properties of graphene can be controlled by synthesizing it into very narrow strips (graphene nanoribbons). Previous research has shown that the ribbon’s electronic characteristics are dependent on its atomic width. A ribbon that is five atoms wide behaves similarly to a metallic wire with extremely good conduction characteristics, but adding two atoms makes the ribbon a semiconductor. “We are now able to seamlessly integrate five atom-wide ribbons with seven atom-wide ribbons. That gives you a metal-semiconductor junction, which is a basic building block of electronic components,” according to Ingmar Swart.

Chemistry on a surface

The researchers produced their electronic graphene structures through a chemical reaction. They evaporated the precursor molecules onto a gold crystal, where they react in a very controlled way to yield new chemical compounds. “This is a different method from that currently used to produce electrical nanostructures, such as those on computer chips. For graphene, it is so important that the structure is precise at the atomic level and it is likely that the chemical route is the only effective method,” Ingmar Swart concludes.

Electronic characteristics

The researchers used advanced microscopic techniques to also determine the electronic and transport characteristics of the resulting structures. It was possible to measure electrical current through a graphene nanoribbon device with an exactly known atomic structure. “This is the first time where we can create e.g. a tunnel barrier and really know its exact atomic structure. Simultaneous measurement of electrical current through the device allows us to compare theory and experiment on a very quantitative level,” says Peter Liljeroth.

In its upcoming Mid-Year Update to The McClean Report 2017 (to be released later this week), IC Insights addresses the changing landscape for semiconductor industry mergers and acquisitions.

The historic flood of merger and acquisition agreements that swept through the semiconductor industry in the past two years slowed to a trickle in the first half of 2017, with the combined value of about a dozen transactions announced in 1H17 reaching just $1.4 billion.

In the first halves of 2016 and the record-high M&A year of 2015, the combined value of acquisition agreements in 1H16 and 1H15 totaled $4.6 billion and $72.6 billion, respectively (Figure 1).  Last year, M&A got off to a slow start—compared to the record-breaking pace in 1H15—but several large transactions announced in 3Q16 pushed the 2016 total value in semiconductor acquisitions to nearly $100 billion and within striking distance of the all-time high of $107.3 billion set in 2015.  A few major semiconductor acquisitions were pending or rumored to be in the works during July 2017, but it is unlikely that a 2H17 surge in purchase agreements will bring this year’s M&A total value anywhere close to those of 2016 and 2015.

The big difference between semiconductor M&A activity in 2017 and the prior two years has been the lack of megadeals.  Thus far, only one transaction in 2017 has topped a half billion dollars (MaxLinear’s $687 million cash acquisition of analog and mixed-signal IC supplier Exar announced in March 2017 and completed in May).  There were seven announced acquisitions with values of more than $1 billion in 2016 (three of which were over $10 billion) and 10 in 2015 (four of which were over $10 billion).  IC Insights’ M&A list only covers semiconductor suppliers and excludes acquisitions of software and systems businesses by IC companies (e.g., Intel’s planned $15.3 billion purchase of Mobileye, an Israeli-based provider of digital imaging technology for autonomous vehicles, announced in March 2017).

The 250+ page Mid-Year Update to the 2017 edition of The McClean Report further describes IC Insights’ updated forecasts for the 2017-2021 timeperiod.

Figure 1

Figure 1

Worldwide PC shipments totaled 61.1 million units in the second quarter of 2017, a 4.3 percent decline from the second quarter of 2016, according to preliminary results by Gartner, Inc. The PC industry is in the midst of a 5 year slump, and this is the 11th straight quarter of declining shipments. Shipments in the second quarter of this year were the lowest quarter volume since 2007.

“Higher PC prices due to the impact of component shortages for DRAM, solid state drives (SSDs) and LCD panels had a pronounced negative impact on PC demand in the second quarter of 2017,” said Mikako Kitagawa, principal analyst at Gartner “The approach to higher component costs varied by vendor. Some decided to absorb the component price hike without raising the final price of their devices, while other vendors transferred the costs to the end-user price.”

