Category Archives: Flexible Displays

Semiconductors, which are the very basic components of electronic devices, have improved our lives in many ways. They can be found in lighting, displays, solar modules and microprocessors that are installed in almost all modern day devices, from mobile phones, washing machines, and cars, to the emerging Internet of Things. To innovate devices with better functionality and energy efficiency, researchers are constantly looking for better ways to make them, in particular from earth-abundant materials using eco-friendly processes. Plastic or organic electronics, which is made from organic carbon-based semiconductors, is one such group of technologies that can potentially provide flexible, light-weight, large-area and additively-manufactured devices, which are attractive for some types of applications.

To make high-performance devices however, good ohmic contacts with low electrical resistances are required to allow the maximum current to flow both ways between the electrode and the semiconductor layers. Recently, a team of scientists from the National University of Singapore (NUS) has successfully developed conducting polymer films that can provide unprecedented ohmic contacts to give superior performance in plastic electronics, including organic light-emitting diodes, solar cells and transistors. The research findings have been recently published in the journal Nature.

Dr. Png Rui-Qi (left), Mervin Ang (middle) and Cindy Tang (right) working on conducting polymers that can provide unprecedented ohmic contacts for better performance in a wide range of organic semiconductor devices. Credit: Seah Zong Long

Dr. Png Rui-Qi (left), Mervin Ang (middle) and Cindy Tang (right) working on conducting polymers that can provide unprecedented ohmic contacts for better performance in a wide range of organic semiconductor devices. Credit: Seah Zong Long

The key these researchers discovered is to be able to design polymer films with the desired extreme work functions needed to generally make ohmic contacts. Work function is the minimum amount of energy needed to liberate an electron from the film surface into vacuum. The researchers showed that work functions as high as 5.8 electron-volts and as low as 3.0 electron-volts can now be attained for films that can be processed from solutions at low cost.

“To design such materials, we developed the concept of doped conducting polymers with bonded ionic groups, in which the doped mobile charges – electrons and holes – cannot dissipate away because their counter-balancing ions are chemically bonded,” explained Dr Png Rui-Qi, a senior research fellow from the Department of Physics at the NUS Faculty of Science, who led the device research team. “As a result, these conducting polymers can remain stable despite their extreme work functions and provide the desired ohmic contacts.”

This breakthrough is the result of a collaboration with the materials chemistry team led by Associate Professor Chua Lay-Lay from the Department of Chemistry at the NUS Faculty of Science, the physics team led by Associate Professor Peter Ho from the Department of Physics from the same faculty, and scientists from Cambridge Display Technology Ltd, a subsidiary of Sumitomo Chemical Co., Ltd.

“The lack of a general approach to make ohmic contacts has been a key bottleneck in flexible electronics. Our work overcomes this challenge to open a path to better performance in a wide range of organic semiconductor devices,” explained Dr Png Rui-Qi. “We are particularly thrilled about this Singapore-led innovation,” she added.

Commenting on the significance of the work, Assoc Prof Chua said, “The close partnership of the chemists and physicists has made this innovation possible. We are now working with our industrial partner to further develop this technology.”

From the ground-breaking research breakthroughs to the shifting supplier landscape, these are the stories the Solid State Technology audience read the most during 2016.

#1: Moore’s Law did indeed stop at 28nm

In this follow up, Zvi Or-Bach, president and CEO, MonolithIC 3D, Inc., writes: “As we have predicted two and a half years back, the industry is bifurcating, and just a few products pursue scaling to 7nm while the majority of designs stay on 28nm or older nodes.”

#2: Yield and cost challenges at 16nm and beyond

In February, KLA-Tencor’s Robert Cappel and Cathy Perry-Sullivan wrote of a new 5D solution which utilizes multiple types of metrology systems to identify and control fab-wide sources of pattern variation, with an intelligent analysis system to handle the data being generated.

#3: EUVL: Taking it down to 5nm

The semiconductor industry is nothing if not persistent — it’s been working away at developing extreme ultraviolet lithography (EUVL) for many years, SEMI’s Deb Vogler reported in May.

#4: IBM scientists achieve storage memory breakthrough

For the first time, scientists at IBM Research have demonstrated reliably storing 3 bits of data per cell using a relatively new memory technology known as phase-change memory (PCM).

