Category Archives: Displays

SEMI Taiwan today announced the formation of the FlexTech Taiwan Steering Committee. Serving as a platform that connects industry, academia, research and government, the committee will focus on identifying market trends and needs, solving technical challenges and accelerating innovation and business development to advance the flexible hybrid electronics industry and open business opportunities for its members.

Lightweight and highly scalable, flexible hybrid electronics promise to bring new applications and capabilities to consumer electronics, medical and health care, defense, transportation, textile, sports and leisure, robotics and industrial automation. To fulfill the potential of flexible hybrid electronics, the industry must overcome challenges in areas such as yield, cost, regulation and technology standards.

Key focus areas of the FlexTech Taiwan Steering Committee will include:

  • Capitalizing on Taiwan’s success in semiconductor and LCD/LED displays to build a complete flexible hybrid electronics ecosystem
  • Advocating for government policies on developing emerging industries, technology research funding, and talent development
  • Organizing exhibitions and other events to raise awareness and communicate the value of flexible hybrid electronics the electronics industry
  • Establishing industry standards to accelerate research and development and facilitate technology and product development

The FlexTech Taiwan Steering Committee consists of key industry players spanning equipment, materials, design, manufacturing, systems and end applications. Committee members include E Ink, ASE Group, AUO, Hitachi, Brewer Science, CymMetrik, DuPont, Singular Wings Medical, BenQ Materials Corporation, Nagase, Flexterra, Wisechip Semiconductor, AiQ Smart Clothing, Makalot Industrial, Far Eastern New Century, Ritdisplay Corportation, Applied Materials, Industrial Technology Research Institute (ITRI), National Sun Yat-sen University, and Chang Gung University.

Over the past 20 years, SEMI-FlexTech, a SEMI Strategic Association Partner, has promoted the development and commercialization of flexible hybrid electronics. Key achievements include:

  • Working with Boeing to develop a flexible electronic control device to reduce the weight of drones and commercial aircraft
  • Teaming with GE to develop RF stickers that measure human hydration
  • Collaborating with the U.S. Air Force to develop a non-invasive wearable device that measures biodata of aircraft pilots

For the past 17 years, SEMI and FlexTech have championed the development of the FHE industry through conferences and exhibitions in major microelectronics manufacturing regions such as North America, Europe, Taiwan, Japan, Korea, Singapore and China.

FLEX Taiwan, 29-30 May, 2019, is a one-day technical conference that provides a powerful platform for connecting with customers, suppliers, future partners and academia to drive collaboration and uncover new opportunities in flexible hybrid electronics. For more information, please click here.

By Serena Brischetto

SEMI spoke with Prof. Christoph Kutter, executive director, Fraunhofer EMFT, about trends and innovations in flexible hybrid electronics ahead of his presentation at the 2018 FLEX Europe – Be Flexible conference at SEMICON Europa 2018, 13-16, November 2018, in Munich, Germany. To register for the event, click here.

SEMI: Recent developments on thin semiconductors, new materials and cost-effective processing techniques have opened the door to a plurality of new applications and future products. What are the most innovative integration approaches?

Kutter: We have a variety of good examples, from medical to automotive. In his keynote, Philips Research Professor Ronald Dekker will present innovative approaches to integration as electronic devices find their way into the human body. Christian Neumann, head of Digital Printed Electronics at Heraeus, will discuss new markets like smart textiles and in-mold electronics, and Mike Hack, VP of Business Development at Universal Display Corporation, will explore the promise of OLED technology in giving rise to new, exciting products over the next few years.

SEMI: Can you share some details about the Fraunhofer EMFT roadmap?

Kutter: In his speech, Christof Landesberger, department manager at Fraunhofer EMFT will delve into the R2R Manufacture of Flexible Hybrid Electronics technology roadmap.  Flex Electronics allows for the hybrid integration of different functionalities and components for a broad variety of applications, which are needed in IoT scenarios. Christof will show a few examples of that.

SEMI: Are you currently working and experimenting on something particularly exciting?

