Category Archives: Flexible Displays

While conventional thin film transistor liquid crystal (TFT LCD) displays are rapidly trending towards commoditization and currently suffering from declining prices and margins, China is quickly adding capacity in all flat-panel display (FPD) manufacturing segments. Supported by financial incentives from local governments, Chinese TFT capacity is projected to grow 40 percent per year between 2010 and 2018. In 2010 China accounted for just 4 percent of total TFT capacity. However by 2018, China is forecast to become the largest FPD-producing region in the world, accounting for 35 percent of the global market, according to IHS Inc. (NYSE: IHS), a global source of critical information and insight.

While Chinese capacity expands, Japan, South Korea and Taiwan have restricted investments to focus mainly on advanced technologies. TFT capacity for flat panel display (FPD) production in these countries is forecast to grow on average at less than 2 percent per year between 2010 and 2018.

Based on the latest IHS Display Supply Demand & Equipment Tracker, BOE Technology Group stands out as the leading producer of FPDs in China. With a capacity growth rate of 44 percent per year between 2010 and 2018, BOE will become the main driver for Chinese share gains. By 2018, the company will have ramped up more FPD capacity than any other producers, except for LG Display and Samsung Display.

“Despite growing concerns of oversupply for the next several years in most parts of the display industry, there is still little evidence that Chinese makers are reconsidering or scaling back their ambitious expansion plans,” said Charles Annis, senior director at IHS. “On the contrary, there continues to be a steady stream of announcements of new factory plans by various regional governments and panel makers.”

In China, the central government has generally encouraged investment in FPDs, in order to shift the economy to higher technology manufacturing, to increase domestic supply and to support gross domestic product (GDP) growth. Provincial governments have become the main enabler of capacity expansion through product and technology subsidies, joint ventures and other direct investments, by providing land and facilities and through tax incentives. In return, new FPD fabs increase tax revenue, support land value appreciation, increase employment and spur the local economy. The economic benefits generated from the feedback loop between local governments, panel makers and new FPD factories are still considered sufficiently positive in China to warrant application of significant public resources.

“China currently produces only about a third of the FPD panels it consumes. However, by rapidly expanding capacity, panel makers and government officials are expecting to double domestic production rates in the next few years and are also looking to export markets,” Annis said. “How excessive global supply, falling prices and lower profitability will affect these plans over time is not yet exactly clear. Even so, there is now so much new capacity in the pipeline that China will almost certainly become the top producer of FPDs by 2018.”

The IHS Display Supply Demand & Equipment Tracker covers metrics used to evaluate supply, demand, and capital spending for all major FPD technologies and applications.

By Dr. Harry Zervos, Principal Analyst, IDTechEx

Flexible electronic devices are starting to experience significant proliferation, with more and more devices with innovative form factors being brought to market, from small components such as disposable sensors that have been in the market for quite some time now, all the way to new flexible smart phones currently being demonstrated by consumer electronics giants like Samsung and LG.

While printing technologies enable lower manufacturing costs and superior performance in many applications, vacuum deposition still claims significant market share in flexible electronics, although sometimes a combination of both can be the ideal combination.

From test strips to OLEDs 

Glucose test strips are a great example of the prevalence of both printed and vacuum deposited devices. Over ten billion test strips are being manufactured worldwide, in order to cater for the needs of the ever-increasing number of people living with diabetes. Although each manufacturer/brand has its own technology and design, the following cross-section shows the key parts of a test strip.  Manufacturers follow both thick film (screen printing) and thin film (sputtering) techniques for depositing the circuit in test strips, each of the techniques with its own merits.

Screen printing technology involves printing patterns of conductors and insulators onto the surface of planar solid (plastic or ceramic) substrates based on pressing the corresponding inks through a patterned mask. Each strip contains printed working and reference electrodes with the working one coated with the necessary reagents and membranes, with the reagents commonly dispensed by ink jet printing technology and deposited in the dry form. With thin film deposited electrodes, sputtering or laser ablation is commonly utilized. Lifescan for instance, a Johnson & Johnson company, mostly prints electrodes whereas Roche utilizes laser ablation in its Indianapolis plant. Along with the very specialized organic materials utilized in assays in the actively sensing part of the test strips, advanced devices integrating thin film technology utilize gold nanoparticles and mesoporous Pt electrodes, and even the use of carbon nanotubes and graphene has been demonstrated in certain designs.