However, in the business segment, vendors could not increase the price too quickly, especially in large enterprises where the price is typically locked in based on the contract, which often run through the quarter or even the year,” Ms. Kitagawa said. “In the consumer market, the price hike has a greater impact as buying habits are more sensitive to price increases. Many consumers are willing to postpone their purchases until the price pressure eases.”

HP Inc. reclaimed the top position from Lenovo in the worldwide PC market in the second quarter of 2017 (see Table 1). HP Inc. has achieved five consecutive quarters of year-over-year growth. Shipments grew in most regions, and it did especially well in the U.S. market where its shipments growth far exceeded the regional average.

Table 1
Preliminary Worldwide PC Vendor Unit Shipment Estimates for 2Q17 (Thousands of Units)

Company

2Q17 Shipments

2Q17 Market Share (%)

2Q16 Shipments

2Q16 Market Share (%)

2Q17-2Q16 Growth (%)

HP Inc.

12,690

20.8

12,285

19.2

3.3

Lenovo

12,188

19.9

13,305

20.8

-8.4

Dell

9,557

15.6

9,421

14.7

1.4

Apple

4,236

6.9

4,252

6.7

-0.4

Asus

4,036

6.6

4,501

7.0

-10.3

Acer Group

3,850

6.3

4,402

6.9

-12.5

Others

14,546

23.8

15,710

24.6

-7.4

Total

61,105

100.0

63,876

100.0

-4.3

Notes: Data includes desk-based PCs, notebook PCs and ultramobile premiums (such as Microsoft Surface), but not Chromebooks or iPads. All data is estimated based on a preliminary study. Final estimates will be subject to change. The statistics are based on shipments selling into channels. Numbers may not add up to totals shown due to rounding.
Source: Gartner (July 2017)

Lenovo’s global shipments declined 8.4 percent in the second quarter of 2017, after two quarters of growth. Lenovo recorded year-over-year shipment declines in all key regions. Ms. Kitagawa said the 2Q17 results could reflect Lenovo’s strategic shift from unit share gains to margin protection. The strategic balance between share gain and profitability is a challenge for all PC vendors.

Dell achieved five consecutive quarters of year-on-year global shipment growth, as shipments increased 1.4 percent in 2Q17. Dell has put a high priority on PCs as a strategic business. Among the top three vendors, Dell is the only vendor which can supply the integrated IT needs to businesses under the Dell Technologies umbrella of companies.

In the U.S., PC shipments totaled 14 million units in the second quarter of 2017, a 5.7 percent decline from the second quarter of 2016 (see Table 2). The U.S. market declined due to weak consumer PC demand. The business market has shown some consistent growth, while early indicators suggest that spending in the public sector was on track with normal seasonality as the second quarter is typically the peak PC procurement season. However, the education market was under pressure from strong Chromebook demand.

The Chromebook market has been growing much faster than the overall PC market. Gartner does not include Chromebook shipments within the overall PC market, but it is moderately impacting the PC market. Worldwide Chromebook shipments grew 38 percent in 2016, while the overall PC market declined 6 percent.

“The Chromebook is not a PC replacement as of now, but it could be potentially transformed as a PC replacement if a few conditions are met going forward,” Ms. Kitagawa said. “For example, infrastructure of general connectivity needs to improve; mobile data connectivity needs to become more affordable; and it needs to have more offline capability.”

Table 2
Preliminary U.S. PC Vendor Unit Shipment Estimates for 2Q17 (Thousands of Units)

Company

2Q17 Shipments

2Q17 Market Share (%)

2Q16 Shipments

2Q16 Market Share (%)

2Q17-2Q16 Growth (%)

HP Inc.