Kutter: Thin chip foil packages with embedded microcontroller ICs were demonstrated successfully by Fraunhofer EMFT using single sheet film substrates. In order to achieve the next major step towards R2R manufacture, we are currently setting up a laser direct imaging (LDI) system for R2R lithographic patterning of interconnects and wiring schemes. A key advantage of such laser imaging system is its capability to correct the UV exposure process locally and, if necessary, individually at any chip position. Such adaptive lithographic patterning is supposed to bridge the gap between alignment requirements and geometric distortions in the web substrate. First results will be shown at the conference for the first time.

SEMI: What are your expectations for the future and why would you recommend attending the 2018 Flexible – Be Flexible conference at SEMICON Europa?

Kutter:  We expect Flex Hybrid Integration to become more and more important, since it offers the best of each world: mass volume printing technologies integrated with high performance ultra-low power electronics. You will see many examples of hybrid integration approaches during the conference.

SEMICON Europa is a very important platform to highlight the latest developments in the semiconductor industry. During the 2018 Flexible – Be Flexible conference, themed “Innovations enabled by Flexible Electronics,” researchers, market analysts, material and product developers, and equipment suppliers will gather to provide insights into the latest Flexible Hybrid Electronics innovations. We are particularly proud to organize this platform with SEMI and FlexTech Alliance.

Prof. Dr. Christoph Kutter is the director of the Fraunhofer EMFT, focusing on sensing technologies based on silicon electronics and flexible hybrid integration technologies.

Kutter serves as a member of the board of trustees at Fraunhofer Institut Für Nachrichten – Heinrich-Hertz Institut HHI and has been a ember of Supervisory Board at First Sensor AG since May 24, 2017 He completed his physics studies at TU Munich. In 1995, he earned his doctorate in physics at the University of Konstanz.

 

Serena Brischetto is a marketing and communications manager at SEMI Europe.

 

MagnaChip Semiconductor Corporation (“MagnaChip”) (NYSE: MX), a designer and manufacturer of analog and mixed-signal semiconductor platform solutions, today announced that volume production of a new Display Driver IC (DDIC) for automotive panel displays has begun.

MagnaChip is planning to expand its business to various automotive display applications in the market, starting with the design-win of new product at a leading Japanese panel maker of automotive CSD (Center Stack Display) panels. The application of this LCD-based display driver product will be further extended to a wide range of automotive applications such as instrument cluster, GPS navigation and car entertainment displays in the future. Over time, it is widely anticipated that OLED display drivers also will be adopted for use in automotive applications.

The new automotive DDIC, S8311, has a maximum of 1440 channel outputs and an mLVDS (Mini Low-Voltage Differential Signaling) interface and supports all types of TFT-LCD such as a-Si (Amorphous silicon), LTPS (Low Temperature Poly Silicon) and IGZO (Indium Gallium Zinc Oxide) for various automotive applications. MagnaChip fabricates the product in-house using the 150nm process, which is a cost-effective method the company has successfully used for many different products in recent years.

According to market research firm IHS, automotive display shipments keep growing with three primary automotive display systems: instrument cluster, center stack and heads-up display system. Based on current trends, IHS forecasts that global shipments of automotive display panels will rise to 165Mpcs in 2018 and increase to 200Mpcs in 2022.

“As the global automotive display market continues to expand, demand for high quality display driver products is expected to grow,” said YJ Kim, CEO of MagnaChip. “With our know-how and long track record of success in the Display market, we will continue to cooperate with major automotive display panel makers to extend our automotive DDIC business from a-Si TFT-LCD to LTPS, IGZO TFT-LCD and further to OLED panel-type displays.”

“MicroLED displays could potentially match or exceed OLED performance in all critical attributes,” said Dr. Eric Virey, Senior Technology & Market Analyst at Yole Développement (Yole).It includes brightness, contrast, color gamut, refresh rate, viewing angle, ruggedness and durability, resolution and pixel density, lifetime, power consumption etc.

 

Yole and its partner Knowmade, both part of Yole Group of Companies release two microLEDs reports to reveal the status of the technology and give a deep understanding of the industry, the companies involved and the related supply chain. MicroLED Displays 2018 and MicroLED Displays: Intellectual Property Landscape are now available. A detailed description is available on i-micronews.com, Displays section.

