Category Archives: Device Architecture

Research information that will be posted in the March Update to the 20th anniversary 2017 edition of IC Insights’ McClean Report shows that fabless IC suppliers represented 30% of the world’s IC sales in 2016 (up from only 18% ten years earlier in 2006).  As the name implies, fabless IC companies do not have an IC fabrication facility of their own.

Figure 1 depicts the 2016 fabless company share of IC sales by company headquarters location.  As shown, at 53%, the U.S. companies held the dominant share of fabless IC sales last year, although this share was down from 69% in 2010 (due in part to the acquisition of U.S.-based Broadcom by Singapore-based Avago).  Although Avago, now called Broadcom Limited after its merger with fabless IC supplier Broadcom became official on February 1, 2016, has fabrication facilities that produce III-V discrete devices, it does not possess its own IC fabrication facilities and is considered by IC Insights to be a fabless IC supplier.

Figure 1

Figure 1

Figure 2 shows that in 2009, there was only one Chinese company in the top-50 fabless IC supplier ranking as compared to 11 in 2016.  Moreover, since 2010, the largest fabless IC marketshare increase has come from the Chinese suppliers, which held a 10% share last year as compared to only 5% in 2010. However, when excluding the internal transfers of HiSilicon (over 90% of its sales go to its parent company Huawei), ZTE, and Datang, the Chinese share of the fabless market drops to about 6%.

Figure 2

Figure 2

European companies held only 1% of the fabless IC company marketshare in 2016 as compared to 4% in 2010.  The reason for this loss of share was the acquisition of U.K.-based CSR, the second largest European fabless IC supplier, by U.S.-based Qualcomm in 1Q15 and the purchase of Germany-based Lantiq, the third largest European fabless IC supplier, by U.S.-based Intel in 2Q15.  These acquisitions left U.K.-based Dialog ($1.2 billion in sales in 2016) as the only Europe-headquartered fabless IC supplier in the fabless top 50-company ranking last year (Norway-based Nordic Semiconductor just missed making the top 50 ranking with 2016 sales of $198 million).

There is also only one major fabless Japanese firm—Megachips, which saw its sales increase by 20% in 2016 (8% using a constant 2015 exchange rate), one major South Korean fabless IC company (Silicon Works), and one major Singapore-based (Broadcom Ltd.) fabless supplier.

The American Institute for Manufacturing Integrated Photonics (AIM Photonics), a public-private partnership advancing the nation’s photonics manufacturing capabilities, and Coventor, Inc., a semiconductor process modeling software company, today announced Coventor as the newest member of AIM Photonics.   Coventor will provide access to its unique, physics-driven 3D modeling technology to improve the performance and manufacturability of complex, integrated photonic designs.

“AIM Photonics partnership with Coventor is another key building block in expanding this vital ecosystem,” said John Maggiore, New York State photonics board of officers chairman. “We are creating nothing short of a revolution in integrated photonics for our members, companies in NY’s Photonic Valley, and across the U.S.”

“Tasked with fostering advanced research in integrated photonics to enable the United States to achieve global manufacturing leadership, AIM Photonics is building a membership that includes the country’s most innovative technology companies. Each member brings vital expertise to the initiative,” said Mr. Robert Duffy, chairman of the AIM Photonics Leadership Council. “Coventor’s process modeling capabilities are strategic to our success and will help ensure the manufacturability of photonic designs produced in the United States.”

AIM Photonics, managed by SUNY Polytechnic Institute, was established in 2015 as part of the National Network for Manufacturing Innovation, a federal initiative designed to foster innovation and deliver new capabilities that can ultimately create a nationwide manufacturing infrastructure for integrated photonics.

Coventor’s SEMulator3D platform provides a complete virtual fabrication environment that models actual semiconductor processes and parallels the capabilities of actual fabs. Coventor’s platform enables photonic device designers to perform “virtual” fabrication of their devices and accurately predict downstream ramifications of process changes that would otherwise require build-and-test cycles in the fab.

