Category Archives: Displays

The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors were $27.9 billion for the month of July 2015, a decrease of 0.9 percent from July 2014 when sales were $28.1 billion. Global sales from July 2015 were 0.4 percent lower than the June 2015 total of $28.0 billion. Regionally, sales in the Americas were roughly flat in July compared to last year, while sales in China increased by nearly 6 percent. All monthly sales numbers are compiled by the World Semiconductor Trade Statistics (WSTS) organization and represent a three-month moving average.

“Global semiconductor sales have slowed somewhat this summer in part due to softening demand, normal market cyclicality, and currency devaluation in some regional markets,” said John Neuffer, president and CEO, Semiconductor Industry Association. “Despite these headwinds, year-to-date global sales through July are higher than at the same time last year, which was a record year for semiconductor revenues.”

Regionally, year-to-year sales increased in China (5.6 percent), Asia Pacific/All Other (1.0 percent), and the Americas (0.8 percent), but decreased in Europe (-12.5 percent) and Japan (-13.3 percent), in part due to currency devaluation. On a month-to-month basis, sales increased in Japan (2.7 percent), China (0.6 percent), and Europe (0.4 percent), but fell slightly in the Americas (-0.3 percent) and Asia Pacific/All Other (-2.5 percent).

“One key facilitator of continued strength in the U.S. semiconductor industry is research, the lifeblood of innovation,” Neuffer said. “SIA and Semiconductor Research Corporation this week released a report highlighting the urgent need for research investments to advance the burgeoning Internet of Things and develop other cutting-edge, semiconductor-driven innovations. Implementing the recommendations in the report will help the United States harness new technologies and remain the world’s top innovator.”

July 2015

Billions

Month-to-Month Sales                               

Market

Last Month

Current Month

% Change

Americas

5.53

5.52

-0.3%

Europe

2.83

2.84

0.4%

Japan

2.57

2.64

2.7%

China

8.13

8.18

0.6%

Asia Pacific/All Other

8.94

8.71

-2.5%

Total

27.99

27.88

-0.4%

Year-to-Year Sales                          

Market

Last Year

Current Month

% Change

Americas

5.47

5.52

0.8%

Europe

3.24

2.84

-12.5%

Japan

3.04

2.64

-13.3%

China

7.75

8.18

5.6%

Asia Pacific/All Other

8.63

8.71

1.0%

Total

28.13

27.88

-0.9%

Three-Month-Moving Average Sales

Market

Feb/Mar/Apr

May/Jun/Jul

% Change

Americas

5.61

5.52

-1.7%

Europe

2.89

2.84

-1.8%

Japan

2.54

2.64

3.8%

China

7.77

8.18

5.2%

Asia Pacific/All Other

8.74

8.71

-0.3%

Total

27.56

27.88

1.2%

Related news: 

Tech, academic leaders call for robust research investments to bolster U.S. tech leadership, advance IoT

Researchers from Holst Centre (set up by TNO and imec), imec and CMST, imec’s associated lab at Ghent University, have demonstrated the world’s first stretchable and conformable thin-film transistor (TFT) driven LED display laminated into textiles. This paves the way to wearable displays in clothing providing users with feedback.

Wearable devices such as healthcare monitors and activity trackers are now a part of everyday life for many people. Today’s wearables are separate devices that users must remember to wear. The next step forward will be to integrate these devices into our clothing. Doing so will make wearable devices less obtrusive and more comfortable, encouraging people to use them more regularly and, hence, increasing the quality of data collected. A key step towards realizing wearable devices in clothing is creating displays that can be integrated into textiles to allow interaction with the wearer.

“Wearable devices allow people to monitor their fitness and health so they can live full and active lives for longer. But to maximize the benefits wearables can offer, they need to be able to provide feedback on what users are doing as well as measuring it. By combining imec’s patented stretch technology with our expertise in active-matrix backplanes and integrating electronics into fabrics, we’ve taken a giant step towards that possibility,” says Edsger Smits, Senior research scientist at Holst Centre.

