Category Archives: Displays

EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG 7200 LA SmartNIL system for display manufacturing and other applications that require large-area substrates.

Leveraging EVG’s proprietary SmartNIL technology, the automated UV nanoimprint lithography (UV-NIL) system enables cost-efficient nano-patterning in high-volume manufacturing (HVM) applications. The EVG7200 LA is specifically designed for Gen 2 (370 mm x 470 mm) display panel manufacturing but can address a wide spectrum of biotechnology, photonics and optics applications. A few examples of imprinted patterns and devices supported by the EVG7200 LA include: wire grid polarizers, which enable better clarity and lower power consumption; lenticular lenses for direct-view 3D screens; and other functional surfaces that enable new features and specifications.

EVG7200 LA in cleanroom at EVG headquarters

EVG7200 LA in cleanroom at EVG headquarters

NIL is a highly cost-efficient method of enabling nano-scale patterns on large areas since it is not limited by sophisticated optics that are required with optical lithography, and since it can provide optimal pattern fidelity for extremely small (sub-100nm) structures. EVG, which has the largest installed base of NIL systems in production, has continually extended the capabilities of its NIL solutions to address new and emerging market needs and technology requirements. The latest addition to EVG’s NIL portfolio–the EVG7200 LA–brings nanoimprint lithography to a whole new level by enabling high-quality nano-patterning on panel-size substrates. As a result, novel structures based on nanotechnology that can improve device performance are now available for use in display manufacturing and other demanding large-area applications.

“EV Group’s market and technology leadership in nanoimprint lithography is built on years of field experience working with our partners and customers in multiple markets, as well as research and development work in our demo labs and NIL Photonics Competence Center,” stated Dr. Thomas Glinsner, corporate technology director at EV Group. “Driven by customer demand, we took our robust SmartNIL technology–which has already achieved outstanding imprint results on substrates up to 200 mm in diameter in high-volume manufacturing–and scaled it up to Gen 2 panel size. With the EVG7200 LA, we can now offer a full patterning solution for the display market, where companies have not previously considered NIL for their manufacturing efforts.”

The EVG7200 LA features EVG’s SmartNIL technology, which in combination with multi-use soft working stamp technology adapts to uneven and rough surfaces to provide unmatched conformal imprinting (down to 40nm) with high uniformity and pattern fidelity. This capability is especially critical to successfully manufacture wire grid polarizers, where pattern transfer into metal layers is needed and where critical dimensions of the device features fall below 100nm. In addition, SmartNIL’s soft stamp fabrication technology combined with automated low-force detachment extends the lifetime of master stamps, which results in significant cost savings for customers.

Demonstrations of the EVG7200 LA SmartNIL system are available at EVG’s headquarters in St. Florian, Austria.

Scientists have created the world’s thinnest lens, one two-thousandth the thickness of a human hair, opening the door to flexible computer displays and a revolution in miniature cameras.

Lead researcher Dr Yuerui (Larry) Lu from The Australian National University (ANU) said the discovery hinged on the remarkable potential of the molybdenum disulphide crystal.

Larry Lu (left), and Jiong Yang with the lens shown on screen. Credit: Stuart Hay, ANU

Larry Lu (left), and Jiong Yang with the lens shown on screen. Credit: Stuart Hay, ANU

“This type of material is the perfect candidate for future flexible displays,” said Dr Lu, leader of Nano-Electro-Mechanical System (NEMS) Laboratory in the ANU Research School of Engineering.

“We will also be able to use arrays of micro lenses to mimic the compound eyes of insects.”

The 6.3-nanometre lens outshines previous ultra-thin flat lenses, made from 50-nanometre thick gold nano-bar arrays, known as a metamaterial.

Molybdenum disulphide is an amazing crystal,” said Dr Lu. “It survives at high temperatures, is a lubricant, a good semiconductor and can emit photons too.

“The capability of manipulating the flow of light in atomic scale opens an exciting avenue towards unprecedented miniaturisation of optical components and the integration of advanced optical functionalities.”

Molybdenum disulphide is in a class of materials known as chalcogenide glasses that have flexible electronic characteristics that have made them popular for high-technology components.

Dr Lu’s team created their lens from a crystal 6.3-nanometres thick – 9 atomic layers – which they had peeled off a larger piece of molybdenum disulphide with sticky tape.