4,270

30.5

4,008

27.0

6.5

Dell

3,874

27.7

3,801

25.6

1.9

Lenovo

1,848

13.2

2,207

14.9

-16.3

Apple

1,649

11.8

1,825

12.3

-9.6

Asus

447

3.2

754

5.1

-40.7

Others

1,921

13.7

2,257

15.2

-14.9

Total

14,009

100.0

14,852

100.0

-5.7

Notes: Data includes desk-based PCs, notebook PCs and ultramobile premiums (such as Microsoft Surface), but not Chromebooks or iPads. All data is estimated based on a preliminary study. Final estimates will be subject to change. The statistics are based on shipments selling into channels. Numbers may not add up to totals shown due to rounding.
Source: Gartner (July 2017)

PC shipments in EMEA totaled 17 million units in the second quarter of 2017, a 3.5 percent decline year over year. There were mixed results across various countries. Uncertainty around the U.K. elections meant some U.K. businesses delayed buying, especially in the public sector. In France, consumer confidence rose more than expected after Emmanuel Macron was elected president, however spending on PCs remains sluggish. PC shipments increased in Germany as businesses invest in Windows 10 based new hardware, and the Russian market continued to show improvement driven by economic stabilization.

In Asia/Pacific, PC shipments surpassed 21.5 million units in the second quarter of 2017, down 5.1 percent from the same period last year. The PC market in this region was primarily affected by market dynamics in India and China. In India, the pent up demand after the demonetization cooled down after the first quarter, coupled with the absence of a large tender deal compared to a year ago and higher PC prices, brought about weak market growth. The China market was hugely impacted by the rise in PC prices due to the component shortage

These results are preliminary. Final statistics will be available soon to clients of Gartner’s PC Quarterly Statistics Worldwide by Region program. This program offers a comprehensive and timely picture of the worldwide PC market, allowing product planning, distribution, marketing and sales organizations to keep abreast of key issues and their future implications around the globe.

 

Advances in semiconductor and related devices are driving significant progress in our increasingly digital world, and the place to learn about cutting-edge research in the field is the annual IEEE International Electron Devices Meeting (IEDM), to be held December 2-6, 2017 at the Hilton San Francisco Union Square hotel. Highlights for 2017 include:

  • A talk on transformative electronics by Dr. Hiroshi Amano, who received the 2014 Nobel Prize in Physics along with Isamu Akasaki and Shuji Nakamura for the invention of efficient blue LEDs, which sparked a revolution in innovative, energy-saving lighting.
  • The above talk is part of an exceptional slate of plenary talks to be given by some of the industry’s leading figures. IEDM plenary presenters include the CEO of Advanced Micro Devices, Inc.; the research chief of TSMC, which is the industry’s largest foundry driving technology forward; a leading academic authority on energy-efficient computing, which is a key societal goal; as well as Dr. Amano’s fourth, additional plenary talk. It will be given on Wednesday, Dec. 6.
  • Focus Sessions will be held on the following topics: 3D Integration and Packaging; Modeling Challenges for Neuromorphic Computing; Nanosensors for Disease Diagnostics; and Silicon Photonics: Current status and perspectives.
  • A vendor exhibition will be held again, based on the success of last year’s first-ever such event at the IEDM.
  • The IEEE Magnetics Society will host a poster session on MRAM (magnetic RAM memories).

The IEDM paper submission deadline this year is August 2 and the deadline for late-news papers is September 11. Only a limited number of late-news papers will be accepted.

Each year at the IEDM, the world’s best technologists in micro/nano/bioelectronics converge to participate in a technical program consisting of more than 220 presentations along with special luncheon talks and a variety of panels, special sessions, tutorials, Short Courses, IEEE/EDS award presentations and other events that highlight leading work in more diverse areas of the field than any other conference.

“This year’s IEDM will feature talks, courses and panels by world experts on what is perhaps the broadest array of topics in recent memory,” said Dr. Barbara De Salvo, Scientific Director at Leti. “The unique technical program can lead one to view the IEDM as a crystal ball of sorts, because many of the developments reported at the conference invariably make their way into commercial products a few years down the road. As an example, this year’s IEDM conference marks 10 years since the industry transition from aluminum to copper interconnect began in earnest.”