The conformable display is very thin and mechanically stretchable. A fine-grain version of the proven meander interconnect technology was developed by the CMST lab at Ghent University and Holst Centre to link standard (rigid) LEDs into a flexible and stretchable display. The LED displays are fabricated on a polyimide substrate and encapsulated in rubber, allowing the displays to be laminated in to textiles that can be washed. Importantly, the technology uses fabrication steps that are known to the manufacturing industry, enabling rapid industrialization.

Following an initial demonstration at the Society for Information Display’s Display Week in San Jose, USA earlier this year, Holst Centre has presented the next generation of the display at the International Meeting on Information Display (IMID) in Daegu, Korea, 18-21 August 2015. Smaller LEDs are now mounted on an amorphous indium-gallium-zinc oxide (a-IGZO) TFT backplane that employs a two-transistor and one capacitor (2T-1C) pixel engine to drive the LEDs. These second-generation displays offer higher pitch and increased, average brightness. The presentation will feature a 32×32 pixel demonstrator with a resolution of 13 pixels per inch (ppi) and average brightness above 200 candelas per square meter (cd/m2). Work is ongoing to further industrialize this technology.

The world’s first stretchable and conformable thin-film transistor (TFT) driven LED display laminated into textiles developed by Holst Centre, imec and CSMT.

The world’s first stretchable and conformable thin-film transistor (TFT) driven LED display laminated into textiles developed by Holst Centre, imec and CSMT.

A coalition of leaders from the tech industry and academia, led by the Semiconductor Industry Association (SIA) and Semiconductor Research Corporation (SRC), today released a report highlighting the urgent need for robust investments in research to advance the burgeoning Internet of Things (IoT) and develop other cutting-edge innovations that will sustain and strengthen America’s global technology leadership into the future. The report, titled “Rebooting the IT Revolution: A Call to Action,” calls for a large-scale, public-private research initiative called the National Computing and Insight Technologies Ecosystem (N-CITE).

“The United States stands at a crossroads in the global race to uncover the next transformative innovations that will determine technology leadership,” said John Neuffer, president and CEO of the Semiconductor Industry Association, which represents U.S. leadership in semiconductor manufacturing, design, and research. “We either aggressively invest in research to foster new, semiconductor-driven technologies such as the Internet of Things that will shape the future of the digital economy, or we risk ceding ground to competitors abroad. The findings and recommendations in the Rebooting the IT Revolution report will help the United States rise to this bold challenge, choose the right path forward, and harness the new technologies that will keep America at the tip of the spear of innovation.”

Basic scientific research funded through agencies such as the National Science Foundation (NSF), the National Institute of Standards and Technology (NIST), the Defense Advanced Research Projects Agency (DARPA), and the Department of Energy (DOE) Office of Science has yielded tremendous dividends, helping launch technologies that underpin America’s economic strength and global competiveness. The U.S. semiconductor industry has been a reliable partner in funding research, investing about one-fifth of revenues each year in R&D – the highest share of any industry.

“The IoT — from ubiquitous sensor nodes to the cloud — will be orders of magnitude larger and more complex than anything we know today. Moreover, as the demand for more energy-efficient yet more powerful computing grows, new approaches such as brain-inspired computing have the potential to transform the way systems are designed and manufactured,” said Ken Hansen, president of Semiconductor Research Corporation (SRC), the world’s leading university research consortium for semiconductor technologies. “Addressing the fundamental research challenges outlined in this report is essential to creating the infrastructure that will enable the conversion of data to insight and actionable information with appropriate security and privacy. While some areas are moving forward quickly, others require collaborative research among industry, academia and government to capture the untold benefits of this distributed, intelligent ecosystem.”

The report contains opinions from industry, academic and government leaders who participated in the Rebooting the IT Revolution Workshop on March 30–31, 2015. The workshop was sponsored by SIA and SRC and supported by NSF.

Participants stressed the need for fundamental research in the following areas in order to fully realize IoT breakthroughs and sustain America’s technology leadership: energy-efficient sensing and computing, data storage, real-time communication ecosystem, multi-level and scalable security, a new fabrication paradigm, and insight computing. Many of these areas align with Federal research initiatives, including the National Strategic Computing Initiative, the BRAIN Initiative, and the National Nanotechnology Initiative Grand Challenges.