“We are excited to be working with AIM Photonics and SUNY Polytechnic Institute, two leading institutions in the development of the emerging photonic integrated circuit industry,” said Michael Jamiolkowski, President and CEO of Coventor. “Building upon our commercial experience in the semiconductor industry, we see our membership in AIM Photonics as essential to our mission in supporting the design and manufacturing of next generation, photonic integrated components.”

“Coventor’s expertise in process modeling brings value to AIM Photonics and its membership and is key to scaling and integrating photonic design into commercial applications,” said Dr. Michael Liehr, CEO of AIM and executive vice president of technology and innovation for SUNY Polytechnic Institute. “We look forward to working with Coventor on next-generation electronic-photonic design platforms that support first pass, high-yield manufacturing of advanced silicon photonic devices.”

Synopsys, Inc. (Nasdaq:  SNPS) today announced that TSMC has certified the complete suite of products in the Synopsys Galaxy Design Platform for the most current version of 12-nanometer (nm) FinFET process technology. This 12nm certification brings with it the broad body of design collateral, including routing rules, physical verification runsets, signoff-accurate extraction technology files, SPICE correlated timing and interoperable process design kits (iPDKs) for this latest FinFET process. Synopsys Custom Compiler design solution support is enabled through an iPDK.

To accelerate access to this power-efficient, high-density process, IC Compiler II place-and-route system has been enabled to support new standard cell architectures seamlessly co-existing with 16FFC intellectual property (IP). Recent collaborations have resulted in enhancements to IC Compiler II’s core placement and legalization engines ensuring maximum utilization while minimizing placement fragmentation and cell displacement. The 12nm ready iPDK enables designers to use Custom Compiler’s layout assistant features to shorten time in creating FinFET layouts.

“This power-efficient, high-density node offers a broad set of opportunities to our customers, enabling them to deliver highly differentiated products,” said Suk Lee, TSMC senior director, Design Infrastructure Marketing Division. “Our ongoing collaboration with Synopsys is helping expedite designer access to 12-nm process technology.”

“The long-standing collaboration between Synopsys and TSMC continues to be key in bringing accelerated access to new process technology nodes,” said Bijan Kiani, vice president of product marketing for the Design Group at Synopsys. “With the Galaxy Design Platform certified for 12nm readiness, our mutual customers are enabled to speed up development and deployment to accelerate their time-to-market.”

A silicon optical switch newly developed at Sandia National Laboratories is the first to transmit up to 10 gigabits per second of data at temperatures just a few degrees above absolute zero. The device could enable data transmission for next-generation superconducting computers that store and process data at cryogenic temperatures. Although these supercomputers are still experimental, they could potentially offer computing speeds ten times faster than today’s computers while significantly decreasing power usage.

The fact that the switch operates at a range of temperatures, offers fast data transmission and requires little power could also make it useful for transmitting data from instruments used in space, where power is limited and temperatures vary widely.

“Making electrical connections to systems operating at very cold temperatures is very challenging, but optics can offer a solution,” said lead researcher Michael Gehl, Sandia National Laboratories, New Mexico. “Our tiny switch allows data to be transmitted out of the cold environment using light traveling through an optical fiber, rather than electricity.”

In The Optical Society’s journal for high impact research, Optica, Gehl and his colleagues describe their new silicon micro-disk modulator and show that it can transmit data in environments as cold as 4.8 Kelvin. The device was fabricated with standard techniques used to make CMOS computer chips, which means it can be easily integrated onto chips containing electronic components.

“This is one of the first examples of an active silicon optical device operating at such a low temperature,” said Gehl. “Our device could potentially revolutionize technologies that are limited by how fast you can send information in and out of a cold environment electrically.”

Optics excels at low temperatures

For low-temperature applications, optical methods provide several benefits over electrical data transmission. Because electrical wires conduct heat, they often introduce heat into a system that needs to stay cold. Optical fibers, on the other hand, transmit almost no heat. Also, a single optical fiber can transmit more data at faster rates than an electrical wire, meaning that one fiber can do the job of many electrical connections.