#5: ams breaks ground on NY wafer fab

In April, ams AG took a step forward in its long-term strategy of increasing manufacturing capacity for its high-performance sensors and sensor solution integrated circuits (ICs), holding a groundbreaking event at the site of its new wafer fabrication plant in Utica, New York.

#6: Foundries takeover 200mm fab capacity by 2018

In January, Christian Dieseldorff of SEMI wrote that a recent Global Fab Outlook report reveals a change in the landscape for 200mm fab capacity.

#7: Equipment spending up: 19 new fabs and lines to start construction

While semiconductor fab equipment spending was off to a slow start in 2016, it was expected to gain momentum through the end of the year. For 2016, 1.5 percent growth over 2015 is expected while 13 percent growth is forecast in 2017.

#8: How finFETs ended the service contract of silicide process

Arabinda Daa, TechInsights, provided a look into how the silicide process has evolved over the years, trying to cope with the progress in scaling technology and why it could no longer be of service to finFET devices.

#9: Five suppliers to hold 41% of global semiconductor marketshare in 2016

In December, IC Insights reported that two years of busy M&A activity had boosted marketshare among top suppliers.

#10: Countdown to Node 5: Moving beyond FinFETs

A forum of industry experts at SEMICON West 2016 discussed the challenges associated with getting from node 10 — which seems set for HVM — to nodes 7 and 5.

BONUS: Most Watched Webcast of 2016: View On Demand Now

IoT Device Trends and Challenges

Presenters: Rajeev Rajan, GLOBALFOUNDRIES, and Uday Tennety, GE Digital

The age of the Internet of Things is upon us, with the expectation that tens of billions of devices will be connected to the internet by 2020. This explosion of devices will make our lives simpler, yet create an array of new challenges and opportunities in the semiconductor industry. At the sensor level, very small, inexpensive, low power devices will be gathering data and communicating with one another and the “cloud.” On the other hand, this will mean huge amounts of small, often unstructured data (such as video) will rippling through the network and the infrastructure. The need to convert that data into “information” will require a massive investment in data centers and leading edge semiconductor technology.

Also, manufacturers seek increased visibility and better insights into the performance of their equipment and assets to minimize failures and reduce downtime. They wish to both cut their costs as well as grow their profits for the organization while ensuring safety for employees, the general public and the environment.

The Industrial Internet is transforming the way people and machines interact by using data and analytics in new ways to drive efficiency gains, accelerate productivity and achieve overall operational excellence. The advent of networked machines with embedded sensors and advanced analytics tools has greatly influenced the industrial ecosystem.

Today, the Industrial Internet allows you to combine data from the equipment sensors, operational data , and analytics to deliver valuable new insights that were never before possible. The results of these powerful analytic insights can be revolutionary for your business by transforming your technological infrastructure, helping reduce unplanned downtime, improve performance and maximize profitability and efficiency.

Chinese panel manufacturers shipped more than one million AMOLED (active-matrix organic light-emitting diode) smartphone displays for the first time in the third quarter of 2016. While the Chinese makers only make up less than 2 percent of the AMOLED smartphone panel market in terms of shipments, hitting the one million unit mark in a quarter shows significant improvements in their manufacturing technology, according to IHS Markit (Nasdaq: INFO).

According to the IHS Markit Smartphone Display Market Tracker, total shipments of AMOLED displays for smartphones set a new record of 101 million units in third quarter 2016. While Samsung Display continues to retain its dominant position with 99.7 million units, three Chinese panel makers — EverDisplay Optronics (EDO), Tianma Micro-electronics and Govisionox Optoelectronics — shipped 1.4 million units for the quarter, representing a sharp increase from the approximate 590,000 units in the previous quarter.

“Strong demand from Chinese smartphone brands, especially OPPO and Vivo, helped boosting overall AMOLED panel demand significantly,” said Terry Yu, principal analyst of small and medium displays for IHS Markit. “Many Chinese smartphone makers, such as Meizu, Gionee, Lenovo, Huawei and even Xiaomi, are planning to adopt AMOLED panels in their devices. This gives Chinese display suppliers a great opportunity to gain more orders, improve their mass production yield rate and enhance their product reliability.”