OLED displays are a good example where the advent of printing techniques is meant to bring about much larger displays, manufactured at lower costs but for the time being, the OLED industry makes displays that are almost exclusively vacuum evaporated. Optimized solution processed materials are also becoming available but for now, vacuum deposited options perform better. Sunic, Aixtron, Canon Tokki and ULVAC are some of the companies that actively design and market equipment and materials for industrial vacuum technology in OLED applications.

Most of these companies, along with others such as Applied Materials are active in making more than just the active OLED layers, providing equipment for TFT deposition, encapsulation, etc.

The opportunity here is significant: The OLED market is meant to reach over $50bn in the next decade, with flexible and rigid plastic OLED displays surpassing 16 billion by 2020.

Flexible encapsulation & thin film PV

Encapsulation of flexible versions of OLED displays is set to become an exciting market: flexible barrier films – whether utilizing CVD or PVD processes or even in cases when ALD is utilized to make high quality, defect free layers- are hugely benefiting from vacuum deposition techniques and have created encapsulation materials that can reach the water vapor transmission rates required to allow flexible OLED displays the necessary lifetimes required to become commercially viable. Encapsulation for flexible OLED devices is a market that is expected to reach almost $340m by 2022 according to IDTechEx Research in the report “Barrier Layers for Flexible Electronics 2016-2026: Technologies, Markets, Forecasts”.

Flexible versions of thin film photovoltaics also require stringent encapsulation, but thin films have had harsh competition from low cost crystalline silicon cells from China, that have significantly reduced their market share in recent years. Just over 7% of the overall market for PV this year is expected to be thin-film based, according to research from SPV Research.

It is interesting to point out that manufacturing of all thin films for solar cell applications is fully vacuum based: PECVD for amorphous silicon platforms, sputtering or co-evaporation tends to be the preferred deposition techniques for CIGS technologies while CdTe leader First Solar has developed and optimized its own unique vacuum deposition technique, High Rate Vapor Transport Deposition (HRVTD). In this process, co-developed with NREL in an effort that started back in the early 1990’s, the material to be deposited is carried on a gas stream in powder form, then heated and vaporized as it passes through a membrane before depositing on a glass substrate. The technology can deposit a thin uniform layer of CdTe (or CdS, a common material system used as a buffer layer in CdTe cells) on 8 square feet of glass in less than 40 seconds, a deposition rate much higher than other rival thin film solar technologies that proved to be key in First Solar’s success in improving yield and output and consequently lower production costs for its thin film solar cells.

Conclusions 

The conclusion is simple: commercializing flexible or printed electronics will invariably require a deeper understanding of vacuum deposition technologies. Printing techniques are not the only manufacturing option that can allow for the freedom in design that the advent of flexibility in form factor is ushering in. In fact, vacuum deposition technologies are currently enabling the proliferation of a wide range of components and devices, from encapsulation films to thin flexible batteries to transparent conductive films and backplane elements. In many cases, having reached economies of scale, vacuum deposited devices have reached attractive cost structures that make it harder for printed versions to compete, having to “dig deep” in order to bring forward additional selling points than just reductions in cost.

Printed Electronics USA 2015 taking place in Santa Clara, CA on the 18th and 19th of November this year is going to focus on the importance of vacuum deposition, with both the conference as well as the trade show featuring contributions from end users, device manufacturers and manufacturing equipment suppliers of vacuum deposition technologies.

