Category Archives: LED Manufacturing

February 22, 2012 — Massachusetts Institute of Technology (MIT) researchers used gases to precisely control nanowires’ width and composition as they grow, which could yield complex structures optimally designed for particular applications, like LED substrates or solar panels.

Also from MIT: MIT etches MEMS structures with glass stamp

Nanowires can have very different properties than the same materials in bulk, because of quantum confinement effects, based on the behavior of electrons and phonons within the material. Nanowires may conduct electricity and heat or interact with light in new and useful ways. The high surface-area-to-volume ratio makes nanowires especially useful in sensing applications versus bulk materials.

The team, led by MIT assistant professor of materials science and engineering Silvija Gradečak, controlled and varied the size and composition of individual wires as they grew from metal seed particles. They adjusted the gases used in growing the nanowires, which affected the size and composition of the seed particles, simultaneously. The nanowires can be produced using tools already in use by the semiconductor industry, so the devices should be relatively easy to gear up for mass production, the team says.

These initial experiments used indium nitride and indium gallium nitride (InGaN), semiconductors used to manufacture light-emitting diodes (LEDs) among other devices; the technique could be applied to various materials.

The team used electron microscopy to observe nanowire growth, making adjustments to the growth process based on what they learned about the growth patterns. Electron tomography measurements were used to reconstruct the three-dimensional shape of individual nanoscale wires.

The nanowire geometry and composition were so precisely structured that they could enable new semiconductor devices with better functionality than conventional thin-film transistors, Gradečak says. Applications such as blue and ultraviolet LEDs could be produced with zinc oxide (ZnO) and gallium nitride (GaN) nanowires grown to produce these colors very efficiently and at lower cost than sapphire or silicon carbide used today. Other applications are solar-energy panels, with nanowires tuned to specific wavelengths of light; or new thermoelectric devices to capture waste heat and turn it into electric power, where the wires could be grown to conduct electricity well but heat poorly.

The results are described in a new paper authored by MIT assistant professor of materials science and engineering Silvija Gradečak and her team, published in the journal Nano Letters (http://pubs.acs.org/doi/abs/10.1021/nl300121p).

In addition to Gradečak, the Nano Letters paper was co-authored by MIT graduate student Sam Crawford, Sung Keun Lim PhD ’11 and researcher Georg Haberfehlner of the research and technology organization CEA-Leti in Grenoble, France. The Nanoscale paper was co-authored by MIT graduate student Xiang Zhou, Megan Brewster PhD ’11 and postdoc Ming-Yen Lu. The work was supported by the MIT Center for Excitonics, the U.S. Department of Energy, the MIT-France MISTI program and the National Science Foundation.

In a related study recently published in the journal Nanoscale, the team also used a unique electron-microscopy technique called cathodoluminescence to observe what wavelengths of light are emitted from different regions of individual nanowires. (http://pubs.rsc.org/en/content/articlelanding/2012/nr/c2nr11706a)

Visit the MIT Department of Materials Science and Engineering at http://dmse.mit.edu/

Courtesy of David L. Chandler, MIT News Office.

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February 20, 2012 — Verticle, Inc. began mass production of its hexagonal-shaped light-emitting diode (LED) chip Honeycomb, developed with a proprietary copper substrate and chemical chip separation technology.

Photo. Verticle Inc.’s hexagonal-shaped LED chip Honeycomb.

The vertically structured LED chip boasts higher light extraction, better optical efficiency, and more uniform beam profile than conventional square or rectangular LED chips based on sapphire or silicon substrates. The hexagonal architecture enables better current spreading control, for higher-current operation. Honeycomb chips can use same package flat form as square or rectangular chips.

Chemical chip separation is faster and easier than conventional laser scribing or dicing, according to Verticle, making the hexagonally shaped LED manufacturable beyond R&D quantities.

Photo. SEM image of the chemically separated hexagonal LED Honeycomb.

Main optical power range is 370-420mW at 350mA with a forward voltage range of 3.1-3.4V.

The mass production level Honeycomb chip will be introduced and available for sale at Guangzhou LED China 2012, February 20-23.

Specification and information are available at http://www.verticleinc.com.

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February 20, 2012 — Samsung Electronics’ Board of Directors (BOD) approved the merger with Samsung LED, Ltd, which was previously decided at the BOD meeting on December 26, 2011. The BOD also decided to request Samsung Mobile Display to pay infrastructure construction costs.

Samsung LED, Co, Ltd. will be merged into Samsung Electronics by way of small-scale merger and be dissolved following the merger. This is expected to nurture the light emitting diode (LED) business as the future growth engine of Samsung Electronics’ component business by utilizing its advanced technology, manufacturing competency, and global sales network.