They then created a 10-micron radius lens, using a focussed ion beam to shave off the layers atom by atom, until they had the dome shape of the lens.

The team discovered that single layers of molybdenum disulphide, 0.7 nanometres thick, had remarkable optical properties, appearing to a light beam to be 50 times thicker, at 38 nanometres. This property, known as optical path length, determines the phase of the light and governs interference and diffraction of light as it propagates.

“At the beginning we couldn’t imagine why molybdenum disulphide had such surprising properties,” said Dr Lu.

Collaborator Assistant Professor Zongfu Yu at the University of Wisconsin, Madison, developed a simulation and showed that light was bouncing back and forth many times inside the high refractive index crystal layers before passing through.

Molybdenum disulphide crystal’s refractive index, the property that quantifies the strength of a material’s effect on light, has a high value of 5.5. For comparison, diamond, whose high refractive index causes its sparkle, is only 2.4, and water’s refractive index is 1.3.

This study is published in the Nature serial journal Light: Science and Applications.

It’s hardly a character flaw, but organic transistors–the kind envisioned for a host of flexible electronics devices–behave less than ideally, or at least not up to the standards set by their rigid, predictable silicon counterparts. When unrecognized, a new study finds, this disparity can lead to gross overestimates of charge-carrier mobility, a property key to the performance of electronic devices.

If measurements fail to account for these divergent behaviors in so-called “organic field-effect transistors” (OFETs), the resulting estimates of how fast electrons or other charge carriers travel in the devices may be more than 10 times too high, report researchers from the National Institute of Standards and Technology (NIST), Wake Forest University and Penn State University. The team’s measurements implicate an overlooked source of electrical resistance as the root of inaccuracies that can inflate estimates of organic semiconductor performance.

A circuit made from organic thin-film transistors is fabricated on a flexible plastic substrate. A team of NIST, Wake Forest, and Penn State University researchers has identified an overlooked source of electrical resistance that can exert a dominant influence on organic-semiconductor performance. Credit: Patrick Mansell/Penn State

A circuit made from organic thin-film transistors is fabricated on a flexible plastic substrate. A team of NIST, Wake Forest, and Penn State University researchers has identified an overlooked source of electrical resistance that can exert a dominant influence on organic-semiconductor performance. Credit: Patrick Mansell/Penn State

Their article appears in the latest issue of Nature Communications.

Already used in light-emitting diodes, or LEDs, electrically conductive polymers and small molecules are being groomed for applications in flexible displays, flat-panel TVs, sensors, “smart” textiles, solar cells and “Internet of Things” applications. Besides flexibility, a key selling point is that the organic devices–sometimes called “plastic electronics”–can be manufactured in large volumes and far more inexpensively than today’s ubiquitous silicon-based devices.

A key sticking point, however, is the challenge of achieving the high levels of charge-carrier mobility that these applications require. In the semiconductor arena, the general rule is that higher mobility is always better, enabling faster, more responsive devices. So chemists have set out to hurry electrons along. Working from a large palette of organic materials, they have been searching for chemicals–alone or in combination–that will up the speed limit in their experimental devices.

Just as for silicon semiconductors, assessments of performance require measurements of current and voltage. In the basic transistor design, a source electrode injects charge into the transistor channel leading to a drain electrode. In between sits a gate electrode that regulates the current in the channel by applying voltage, functioning much like a valve.

Typically, measurements are analyzed according to a longstanding theory for silicon field-effect transistors. Plug in the current and voltage values and the theory can be used to predict properties that determine how well the transistor will perform in a circuit.

Results are rendered as a series of “transfer curves.” Of particular interest in the new study are curves showing how the drain current changes in response to a change in the gate electrode voltage. For devices with ideal behavior, this relationship provides a good measure of how fast charge carriers move through the channel to the drain.

“Organic semiconductors are more prone to non-ideal behavior because the relatively weak intermolecular interactions that make them attractive for low-temperature processing also limit the ability to engineer efficient contacts as one would for state-of-the-art silicon devices,” says electrical engineer David Gundlach, who leads NIST’s Thin Film Electronics Project. “Since there are so many different organic materials under investigation for electronics applications, we decided to step back and do a measurement check on the conventional wisdom.”