According to IHS Markit, AMOLED display penetration among Chinese smartphone brands is expected to increase from 8 percent in 2015 to 13.6 percent in 2016. However, due to the tight supply of AMOLED panels from Samsung Display, many domestic smartphone brands are turning to local Chinese panel makers. For example, after Xiaomi and Huawei failed to secure their orders of AMOLED panels from Samsung, they struck partnerships with EDO, the leading AMOLED panel suppliers in China, with the promise of mass production and product reliability. EDO, which started operating its Shanghai-based Gen 4.5 AMOLED fab in 2014, shipped one million units of AMOLED panels in the third quarter of 2016, up from 0.2 million units in the first quarter. Similarly, Tianma and Govisionox have also developed business relationships with ZTE as its secondary supplier of AMOLED smartphone displays.

“Chinese panel makers are still too small to threaten Samsung’s dominant position, but they still play an important role as a second or third source for major smartphone brands in China,” Yu said. “Furthermore, as Samsung Display shifts its focus to the flexible OLED, Chinese panel makers are expected to expand their shares in the rigid OLED panel market.”

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Faster production of advanced, flexible electronics is among the potential benefits of a discovery by researchers at Oregon State University’s College of Engineering.

Taking a deeper look at photonic sintering of silver nanoparticle films — the use of intense pulsed light, or IPL, to rapidly fuse functional conductive nanoparticles — scientists uncovered a relationship between film temperature and densification. Densification in IPL increases the density of a nanoparticle thin-film or pattern, with greater density leading to functional improvements such as greater electrical conductivity.

The engineers found a temperature turning point in IPL despite no change in pulsing energy, and discovered that this turning point appears because densification during IPL reduces the nanoparticles’ ability to absorb further energy from the light.

This previously unknown interaction between optical absorption and densification creates a new understanding of why densification levels off after the temperature turning point in IPL, and further enables large-area, high-speed IPL to realize its full potential as a scalable and efficient manufacturing process.

Rajiv Malhotra, assistant professor of mechanical engineering at OSU, and graduate student Shalu Bansal conducted the research. The results were recently published in Nanotechnology.

“For some applications we want to have maximum density possible,” Malhotra said. “For some we don’t. Thus, it becomes important to control the densification of the material. Since densification in IPL depends significantly on the temperature, it is important to understand and control temperature evolution during the process. This research can lead to much better process control and equipment design in IPL.”

Intense pulsed light sintering allows for faster densification — in a matter of seconds – over larger areas compared to conventional sintering processes such as oven-based and laser-based. IPL can potentially be used to sinter nanoparticles for applications in printed electronics, solar cells, gas sensing and photocatalysis.

Earlier research showed that nanoparticle densification begins above a critical optical fluence per pulse but that it does not change significantly beyond a certain number of pulses.

This OSU study explains why, for a constant fluence, there is a critical number of pulses beyond which the densification levels off.

“The leveling off in density occurs even though there’s been no change in the optical energy and even though densification is not complete,” Malhotra said. “It occurs because of the temperature history of the nanoparticle film, i.e. the temperature turning point. The combination of fluence and pulses needs to be carefully considered to make sure you get the film density you want.”

A smaller number of high-fluence pulses quickly produces high density. For greater density control, a larger number of low-fluence pulses is required.

“We were sintering in around 20 seconds with a maximum temperature of around 250 degrees Celsius in this work,” Malhotra. “More recent work we have done can sinter within less than two seconds and at much lower temperatures, down to around 120 degrees Celsius. Lower temperature is critical to flexible electronics manufacturing. To lower costs, we want to print these flexible electronics on substrates like paper and plastic, which would burn or melt at higher temperatures. By using IPL, we should be able to create production processes that are both faster and cheaper, without a loss in product quality.”

Products that could evolve from the research, Malhotra said, are radiofrequency identification tags, a wide range of flexible electronics, wearable biomedical sensors, and sensing devices for environmental applications.

Scientists at The Australian National University (ANU) have designed a nano crystal around 500 times smaller than a human hair that turns darkness into visible light and can be used to create light-weight night-vision glasses.

Professor Dragomir Neshev from ANU said the new night-vision glasses could replace the cumbersome and bulky night-vision binoculars currently in use.

“The nano crystals are so small they could be fitted as an ultra-thin film to normal eye glasses to enable night vision,” said Professor Neshev from the Nonlinear Physics Centre within the ANU Research School of Physics and Engineering.

“This tiny device could have other exciting uses including in anti-counterfeit devices in bank notes, imaging cells for medical applications and holograms.”

Co-researcher Dr Mohsen Rahmani said the ANU team’s achievement was a big milestone in the field of nanophotonics, which involves the study of behaviour of light and interaction of objects with light at the nano-scale.