“IoT technology will connect directly to both the physical and social worlds by advancing disruptive hardware, cross-field networking, insight-generating IT, and principles of convergence, which are at the core of future U.S. technology and economic development,” said Mihail C. Roco, Senior Advisor for Science and Engineering at NSF and a key architect of the National Nanotechnology Initiative. “The report’s contents reflect a new way of thinking to create an interdependent, scientific-technological-social ecosystem driven by the emergent confluence of IT with nanotechnology, advanced manufacturing, cognitive sciences, sustainability, and safety. All are in response to an increasingly interconnected, knowledge-driven and demanding society. In the longer term, implementation of the report would support global human progress.”

Electronic materials play a key role in touch panel technologies, such as new flexible touch technologies. Equally application know-how plays a vital part in the success of the new material to be used in device manufacture.

Together with ITRI, Taiwan, Heraeus, demonstrated the integration of Clevios conductive polymer based touch panel with AM OLED technology in a highly flexible device. The device was prepared using Clevios PEDOT conductive polymer material (formulated by EOC, Taiwan) patterned on ITRI’s FlexUp substrate. Solution processable and printable Clevios PEDOT: PSS is used as the transparent electrode in this device. In the project a 7 inch flexible Touch Panel / AM OLED device was produced.

Heraeus has been collaborating with ITRI since 2013.

“In this latest development project with ITRI, we have produced a reliable, flexible, advanced touch panel and integrated it with an AM OLED display, opening up new possibilities in flexible, foldable and wearable technologies” said Dr. Stephan Kirchmeyer, Global Marketing Director for the Display & Semiconductor Business at Heraeus. Dr. Janglin Chen, Vice President and General Director of ITRI’s Display Technology Center added, “The co-operation with Heraeus has shown the options for touch panel makers are broader than just metallic based ITO-alternatives.”

Further projects with the ITRI Group and Heraeus in the application of displays are ongoing. The touch sensor electrodes are based on a Clevios PEDOT. The experts at ITRI subsequently patterned the film using Heraeus invisible etch technology. A key element is flexibility which was tested 10,000 times at a bending radius of 5mm. The touch panel is laminated on the AM OLED display. The final product has 5 interactive functions within the display including touch controllable zoom in/out and rotation functions.

The Clevios PEDOT:PSS range from the Display & Semiconductor Business Unit of Heraeus consists of materials for antistatic through to highly conductive applications. Materials are modified for their application method, usually printing or coating, and for their end application requirements. Typically Clevios coatings can reach 100 -250 Ohm/sq. at a transparency of 90 percent (excluding substrate film). Clevios is increasingly finding applications in touch panels and sensors, as well as OLEDs, organic solar cells and security coatings.

BY PETE SINGER, Editor-in-Chief

Solid State Technology recently conducted a survey of our readers on how the Internet of Things (IoT) is driving the demand for semiconductor technology. A total of 303 people responded to the survey. A majority of the respondents were in management roles.

Survey questions focused on their expectations for growth in the Internet of Things (IoT), drivers, potential roadblocks, opportunities and impact on semiconductor technology, including manufacturing and packaging.

There is little agreement on how strongly the IoT device market will grow. About a quarter of the respondents said, by 2020, 30-50 billion devices would be connected to internet with unique urls. Almost as many were much more optimistic, saying more than 90 billion.

A sizable majority of the respondents (59.41%) believe new companies will emerge to benefit from the growth in IoT. Existing companies will also benefit, with MEMS companies benefitting the most.

A majority of the respondents said the existing supply chain and industry infrastructure was not equipped to handle the needs of the IoT or said they weren’t sure. Similarly, most said new manufacturing equipment and new materials will be needed for IoT device manufacturing.
My take on this is that while the market potential for companies involved in IoT devices is large, there is little agreement on exactly how large it might become.