Using what Gundlach describes as the semiconductor industry’s “workhorse” measurement methods, the team scrutinized an OFET made of single-crystal rubrene, an organic semiconductor with a molecule shaped a bit like a microscale insect. Their measurements revealed that electrical resistance at the source electrode–the contact point where current is injected into the OFET– significantly influences the subsequent flow of electrons in the transistor channel, and hence the mobility.

In effect, contact resistance at the source electrode creates the equivalent of a second valve that controls the entry of current into the transistor channel. Unaccounted for in the standard theory, this valve can overwhelm the gate–the de facto¬ regulator between the source and drain in a silicon semiconductor transistor–and become the dominant influence on transistor behavior.

At low gate voltages, this contact resistance at the source can overwhelm device operation. Consequently, model-based estimates of charge-carrier mobility in organic semiconductors may be more than 10 times higher than the actual value, the research team reports.

Hardly ideal behavior, but the aim of the study, the researchers write, is to improve “understanding of the source of the non-ideal behavior and its impact on extracted figures of merit,” especially charge-carrier mobility. This knowledge, they add, can inform efforts to develop accurate, comprehensive measurement methods for benchmarking organic semiconductor performance, as well as guide efforts to optimize contact interfaces.

The electronics and electrical appliances (E&E) industry in Thailand has long been an important sector to the nation, first as a manufacturer of white goods, then computers and parts, and now integrated circuits, hard disk drives, and printed circuit boards.

Constituting a nearly $100 billion USD industry, Thailand’s E&E sector has played a vital role in growing the country’s economy as a major export earner and positioning Thailand as one of the semiconductor leaders in the Southeast Asia region.

Taking note of this, SEMI, the global industry association serving the electronics manufacturing supply chains, will include discussions pertinent to Thailand’s semiconductor industry at the upcoming SEMICON Southeast Asia 2016 (SEMICON SEA 2016), the region’s premier showcase for microelectronics innovation.

According to Ng Kai Fai, President of SEMI Southeast Asia, “Forums and discussion sessions during SEMICON SEA 2016 will include topics that will interest semiconductor players from Thailand. This includes integrated circuit (IC) manufacturing, which is Thailand’s largest electronic imports and second largest electronics exports as well as automotive electronics, a sector which is booming in Thailand.”

“Thailand is in the list of the world’s fifteen automotive manufacturing countries and the most important growth area within automotive electronics is infotainment. According to recent news reports, the global automotive electronics market is expected to reach $280 billion USD by 2020. This provides a fertile ground for the semiconductor and electronics industry to strengthen the regional business collaborations between Thailand and Southeast Asia.”

Set to take place from 26-28 April 2016 at the Subterranean Penang International Convention and Exhibition Centre (SPICE) in Penang, Malaysia, SEMICON SEA 2016 will offer a complete platform for engaging customers, suppliers, engineers and decision-makers from across the industry. With the objective to champion regional collaboration, the showcase will open new business opportunities for customers and foster stronger cross-regional engagement.

“The inaugural SEMICON SEA was a success with audiences from not only Malaysia, but also around the Southeast Asia region. This year, we expect additional regional participation given the expanded content of the show as well as the ever increasing need for regional collaboration,” he added.

SEMICON SEA 2016 will focus on the key trends and solutions in semiconductor design and manufacturing, including emphasis on serving the needs of expanding applications markets many of which require development of specialised materials, packaging, and test technologies, as well as new architectures and processes.

To register for SEMICON SEA 2016 or to explore exhibiting opportunities, visit http://www.semiconsea.org/ or contact Ms. Shannen Koh at [email protected].

IoT Planet, a new European event dedicated to the Internet of Things (IoT), will co-locate this year with SEMICON Europa (25-27 October) in Grenoble, France.  IoT Planet provides a platform of networking and business to all IoT actors from software development, data management, IT infrastructures, system integration and “Connected Objects” applications.

For over 40 years, SEMI has organized SEMICON Europa, which has served as the premier annual European event for the electronics industry. In 2016, SEMICON Europa will connect the entire electronics supply chain: from materials and equipment, to manufacturing and technology, to advanced packaging and smart system integration – with a strong emphasis on application-driven markets, including Imaging, Power Electronics, Automotive, MedTech, and Flexible Hybrid Electronics.

