Category Archives: LED Manufacturing

July 23, 2012 — Strategies in Light 2013 will take place February 12-14 in Santa Clara, CA, hosted by PennWell Co.’s Strategies Unlimited and LEDs Magazine. The event’s theme is “Exploring the Growth Opportunities in the LED and Lighting Markets.” Submit an abstract through August 3 for a chance to present at the conference.

Also read: Strategies in Light 2012 takeaways: LED expectations for the short- and long-term

Strategies in Light seeks presentations on these or related topics:

Technology–

• Automotive lighting

• Display backlighting

• Phosphors-new materials, remote, quantum dots

• Packaging-HV,AC LEDs, COB/multichip arrays

• Color quality metrics, optical safety, test & measurement

• Drivers, dimming & control networks

• Replaceable modules and light engines

• Luminaire design: role of thermal management, advanced packaging & optical concepts

• Measuring color quality

• Light & human biology

• Advances in LED cost, performance, lifetime and reliability

• Development of OLEDs and other competing lighting technologies

• Testing-chips/packages, luminaires

• Controls — components and systems — design & implementation

Market Transformation–

• Market growth and outlook, penetration of LEDs into key applications, barriers to further market penetration

• Case studies of specific installations: cost and performance analysis, user feedback, lessons learned

• Product differentiation

• Industry consolidation

• Regional- and country-specific activities to promote LED lighting

• Quality control and labeling programs

• Customer awareness and acceptance, incentives and subsidies

• Funding from governments and investment community

• Standards development and implementation

• Intellectual property issues

• LED Lighting–design perspectives, luminaire design

• End-user requirements: lighting designers, specifiers, architects

• New applications

• Color (quality, reliability, tunability)

• Non-visual response to light

• Perception of light & color

LED Manufacturing–

• Supply and demand, capacity constraints, availability of materials and equipment

• Advanced chip design and lower-cost manufacturing; epitaxial growth and processing

• Process automation

• Yield management

• Metrology

• Substrates, GaN on silicon

• Transition to larger substrates

• Adapting existing semiconductor facilities to LED manufacturing

• Advances in MOCVD technology

• LED packaging — advanced materials and processes

• Manufacturing standards

Also consider presenting a 3-4 hour workshop or tutorial.

All abstracts must be submitted in English between 100 and 300 words. Overtly commercial submissions will be automatically rejected. Submit an abstract by August 3 at http://forms.events.pennnet.com/fl/forms/sil/online_abstract_main.cfm.

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July 20, 2012 — Maxim Group LLC analyzed metal organic chemical vapor deposition (MOCVD) utilization and revenues at light emitting diode (LED) makers in Taiwan, finding that MOCVD orders are placed just to maintain capacity, not add, and high utilization rates are only at the top LED makers.

The next uptick in MOCVD spending is likely to “fall far short” of the peak seen in 2010-2011, Maxim reported. The analysts expect H2 2012 MOCVD orders at about 130 tools.

High tool utilization reports are coming from Epistar, ForEpi, and Genesis Photonics. Large LED players like Sanan are expanding in H2 2012. Epistar is planning new LED fabs (Miaoli and Fujian) by 2014. Still, near-term spending doesn’t signifies a return to growth, but instead what is needed to maintain spending levels in 2H 2012 and 2013, Maxim said. Higher MOCVD utilization rates are not the norm across all LED makers, but rather at sector leaders.

Figure. Revenue Rebound Points to High Utilization at Epistar and Genesis Photonics but Not Others

After falling three quarters in a row, revenue at seven Taiwanese LED chip makers jumped 29% Q/Q in Q2 2012 on a rebound in display backlighting applications. While this has driven utilization at high-quality vendors with exposure to general lighting like Epistar to >95%, Maxim estimated small, lower-quality players remain at ~70%. With Taiwan’s TV subsidy ending and Europe entering a recession, Maxim does not expect backlighting to drive a new wave of MOCVD spending.