The micro-disk modulator requires very little power to operate — around 1000 times less power than today’s commercially available electro-optical switches — which also helps reduce the heat the device contributes to the cold environment.

To make the new device, the researchers fabricated a small silicon waveguide (used to transmit light waves) next to a silicon micro-disk only 3.5 microns in diameter. Light coming through the waveguide moves into the micro-disk and travels around the disk rather than passing straight through the waveguide. Adding impurities to the silicon micro-disk creates an electrical junction to which a voltage can be applied. The voltage changes the material’s properties in a way that stops the light from moving into the disk and allows it to instead pass through the waveguide. This means that the light signal turns off and on as the voltage switches on and off, providing a way to turn the ones and zeroes that make up electrical data into an optical signal.

Although other research groups have designed similar devices, Gehl and his colleagues are the first to optimize the amount of impurities used and the exact placement of those impurities to allow the micro-disk modulator to operate at low temperatures. Their approach could be used to make other electro-optical devices that work at low temperatures.

Low error rate

To test the micro-disk modulator, the researchers placed it inside a cryostat — a small vacuum chamber that can cool what’s inside to very low temperatures. The micro-disk modulator converted an electrical signal sent into the cryostat to an optical signal. The researchers then examined the optical signal coming out of the cryostat to measure how well it matched the incoming electrical data.

The researchers operated their device at room temperature, 100 Kelvin and 4.8 Kelvin with various data rates up to 10 gigabits per second. Although they observed a slight increase in errors at the highest data rate and lowest temperature, the error rate was still low enough for the device to be useful for transmitting data.

This work builds on years of effort to develop silicon photonic devices for optical communication and high performance computing applications, led by the Applied Photonics Microsystems group at Sandia. As a next step, the researchers want to demonstrate that their device works with data generated inside the low temperature environment, rather than only electrical signals coming from outside the cryostat. They are also continuing to optimize the performance of the device.

Synopsys, Inc. (Nasdaq:  SNPS) today announced its collaboration with TSMC to develop DesignWare Interface, Analog and Foundation IP for TSMC’s 12FFC process. By offering a wide range of IP on TSMC’s latest low-power process, Synopsys is enabling designers to take advantage of the low leakage and small area advantages of the new process. Synopsys and TSMC have partnered on the development of Synopsys IP for advanced process technologies for more than two decades, resulting in a robust portfolio of IP supporting process technologies down to 7nm. Synopsys DesignWare IP for the 12FFC process enables designers to accelerate development of mobile SoCs that incorporate logic librariesembedded memoriesembedded test and repairUSB 3.1/3.0/2.0USB-C 3.1/DisplayPort 1.3DDR4/3LPDDR4XPCI Express 4.0/3.1/2.1SATA 6GHDMI 2.0MIPI M-PHY and D-PHY and data converter IP.

“TSMC and Synopsys share a long history of providing designers with a wide range of high-quality IP on TSMC’s advanced FinFET processes,” said Suk Lee, TSMC senior director, Design Infrastructure Marketing Division. “By developing IP on the latest TSMC 12FFC process, Synopsys is paving the way for designers to improve their SoCs’ leakage and lower overall costs.”

“As SoCs continue to incorporate more advanced functionality, designers are constantly challenged with meeting aggressive performance, power and area requirements,” said John Koeter, vice president of marketing for IP at Synopsys. “Our close collaboration with TSMC on the development of a broad range of IP for the 12FFC process will ensure that designers have timely access to the high-quality, proven IP solutions they need to achieve their design goals and quickly get their product to market.”

Synopsys is a provider of high-quality, silicon-proven IP solutions for SoC designs.

Cadence Design Systems, Inc. (NASDAQ:  CDNS) today announced new optimization capabilities within its holistic, integrated design flow for TSMC’s advanced wafer-level Integrated Fan-Out (InFO) packaging technology. The integrated flow provides design and analysis capabilities and modeling of cross-die interactions for mobile and IoT applications.