This year again, Yole Group of Companies pursued its investigation to understand the technical issues and business challenges and confirms today its market positioning with a new online event: MicroLED Displays: Hype and Reality, Hopes and Challenges – Webcast on October 11, 2018 at 5 PM CEST – 8 AM PDT – Powered by Yole Développement. Make sure to get a clear vision of this emerging industry and REGISTER today.

Sony’s demonstration of a full HD 55” microLED TV at CES 2012, more than six years ago, was the first exposure for microLED displays and generated a lot of excitement. Since Apple acquired Luxvue in 2014, many leading companies such as Facebook, Google, Samsung, LG or Intel have entered the game via sizable internal developments, acquisitions, like those of mLED and eLux, or investments in startups such as glō or Aledia.

Analyzing Apple’s microLED patent activity shows that the company essentially halted its filing around 2015. This is a surprising finding in the light of the fact that the consumer electronics giant has maintained a large project team and consistently spent hundreds of millions of dollars annually on microLED development. A closer analysis however brought up the name of a possible strawman entity used by Apple to continue filing patents and shows that the company is still advancing key aspects of microLED technologies.

“Despite a later start compared to pioneers such as Sony or Sharp, Apple’s portfolio is one of the most complete, comprehensively covering all critical technologies pertinent to microLEDs,” explains Dr Virey from Yole. “The company is the most advanced and still one of the best positioned to bring high volume microLED products to the market. However, it also faces unique challenges”, he adds.
Apple can’t afford to tarnish its brand and introduce a product featuring such a highly differentiating technology that would be anything but flawless. Moreover, it requires high volumes, which makes setting up the supply chain more challenging than for any other company.

In addition, it has no prior experience in display manufacturing and due to its need for secrecy, has to develop pretty much everything internally, duplicating technologies and infrastructures that others have the option to outsource…

The smartphones sector is a good example to illustrate the leadership of Apple. Indeed smartwatch volumes could reach 100 million units by 2027 and Apple remains the single largest smartwatch maker, explains Yole’s analysts in microLED reports. Yole’s scenario assumes that Apple would start using microLEDs in 2021 in a new flagship model, and, as is common with the brand, will propagate the technology in a staggered fashion over the next three years as legacy products are discontinued… MicroLED Displays report invites you to discover the MicroLED world with a section dedicated to the patent landscape. With this focus, Yole Group of Companies offers you a unique opportunity to get a clear view of the competitive landscape, understand the current challenges and identify business opportunities.

MicroLED webcast will average both Yole’s reports, MicroLED Displays and MicroLED Displays: Intellectual Property Landscape report in order to provide a global overview and status of the microLED industry. Powered by Yole, this event taking place on October 11, will provide an update on the status of the microLED industry. Dr. Eric Virey will detail the activity of the major players as well as remaining technology and supply chain bottlenecks. In addition, cost aspects will also be discussed as well as an assessment of when products can realistically be expected to hit the market. Yole Group of Companies is pleased to welcome during this webcast, on October 11

Plessey, a developer of award-winning optoelectronic technology solutions, announces it has placed an order for its next reactor from AIXTRON SE (FSE: AIXA), a global provider of deposition equipment to the semiconductor industry. The AIX G5+ C metal organic chemical vapour deposition (MOCVD) reactor will boost Plessey’s manufacturing capability of gallium nitride on silicon (GaN-on-Si) wafers targeting next-generation microLED applications.

With an automatic cassette-to-cassette (C2C) wafer transfer module, the new AIXTRON reactor will be installed and operational during Q1 of 2019 at Plessey’s 270,000 sq ft fabrication facility located in Plymouth, UK. The AIX G5+ C MOCVD system has two separate chamber set-up options, which enables configurations of 8 x 6in or 5 x 8in GaN-on-Si wafers to be automatically loaded and removed from the system in an enclosed cassette environment. The system will be an addition to the company’s existing metal organic chemical vapour deposition (MOCVD) reactors, also supplied by AIXTRON, which provide configurations of 7 x 6in or 3 x 8in with manual loading.