Here are details of some of the events that will take place at this year’s IEDM:

Focus Sessions

  • 3D Integration and Packaging – Packaging technology is taking on an increasingly important role in semiconductor manufacturing, and this session will provide an industry perspective on forthcoming approaches ranging from “Simpler is better” to “Advanced packaging saves the day for continued scaling.” The session will address the latest in 3D, from alternative packaging to 3D stacking, and applications and technologies for Integrated Power Microelectronics.
  • Modeling Challenges for Neuromorphic Computing – This session will address the opportunities and challenges of efficient synaptic processes, from learning models to device-circuit implementations of neuromorphic architectures.  Half of the session will discuss learning models in stochastic processes, with the other half devoted to RRAM (resistive RAM) memory for deep neural networks and neuromorphic computing.
  • Nanosensors for Disease Diagnostics — From microfluidics to nanosensing, this session will review the latest advances for the detection of diseases such as cancer, sepsis and diabetes, using biomarkers ranging from (bio)molecules and individual cells to in-vitro tissue models.
  • Silicon Photonics: Current Status and Perspectives – This session addresses the state-of-the-art in silicon photonics technology, ranging from topics on high-volume manufacturing, optical transceivers and interconnects, to femto-joule per bit integrated nanophotonics for upcoming market applications in optical computing.

90-Minute Tutorials – Saturday, Dec. 2
A program of 90-minute tutorial sessions on emerging technologies will be presented by experts in the fields, bridging the gap between textbook-level knowledge and leading-edge current research. Advance registration is recommended.

  • The Evolution of Logic Transistors Toward Low Power and High Performance IoT Applications, Dr. Dae Won Ha, Samsung Electronics
  • Negative Capacitance Transistors, Prof. Sayeef Salahuddin, UC Berkeley
  • Fundamental, Thermal, and Energy Limits of PCM and ReRAM, Prof. Eric Pop, Stanford University
  • Hardware Opportunities in Cognitive Computing: Near- and Far-Term, Dr. Geoffrey Burr, Principal Research Staff Member, IBM Research-Almaden
  • 2.5D Interposers and High-Density Fanout Packaging as Enablers for Future Systems Integration, Dr. Sundaram Venkatesh, Associate Director, Georgia Tech 3D Systems Packaging Research Center
  • Silicon Photonics for Next-Generation Optical Interconnects, Dr. Joris Van Campenhout, Program Director Optical I/O, IMEC

Short Courses – Sunday, Dec. 3
Short Courses provide the opportunity to learn about important areas and developments, and provide the opportunity to network with experts from around the world. Advance registration is recommended.

  • Performance Boosters and Variation Management in Sub-5nm CMOS, organized by Sandy Liao, Intel
  • Merged Memory-Logic Technologies and Their Applications, organized by Kevin Zhang, TSMC

Plenary Presentations – Monday, Dec. 4

  • System Scaling Innovation for Intelligent Ubiquitous Computing, Jack Sun, VP of R&D, TSMC
  • Driving the Future of High-Performance Computing, Lisa Su, President & CEO, AMD
  • Energy-Efficient Computing and Sensing: From Silicon to the Cloud, Adrian Ionescu, Professor, EPFL

Plenary Presentation – Wednesday, Dec. 6

  • Development of a Sustainable Smart Society by Transformative Electronics, Hiroshi Amano, Professor, Nagoya University

Evening Panel Session – Tuesday evening, Dec. 5
The IEDM offers attendees an evening session where panels of experts give their views on important industry topics. Audience participation is encouraged to foster an open and vigorous exchange of ideas.

  • Who Will Lead the Industry in the Future? Moderator: Prof. Philip Wong, Stanford University

Entrepreneurs Lunch
The topic and speaker are yet to be determined, but this popular luncheon jointly sponsored by IEDM and the IEEE Electron Devices Society will be held once again.

Further information about IEDM
For registration and other information, visit www.ieee-iedm.org.

SUNY Polytechnic Institute (SUNY Poly) announced today that Interim Dean of Graduate Studies Dr. Fatemeh (Shadi) Shahedipour-Sandvik and her team of collaborators have been selected to receive $720,000 in federal funding from the U.S. Department of Energy’s Advanced Research Projects Agency-Energy (ARPA-E). The grant will be used to develop more efficient and powerful high-performance power switches at SUNY Poly for power electronics applications, such as for enabling a more efficient energy grid, for example. The research is in partnership with Dr. Woongje Sung of SUNY Poly, the Army Research Lab, Drexel University, and Gyrotron Technology, Inc.