The merger ratio is 0.0134934 Samsung Electronics share in exchange for each Samsung LED share. This merger will take effect on April 1, 2012.

What does this merger move mean? Check out the implications in Will Samsung reorganize LCD and AMOLED display units?

Pursuant to Article 527-3 of the Commercial Act, the deal constitutes a small-scale merger with the shares to be provided accounting for less than 5% of the total shares issued. Hence, the BOD approval will substitute an General Meeting of Shareholders.

Samsung Electronics decided to request Samsung Mobile Display to pay KRW198.1 billion related to
constructing infrastructure (water supply and waste water disposal facilities) under the
causer pay principle. Samsung Electronics will be constructing the infrastructure, which is
required at Samsung Mobile Display’s production site, and give Samsung Mobile Display
the long-term right to use the infrastructure. Payment will be made in 5 installments over the next 12 months. Samsung Electronics also approved signing of a new real estate rental contract with Samsung Mobile Display.

February 20, 2012 — Strategies in Light Europe 2012, September 18-20 in Munich, Germany, is accepting presentation abstracts through February 29. Light-emitting diode (LED) industry professionals can submit papers on LED technology, LED manufacturing and the supply chain, markets, LED applications, and related topics.

Read about Strategies in Light 2012, Santa Clara, CA
 
Papers submitted should describe or demonstrate efforts to improve quality and performance of LED lighting, activities that help accelerate the market adoption of LED lighting, and/or results from real-world LED lighting applications and installations.

Strategies in Light Europe is in its 3rd year of providing a comprehensive conference and exhibition for the rapidly-growing LED lighting industry. The event offers a platform for the best networking opportunities and a forum for the sharing of ideas and experiences in the latest technologies.
Papers will be selected by the SIL Europe Advisory Board on the basis of technical content, audience

Papers can cover these suggested topics, or related fields of interest:
Applications

  • Market growth and outlook, penetration of LEDs into key applications, barriers to further market penetration
  • Case studies of specific installations: cost and performance analysis, user feedback, lessons learned 
  • Requirements and perspectives from lighting designers, specifiers, architects and other end-users

Supply chain & manufacturing

  • Supply and demand, capacity constraints, availability of materials and equipment
  • Advanced chip design and lower-cost manufacturing; epitaxial growth and processing
  • Luminaire design: role of thermal management, advanced packaging & optical concepts
  • Advances in LED cost, performance, lifetime and reliability 

Market transformation

  • Regional- and country-specific activities to promote LED lighting
  • European activities to develop high-quality LED lighting products
  • Quality control and labelling programs
  • Customer awareness and acceptance, incentives and subsidies
  • Funding from governments and investment community
  • Standards development and implementation 
  • EU Directives: development and impact on LED market

Technology

  • Color quality metrics, optical safety, test & measurement 
  • Development of OLEDs and other competing lighting technologies
  • Drivers, and dimming & control networks 
  • Replaceable modules and light engines

Submit your abstract today at http://www.sileurope.com/conference.html

In submitting an abstract you are indicating your availability and willingness to attend and present a paper at Strategies in Light Europe 2011, if selected, and to comply with all deadlines. The speaker and author details provided when submitting an abstract will be used for pre-event marketing purposes. Papers with an overt marketing/sales/commercial subject will be rejected. Please do not submit presentations that are scheduled to be presented at other LED-related conferences.

For information/assistance on submitting an abstract for the Call for Papers, contact: Emily Pryor, Conference manager, [email protected]; Tel: +44 (0) 1992 656 614.

Visit the new LEDs Manufacturing Channel on ElectroIQ.com!

February 16, 2012 — Light emitting diode (LED) supply exceeded demand by 30% in 2011, thanks to poor LED TV sales and slow growth in LED lighting. Recovering backlight demand and a new uptake in LED lighting are closing this gap in 2012, shows a recent NPD DisplaySearch Quarterly LED Supply/Demand Market Forecast Report, putting the LED supply glut at 19% in Q1 2012, dropping 3 percentage points by the next quarter.

After a buying spree for metal organic chemical vapor deposition (MOCVD) tools in 2010, major LED makers like Samsung LED, LGIT and Lextar found underwhelming end-market demand. This caused tool utilization rates to drop throughout 2011, hitting about 50% now. Also read: LEDs and a MOCVD bubble: We’ve only just begun

Figure. LED supply and demand, backlighting and lighting applications. Source: NPD DisplaySearch Quarterly LED Supply/Demand Market Forecast Report.