The Cadence tools in the enhanced flow include the OrbitIO interconnect designer, System-in-Package (SiP) Layout, Quantus QRC Extraction Solution, Sigrity XtractIM technology, Tempus Timing Signoff Solution, Physical Verification System (PVS), Voltus-Sigrity Package Analysis, Sigrity PowerDC technology and Sigrity PowerSI 3D-EM Extraction Option. With the new flow, system-on-chip (SoC) designers can:

  • Quickly generate netlists among the multiple dies and InFO package in the context of the full system within a single-canvas multi-fabric environment: The OrbitIO interconnect designer efficiently handles multi-die integrations with TSMC InFO technologies to generate top-level netlists that can be directly used for subsequent design steps such as detailed electrical and timing analysis.
  • Generate Standard Parasitic Exchange Format (SPEF) directly from the package design database, which greatly eases timing signoff: Rather than using a traditional methodology that requires converting the package design database of an InFO design to an IC design database to generate SPEF, Sigrity XtractIM technology automatically generates SPEF for heterogeneous InFO systems, which accelerates the timing signoff process and speeds time to market.

“We’ve continued to see strong demand from mobile and IoT customers who want to deploy systems based on TSMC’s InFO technology,” said Steve Durrill, senior product engineering group director at Cadence. “By working closely with TSMC, we are enabling our mutual customers to shorten design and verification cycle times so they can deliver reliable, innovative SoCs to market faster.”

“The Cadence flow developed specifically for our InFO technology is an enabler for customers who need to increase bandwidth within small form factors,” said Suk Lee, TSMC senior director, Design Infrastructure Marketing Division. “The integrated full-flow includes a comprehensive set of Cadence digital, signoff and custom IC technologies that address this market need, and our collaboration is helping customers to efficiently achieve their design goals.”

Over 60,000 attendees are expected at SEMICON China opening tomorrow at Shanghai New International Expo Centre (SNIEC). SEMICON China (March 14-16) offers the latest in technology and innovation for the electronics manufacturing industry. FPD China is co-located with SEMICON China, providing opportunities in this related market. Featuring nearly 900 exhibitors occupying nearly 3,000 booths, SEMICON China is the largest gathering of its kind in the world.

Worldwide fab equipment spending is expected to reach an industry all-time record, to more than US$46 billion in 2017, according to the latest version of the SEMI (www.semi.org) World Fab Forecast. In 2018, the record may break again, with spending close to the $50 billion mark.  SEMI forecasts that China will be third ($6.7 billion) for regional fab equipment spending in 2017, but its spending in 2018 may reach $10 billion – which would be a 55 percent increase year-over-year, placing China in second place for worldwide fab equipment spending in 2018.

On March 14, keynotes at SEMICON China include SMIC chairman of the Board Zhou Zixue. ASE Group director and COO Tien Wu, ASML president and CEO Peter Wennink, Intel VP Jun He, Lam Research CEO Martin Anstice, TEL CTO Sekiguchi Akihisa and imec president and CEO Luc Van den hove.

SEMICON China programs expand attendees’ knowledge, networking reach, and business opportunities. Programs this year feature a broad and deep range:

  • CSTIC: On March 12-13, the China Semiconductor Technology International Conference (CSTIC) precedes SEMICON China. CSTIC is organized by SEMI and imec and covers all aspects of semiconductor technology and manufacturing.
  • Technical and Business Programs: 
    • March 14: China Memory Strategic Forum.
    • March 15: Building China’s IC Ecosystem, Green High-Tech Facility Forum, and Smart Manufacturing Forum, in addition Power & Compound Semiconductor Forum (Day 1).
    • March 16: Smart Automotive Forum, MEMS & Sensors Conference Asia, plus Power & Compound Semiconductor Forum (Day 2)
  • Tech Investment Forum: On March 15, an international platform to explore investment, M&A, and China opportunities.
  • Theme Pavilions:  SEMICON China also features six exhibition floor theme pavilions: IC Manufacturing, LED and Sapphire, ICMTIA/Materials, MEMS, Touch Screen and OLED.
  • Networking Events: SEMI Industry Gala, China IC Night, and SEMI Golf Tournament

For additional information on sessions and events at SEMICON China 2017, please visit www.semiconchina.org/en/4.