“On behalf of SUNY Poly, I am excited to congratulate Professor Shahedipour-Sandvik as her wide-bandgap-focused research is recognized by the Department of Energy for its potential to improve power devices that are all around us to make our technological world more energy efficient and robust,” said SUNY Poly Interim President Dr. Bahgat Sammakia. “This award highlights SUNY Poly’s unique and advanced research capabilities, as well as its superb faculty who are developing the innovations of tomorrow right now in New York State.”

“This award is a strong indicator of how SUNY Poly’s resources and facilities are enabling the types of research that have the potential to improve power electronics devices which have become ubiquitous, from those utilized to make the power grid more efficient, to those that can improve electric car capabilities,” said SUNY Poly Vice President of Research Dr. Michael Liehr.

“I am proud that the U.S. Department of Energy’s ARPA-E has recognized our leading-edge power electronics-focused research, which holds the incredible potential to drive innovation for practical applications that could lead to worldwide energy savings. Advanced power electronic devices offer significant advances in power density, efficiency, and reduced total lifecycle cost,” said Prof. Shahedipour-Sandvik. “This grant allowing our SUNY Poly team and partners at the Army Research Lab, Drexel University and Gyrotron Technology, Inc. to explore advanced doping and annealing techniques for gallium nitride-based power devices is a testament to how SUNY Poly’s resources and leadership in areas like power electronics can help power the future in exciting and meaningful ways.” 

The SUNY Poly grant is part of a total of $6.9 million in funding that the U.S. Department of Energy ARPA-E is providing through its Power Nitride Doping Innovation Offers Devices Enabling SWITCHES (PNDIODES) program to seven institutions and organizations. With PNDIODES, ARPA-E is tackling a specific challenge in wide-bandgap semiconductor production. Wide-bandgap semiconductors are an important area of research because the materials, such as gallium nitride (GaN), allow for electronic devices to operate at higher temperatures and/or frequencies, for example, than current silicon-based computer chips, which is why technical advances in power electronics promise energy efficiency gains throughout the United States economy. Achieving high power conversion efficiency in these systems, however, requires low-loss power semiconductor switches. Power converters based on GaN could potentially meet the challenge by enabling higher voltage devices with improved efficiency—while also dramatically reducing size and weight of the device, for example.

The PNDIODES-funded research focuses on a process called selective area doping, in which a specific impurity is added to a semiconductor to change its electrical properties and achieve performance characteristics that are useful for electronics. Implemented well, this process can allow for the fabrication of devices at a competitive cost compared to their traditional, silicon-based counterparts. Developing a reliable and usable doping process that can be applied to specific regions of GaN and its alloys is an important obstacle in the fabrication of GaN-based power electronics devices that PNDIODES seeks to overcome. Ultimately, the PNDIODES project teams, including the Shahedipour-Sandvik team and Dr. Sung at SUNY Poly as well as the institution’s partners, will develop new ways to build semiconductors for high performance, high-powered applications like aerospace, electric vehicles, and the grid.

Prof. Shahedipour-Sandkvik team’s research, “Demonstration of PN-junctions by ion implantation techniques for GaN (DOPING-GaN),” will focus on ion implantation as the centerpiece of its approach and use new annealing techniques to develop processes to activate implanted silicon or magnesium in GaN to build p-n junctions, which are used to control the flow of electrons within an integrated circuit. Utilizing a unique technique with a gyrotron beam, a high-power vacuum tube that generates millimeter-wave electromagnetic waves, the team’s research aims to understand the impact of implantation on the microstructural properties of the GaN material and its effects on p-n diode performance.

In addition to this GaN-focused research being conducted by Prof. Shahedipour and her team at SUNY Poly, which also provides hands-on research opportunities for a number of the institution’s students, SUNY Poly and General Electric also lead the New York Power Electronics Manufacturing Consortium (NY-PEMC) with the goal of developing and producing low cost, high performance 6″ silicon carbide (SiC) wafers for power electronics applications. The consortium announced its first successful production of SiC-based patterned wafers in February at the Albany NanoTech Complex’s 150mm SiC line, with production coordinated with SUNY Poly’s Computer Chip Commercialization Center (Quad-C), located at its Utica campus where the SiC-based power chips will be packaged, a process that combines them with a housing that allows for interconnection with an application.