Cambridge, UK — November 9, 2015 — Xaar plc, a world leader in industrial inkjet technology, and Lawter, along with its parent company Harima Chemicals Group (HCG), announced a collaboration to optimize the performance of a line of nanosilver conductive inks in the Xaar 1002 industrial inkjet printhead. The combined solution will be of particular interest to manufacturers of consumer electronics goods looking for a robust and reliable method for printing antennas and sensors with silver nanoparticle ink as part of their manufacturing processes.

Industrial inkjet offers significant advantages over traditional print technologies to manufacturers of consumer electronics products. Inkjet is a cleaner process than other methods of printing silver inks; this is especially relevant when printing onto a substrate, such as a display, in which any yield loss is very expensive. With inkjet, manufacturers can very precisely control the amount of ink dispensed in certain areas of a pattern so that the ink or fluid deposited can be thicker in some areas and thinner in others. Similarly, inkjet enables the deposition of a much thinner layer of fluids than traditional methods, which is significant for the manufacturers looking to produce thinner devices. In addition, inkjet is one of the few technologies able to print a circuit over a substrate that has a structured surface.

“This is an excellent opportunity to showcase our latest technological breakthroughs and demonstrate the unique value that our revolutionary nanoparticle inkjet solutions can play as part of an integrated system solutions in the PE world,” says Dr. Arturo Horta Ph.D., Business Development Manager for Lawter Innovation Group.

HCG pioneered the development and manufacture of silver nanoparticle conductive inks for the printed electronics industry over 20 years ago and has over 100 patents related to its nanoparticle dispersion technology. This line of nanosilver conductive inks for inkjet printing offers a unique combination of low temperature sintering and high circuit conductivity. In addition, Lawter’s novel inks are compatible with a range of photonic curing tools as well as a variety of substrates.  These value-added features, together for the first time in a single product, provide increased project efficiency, decreased raw material costs and finer line printing.  All of this adds up to significant, quantifiable benefits for the end-user.

Xaar, also a major player in industrial manufacturing applications, has been delivering inkjet technology for 25 years. Its leading printhead, the Xaar 1002 is particularly suitable for Lawter’s nanosilver conductive inks due to the printhead’s unique TF Technology™ (fluid recirculation) which ensures a continuous flow of the heavy particulate in the ink to deliver uninterrupted high volume production printing.

“The applications that will benefit from the combination of Lawter’s nanosilver conductive inks and Xaar’s 1002 printhead are exciting,” says Keith Smith, Director of Advanced Manufacturing at Xaar. “We are seeing more and more that the consumer electronics market is looking for a printing solution that provides the quality of the Lawter ink and production reliability of the Xaar GS6 1002 to allow designers to make thinner devices.  The printhead and ink combination, along with photonic sintering, is unlocking mechanical and electrical designs never thought possible before.”

 

WEST LAFAYETTE, Ind. — Silver nanowires hold promise for applications such as flexible displays and solar cells, but their susceptibility to damage from highly energetic UV radiation and harsh environmental conditions has limited their commercialization.

New research suggests wrapping the nanowires with an ultrathin layer of carbon called graphene protects the structures from damage and could represent a key to realizing their commercial potential.

“We show that even if you have only a one-atom-thickness material, it can protect from an enormous amount of UV radiation damage,” said Gary Cheng, an associate professor of industrial engineering at Purdue University.

The lower images depict how graphene sheathing protects nanowires even while being subjected to 2.5 megawatts of energy intensity per square centimeter from a high-energy laser, an intensity that vaporizes the unwrapped wires. The upper images depict how the unwrapped wires are damaged with an energy intensity as little as .8 megawatts per square centimeter. (Purdue University image)

The lower images depict how graphene sheathing protects nanowires even while being subjected to 2.5 megawatts of energy intensity per square centimeter from a high-energy laser, an intensity that vaporizes the unwrapped wires. The upper images depict how the unwrapped wires are damaged with an energy intensity as little as .8 megawatts per square centimeter. (Purdue University image)

Devices made from silver nanowires and graphene could find uses in solar cells, flexible displays for computers and consumer electronics, and future “optoelectronic” circuits for sensors and information processing. The material is flexible and transparent, yet electrically conductive, and is a potential replacement for indium tin oxide, or ITO. Industry is seeking alternatives to ITO because of drawbacks: It is relatively expensive due to limited abundance of indium, and it is inflexible and degrades over time, becoming brittle and hindering performance, said Suprem Das, a former Purdue doctoral student and now a postdoctoral researcher at Iowa State University and The Ames Laboratory.