“These semiconductor nano-crystals can transfer the highest intensity of light and engineer complex light beams that could be used with a laser to project a holographic image in modern displays,” said Dr Rahmani, a recipient of the Australian Research Council (ARC) Discovery Early Career Researcher Award based at the ANU Research School of Physics and Engineering.

PhD student Maria del Rocio Camacho-Morales said the team built the device on glass so that light can pass through, which was critical for optical displays.

“This is the first time anyone has been able to achieve this feat, because growing a nano semi-conductor on a transparent material is very difficult,” said Ms Camacho-Morales from the Nonlinear Physics Centre at ANU.

As more smartphone manufacturers build designs using flexible display technology, shipments of flexible displays are expected to reach 139 million units in 2017, an increase of 135 percent compared to 2016. According to IHS Markit (NASDAQ: INFO), flexible displays are expected to comprise 3.8 percent of total display unit shipments in 2017.

Vivo and Xiaomi launched their first smartphones with flexible active-matrix organic light-emitting diode (AMOLED) displays in 2016, while many other manufacturers have plans to develop their own foldable (or bendable, dual-edge curved) smartphone designs. In particular, Apple is expected to launch its new iPhone using flexible AMOLED display in 2017, which would dramatically drive up expected demand for flexible AMOLED panels. Flexible AMOLEDs are expected to comprise 20 percent of total OLED display unit shipments in 2017.

IHS_Markit_Flexible_display_shipments_forecast

“During 2016, many smartphone manufacturers have pressured display panel makers to supply them with more flexible AMOLEDs for their new smartphone designs, however, due to limited production capacity only a few players had their orders met in quantity,” said Jerry Kang, principal analyst of display research for IHS Markit.

However, tight supply conditions are expected to change in 2017 once Samsung Display and LG Display start operating their new fabs to increase supply capacity for flexible displays, resulting in earlier availability of new smartphone entrants in the market.

“With new form factors entering the marketplace next year to entice consumers, smartphone manufacturers will find themselves locked in a fierce battle with one another as they jostle to win marketshare for their new smartphone models featuring dual-edge curved and foldable AMOLED displays,” Kang said.

According to the latest IHS Markit Flexible Display Market Tracker report, smartphones took up 76 percent of the total flexible display supply in 2016 with the remainder taken up by smartwatches. However, flexible display supply for other applications, including tablet PCs, near-eye virtual reality devices, automotive monitors and OLED TVs, is not expected to be significant until 2023.

“Consumer device manufacturers will eventually move from conventionally designed flat and rectangular form factors to the latest curved, foldable or rollable screens, but only once their product roadmap for newer, innovative devices becomes more mature,” Kang said.

The semi-annual IHS Markit Flexible Display Market Tracker covers the latest flexible display market forecast, and panel manufacturer’s strategies, technologies and patent trends.

The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, today announced worldwide sales of semiconductors reached $30.5 billion for the month of October 2016, an increase of 3.4 percent from last month’s total of $29.5 billion and 5.1 percent higher than the October 2015 total of $29.0 billion. All monthly sales numbers are compiled by the World Semiconductor Trade Statistics (WSTS) organization and represent a three-month moving average. Additionally, a new WSTS industry forecast projects roughly flat annual semiconductor sales in 2016, followed by slight market growth in 2017 and 2018.

“The global semiconductor market has rebounded in recent months, with October marking the largest year-to-year sales increase since March 2015,” said John Neuffer, president and CEO, Semiconductor Industry Association. “Sales increased compared to last month across all regional markets and nearly every major semiconductor product category. Meanwhile, the latest industry forecast has been revised upward and now calls for flat annual sales in 2016 and small increases in 2017 and 2018. All told, the industry is well-positioned for a strong close to 2016.

Regionally, year-to-year sales increased in China (14.0 percent), Japan (7.2 percent), Asia Pacific/All Other (1.9 percent), and the Americas (0.1 percent), but decreased in Europe (-3.0 percent). Compared with last month, sales were up across all regional markets: the Americas (6.5 percent), China (3.2 percent), Japan (3.0 percent), Europe (2.2 percent), and Asia Pacific/All Other (2.0 percent).