IoT Planet, in its second year, will cover the full IoT domain with a unique format in mixing exhibition, Start-Up programs, crash tests, hackathon, forums, and debates, and many other events co-designed with the Partners. IoT Planet will connect professional visitors and high tech public across the domains of IoT applications, business, services, societal and private impact and talent management.

Together, the co-located events will offer visitors many learning and networking options along an extended supply chain. The events are expected to attract over 7,000 professional visitors and more than 600 exhibiting companies.

“Tomorrow’s applications will allow people to live smarter – healthier, safer, and more comfortable. The emerging opportunities are endless in smart electronic systems, but technology and system challenges must be overcome by connecting forces and by building on the strengths of different players in the value chain,” says Laith Altimime, president of SEMI Europe. “The co-location of these two events perfectly supports the SEMI 2020 strategy and will accelerate SEMI’s move towards covering the full electronics supply chain.”

“That initiative of co-location will contribute to our fast growth and strong differentiation, while providing a unique European opportunity to explore the full value chain from Silicon to Connected Object, in Grenoble, the European capital of Nanotechnologies and Connected Things,” says Alain Astier, president of IoT Planet UNIVERSAL.

For more information, please visit www.semiconeuropa.org and www.iot-planet.org.

Global flat panel display (FPD) market revenue is expected to shrink by 6 percent year over year in 2016 to $120 billion. While revenue has been declining for some time, this year it will reach its lowest level since 2012, according to IHS Inc. (NYSE:IHS), a global source of critical information and insight.

“The industry has begun to question whether the 2016 Summer Olympics in Brazil will spur panel demand, as Brazil’s domestic situation and economy are worsening,” said Ricky Park, director of large display research for IHS Technology. “The prolonged decline in oil prices and the resulting economic downturn in oil-producing countries, together with the economic slowdown in emerging markets, continue to adversely affect display demand. There is also growing concern about China’s sluggish domestic market, and the free fall in panel prices that began last year is also hampering market growth.”

Due to the panel oversupply situation, panel prices declined more rapidly in the second half of 2015 than during any other year since 2008. In December of 2015, for example, the average price for open-cell 32-inch liquid crystal displays (LCDs) tumbled nearly 41 percent since the previous year.

According to the IHS Display Long-term Demand Forecast Trackerstronger demand for large ultra-high definition (UHD) and 8K panels could slow declining average selling prices. Overall global display demand could also pick up after 2016, if the global economy improves as expected. Furthermore, as the demand for large TV panels rises, FPD shipment area is expected to grow at a compound annual growth rate of 5 percent, from 2015 to 2020.

FPD_Demand_Chart

Liquid crystal display (LCD) manufacturer inventory adjustments and continued slowing demand are causing TV and information technology (IT) display prices to fall, further eroding panel makers’ profitability. TV and IT display shipments in the first quarter (Q1) of 2016 are expected to decline 8 percent compared to the same period last year, to register just 196 million units. This is the first time since 2009 that panel shipments have declined in the first quarter year over year, according to IHS Inc., a global source of critical information and insight.

Although unit shipments of LCD display also declined last year, shipment area increased thanks to the growing popularity of large-screen TV sets, which sustained the display industry. Large-area TFT LCD shipment area increased by 5 percent in 2015 year over year, while unit shipments declined 4 percent, reaching 694 million units, according to the IHS Large Area Display Market Tracker“Due to global currency exchange issues and slower demand from emerging markets, global TV display demand in 2015 was lower than initially forecast,” said Yoonsung Chung, director of large area display research for IHS Technology.

“TV panel demand in early of 2016 will continue to falter, because of excess panel inventory carried over from last year,” said Linda Lin, senior analyst, large displays, IHS Technology. “To control the deficits caused by overproduction of IT and TV panels, panel makers will have to reduce fab utilization early this year, since average selling prices are nearing manufacturing costs.”

Notebook PC panel shipments are expected to experience the most serious year-over-year decline, falling 14 percent to reach 40.9 million units in Q1 2016. OLED TV panels will be the only display segment forecast to experience growth in Q1.

TV_IT_LCD_Shipment_Forecast

The oversupply in LCD TV panels is forecast to continue into the first quarter, according to the latest IHS TV Display Supply Chain Tracker – China. The leading six TV manufacturers in China expect to lower their panel purchasing by 37 percent quarter over quarter and 15 percent year over year. Meanwhile, Samsung Electronics and LG Electronics will slightly reduce panel purchases in Q1.