However, a major factor limiting commercial applications for silver nanowires is their susceptibility to harsh environments and electromagnetic waves.

“Radiation damage is widespread,” said Das, who led the work with Purdue doctoral student Qiong Nian (pronounced Chung Nee-an). “The damage occurs in medical imaging, in space applications and just from long-term exposure to sunlight, but we are now seeing that if you wrap silver nanowires with graphene you can overcome this problem.”

Findings appeared in October in the journal ACS Nano, published by the American Chemical Society. The paper was authored by Das; Nian; graduate students Mojib Saei, Shengyu Jin and Doosan Back; previous postdoctoral research associate Prashant Kumar; David B. Janes, a professor of electrical and computer engineering; Muhammad A. Alam, the Jai N. Gupta Professor of Electrical and Computer Engineering; and Cheng.

Raman spectroscopy was performed by the Purdue Department of Physics and Astronomy. Findings showed the graphene sheathing protected the nanowires even while being subjected to 2.5 megawatts of energy intensity per square centimeter from a high-energy laser, which vaporizes the unwrapped wires. The unwrapped wires were damaged with an energy intensity as little as .8 megawatts per square centimeter. (The paper is available at http://pubs.acs.org/doi/abs/10.1021/acsnano.5b04628.)

“It appears the graphene coating extracts and spreads thermal energy away from the nanowires,” Das said. The graphene also helps to prevent moisture damage.

The research is a continuation of previous findings published in 2013 and detailed in this paper: http://onlinelibrary.wiley.com/doi/10.1002/adfm.201300124/full. The work is ongoing and is supported by the National Science Foundation and a National Research Council Senior Research Associateship.

While conventional thin film transistor liquid crystal (TFT LCD) displays are rapidly trending towards commoditization and currently suffering from declining prices and margins, China is quickly adding capacity in all flat-panel display (FPD) manufacturing segments. Supported by financial incentives from local governments, Chinese TFT capacity is projected to grow 40 percent per year between 2010 and 2018. In 2010 China accounted for just 4 percent of total TFT capacity. However by 2018, China is forecast to become the largest FPD-producing region in the world, accounting for 35 percent of the global market, according to IHS Inc., a leading global source of critical information and insight.

While Chinese capacity expands, Japan, South Korea and Taiwan have restricted investments to focus mainly on advanced technologies. TFT capacity for flat panel display (FPD) production in these countries is forecast to grow on average at less than 2 percent per year between 2010 and 2018.

Based on the latest IHS Display Supply Demand & Equipment Tracker, BOE Technology Group stands out as the leading producer of FPDs in China. With a capacity growth rate of 44 percent per year between 2010 and 2018, BOE will become the main driver for Chinese share gains. By 2018, the company will have ramped up more FPD capacity than any other producers, except for LG Display and Samsung Display.

IHS FPD_capacity_table“Despite growing concerns of oversupply for the next several years in most parts of the display industry, there is still little evidence that Chinese makers are reconsidering or scaling back their ambitious expansion plans,” said Charles Annis, senior director at IHS. “On the contrary, there continues to be a steady stream of announcements of new factory plans by various regional governments and panel makers.”

In China the central government has generally encouraged investment in FPDs, in order to shift the economy to higher technology manufacturing, to increase domestic supply and to support gross domestic product (GDP) growth. Provincial governments have become the main enabler of capacity expansion through product and technology subsidies, joint ventures and other direct investments, by providing land and facilities and through tax incentives. In return, new FPD fabs increase tax revenue, support land value appreciation, increase employment and spur the local economy. The economic benefits generated from the feedback loop between local governments, panel makers and new FPD factories are still considered sufficiently positive in China to warrant application of significant public resources.