Also read: LED cost and manufacturing topics of Veeco LED maker gathering in Taiwan

Lower subsidies and lower profitability will keep MOCVD spending in check, unlike 2010-2011. Maxim does not see a traditional cyclical downturn/boom, despite some pick up once general lighting adopts LEDs. In 2013-2014, expect MOCVD tool orders to hit about 300 systems, far below the peak numbers of 700+.

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July 20, 2012 – BUSINESS WIRE — Veeco Instruments Inc. (Nasdaq:VECO) hosted more than 150 LED manufacturers and customers of its metal organic chemical vapor deposition (MOCVD) products recently during its MOCVD User Meeting in Tainan, Taiwan. The talks largely focused on reducing light emitting diode (LED) cost through manufacturing, as well as using silicon as an LED substrate.

Representatives from most of Taiwan’s top LED manufacturers such as Epistar Corporation, FOREPI, Genesis Photonics Inc. (GPI), Huga Optotech Inc., Tekcore Co. Ltd., Epileds Co. Ltd., and Arima Optoelectronics Corp. attended.

Invited speaker Charles Li, Ph.D., VP of R&D at LED maker GPI, presented “The Trend of LED Chips for Lighting.” He addressed key drivers that will help to commercialize LEDs for general lighting, such as cost reduction, which can be achieved by developing better high-current LED chip technology.

Jia Lee, Ph.D., Veeco’s senior director of marketing and business development, also spoke on LED manufacturing costs, focusing on Veeco’s TurboDisc MOCVD offerings. Veeco recently introduced a new suite of MOCVD systems based on its TurboDisc technology, aiming for reduced LED manufacturing costs.

An update on gallium nitride on silicon (GaN on Si) LED manufacturing came from Kenny Sun, Ph.D., Veeco’s director, Taiwan Technology Center (TTC), located in Hsinchu Park. Dr. Sun also presented the mission of Veeco’s TTC and technical projects since its establishment a year ago. Veeco’s Taiwan Technology Center conducts process demonstrations, arranges rapid start programs to transfer best known methods, provides early access to evaluate system upgrades, and supports joint technology development programs. It is equipped with Veeco’s MOCVD systems.

Tim Liu, Veeco VP & Greater China country manager, said the event enables Veeco to share its MOCVD solutions to problems of yield, productivity, and fab costs.

Veeco’s process equipment solutions enable the manufacture of optoelectronics, LEDs, power electronics, hard drives, MEMS and wireless chips. For information, please visit www.veeco.com.

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July 16, 2012 — Light-emitting diode (LED) prices are declining, as revenues are growing through 2016, according to a report from Strategies Unlimited. Trends include multi-chip packaging and different LED power levels for different applications.

Global revenue for LED packages hit $2.04 billion in 2011, according to Strategies Unlimited.

Between 2010 and 2011, LED prices declined by more than 25%; for some suppliers the decline was more than 40%. The decline in prices stimulated demand for LED lighting products, increasing overall revenue by 46.3%. LED suppliers diverted excess manufacturing capacity to produce LEDs for the lighting industry, picking up the slack from the slower-than-expected display backlighting sector.

LED prices will continue to decline 2012-2016 at a 13% compound annual growth rate (CAGR). In the same period, CAGR for revenues for LEDs in lighting is forecast to grow 10%.

In 2011, all major players in the LED industry made a big push in the sales of multi-chip packages (MCP). The use of high-lumen-output packages helps reduce the size of the light source as well as the time for luminaire design development.

Use of high-power LEDs continues where high lumen output from compact light sources is required in applications such as streetlights, flashlights, recessed lights and PAR replacement lamps. In the forecast period, more luminaire manufacturers will use MCPs, while ambient lighting applications will use low- and mid-power LEDs for diffused lighting applications such as troffers and linear fluorescent tube replacement products.

Figure. Forecast for LEDs in lighting, by application, 2010-2016 ($M). SOURCE: Strategies Unlimited.