“Leading display manufacturers have not dramatically reduced fab utilization in the fourth quarter of last year, but the situation will change in the first quarter of 2016, as they will be pressed to reduce the loading,” Lin said. “The Chinese New Year holiday, planned fab maintenance and repairs, and the transition to thinner glass will also reduce output. BOE, ChinaStar, CEC-Panda and other leading Chinese manufacturers that are ramping up new Gen8 fabs will have to reduce their capacity utilization in the first quarter to fight declining panel prices and shipments.”

Mentor Graphics Corporation today announced the availability of new expanded processor support from the Mentor Embedded Linux development platform, including Yocto 2.0-based development tools, for the third generation AMD Embedded G-Series system-on-chip (SoC). The AMD Embedded G-Series Family of SoC devices with AMD Radeon R7 Graphics (codenamed: “Brown Falcon”) support heterogeneous system architectures for advanced processing performance, power efficiency and multimedia immersion. Mentor Graphics support enables efficient heterogeneous multicore development, allowing embedded developers to take full advantage of AMD processors for feature-rich applications targeting markets such as digital gaming, point-of-sale (POS), and electronic signage and displays.

AMD embedded customers can download the updated Mentor Embedded Linux Lite and CodeBench Lite tools to quickly build, from source, a customized Linux-based platform based on technology from the latest 2.0 release of the Yocto Project. Using the Mentor Embedded Sourcery CodeBench and award-winning Sourcery Analyzer technologies, embedded C/C+ developers can gain valuable insights into system behavior and timing through a visual debugging framework that identifies functional, timing, and performance bottlenecks.

“With this announcement, AMD embedded customers now have even more choices available for their Linux development, from the no-cost Mentor Embedded Linux Lite to the robust commercially-supported Mentor Embedded Linux,” stated Scott Aylor, corporate vice president and general manager, AMD Enterprise Solutions. “Free access to Mentor’s embedded development software will be of great value to our AMD embedded customers who require a scalable global supplier to meet the needs of their embedded system design challenges.”

Embedded developers can now perform evaluation, prototyping, and development by downloading freely available Mentor Embedded Linux Lite and Sourcery CodeBench Lite solutions to support these latest AMD embedded processors today. Additionally, developers can continue to seamlessly migrate to these new commercial versions of Mentor Embedded Linux with the Sourcery CodeBench tool. The combination of AMD embedded processors and the Mentor Embedded Linux product delivers a powerful hardware/software platform for highly-productive embedded development.

The Mentor Embedded Linux runtime and development tools also support the AMD Embedded R-Series SoC (previously codenamed “Merlin Falcon”), previous generation G-Series processors (previously codenamed: “Steppe Eagle” and “Crowned Eagle”), and the AMD Embedded R-Series APU (previously codenamed: “Bald Eagle”).

With just a tiny tweak, researchers at Kyushu University greatly increased the device lifetime of organic light-emitting diodes (OLEDs) that use a recently developed class of molecules to convert electricity into light with the potential for increased efficiency at a lower cost in future displays and lighting.

Using the OLED structure in this schematic, researchers were able to delay the degradation in brightness of an OLED with the TADF emitter 4CzIPN by eight to sixteen times. Credit: Daniel Ping-Kuen Tsang and William John Potscavage Jr.

Using the OLED structure in this schematic, researchers were able to delay the degradation in brightness of an OLED with the TADF emitter 4CzIPN by eight to sixteen times. Credit: Daniel Ping-Kuen Tsang and William John Potscavage Jr.

The easily implemented modifications can also potentially increase the lifetime of OLEDs currently used in smartphone displays and large-screen televisions.

Typical OLEDs consist of multiple layers of organic films with various functions. At the core of an OLED is an organic molecule that emits light when a negatively charged electron and a positively charged hole, which can be thought of as a missing electron, meet on the molecule.

Until recently, the light-emitting molecules were either fluorescent materials, which can be low cost but can only use about 25% of electrical charges, or phosphorescent materials, which can harvest 100% of charges but include an expensive metal such as platinum or iridium.

Researchers at Kyushu University’s Center for Organic Photonic and Electronics Research (OPERA) changed this in 2012 with the demonstration of efficient emitters based on a process called thermally activated delayed fluorescence (TADF).