Texas Instruments Incorporated (TI) (NASDAQ: TXN) today announced that Brian T. Crutcher has been named to its board of directors. Mr. Crutcher is executive vice president and chief operating officer of TI.

“Brian is a great addition to our board,” said Rich Templeton, TI’s chairman, president and CEO. “He knows TI well and brings strong financial acumen and business judgment to the board.”

Crutcher, 44, joined TI in 1996 and has critical leadership responsibility for TI’s businesses, sales and manufacturing organizations. He was named a senior vice president in 2010, executive vice president in 2014 and chief operating officer in early 2017. Brian holds a Bachelor of Science in electrical engineering from the University of Central Florida and a Master of Business Administration from the University of California, Irvine.

“Brian’s 20-plus years of leading large, complex semiconductor operations gives him keen insights into the current and future state of this industry. His knowledge of markets and customers will be valuable to the board’s deliberations,” said Wayne Sanders, the TI board’s lead director and chairman of its governance and stockholder relations committee.

An international team of physicists, materials scientists and string theoreticians have observed a phenomenon on Earth that was previously thought to only occur hundreds of light years away or at the time when the universe was born. This result could lead to a more evidence-based model for the understanding the universe and for improving the energy-conversion process in electronic devices.

Using a recently discovered material called a Weyl semimetal, similar to 3D graphene, scientists at IBM Research (NYSE: IBM) have mimicked a gravitational field in their test sample by imposing a temperature gradient. The study was supervised by Prof. Kornelius Nielsch, Director at the Leibniz Institute for Materials and Solid State Research Dresden (IFW) and Prof. Claudia Felser, Director at the Max Planck Institute for Chemical Physics of Solids in Dresden.

After conducting the experiment in a cryolab at the University of Hamburg with high magnetic fields, a team of theoreticians from TU Dresden, UC Berkeley and the Instituto de Fisica Teorica UAM/CSIC confirmed with detailed calculations that they observed a quantum effect known as an axial-gravitational anomaly, which breaks one of the classical conservation laws, such as charge, energy and momentum.

This law-breaking anomaly had previously been derived in purely theoretical reasoning with methods based on string theory. It was believed to exist only at extremely high temperatures of trillions of degrees, as an exotic form of matter, called a quark-gluon plasma, at the early stages of the universe deep within the cosmos or created using particle colliders. But to their surprise, the researchers discovered that it also exists on Earth in the properties of solid-state physics, on which much of the computing industry is based on, spanning from tiny transistors to cloud data centers. This discovery is appearing today in the peer-reviewed journal Nature.

“For the first time, we have experimentally observed this fundamental quantum anomaly on Earth which is extremely important towards our understanding of the universe,” said Dr. Johannes Gooth, an IBM Research scientist and lead author of the paper. “We can now build novel solid-state devices based on this anomaly that have never been considered before to potentially circumvent some of the problems inherent in classical electronic devices, such as transistors.”

“This is an incredibly exciting discovery. We can clearly conclude that the same breaking of symmetry can be observed in any physical system, whether it occurred at the beginning of the universe or is happening today, right here on Earth,” said Prof. Dr. Karl Landsteiner, a string theorist at the Instituto de Fisica Teorica UAM/CSIC and co-author of the paper.

IBM scientists predict this discovery will open up a rush of new developments around sensors, switches and thermoelectric coolers or energy-harvesting devices, for improved power consumption.

The semiconductor market in China continues to grow at a staggering speed. The current backbone of the electronics and telecom industry in China, semiconductor companies in China are driving innovation with new trends like spending on wafer fab equipment. China’s semiconductor consumption and overall semiconductor manufacturing has also seen rapid growth over the recent years. BizVibe predicts that China will overtake the US to become the leader in the global semiconductor market within the next five years.

BizVibe_Predicts_-_China_Will_Dominate_the_Global_Semiconductor_Market_in_the_Next_5_Years

BizVibe is home to over 55,000 Electronics & Telecoms companies around the world, including many in China. In a recent article titled China Sets to Dominate the Global Semiconductor Market, BizVibe closely examines what is driving growth for the semiconductor market in China.