Although the demand for white LEDs increased to 84% of the total revenues, the lighting industry is increasingly using remote phosphor with blue LEDs or red LEDs with cool white LEDs to make warm white light. Also read: Phosphor trends for LED manufacturing

China was the largest LED market in 2011, with 49% of the revenues, with high penetration rates in outdoor, industrial and building decoration lighting applications. The improvements in quality of LED lighting products for retail displays — refrigerated and general merchandise displays — is forecast to be the fastest growing segment.

This report is the latest in a series of reports on LED Markets from Strategies Unlimited. Strategies Unlimited specializes in market research and strategic consulting directed
at photonics systems and components. The company is a research unit of PennWell Corporation, a global media and information company that also publishes Solid State Technology. Strategies Unlimited’s new report, The Market for High-Brightness LEDs in Lighting Applications: Market Review and Forecast- 2012, is now available. Learn more at www.strategies-u.com.

Visit the LED Manufacturing Channel on Solid State Technology and subscribe to the LED Manufacturing News monthly e-newsletter!

July 16, 2012 — The price of a light-emitting diode (LED) bulb will fall by about half by 2020, hitting $11.06, according to Lux Research. With the LED chip package seeing 70%+ cost reduction, technology innovation will shift to the surrounding “balance of system” elements — thermal management, drivers and optics — to push costs lower.

Costs of the central LED chip package will fall by more than 70% to $2.14 in the next decade, but this makes up just 19% of the bulb costs in 2020. To drive overall costs lower, the related system elements will need to see similar cost reductions.

Read about blogger Dr. Phil Garrou’s costs saving analysis of an LED bulb in Bidding Adieu to Lester Lightbulb and Lester the Lightbulb vs CFL and LED : the Saga Continues

“We find that today’s balance of system technology solutions fall short of the dramatic cost reductions needed to mirror the LED package,” said Pallavi Madakasira, Lux Research Analyst, adding that existing alternatives are ineffective and uneconomical.

Lux Research analysts studied the key LED cost stack components of a 60 W incandescent equivalent LED bulb as well as the technologies available to accelerate cost cuts in order to understand the true pathways to LED bulbs’ potential. “LED lighting is by no means standardized, and potential disruptions to the component stack abound,” Madakasira said.

Thermal management is the biggest target for cost reduction past the package. Active thermal management technologies such Nuventix’s SynJet will lead to cost savings over aluminum-based solutions, but only from 2017 on.

Dimmable drivers are priced at a premium to non-dimmable ones because they enable precise control of the light output and lead to energy savings. Innovation in this area will bring about a 1% cost saving in 2020, boosting the performance of the LEDs overall.

Secondary optics account for about 5% of the total cost of a 60 W equivalent LED bulb. The field is dominated by specialists such as Ledil, Khatod, and Fraen, and innovation lies in improving the shape of the beam and the ability to collect more light from primary optics.

The report, Cheaper, Brighter, Cooler: The Need for Cost Reduction Past the Package, is part of the Lux Research Energy Electronics Intelligence service. Lux Research provides strategic advice and intelligence for emerging technologies. Visit www.luxresearchinc.com for more information.

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July 16, 2012 — Oxford Instruments launched the PlasmaPro 100 etch and deposition tool for manufacturing micro electro mechanical systems (MEMS), high-brightness light-emitting diodes (HB-LED), semiconductors, and other applications.

Deposition rate for high-quality SiO2 and SiNx improved with changes to the plasma-enhanced chemical vapor deposition (PECVD) hardware, which also reduces cleaning overhead. The latest generation of Cobra ICP source improves etch rate and feature control capability.

The tool’s robotic handler optimizes processes. Combined with the system’s control and software interface, this improves diagnostics, reliability and serviceability, the company reports.

The PlasmaPro 100 is configurable with process chambers as stand-alone modules or clusters. Users can access over 6,000 process recipes through Oxford Instruments.