I believe it’s also likely that new companies will emerge focused specifically on manufacturing IoT devices. Existing companies across the supply chain will also benefit.

Clearly, IoT devices will create new challenges, especially in the area of packaging. Form-factor, security and reliability are the most important characteristics of IoT devices.

Another recently completed survey on the IoT by McKinsey & Company and the Global Semiconductor Alliance (GSA) revealed some ambiguity about whether the IoT would be the top growth driver for the semiconductor industry or just one of several important forces.

The survey of executives from GSA member companies showed that they had mixed opinions about the IoT’s potential, with 48 percent stating that it would be one of the top three growth drivers for the semiconductor industry and 17 percent ranking it first.

The digital world once existed largely in non-material form. But with the rise of connected homes, smart grids and autonomous vehicles, the cyber and the physical are merging in new and exciting ways. These hybrid forms are often called cyber-physical systems (CPS), and are giving rise to a new Internet of Things.

Such systems have unique characteristics and vulnerabilities that must be studied and addressed to make sure they are reliable and secure, and that they maintain individuals’ privacy.

The National Science Foundation (NSF), in partnership with Intel Corporation, one of the world’s leading technology companies, today announced two new grants totaling $6 million to research teams that will study solutions to address the security and privacy of cyber-physical systems. A key emphasis of these grants is to refine an understanding of the broader socioeconomic factors that influence CPS security and privacy.

“Advances in the integration of information and communications technologies are transforming the way people interact with engineered systems,” said Jim Kurose, head of Computer and Information Science and Engineering at NSF. “Rigorous interdisciplinary research, such as the projects announced today in partnership with Intel, can help to better understand and mitigate threats to our critical cyber-physical systems and secure the nation’s economy, public safety, and overall well-being.”

The partnership between NSF and Intel establishes a new model of cooperation between government, industry and academia to increase the relevance and impact of long-range research. Key features of this model for projects funded by NSF and Intel include joint design of a solicitation, joint selection of projects, an open collaborative intellectual property agreement, and a management plan to facilitate effective information exchange between faculty, students and industrial researchers.

This model will help top researchers in the nation’s academic and industrial laboratories transition important discoveries into innovative products and services more easily.

“The new CPS projects, announced today, enable researchers to collaborate actively with Intel, resulting in strong partnerships for implementing and adopting technology solutions to ensure the security and privacy of cyber-physical systems,” said J. Christopher Ramming, director of the Intel Labs University Collaborations Office. “We are enthusiastic about this new model of partnership.”

The NSF-Intel partnership further combines NSF’s experience in developing and managing successful large, diverse research portfolios with Intel’s long history of building research communities in emerging technology areas through programs such as its Science and Technology Centers Program.

The projects announced today as part of the NSF/Intel Partnership on Cyber-Physical Systems Security and Privacy are:

Rapidly increasing incorporation of networked computation into everything from our homes to hospitals to transportation systems can dramatically increase the adverse consequences of poor cybersecurity, according to Philip Levis, who leads a team at Stanford University that received one of the new awards. Levis’ team investigates encryption frameworks for testing and protecting networked infrastructure.

“Our research aims to lay the groundwork and basic principles to secure computing applications that interact with the physical world as they are being built and before they are used,” Levis said. “The Internet of Things is still very new. By researching these principles now, we hope to help avoid many security disasters in the future.”

The team, consisting of researchers from Stanford University, the University of California, Berkeley, and the University of Michigan, considers how new communication architectures and programming frameworks can help developers avoid decisions that lead to vulnerabilities.

Another project explores the unique characteristics of cyber-physical systems, such as the physical dynamics, to provide approaches that mix prevention, detection and recovery, while assuring certain levels of guarantees for safety-critical automotive and medical systems.

“With this award, we will develop robust, new technologies and approaches that work together to lead to safer, more secure and privacy-preserving cyber-physical systems by developing methods to tolerate attacks on physical environment and cyberspace in addition to preventing them,” said Insup Lee, who leads a team at the University of Pennsylvania, along with colleagues at Duke University and the University of Michigan.