Through clever molecular design, these TADF materials can convert nearly all of the electrical charges to light without the expensive metal used in phosphorescent materials, making both high efficiency and low cost possible.

However, OLEDs under constant operation degrade and become dimmer over time regardless of the emitting material.

Devices that degrade slowly are key for practical applications, and concerns remained that the lifetime of early TADF devices was still on the short side.

But with the leap in lifetime reported in a paper published online March 1, 2016, in Scientific Reports, many of those concerns can now be put to rest.

“While our initial TADF devices lost 5% of their brightness after only 85 hours,” said postdoctoral researcher Daniel Tsang, lead author on the study, “we have now extended that more than eight times just by making a simple modification to the device structure.”

The newly developed modification was to put two extremely thin (1-3 nm) layers of the lithium-containing molecule Liq on each side of the hole blocking layer, which brings electrons to the TADF material, the green emitter 4CzIPN in this case, while preventing holes from exiting the device before contributing to emission.

The devices will last even longer in practical applications because the tests are performed at extreme brightnesses to accelerate the degradation.

Applying additional optimizations that have been previously reported, the 5% drop was further delayed to longer than 1,300 hours, over 16 times that of the initial devices.

“What we are finding is that the TADF materials themselves can be very stable, making them really promising for future displays and lighting,” said Professor Chihaya Adachi, director of OPERA.

The benefits of the Liq layers are not limited to TADF-based OLEDs as the researchers also found an improvement using a similar device structure with a phosphorescent emitter.

Though still trying to completely unravel the degradation mechanism, the researchers found that devices with the Liq layers contain a much lower number of traps, a type of defect that can capture and hold a charge, preventing it from moving freely in the device.

These defects were observed by measuring tiny electrical currents created when charges that were frozen in the traps at extremely cold temperatures escape by receiving a jolt of thermal energy as the device is heated, a process called thermally stimulated current.

Having charges stuck in these traps may increase the chance for interactions with other charges and electrical excitations that can destroy the molecules and lead to degradation.

One of the next major challenges for TADF is stable and efficient blue emitting materials, which are necessary for full color displays and are also still difficult using phosphorescence.

“With the continued development of new materials and device structures,” said Prof. Adachi, “we think that TADF has the potential to solve the challenge of efficient and stable blue emission.”

Microchip Technology Inc., a provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced the industry’s first development kit for integrated 2D projective capacitive touch (PCAP) and 3D gesture recognition on displays – the 2D/3D Touch and Gesture Development Kit (DV102014). The kit will provide designers easy access to Microchip’s patented 2D and 3D GestIC sensing technology, allowing them to easily integrate 2D multi-touch and 3D hand gesture recognition into their display applications. The use of electric-field based technology enables hand and finger gestures to now be tracked both on the display surface as well as above at a distance of up to 20 cm. In addition, the development kit provides an easy-to-use, “out-of-the-box” experience that requires no code development.  Parameterization, diagnostics and optional settings are done through Aurea 2.0, a free downloadable graphical user interface (GUI).

The 2D/3D Touch and Gesture Development Kit features Microchip’s latest PCAP controller, MTCH6303, with the MGC3130 3D gesture controller. It includes an eight-inch transparent touch sensor to enable rapid prototyping for widely available displays. The MTCH6303 provides multi-touch coordinates with a five-finger scan rate of 100 Hz. In addition, it has an integrated multi-finger surface gesture suite which makes it a good fit both for Operating System (OS) driven applications as well as embedded systems without an operating system.

The MGC3130 with Microchip’s award-winning GestIC technology was the first electrical-field-based 3D gesture controller to offer low-power, precise, and robust hand position tracking at 200 Hz. In addition, GestIC technology utilizes advanced Hidden Markov Models to ensure that the recognition rate for 3D hand gestures is above 95%. Free-space hand gestures are universal, hygienic and easy to learn, making them ideal for display applications.

“Microchip has been an industry leader in developing gesture-based technologies since the launch of GestIC,” said Dr. Roland Aubauer, director of Microchip’s Human-Machine Interface Division, “GestIC technology is a low complexity solution for adding 3D features to display applications that combine seamlessly with 2D PCAP multi-touch designs. Designers now have an easy way to combine 2D and 3D user interface technologies in order to build innovative and easy to use applications.”