Oxford Instruments specializes in the design, manufacture and support of high-tech tools and systems for industry research. Learn more at www.oxford-instruments.com.

Visit the MEMS Channel of Solid State Technology, and subscribe to our MEMS Direct e-newsletter!

July 13, 2012 — Terry Brewer, one of the newest members of SEMI’s North American advisory board, talks about semiconductor industry consolidation, as well as new technologies and materials in the industry. He shares how SEMI is reacting to this evolution.

Brewer, president and founder of Brewer Science, speaks with Pete Singer, chief editor, Solid State Technology, at SEMICON West 2012 in San Francisco. See all the news and interviews from SEMICON West here!

 

July 13, 2012 — Barclays Capital Inc. analysts held conversations with the light-emitting diode (LED) supply chain at SEMICON West, this week in San Francisco, CA. The show confirmed for Barclays that Q2 2012 orders for metal organic chemical vapor deposition (MOCVD) tools remained flattish with the trough-like Q1 numbers.

Top MOCVD suppliers Veeco and Aixtron confirm that activity is picking up into H2 2012. Sub-component suppliers to the MOCVD makers, as well as adjacent LED equipment suppliers, are anticipating gradual order growth in Q3 and Q4 2012.

Key accounts that are in the process or on the cusp of placing orders in the remainder of 2012  include Sanan and 3E in China, Toyoda Gosei and Showa Denko in Japan, a little bit of Epistar in Taiwan exiting the year, and likely Samsung in Q4 for equipment installation in 2013. Additionally, Nichia also appears to be actively ramping capacity, though this will not benefit Veeco or Aixtron, given Nichia’s internal tool production.

Barclays Capital estimates that MOCVD chamber shipments will pick up from 67 in H1 2012 to 80 in H2. The risk to MOCVD orders comes from the hard disk drive (HDD) sector, and how much it decelerates in H2, though service should provide a buffer here.

Get the full report from Barclays at http://live.barcap.com/PRC/servlets/dv.search?contentPubID=FC1838394&bcllink=decode

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July 11, 2012 — Citi analysts surveyed the light-emitting diode (LED) manufacturing market and LED demand at SEMICON West 2012, taking place this week at the Moscone Center in San Francisco, CA.

Demand for general lighting applications remains robust for LEDs, though the LED oversupply remains significant. This could explain why orders for metal organic chemical vapor deposition (MOCVD) tools have ticked slightly higher, but primarily limited to Epistar and some small China orders.

From a chip perspective, discussions suggest Cree (NASDAQ:CREE) stepped on some large customers toes when it acquired Ruud Lighting in August 2011. Ruud makes outdoor lighting fixtures based on LEDs. This has had greater than expected negative impact on chip demand, Citi says. The downstream acquisition for the LED maker is viewed by some customers as directly competitive with their businesses.

View Citi’s full report at http://ir.citi.com/uyRtd8u%2B6M2pDF7aCZQyUr4RBK2BMqjLd6ziy8f56t2Ci20uJjgV%2Bg%3D%3D

Visit the LED Manufacturing Channel on Solid State Technology and subscribe to the LED Manufacturing News monthly e-newsletter!

July 10, 2012 – BUSINESS WIRE — Semiconductor manufacturing equipment supplier SUSS MicroTec uncrated the third generation of the ACS200 Coating and Developing Platform, developed from the company’s ACS200Plus and Gamma platforms.

The ACS200 Gen3 offers the capability to combine four wet process modules with up to 19 plates for high-volume production. State of the art offerings include open bowl spin coating and proprietary GYRSET closed cover coating technology.

The configuration flexibility of modules and technologies suits production of advanced semiconductor packages, micro electro mechanical systems (MEMS) and light-emitting diodes (LEDs). The tool can also be used to bridge the gap between research & development (R&D) and high-volume manufacturing (HVM).

SUSS MicroTec, listed on TecDAX of Deutsche Boerse AG, is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. For more information, please visit http://www.suss.com.