Additionally, SIA today endorsed the WSTS Autumn 2016 global semiconductor sales forecast, which projects the industry’s worldwide sales will be $335.0 billion in 2016, a 0.1 percent decrease from the 2015 sales total. WSTS projects a year-to-year increase in Japan (3.2 percent) and Asia Pacific (2.5 percent), with decreases expected in Europe (-4.9 percent) and the Americas (-6.5 percent). Among major semiconductor product categories, WSTS forecasts growth in 2016 for sensors (22.6 percent), discretes (4.2 percent), analog (4.8 percent) and MOS micro ICs (2.3 percent), which include microprocessors and microcontrollers.

Beyond 2016, the semiconductor market is expected to grow at a modest pace across all regions. WSTS forecasts 3.3 percent growth globally for 2017 ($346.1 billion in total sales) and 2.3 percent growth for 2018 ($354.0 billion). WSTS tabulates its semi-annual industry forecast by convening an extensive group of global semiconductor companies that provide accurate and timely indicators of semiconductor trends.

The overall utilization rate at fabrication plants (fabs) used for display panel production is expected to reach 90 percent in the fourth quarter of 2016, up 7 percentage points from the same period in the previous year, and up 1 percentage point from the previous quarter, according to IHS Markit (Nasdaq: INFO).

2016_Display_Panel_Manufacturing_Monthly_Utilization_Rates_-_IHS_Markit

One of the contributing factors for driving up the fab utilization rate is the sudden rise in demand for larger TV panels, notably in 2016, when the average area size of overall TV panels increase by 1.9 inches from the previous year, raising the unit area by about 10 percent.

TV display panels, which account for about 70 percent of overall display area demand, suffered a fall in unit demand in recent times, but the area demand is expected to increase by 6 percent in 2016. A rise in TV panel demand is now projected to raise overall display panel area demand by 5 percent in 2016 compared to a year ago.

As a result, display panel makers are increasing the utilization rate of Gen 7 fabs and later Gen fabs, used mainly to produce TV panels, and can be expected to stay high in the fourth quarter of 2016 and beyond, according to the latest IHS Markit Display Production & Inventory Tracker report.

“Such a high utilization rate would suggest that these fabs are running at full loading, considering the remaining capacity is already allotted for test runs and maintenance,” said Alex Kang, senior analyst of display research at IHS Markit.

“This increase in display panel area demand has allowed panel manufacturers to sustain inventory levels that are considered healthy, and has prevented a sharp drop in utilization rate this year,” Kang added.

IHS Markit expects that panel manufacturers’ year-end panel inventory level will remain healthy at under four weeks. This will allow panel manufacturers to maintain a high utilization rate for a certain period of time regardless of demand fluctuations with sufficient space to pile up extra production stock.

With a healthy inventory outlook, panel manufacturers are projected to reach a fab utilization rate of between 85 and 90 percent in the first quarter of 2017 after the year-end peak season, which is up by between 5 and 10 percentage points since the first quarter of 2016.

 

Last night at the Printed Electronics USA conference in Santa Clara, Calif., Kateeva’s YIELDjet FLEX inkjet printing system was named the winner of the prestigious Technical Development Manufacturing Award. Presented annually by conference organizer IDTechEx, the award honors the most significant development of a manufacturing device process or production plant in the printed electronics industry over the previous 24 months. In particular, manufacturing developments that optimize the process of lab-scale or mass-scale production by improving productivity, quality, reliability, uniformity, or scale.

Since its debut in late 2014, Kateeva’s YIELDjet FLEX system has become the leading high-yield mass-production tool for the key organic layer deposition step in the OLED Thin Film Encapsulation (TFE) market. Customers include the world’s largest flat panel display manufacturers located in Asia. With its novel features and capabilities, it solves critical technical problems that previously made it economically impractical to mass produce flexible OLEDs.

Raghu Das, CEO of IDTechEx, reports: “This is printed electronics in action, where inkjet printing is used to enable commercial consumer electronics devices today. Kateeva has built a system that continuously provides uniform, reliable and precise function required for the demanding display business.”

In accepting the award, Kateeva’s Chief Product Officer Eli Vronsky thanked the Judging Panel and called the accolade a considerable honor. “Engineering the YIELDjet FLEX system was an extraordinary opportunity for our team,” he said. “But as any product designer will confess, watching it catalyze an industry shift is the greater thrill. We’re proud that by solving certain OLED mass-production challenges, our tool has helped customers clear the path for exciting mobile products that are bendable, foldable and even roll-able. We’re grateful to be recognized for this achievement by our friends in the printed electronics industry.”