“China currently produces only about a third of the FPD panels it consumes. However, by rapidly expanding capacity, panel makers and government officials are expecting to double domestic production rates in the next few years and are also looking to export markets,” Annis said. “How excessive global supply, falling prices and lower profitability will affect these plans over time is not yet exactly clear. Even so, there is now so much new capacity in the pipeline that China will almost certainly become the top producer of FPDs by 2018.”

FlexEnable, a leader in the development and industrialization of flexible electronics, has successfully validated a new class of high performance organic semiconductors in a million pound project funded by Innovate UK. It combined materials developed by Flexink with FlexEnable’s proprietary industrial process for making flexible electronics and culminated in a proof of concept plastic LCD display.

The project, Printable Organic Semiconductors for Highly Enhanced Displays (PORSCHED), is part of the UK government’s bid to inspire technological innovation in the areas of electronics, photonics and electrical systems. FlexEnable collaborated with partners Flexink, Imperial College London, and the University of Cambridge, each bringing expertise in the area of organic semiconductors, from materials to device testing and optimization.

The main objective was to create an organic semiconductor that would ensure excellent film uniformity for large-area, flat panel displays. Proof of the performance of this semiconductor is seen in the plastic LCD display demonstrator fabricated at FlexEnable.

Chuck Milligan, CEO of FlexEnable said: “Cutting edge organic semiconductors combined with our industrially proven process and toolkit for flexible electronics have resulted in a high performance transistor platform – as demonstrated by its ability to drive full color video rate plastic LCD. High volume manufacturing for flexible electronics requires semiconductors not only with sufficient mobility, but also with uniformity over large areas and electrical stability. Organic Semiconductors processed at low temperatures enable the use of ultra low cost plastic substrates — even cheaper than glass — and make conformable, flexible, thin and light weight displays possible — transforming where and how we use electronics in our daily lives.”

FlexEnable has developed a complete set of processes to manufacture flexible organic thin film transistor (OTFT) devices and arrays. This has led to the successful volume production of thin, lightweight, and robust backplanes for flexible displays. FlexEnable’s process is very low temperature (<100°C) which opens up a host of manufacturing and cost benefits.

A maximum processing temperature below 100°C brings manufacturing advantages by allowing for the use of lower cost plastic substrates (e.g. PET), minimizing distortion (to improve yield) and enabling low cost mount and demount. However, implementing such a low temperature process presents significant challenges, for example in low temperature deposition and patterning of materials. These challenges have been addressed by FlexEnable’s low temperature process technology for flexible electronics.

The Centre of Process Innovation (CPI) has announced that it is part of a UK based collaboration to develop the next generation of ultra-barrier materials using graphene for the production of flexible transparent plastic electronic based displays such as those required for the next generation of smartphones, tablets and wearable electronics.

The UK is a world leader in the field of graphene innovation and the market is predicted to be worth more than £800m by 2023. The graphene market could transform the manufacturing landscape in the UK if new materials, processes, equipment and metrology can be developed effectively in concert. The project combines the skills from each of the partners (University of Cambridge, FlexEnable Ltd, the National Physical Laboratory, and the Centre for Process Innovation) and expects to deliver a feasible material and process system. It builds upon significant existing investments by InnovateUK and the EPSRC in this area. The resulting ultra-barrier material can be potentially used in a wide range of novel applications by the lead business partner, FlexEnable.

The twelve month project titled “Gravia” funded under the Innovate UK “realising the graphene revolution” call will investigate the feasibility of producing graphene-based barrier films for next generation flexible OLED lighting and display products. However current commercially available barrier layers used to protect the electronics in display screens have limitations with regards to flexibility. In order to realize the commercialization of such applications, display manufacturers have to be able to source flexible barrier platforms such as graphene on which they can fabricate their displays.