“New smart cyber-physical systems technologies are driving innovation in sectors such as food and agriculture, energy, transportation, building design and automation, healthcare, and advanced manufacturing,” Kurose said. “With proper protections in place, CPS can bring tremendous benefits to our society.”

The new program extends NSF’s investments in fundamental research on cyber-physical systems, which has totaled more than $200 million in the past five years.

NSF is also separately investing in three additional CPS security and privacy projects that address the safety of autonomous vehicles, the privacy of data delivered by home sensors and the trustworthiness of smart systems:

The U.S. Department of Defense (DoD) today awarded FlexTech Alliance a Cooperative Agreement to establish and manage a Manufacturing Innovation Institute (MII) for Flexible Hybrid Electronics (FHE MII). The award is for $75 million in federal funding over a five-year period and is being matched by more than $96 million in cost sharing from non-federal sources, including the City of San Jose, private companies, universities, several U.S. states, and not-for-profit organizations. FlexTech Alliance’s winning proposal results in the first of seven MIIs to be headquartered on the West Coast. The DoD’s Manufacturing Technology Program Office (ManTech) oversees the MIIs.

U.S. Secretary of Defense, Ashton Carter, delivered today’s announcement at National Full-Scale Aerodynamics Complex at NASA’s Ames Research Center in Moffett Field. FlexTech Alliance, a research consortium and trade association, successfully proposed a San Jose-based hub and node approach to create the FHE MII, which comprises 96 companies, 11 laboratories and non-profits, 42 universities, and 14 state and regional organizations.

The Institute’s activities will benefit a wide array of markets beyond defense, including automotive, communications, consumer electronics, medical devices, health care, transportation and logistics, and agriculture. While the Institute will be headquartered in San Jose, existing nodes around the country already have in place an infrastructure ready to solve some of the known manufacturing challenges. The Institute will distribute R&D funds via competitively-bid project calls. Industry-generated technology roadmaps will drive project calls, timelines and investments.

Additionally, education and training in FHE manufacturing will be emphasized in order to expand the available workforce. A “Flex School” concept will be developed through partnerships with community colleges, teaching and research universities, trade associations, and professional societies.

Michael Ciesinski, president and CEO of FlexTech Alliance, said, “FlexTech is privileged to accept this award from the Defense Department to stand up and lead the FHE MII. Our partners collaborated on a superb proposal that links a national hub in San Jose to a network of centers of excellence throughout the U.S. We are excited by the FHE manufacturing challenge and eager to get operations underway.”

Flexible hybrid electronics, an emerging manufacturing capability, enables the integration of thin silicon electronic devices, sensing elements, communications, and power on non-traditional flexible substrates. FHE has the potential to re-shape entire industries, from the electronic wearable devices market, to medical health monitoring systems, to the ubiquitous sensing of the world around us – also known as the Internet of Things. To be successful, the Institute will need to engage aspects of the integrated circuit (IC) industry, the graphics printing industry, and the electronic assembly/packaging industry.

FlexTech

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The new institute is part of the National Network for Manufacturing Innovation program (NNMI). The FHE MII is the seventh MII announced—the fifth under DOD management. The NNMI program is an initiative of the Obama Administration to support advanced manufacturing in the U.S. Each institute is part of a growing network dedicated to securing U.S. leadership in the emerging technologies required to win the next generation of advanced manufacturing.  Bridging the gap between applied research and large-scale product manufacturing, the institutes bring together companies, universities, other academic and training institutions, and Federal agencies to co-invest in technology areas that benefit the nation’s commercial and national defense interests.

“The intent of the MII is to draw in the country’s ‘best of the best’ scientists, engineers, manufacturing experts and business development professionals in the field of flexible hybrid electronics,” stated Dr. Malcolm Thompson, Executive Director-designate of the Institute. Under the FlexTech proposal, the Hub provides overall program direction, is the integrator of components, creates prototypes, and matures manufacturing readiness levels (MRLs). “Fast start” projects for equipment, materials, devices and other vital components will make use of existing node facilities and key personnel from around the country.