Productivity is further enhanced by the new reactor’s automated self-cleaning technology, which helps to deliver a very low level of wafer defects by ensuring the reactor is clean on every run, significantly reducing downtime for maintenance. The new equipment also provides faster ramp and cool down along with a high susceptor unload temperature to reduce the recipe time.

The AIX G5+ C reactor will support Plessey’s extensive production roadmap to increase R&D capacity of its monolithic microLEDs based on its proprietary GaN-on-Si technology. Plessey’s microLEDs offer extremely low power, high brightness and very high pixel density to create the potential for disruption in many existing application areas that use conventional display technologies such as LCD and OLED.

Plessey’s mission is to become the world’s leading company developing innovative illuminators for display engines and full-field emissive microLED displays. The complex devices combine very high-density RGB pixel arrays with high-performance CMOS backplanes to produce very high-brightness, low-power, and high-frame-rate image sources for head-mounted displays, and wearable electronics devices for augmented reality and virtual reality systems.

Quantum dots are nanometer-sized boxes that have attracted huge scientific interest for use in nanotechnology because their properties obey quantum mechanics and are requisites to develop advanced electronic and photonic devices. Quantum dots that self-assemble during their formation are particularly attractive as tunable light emitters in nanoelectronic devices and to study quantum physics because of their quantized transport behavior. It is important to develop a way to measure the charge in a single self-assembled quantum dot to achieve quantum information processing; however, this is difficult because the metal electrodes needed for the measurement can screen out the very small charge of the quantum dot. Researchers at Osaka University have recently developed the first device based on two self-assembled quantum dots that can measure the single-electron charge of one quantum dot using a second as a sensor.

The device was fabricated using two indium arsenide (InAs) quantum dots connected to electrodes that were deliberately narrowed to minimize the undesirable screening effect.

This is a scanning electron micrograph of InAs self-assembled quantum dot transistor device. Credit: Osaka University

“The two quantum dots in the device showed significant capacitive coupling,” says Haruki Kiyama. “As a result, the single-electron charging of one dot was detected as a change in the current of the other dot.”

The current response of the sensor quantum dot depended on the number of electrons in the target dot. Hence the device can be used for real-time detection of single-electron tunneling in a quantum dot. The tunneling events of single electrons in and out of the target quantum dot were detected as switching between high and low current states in the sensor quantum dot. Detection of such tunneling events is important for the measurement of single spins towards electron spin qubits.

“Sensing single charges in self-assembled quantum dots is exciting for a number of reasons,” explains Akira Oiwa. “The ability to achieve electrical readout of single electron states can be combined with photonics and used in quantum communications. In addition, our device concept can be extended to different materials and systems to study the physics of self-assembled quantum dots.”

An electronic device using self-assembled quantum dots to detect single-electron events is a novel strategy for increasing our understanding of the physics of quantum dots and to aid the development of advanced nanoelectronics and quantum computing.

SEMI announced today the September 18 deadline for presenters to submit abstracts for the annual SEMI Flexible Hybrid Electronics (FLEX) and MEMS and Sensors Technical Conference (MSTC). The co-located gathering, February 18-21, 2019, in Monterey, California, will feature technical presentations of more than 135 peer-reviewed manuscripts covering leading materials and methods that can enhance an expanding range of markets for microelectronics.

FLEX 2019 sessions will feature demonstrations of flexible hybrid and printed electronics products, equipment, and materials, as well as the unique electronics applications they enable.

MSTC 2019 sessions will address wearables, point of care medical devices, food delivery, and agriculture platforms, remote monitoring systems and other trending applications.

Both events will present opening day keynotes and a panel discussion, networking events, technical sessions on emerging and advanced electronics, tech courses and the annual FLEXI Awards Ceremony.  The conference will feature a special student poster session to highlight student projects related to either flexible electronics or MEMS and sensors and will conclude with an awards ceremony.

NextFlex, The Flex Group, Nano Bio Manufacturing Consortium and MEMS & Sensors Industry Group will hold several leadership meetings throughout the week in Monterey.