Today at the Printed Electronics USA Conference, Kateeva technologist, Xiao Chen, Ph.D. will reveal how YIELDjet technology will soon be applied to mass produce the RGB OLED layer to enable affordable OLED TVs. Dr. Chen’s talk begins at 11:40am.

By Ji-Won Cho, SEMI Korea

SEMI Korea has hosted a SEMI member event every year for its members since 2008 to provide networking opportunities and insight on the ever-changing issues in the industry. This year, over 225 SEMI members in Korea from 132 companies ─ including the chipmakers, Samsung and Dongbu Hitek ─ participated in SEMI Members Day on October 6. Almost 70 percent of the attendees were executive level. Five speakers shared their thought-provoking perspectives: global semiconductor outlook, technology trends, flexible AMOLED technology, autonomous vehicle, and robot industry.

Soo Kyum Kim, director at IDC Korea, presented “Global Semiconductor Industry Outlook.”  Kim pointed out that global semiconductor market will decrease 2.9 percent in 2016 and recover slightly 0.6 percent in 2017 while the dedicated foundry market will face a short correction. He also forecasted that the CAGR of global semiconductor market will be 2.6 percent between 2017 and 2020. This growth will be led by non-traditional areas; automotive, industrial and smart home. He believes that IoT and Intelligent system penetration will drive both MPU and MCU in processor market.

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Sei Cheol Lee, principal analyst at NH Securities, presented “Semiconductor Technology Trends.” Lee discussed how the solid state drives (SSD) and UFS markets are rapidly growing and 3D NAND stack will move from 48 to 64 layers. Lee added that increasing layers will lead to more dry etch than wet etch in processes and incease in KrF patterning, PECVD/ALD,  and test. Lee forecasted that the test market will grow to $3 billion in 2017 from only $2.2 billion in 2016 due to high-end SSD and DDR4’s bus speed enhancement.

Minsu Kang, analyst at IHS Technology, spoke about the Flexible AMOLED Industry Outlook. According to his presentation, flexible displays are mainly used for smartwatch and smartphone, but set manufacturers are also trying to apply them with foldable or rollable form-factors. Flexible AMOLED has clear advantages for flexible display technology, in terms of form-factor, size, PPI and picture quality. He pointed out that flexible AMOLED was expected to increase to over 13 percent of OLED panel shipment in 2016, and it will continue to grow rapidly because more set manufacturers are adopting the technology. Apple may try to apply it to their smartphone in 2017.

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Kang highlighted that many panel manufacturers have been trying to increase flexible AMOLED capacity since 2015, but need to develop experience. He added that the curved forms of flexible display will be the mainstream until 2020, but foldable forms may be the mainstream after.  It depends on how the innovation resonates with the user experience

Seyong Kim, senior manager at Renesas Electronics Korea, presented “Technology Trends of the Autonomous Vehicle.” He said it may be fully realized between 2025 and 2030. Each country is now focusing on establishing the safety standards as like ISO 26262 to gain the initiatives.

Concerning the connected car, he mentioned the most important issue was security. Kim also added that a growing autonomous vehicle industry will need more semiconductors but the market share likely will remain under 10 percent of the entire semiconductor market.

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Dongkyeong Kim, head of R&D center at Future Robot, wrapped up the day with a presentation on Artificial Intelligence (AI) and Intelligent Robots in the semiconductor industry. Kim stated that development of semiconductor technology has driven the Big Data and AI eras and it will increasingly result in strong demand for semiconductors. According to Kim, globally the robot industry has invested 1.8 billion USD and 50 percent of the amount was invested by China in 2015.

The attendees were interested in the topics and an ongoing dialogue took place during the Q&A after each presentation. In the survey, more than 92 percent of attendees responded that they were satisfied. The attendees recommended additional topics for next year’s program, including equipment and materials outlook, advanced packaging market outlook, and technology roadmap.

Jin Soo Ko, VP of Teradyne said, “SEMI Members Day was the best in terms of agenda and contents since I attended from 2007. I am very satisfied with all programs and networking opportunities provided by SEMI.”

Hyun-Dae Cho, president of SEMI Korea, said, “The SEMI Korea Members Day connects our members to peers and industry executives and gives first-hand information on the trends and technology in the industry. I hope SEMI members enjoyed the opportunities through this annual event.”

For information on becoming a SEMI member, visit www.semi.org/en/Membership.