Manufacturing provides well-paying job opportunities at a range of educational levels in occupations spanning engineering, production, logistics and sales. Commenting on the Institute’s local impact, San Jose Mayor Sam Liccardo noted, “San Jose ranks number one in the nation for Advanced Technology Industries, and is in the top two for Advanced Manufacturing.  Here in Silicon Valley, our extensive advanced manufacturing capability is essential for new product innovation across a range of growth areas—including wearable electronics, medical devices, connected vehicles, and clean tech.  The Manufacturing Innovation Institute for Flexible Hybrid Electronics will accelerate growth of companies and good jobs in San Jose. This decision affirms San Jose’s role as global hub for innovation advancing the Internet of Things.”

To complement the San Jose hub, key technology nodes will be linked and include IC thinning, system design and fabrication, integration and assembly, and FHE applications. Several regional nodes have been recognized and more are expected.  Those currently aligned to the institute are centers and educational institutions throughout California, along with Alabama, Arizona, Arkansas, Connecticut, Georgia, Indiana, Massachusetts, Michigan, New York, North Dakota, Ohio and Texas.

Congressman Mike Honda (D-17) said, “Congratulations to the FlexTech team and Silicon Valley for being selected as the latest Manufacturing Innovation Institute.  As the epicenter of American innovation, Silicon Valley is uniquely poised to be the leader in advanced manufacturing. Headquartering this Flexible Hybrid Electronics hub in San Jose ensures that the best of Silicon Valley’s tremendous academic, commercial, industrial, public, and labor resources are available to bridge the technology transfer gap and develop this emerging, game-changing technology as it reshapes the electronics industry and brings good-paying, middle-class manufacturing jobs to the Bay Area.”

FlexTech Alliance is an industry association focused on growth, profitability, and success throughout the manufacturing and distribution chain of flexible, printed electronics, and displays. By facilitating collaboration between and among industry, government, and academia, FlexTech Alliance develops solutions for advancing these technologies from R&D to commercialization.

Cima NanoTech, a developer and manufacturer of transparent conductive film solutions, announced today that it has entered into a joint venture with Foxconn, the world’s largest ICT technology provider and vertically integrated device manufacturer, to deliver the industry’s first cost-competitive, projected capacitive (pro-cap) solution for large format touch screens. Both companies will sell SANTE ProTouch modules through Cima Touch, the company formed under this joint venture.

Foxconn’s expertise in the mass production of reliable, high-quality products, coupled with Cima NanoTech’s proprietary SANTE self-assembling nanoparticle technology, delivers a cost-competitive solution for customers looking to shift from infrared (IR) touch technology to pro-cap multi-touch solutions and systems.

“SANTE ProTouch modules will be manufactured at our newly established manufacturing facilities,” said Jon Brodd, CEO of Cima NanoTech. “Having a full, in-house supply chain for large format projected capacitive touch solutions is an industry first, and ensures that we have full control over the quality and reliability of SANTE ProTouch modules.”

SANTE ProTouch modules provide users with ultra fast response for an intuitive multi-user, multi-touch experience, making it an ideal solution for interactive digital signage, interactive kiosks, interactive tabletops and interactive whiteboards. The overall design and product appeal of the touch system is also enhanced with edge-to-edge cover lens and narrow bezel.

“Cima NanoTech has a cutting-edge, disruptive technology which puts them at the forefront of high performance innovations.” said Kevin Chen, Director of Foxconn Technology Group. “Our partnership with Cima NanoTech enables us to break new ground and address the rapidly growing large format touch market.”

SANTE ProTouch modules are available in sizes ranging from 40” to 85”. The non-moiré characteristic of SANTE self-assembling nanoparticle technology makes it compatible with all LCD display models in the market; the highly customizable nature of SANTE ProTouch modules also provides manufacturers and system integrators with the freedom to design features such as cover lens thickness, glass type and bezel width.

In 2020, flexible barrier manufacturing for flexible electronic devices such as displays will be a market worth more than US$184 million, according to IDTechEx Research. That equates to 3.8 million square meters of flexible barrier films for electronics.