Analog Devices, Inc. (NASDAQ: ADI) today announced the completion of its acquisition of Linear Technology Corporation.

“The combination of Analog Devices and Linear Technology creates an analog industry powerhouse,” said Vincent Roche, ADI President and Chief Executive Officer. “Together, we are capable of solving more of our customers’ biggest and most complex challenges at the intersection of the physical and digital domains. We expect that this combination will create tremendous value for our customers, our employees, and our shareholders for many years to come.”

Election of Robert H. Swanson to ADI Board of Directors

ADI also announced that Robert H. Swanson, former Executive Chairman of Linear Technology, has been elected to the ADI Board of Directors, effective immediately after the closing of the acquisition.

“We are very excited to welcome Bob Swanson to our Board,” said Ray Stata, ADI Chairman of the Board. “Bob’s decades of analog semiconductor expertise will add considerable value to ADI’s Board of Directors.”

Mr. Swanson, a founder of Linear Technology, has served as Executive Chairman of the Linear Technology board of directors since January 2005. Prior to that time, he served as Chairman and Chief Executive Officer of Linear Technology since its incorporation in 1981.

As a result of the acquisition, Linear Technology’s shares of common stock have been delisted from the NASDAQ Global Select Market effective as of the close of trading today.

Credit Suisse Securities (USA) LLC acted as ADI’s exclusive financial advisor and Wachtell, Lipton, Rosen & Katz and WilmerHale acted as ADI’s legal counsel in connection with the transaction.

Contribution from Linear Technology to ADI’s 2nd fiscal quarter of 2017

ADI expects Linear Technology to contribute between $160 million to $170 million in revenue to ADI’s second fiscal quarter of 2017. This revenue range includes a reduction of approximately $30 million related to a purchase accounting adjustment for Linear’s North America distributor deferred revenue where revenue is recognized on a sell-through basis, and represents ADI’s current best view of Linear’s business performance through the end of ADI’s second fiscal quarter of 2017.

ADI also expects its non-GAAP interest and other interest expense to be approximately $60 million in the second quarter of fiscal 2017, approximately $70 million in the third quarter of fiscal 2017, and approximately $60 million per quarter thereafter.

In the first full quarter after the combination, ADI expects its weighted average diluted sharecount to be approximately 375 million and for the Company’s non-GAAP tax rate to be approximately 15%.

With respect to the forward-looking information presented on a non-GAAP basis, ADI is unable to provide a quantitative reconciliation to GAAP because the items that would be included or excluded are difficult to predict and estimate and are primarily dependent on future events, including costs relating to the acquisition of Linear.

Applied Materials, Inc. today announced Thomas J. Iannotti as chairman of the Board of Directors effective immediately. Mr. Iannotti succeeds Willem P. Roelandts, who has retired from the board. Mr. Iannotti joined Applied’s board in 2005. Prior to being named chairman, he served as chair of the board’s Human Resources and Compensation Committee and was a member of the Corporate Governance and Nominating Committee.

A veteran of the electronics industry for more than three decades, Mr. Iannotti is known for his global business, industry and operational expertise. He spent nine years as an executive at Hewlett-Packard Company, including Senior Vice President and General Manager, Enterprise Services from 2009 to 2011. Prior to Hewlett-Packard, Mr. Iannotti worked at Digital Equipment Corporation, a vendor of computer systems and software, and at Compaq Computer Corporation, a supplier of personal computing systems, after its acquisition of Digital Equipment Corporation.