Selected FLEX and MSTC speakers will present to more than 700 executives, product marketing managers, business development professionals, researchers and engineers from the flexible, hybrid and printed electronics value chain, as well as the MEMS and Sensors industries; 400 companies, universities, R&D labs and government agencies; and, leading industry analysts and media from around the world. Technical abstracts are due September 28, 2018, and can be submitted here for FLEX and here for MSTC. Submissions are FREE and notifications of acceptance will be issued October 19.

FLEX 2019 will cover the following topics:

1. Application market segments and IOT for:

  • Agriculture
  • Consumer Electronics and Agriculture
  • Consumer Electronics: Appliances, Wearables & Textiles
  • Smart Infrastructure: Buildings, Surfaces & Lighting
  • Smart Manufacturing
  • Smart MedTech: Health and Wellness & Human Performance Monitoring
  • Smart Transportation: Automotive, Aircraft & Public Transit

2. Flexible electrical components for:

  • Advanced Packaging
  • Batteries & Energy Sources
  • Flexible Displays
  • Lighting
  • Other Hybrid Devices
  • Sensors
  • TFTs, Memory & Logic
  • User Interface

3. Materials for:

  • Barrier Films
  • Conductors, Insulators & Semiconductors
  • Electronic Fibers & Fabrics
  • Functional Inks
  • ITO & ITO Replacements
  • Substrates & Substrate Treatments

4. Processes and manufacturing for:

  • Equipment & Metrology
  • Failure & Lifetime Reliability
  • Hybrid Printing Processes
  • Integrated Manufacturing
  • Integration of Hybrid Devices
  • Multi-layer Additive Printing
  • Roll to Roll & Web Processing
  • System Interconnects
  • Testing

5. Standards for:

  • Design & Modeling File Format
  • Processes & Manufacturing
  • Reliability & Qualifications

MSTC 2019 will cover wearables, point-of-care medical devices, food delivery and agriculture platforms and remote monitoring systems such as environmental, weather, energy, industrial IoT and more. The conference will focus on the technical aspects of system-level solutions for these areas incorporating MEMS/Sensor and Actuators, Unique Applications and Innovative Technologies.

The co-location of FLEX and MSTC is organized by SEMI Americas to connect more than 2,000 member companies and 1.3 million professionals worldwide to advance the technology and business of flexible electronics and MEMS and Sensors.

Tight supplies of display panel materials and components, such as driver integrated circuit (IC), glass substrate and polarizer, are expected to slow the decline rate of liquid crystal display panel costs, according to IHS Markit (Nasdaq: INFO).

Supply of driver IC is forecast to tighten throughout 2018, estimated to exceed demand by 4 percent, per the new Display Driver IC Market Tracker by IHS Markit. Foundries have cut their production capacity of cheap driver ICs while increasing production of high-profit ICs and large-scale integrations (LSIs), mainly to satisfy orders from industries producing Internet of Things (IoT) and automotive technologies.

In addition, large panel driver ICs are mainly produced using 8-inch wafers but no foundries are making further investments into these wafer sizes as a generational transition is making its way into 12-inch wafers. “It seems that panel makers can secure driver IC supplies only by offering higher prices,” said Tadashi Uno, senior analyst at IHS Markit.

The average driver IC price increased by about 10 percent during the first half of 2018. Tight supply of driver ICs has impacted the prices of IT panels, such as desktop monitors, notebook PC and tablet PC panels, and has also extended into TV and smartphone panel prices since the third quarter of 2018.

Glass substrates are also in a tight supply situation since the beginning of  third quarter2018, according to the Display Glass Market Tracker by IHS Markit. The supply-demand glut in the third quarter has been below 5 percent, which is considered a tight supply threshold, while taking into account later delivery times.

“Major glass makers are investing in glass-melting tanks in China, but the higher glass consumption of Chinese panel makers’ means it exceeds more than double the glass production capacity of the country,” Uno said. “Chinese panel makers also import products from Japan, South Korea and Taiwan but they are stymied by glass production delays and delivery.”

According to the Display Optical Film Market Tracker by IHS Markit, polarizers have been in a tight supply situation since the third quarter. In July, film makers, such as Dai Nippon Printing and Nitto Denko, stopped operations for more than a week due to heavy rain in Japan. The production facilities are not damaged directly, but damaged infrastructures, such as roads, waterworks and electric facilities, have caused delivery delays.