Although multilayer approaches – usually organic and inorganic layers – have been the most popular solution for flexible encapsulation so far, there is significant development work with solutions based on single layer approaches such as flexible glass or atomic layer deposition (ALD) which could, in later years, capture part of the market. The table below, compiled by IDTechEx analysts shows some of the characteristics of flexible glass and ALD films as developers are looking to bring them to market.

Table 1. ALD and flexible glass metrics and commercialization status for Beneq, Lotus and Corning

Company Name  WVTR (gr/sq.m./day Deposition Technique Material Commercialization Status – Strategy
Beneq Can reach
10-6 		 Batch ALD. Also developing roll 2 Roll ALD. Proprietary Aluminium Oxide/Titanium Oxide nanolaminate Beneq supplies coating equipment
Lotus Can reach
10-6 		 Roll 2 Roll ALD Proprietary homogeneous mixture” of Aluminium Oxide/Titanium Oxide layers Lotus follows a licensing business model and is patenting Plasma Enabled Oxygen Radical Decomposition process so as to enable faster deposition rates
Corning Perfect sealing from water vapour/oxygen Down drawing Thin glass (less than 100 μm) Available in rolls and sheets, in sample volumes

Source: IDTechEx report “Barrier Layers for Flexible Electronics 2015-2025” www.IDTechEx.com/barrier

Flexible glass: current status, outlook and challenges

Flexible glass is a significant technical achievement, yet IDTechEx Research believes that it will not be the solution of choice for encapsulation of flexible electronics in the short to medium term, for multiple reasons.

In spite of the marketing spin given by the manufacturers, glass is inherently a fragile material and requires specialized handling and processing. While plastic materials can also be damaged, there is an important difference between the two: damage of barriers on plastic can lead to the failure of a specific part, however, shattering of glass, even if protective sheets are used, leads to particle contamination on the defect line able to affect multiple parts.

Inherent fragility of flexible glass makes sheet edges critical. All suppliers propose protective tabs to reduce the problem. However, any other particle on the processing equipment could also become a focal point of stress and lead to shattering of the glass sheet or web.

A strong point of traditional glass encapsulation (especially for top emission devices) has been its ability to form truly hermetic packaging by using glass frit and laser sealing. This advantage may not be transferable to flexible glass where glass-to-glass sealing may be very problematic and difficult because points of stress and relative twisting of the two sheets must be avoided in the laser firing of the frit. It may be that flexible glass has to be used in combination with adhesives (and desiccants).

Flexibility is another issue. Although glass is very flexible if flexed along a well-defined axis, it can be poor at tolerating any stress out of axis, so much so that twisting the sheet may lead to fracture. This is true with or without protective film applied to the glass. Extreme flexibility (r< 2-3 mm) may also be a problem. Data that has been shown would put the flexibility limit around r= 2.5 cm. Consequently, flexible glass as an encapsulant superstrate or substrate may be good for conformal applications, but for truly flexible applications there seem to be several challenges to be overcome.

Flexible glass makers are also waiting for equipment providers to make appropriate equipment to handle the flexible glass in manufacturing, another bottle neck.

Future opportunities for flexible glass

The thermal stability of flexible glass makes it the best choice as substrate for back-planes of high-resolution high-end large displays. Glass enables improved resolution and good registration between layers during processing compared to plastic substrates like PET, PEN, and PI. However, IDTechEx analysts and other affiliate experts have only seen results with metal oxide backplanes only so far (Tprocess < 350 C), none with LTPS backplanes (Tprocess < 450 C). If processability up to 450C is indeed possible, flexible glass would be a very good choice as a substrate for flexible AMOLED TV. Those devices are bottom emission (BE) AMOLED, normally have a metal foil as back encapsulant, a higher cost tolerance. Regarding R2R processing of flexible glass, it has demonstrated possible. Manufacturing by R2R will require specialized tools not differently than fabrication of barrier in R2R.