“As a member of the Applied board, I have been inspired by the company’s ability to push the boundaries of technology and create innovations that drive the semiconductor and display industries forward,” said Mr. Iannotti. “I am honored to serve as chairman and would like to thank Wim Roelandts for his many contributions to Applied and the semiconductor industry during his remarkable career.”

“Tom brings deep knowledge of Applied, as well as strong industry and governance experience, to lead the board during one of the most exciting periods of innovation and growth in our company’s history,” said Gary Dickerson, president and CEO. “On behalf of everyone at Applied Materials, I thank Wim for his longtime service as a member of the board and for his leadership as chairman.”

Annual total semiconductor unit shipments (integrated circuits and opto-sensor-discrete, or O-S-D, devices) are forecast to continue their upward march in the next five years and are now expected to top one trillion units for the first time in 2018, according to data presented in IC Insights’ soon to be released March Update to the 2017 edition of The McClean Report—A Complete Analysis and Forecast of the Integrated Circuit Industry, and the 2017 O-S-D Report—A Market Analysis and Forecast for the Optoelectronics, Sensors/Actuators, and Discretes.

Semiconductor shipments totaled 868.8 billion in 2016 and are forecast to top one trillion units in 2018. Figure 1 shows that semiconductor unit shipments are forecast to climb to 1,002.6 billion devices in 2018 from 32.6 billion in 1978, which amounts to average annual growth of 8.9% over the 40 year period and demonstrates how dependent on semiconductors the world has become.

semiconductor unit growth

Figure 1

The largest annual increase in semiconductor unit growth during the timespan shown was 34% in 1984, and the biggest decline was 19% in 2001 following the dot-com bust.  The global financial meltdown and ensuing recession caused semiconductor shipments to fall in both 2008 and 2009; the only time that the industry experienced consecutive years in which unit shipments declined. Semiconductor unit growth then surged 25% in 2010, the second-highest growth rate across the time span.

Despite advances in integrated circuit technology and the blending of functions to reduce chip count within systems, the percentage split of IC and O-S-D shipments within total semiconductor units remains heavily weighted toward O-S-D devices.  In 2016, O-S-D devices accounted for 72% of total semiconductor units compared to 28% for ICs. Thirty-six years ago in 1980, O-S-D devices accounted for 78% of semiconductor units and ICs represented 22% (Figure 2).

Figure 2

Figure 2

Surprisingly, shipments of commodity-filled discretes devices category (transistor products, diodes, rectifiers, and thyristors) accounted for 44% of all semiconductor unit shipments in 2016. The long-term resiliency of discretes is primarily due to their broad use in all types of electronic system applications. Consumer and communications applications remain the largest end-use segments for discretes, but increasing levels of electronics being packed into vehicles for greater safety and fuel efficiency have boosted shipments of discretes to the automotive market as well. Discretes are used for circuit protection, signal conditioning, power management, high current switching, and RF amplification. Small signal transistors are still used in and around ICs on board designs to fix bugs and tweak system performance.

Among ICs, analog products accounted for the largest number of shipments in 2016. Analog ICs represented 52% of IC unit shipments in 2016, but only 15% of total semiconductor units. Figure 3 shows the split of semiconductor unit shipments by product type in 2016.

2016 semiconductor unit shipments

For 2017, semiconductor products showing the strongest unit growth rates are those that are essential building-block components in smartphones, new automotive electronics systems, and within systems that are helping to build out of Internet of Things.  Some of the fast-growing IC unit categories for 2017 include Consumer—Special Purpose Logic, Signal Conversion (Analog), Auto—Application-Specific Analog, and flash memory.  Among O-S-D devices, CCDs and CMOS image sensors, laser transmitters, and every type of sensor product (magnetic, acceleration and yaw, pressure, and other sensors) are expected to enjoy strong double-digit unit growth this year. More coverage about these semiconductor products and end-use applications are included in the 2017 editions of IC Insights’ McClean Report and O-S-D Report.