Logistics issues remain even though operations have resumed. “Non-TAC polarizers, especially acryl polarizers, were already in tight supply but the recent floods have made the situation worse,” said Irene Heo, senior principal analyst at IHS Markit. Polarizer supply-demand glut is expected to be 4 percent in the third quarter, below the 5 percent balance bar.

The cash cost of a typical 32-inch high-definition (HD) open cell is expected to decline 1.4 percent in third quarter2018 compared to a year ago, according to the Large Area Display Cost Model. The contraction rate has slowed from 2.9 percent in the same period last year. “The main reason for the slow cost reduction is the increasing price of driver ICs,” Uno said. “However, glass substrate and polarizer price reductions have been relatively stable.”

Large thin-film transistor liquid crystal display (TFT LCD) panel shipments hit a record monthly high in July 2018 in terms of unit and area shipment. Unit shipments increased by 10 percent in July compared to a year ago to reach 64.3 million units, while area shipments jumped 19 percent during the same period to 17 million square meters, according to IHS Markit (Nasdaq: INFO).

“New facilities from China, such as BOE’s Gen 10.5, CHOT’s Gen 8.6 and CEC-Panda’s Gen 8.6, started mass production in the first half of this year. The production at the fabs has increased since the second quarter of 2018 as their glass inputs and production yield rates have improved,” said Robin Wu, principal analyst at IHS Markit. “Despite the growing production, panel makers have maintained the utilization rate and instead tried to push out panel shipments by lowering panel prices in the first half of 2018. That’s one of the reasons that panel shipments are continuously growing.”

The LCD TV panel contributed to the record high shipments of larger-than-9-inch LCD panels in July. Unit shipments of LCD TV panels increased by 15 percent in July year on year to 24.6 million units and area shipments jumped 21 percent to 13.3 million square meters, according to the Large Area Display Market Tracker by IHS Markit.

Panel makers suffered from high TV panel inventories in the first half of 2018 due to growing production capacities. Panel prices have been weak for a year and panel makers’ profit margins have plunged. “Therefore, panel makers wanted to clear up the inventory before the third quarter, high-demand season, when they aim to raise the panel price back again,” Wu said. “That has led to the fast growth in TV panel shipments lately, which as a result pulled the total large panel shipments to a historical high in July.” As the panel makers hoped, LCD TV panel prices rebounded in July 2018.

Chinese panel maker BOE led the large TFT LCD market in July 2018 in terms of unit shipments with a stake of 24 percent, followed by LG Display with 19 percent. However, in terms of area shipments, South Korea’s LG Display continued to lead with a 20 percent share, followed by BOE with 18 percent.

Universal Display Corporation (Nasdaq: OLED), enabling energy-efficient displays and lighting with its UniversalPHOLED® technology and materials, announced today the recipients of the UDC Innovative Research Award in Organic Electronics and the UDC Pioneering Technology Award in Organic Electronics. These awards were presented at the 18th International Meeting of Information Display (IMID) conference on August 30, 2018 in Busan, Korea by Dr. Julie Brown, Senior Vice President and Chief Technology Officer of Universal Display.

“Universal Display Corporation is proud to sponsor and support the innovative and brilliant research work in the organic electronics industry,” said Steven V. Abramson, President and Chief Executive Officer. “As a leader in the OLED industry, we believe that it is important to encourage and foster the relentless pursuit of exploration, experimentation and education in the scientific community. We congratulate the award recipients, and commend all the researchers for the important role they play in the field of organic electronics.”

The UDC awards recognize outstanding individuals or teams that have demonstrated innovative ideas or research initiatives impacting the organic electronics industry. The winners were selected by IMID and KIDS (Korean Information Display Society). The recipients for 2018 are:

UDC Innovative Research Award in Organic Electronics

Byung-Jun Kang, Dong-Myung Lee, Chang-Jae Yu, E-Joon Choi (Kumoh National Institute of Technology, Korea), and Jae-Hoon Kim (Hanyang University, Korea)

UDC Pioneering Technology Award in Organic Electronics

Hwang-Beom Kim and Jang-Joo Kim (Seoul National University, Korea)