The incorporation of graphene interlayers offers great potential for flexible displays. Its gas blocking properties will enable barrier materials that are not only flexible, but also transparent, robust, and very impervious to many molecules. Gravia will seek to accelerate product development, improving upon current ultra barrier performance and lifetimes by producing consistent barrier materials and processes on large area substrates by utilizing specialist growth techniques. The key challenge will be to develop large-area poly-crystalline graphene films which maximize performance whilst mitigating process imperfections. In this way, solutions can be produced at scale and economically viable in the future.

The demonstration of feasible working prototypes will represent a significant achievement in the race to bring wearable electronics and plastic displays to the mass market. The project is exploring the necessary industrial process parameters to ensure that the barriers produced are not only of high performance but also at a price point that allows market adoption. Measuring barriers at very low levels of permeability requires sensitive and accurate tests. Collaborating with the National Physical Laboratory (NPL) will ensure that the data claims are correct and meaningful comparisons can be made in the future with the very latest and most sensitive equipment. Future development work will focus on transferring the technology from proof of concept to pilot production scale.

James Johnstone, Business Development Manager at CPI, said: “The collaboration brings together world class supply chain expertise across the UK to bridge the gap from Graphene research to the manufacturing of commercial flexible display screens. The Hofmann group at the Department of Engineering in Cambridge is a key innovator in the growth and processing of graphene films. NPL are experts in the traceable measurement of water transfer characteristics and FlexEnable brings an industrial focus to the project with their extensive expertise in the manufacture of flexible electronics and flexible display screens in particular. CPI’s role in the project is to use roll-to-roll atomic layer deposition technologies to scale up, test and fabricate the ultra barrier materials.”

Chuck Milligan, CEO FlexEnable adds: “Graphene and other 2D materials are extremely relevant for the flexible electronics industry, with the potential for broad usage from conductors to semiconductors, insulators and even barriers. Building on FlexEnable’s previous leading-edge work with graphene, our involvement will enable the accelerated integration of these game-changing materials in a new generation of ultra-flexible end-user applications with innovative form factors.”

SEMI announced today that FlexTech Alliance has become the first SEMI Strategic (Association) Partner, a form of inter-industry cooperation. In this partnership, FlexTech will continue to pursue its mission of fostering the growth of the emerging flexible, hybrid and printed electronics industry as part of SEMI, the global industry association advancing the interests of the worldwide electronics supply chain.

SEMI is strengthening its position in the flexible, hybrid and printed electronics sector by more directly engaging with a new set of companies and R&D organizations, and leveraging an experienced team dedicated to this emerging industry. FlexTech’s activities — R&D programs, the annual Flex Conference, and industry-building workshops and webinars in the flexible electronics market — will gain improved reach through SEMI’s global platforms.

“SEMI identified several technology areas of high interest to our members and flexible hybrid electronics (FHE) was at the top of the list,” said Denny McGuirk, CEO and president of SEMI. “FHE is an exciting technology, combining aspects of traditional IC manufacturing with printed electronics. FlexTech is at the epicenter of this rapidly growing electronics field and has built a vital and collaborative community. SEMI and FlexTech members will gain both wider and deeper visibility to opportunities in the new markets created by FHE, like wearable electronics and applications for the IoT.”

“Our new partnership with SEMI provides FlexTech members with access to more resources, the expertise of a complementary industry, and worldwide platforms,” notes Michael Ciesinski, president and CEO of FlexTech Alliance. “FlexTech is now better positioned to maintain our R&D programs, broaden our contributions to industry technical forums including standards-setting, and enhance our industry-building business programs.”

Companies, public and private R&D organizations, and universities will benefit from new engagement platforms which will be led by SEMI and FlexTech. In the U.S., FHE will continue to be an integral part of SEMICON West. In conjunction with SEMICON Europa, SEMI annually sponsors the Plastic Electronics Conference with FlexTech as a contributing partner. In Korea, SEMI will build upon the success of its first printed electronics conference. As a SEMI Strategic Partner, FlexTech programs will augment SEMI’s, creating additional avenues for collaboration.