The multi-layer approach if correctly implemented on dedicated tools may have the potential to be low cost but an open question remains as to how low the defect density of barrier on foil can be. Consequently, it is an open question what the maximum size of displays that can be encapsulated with compatible yield can be. As it transpires from the discussion above, plastic engineered superstrate (=encapsulant foil) may be better for smaller devices (wearable, phone, tablets), while flexible glass may be better for TVs and in general larger displays.

Additionally, the smoothness of plastic films, even with smoothing layers, is not as good as glass (0.2 nm). This may be a problem for organic TFT backplanes. Finally optical transmission below 400nm require glass as substrate since PET and PEN have a cut off around 400 nm (PEN). IDTechEx does not see this as a critical limitation for general display applications (it may be for OPV).

Atomic layer deposition (ALD) present and future outlook/market share 

ALD is another flexible encapsulation technology receiving a lot of attention with several players currently developing solutions based on it. It seems like it is not a short-term solution, if it will ever be one as a stand-alone layer but ALD may be a solution in a multi-layer stack in combination with a sputtered or PECVD layer if it would be possible to find a good cost structure. Regarding the intrinsic properties of the material, ALD film deposited at low temperature (T<80 C) have a superior quality when tested at room temperature. A single ALD layer less-than 50 nm thick can perform better than thicker layers deposited by sputtering or PECVD.

However, the inherent stability of the films at higher temperature/humidity (e.g. 85C/85%RH) is a problem. If PE-CVD is used, ALD film stability improves, as well as for mixed oxides, but it is still an issue. A second problem comes with particles and substrates non-uniformity. Any defect may lead at an initial non-uniform nucleation that propagates into the growing film. Furthermore, loose particles on substrates may be partially covered, but because of the extreme thinness, the thin film does not have the mechanical strength to keep them in place under mechanical stress. Any mechanical stress leads to film fracture with consequent creation of an ingress path for moisture. That is why multilayer structures are necessary.

Deposition tools are in development from Lotus, Beneq, Encapsulix and others. Exploration at Samsung SDC with ALD films for TFE was very much advertised by Synos, but resulted in failure and any further evaluation was halted. ALD for barrier on foil has better results although there are doubts and hurdles in scaling up and reaching the deposition speed required for a cost effective process.

This is also one of the sessions at the Printed Electronics USA event, to be held on November 18-19 at Santa Clara, CA. See www.PrintedElectronicsUSA.com for full details.

North America-based manufacturers of semiconductor equipment posted $1.59 billion in orders worldwide in July 2015 (three-month average basis) and a book-to-bill ratio of 1.02, according to the July EMDS Book-to-Bill Report published today by SEMI.  A book-to-bill of 1.02 means that $102 worth of orders were received for every $100 of product billed for the month.

SEMI reports that the three-month average of worldwide bookings in July 2015 was $1.59 billion. The bookings figure is 5.1 percent higher than the final June 2015 level of $1.52 billion, and is 12.5 percent higher than the July 2014 order level of $1.42 billion.

The three-month average of worldwide billings in July 2015 was $1.56 billion. The billings figure is 0.3 percent higher than the final June 2015 level of $1.55 billion, and is 18.2 percent higher than the July 2014 billings level of $1.32 billion.

“Year-to-date, the bookings and billings reported in the SEMI North American equipment book-to-bill report indicate a solid year for the industry,” said SEMI president and CEO Denny McGuirk. “The outlook for the remainder of the year is somewhat clouded, but we see investments in 3D NAND and advanced packaging as drivers.”

The SEMI book-to-bill is a ratio of three-month moving averages of worldwide bookings and billings for North American-based semiconductor equipment manufacturers. Billings and bookings figures are in millions of U.S. dollars.

Billings
(3-mo. avg)

Bookings
(3-mo. avg)

Book-to-Bill
February 2015 

$1,280.1

$1,313.7

1.03
March 2015 

$1,265.6

$1,392.7

1.10
April 2015 

$1,515.3

$1,573.7

1.04
May 2015 

$1,557.3

$1,546.2

0.99
June 2015 (final)

$1,554.9

$1,517.4

0.98
July 2015 (prelim)

$1,559.3

$1,594.3

1.02

Source: SEMI (www.semi.org), August 2015