BizVibe notes that, over the last ten years, both China’s semiconductor consumption and production revenues increased at a greater rate than worldwide revenues. From 2005 through 2015, China’s semiconductor industry grew at a ten-year compounded annual growth rate (CAGR) of 18.7%, while its semiconductor consumption grew at a rate of 14.3%, compared to the worldwide semiconductor market, which grew at a 4% CAGR.

One of the main reasons behind China’s growing semiconductor sector is attributed to the country’s rising wafer fab equipment spending trends over the last decade. Although China is expected to play an increasingly influential role in the global semiconductor market over the next few years, government incentives and market conditions still need improvement to allow for the further reduction in the consumption/production gap and long-range moderate growth.

Taiwan is the world’s largest consumer of semiconductor materials for the seventh consecutive year, bringing new opportunities in this increasingly critical sector.  SEMICON Taiwan (13-15 September), held at Taipei’s Nangang Exhibition Center, will feature over 1,700 booths and 700 exhibitors, and more than 45,000 attendees from the global electronics manufacturing supply chain. This year, in addition to the much-anticipated Executive Summit, themed “Transformation: A Key to Solution,” 27 international forums will be held, exploring major issues. Speakers from TSMC, UMC, Powerchip, NVIDIA, Micron and Amkor will share their insights on trends and strategies of the next-generation electronics industry.

According to the SEMI Material Market Data Report, Taiwan’s semiconductor materials consumption was US$9.8 billion in 2016 − the world’s largest. Global semiconductor manufacturing equipment billings reached US$13.1 billion in Q1 2017, exceeding the record quarterly high set in Q3 2000. These figures signal that application drivers will continue to drive the development of a supply chain feeding their manufacturing processes, equipment and materials.

“As SEMICON Taiwan celebrates its 22nd year, the exhibition area will be expanded to closely align with the four major trends of applications in the market, which include Internet of Things (IoT), Smart Manufacturing, Smart Transportation, and Smart Medtech,” said Terry Tsao, president of SEMI Taiwan. “This year, SEMICON Taiwan aims to increasingly connect the entire manufacturing ecosystem vertically and horizontally. In addition, it will provide an overview of market trends and leading technologies in the industry, with forums and business matching activities which will enable collaboration and new opportunities.”

Theme Pavilions and Region Pavilions Focus on Opportunities

In addition to the eight customary theme pavilions, five new pavilions are featured this year, and to promote cross-border collaboration, eight regional pavilions are offered. The 21 pavilions include:

Theme Pavilions
  • Automated Optical Inspection (AOI)
  • Chemical Mechanical Planarization (CMP)
  • High-Tech Facility
  • Materials
  • Precision Machinery
  • Secondary Market
  • Smart Manufacturing & Automation
  • Taiwan Localization

 
New Theme Pavilions
  • Circular Economy
  • Compound Semiconductor
  • Flexible Hybrid Electronics/Micro-LED
  • Laser
  • Opto Semiconductor

 
Regional Pavilions
  • Cross-Strait
  • German
  • Holland High-Tech
  • Korean
  • Kyushu (Japan)
  • Okinawa (Japan)
  • Silicon Europe
  • Singapore

Co-located with SEMICON Taiwan 2017, the SiP Global Summit will discuss three key system-in-package topics:

  • Package Innovation in Automotive
  • 3D IC, 3D interconnection for AI and High-end Computing
  • Innovative Embedded Substrate and Fan-Out Technology to Enable 3D-SiP Devices

Participants will share trends on 2.5D/3D IC technologies, and the evolution and challenges of embedded technologies and wafer level packaging.

This is the first year that the International Test Conference (ITC) will be co-located with SEMICON Taiwan 2017, also marking the first time that ITC is held in Asia. The conference will focus on the rapid growth of emerging applications like IoT and automotive electronics, and how testing technologies are challenged by rapid advancements of manufacturing processes, 3D stacking and SiP.

For more information about SEMICON Taiwan 2017, please visit www.semicontaiwan.org or follow us on Facebook.