“Flexible and printed electronics, the core of FlexTech’s mission, are quickly becoming an important sector of the international electronics market,” comments Jennifer Ernst, chair of the FlexTech Governing Board and chief strategy officer at Thin Film Electronics. “This is a natural step in FlexTech’s growth, and the Governing Board is excited about the international reach the SEMI partnership provides.”

“As a member of both organizations, I believe that this is a logical combination and an excellent move for the industry,” states Om Nalamasu, PhD, senior VP and chief technology officer at Applied Materials. “The strengths of these two organizations are fully complementary and with their synergies, the whole is clearly greater than the sum of the parts.”

FlexTech retains management of the newly announced Flexible Hybrid Electronics Manufacturing Innovation Institute (FHE MII), the Nano-Bio Manufacturing Consortium (NBMC), and the Laser Illuminated Projector Association (LIPA). Additionally, it will seek new consortium opportunities to serve the electronics industry under the SEMI umbrella. As a SEMI Strategic Partner, FlexTech Alliance will continue to operate under its own name and administer its R&D programs with U.S. government agencies.

When the world’s leading scientists and engineers in micro/nanoelectronics convene in Washington, D.C. this December for the 61st annual IEEE International Electron Devices Meeting (IEDM), the subjects under discussion will encompass a range of topics critical to the continuing progress of the industry:

  • how to make transistors that are vanishingly small
  • a growing emphasis on low-power devices for mobile & Internet of Things (IoT)
  • alternatives to silicon transistors
  • 3D IC technology
  • a broad range of papers that address some of the fastest-growing specialized areas in micro/nanoelectronics, including silicon photonics, physically flexible circuits and brain-inspired computing.

The 2015 IEDM will take place at the Washington D.C. Hilton Hotel from December 7-9, 2015, preceded by day-long short courses on Sunday, Dec. 6 and a program of 90-minute tutorials on Saturday, Dec. 5. In addition to a technical program of some 220 papers, other events will take place during the meeting, including evening panels, special focus sessions, IEEE awards, and an entrepreneurial luncheon sponsored by IEDM and IEEE Women in Engineering.

Back for the third year, the 2015 IEDM will feature a slate of designated focus sessions on topics of special interest. This year’s topics are:

  • Neural-Inspired Architectures: From Ultra-Low Power Devices To Applications
  • 2D Layered Materials And Applications
  • Power Devices And Their Reliability On Non-Native Substrates
  • Flexible Hybrid Electronics
  • Silicon-Based Nano-Devices For Detection Of Biomolecules And Cell Functions

“From its inaugural meeting until today, the IEDM conference has been the place where breakthroughs that drive the electronics industry forward are unveiled,” said Mariko Takayanagi, IEDM 2015 Publicity Chair and Senior Manager at Toshiba. “For example, at the IEDM in 1975 Intel’s Gordon Moore gave a talk that refined his earlier prediction of transistor scaling into what has since become known as Moore’s Law. That tradition of attracting the best speakers and a large, diverse audience from around the world continues, with a focus this year on devices intended to support the Internet of Things and other emerging areas of importance that depend upon advances in semiconductor technology.”

A screen-printable functionalized graphene ink supplied by Goodfellow performs better than normal carbon-based ink, opening the door to innovative applications that require exceptional electrical conductivity, excellent ink coverage, and high print resolution. Such applications are found in light flexible displays, plastic electronics, printed circuit boards, thin film photovoltaics, sensors, electrodes, and OLEDs.

The ink is made with HDPlas (R) functionalized graphene nanoplatelets and is optimized for the viscosity and solid contents required of semi-automatic and manual screen-printing equipment. Substrates that can be printed include but are not limited to polymers, ceramics, and papers.

In addition to the distinguishing characteristics stated above, functionalized graphene ink is:

  • Flexible on appropriate substrates
  • Metal-free, 100% organic (non-tarnishing)
  • Curable at low temperatures
  • Environmentally friendly

The ink is fully customizable and can be modified for specific applications. Scientists and printers running trials with the small quantities available from Goodfellow (100g to 1000g) can, if desired, consult with Goodfellow to further tailor performance in order to meet individual needs.