Low-cost direct-LED TV backlights should trigger renewed demand for LEDs in TVs, thanks to the lower price. CCFL-backlit LCD TVs and low-cost direct LED-backlit TVs differ in cost by only about 5% (for a 32" set). High growth is expected for low-cost direct LED TVs in 2012.

LED backlights are used in all small/medium LCD displays, and LED penetration in mobile PCs is nearly 100%. While penetration in LCD monitors and TVs continues to grow, the LED package count in these displays is decreasing.

LED lighting has been gradually growing, due to efficacy enhancements and cost reductions. Lumen per dollar costs are closing in on those of traditional light sources. Government incentives and market drivers, such as the electricity shortages following Japan’s March 2011 earthquake, can spike LED lighting sales. NPD DisplaySearch expects sales to rapidly increase in Japan in 2012. Other regions — China, the US, Korea — are aggressively promoting LED lighting.

The NPD DisplaySearch Quarterly LED Supply/Demand Market Forecast Report analyzes supply and demand on a quarterly basis for the entire LED industry. From chip prices to LED maker roadmaps, this report gives a clear outlook and reliable forecast of LED supply/demand, along with an analysis of the impacts on pricing. NPD DisplaySearch specializes in research and consultancy in the display supply chain, as well as the emerging photovoltaic/solar cell industries. For more information, go to http://www.displaysearch.com/.

Visit the new LEDs Manufacturing Channel on ElectroIQ.com!

February 16, 2012 — Iljin Materials Co., Ltd., a developer and producer of elecfoils for use in the electronic components, has signed a statutory merger agreement with ILJIN Semiconductor Co., Ltd., a company engaged in the manufacturing of light emitting diodes (LEDs). Both the companies are based in Korea.

The merger ratio of Iljin Materials and ILJIN Semiconductor is 1 : 0.3040296 and 1,865,318 common shares will be issued with the merger. The merger effective date is April 30, 2012. After the merger, Iljin Materials will survive and ILJIN Semiconductor will be dissolved.

Deal Type Merger Deal Status Announced: 2012-02-14
Deal Participants
Target 1 (Company) Iljin Materials Co., Ltd. Target 2 (Company) ILJIN Semiconductor
Copyright 2012 Datamonitor

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February 13, 2012 — Yole Developpement released "European Microelectronic Fabs Database & Report 2012," a database and report on the European microelectronics and microsystem manufacturing fabs, pilot lines, and major R&D organizations.

The database details fab locations, products, technologies, manufacturing facilities, and financial information. Fab data includes employee counts, sales figures, capacity info, and more.

The database covers 50 countries, extending throughout Europe and the Middle East area (EMEA), and Russia. There are 300+ fabs in Europe, Yole reports. It includes major changes that have taken place since 2007, such as fab closures and new investments.


 
The European Microelectronic Fabs Database & Report 2012 includes:

The database can be used to understand the European fab environment, and assess business opportunities in the European and Middle-East market.

Companies described in the database: ABB Semiconductor, Acreo AB, Altis/GIS Semiconductor, Analog Devices, austriamicrosystems, Autopribor, Avago Technologies, Boehringer Ingelheim microParts, Robert Bosch, Colibrys, Dynex Semiconductor, e2v technologies, ELMOS, EM Microelectronic Marin, EPCOS, Estel, First Sensor Technology, FLIR Systems, Freescale Semiconductor, GE Measurement & Control Solutions, GLOBALFOUNDRIES, HL-Planartechnik, IBM Microelectronics, IMEC, Infineon Technologies, Intel, International Rectifier, IPDIA, Leister Process Technologies, LETI, Lionix, LITE F, MHS Electronics, Micran, Microfab Bremen, Micron Technology, Micronas, Nemotek Technologies, Norstel, Nortel Technology, NXP, Oclaro Inc., Olivetti I-Jet, OMMIC, On Semiconductor, OptoGaN, OSRAM, Philips, Photonix, Prema Semiconductor, Pulsar (Scientific Research Institute), Raytheon Company, Retina Implant, RF Micro Devices, Scottish Microelectronics Centre, SE MEFAB, SENSIRION, SenSonor Technologies, Sigm Plus, Silex Microsystems, Siliconix, Silway Semiconductor, SINTEF, STMicroelectronics, Telefunken Semiconductors, Texas Instruments, Texet, Three-Five Epitaxial Services, TowerJazz Semiconductors Ltd., Tronic’s Microsystems, ULIS , United Monolithic Semiconductors, Vishay Intertechnology, VTI Technologies, VTT, XFAB semiconductor.

Access the report at http://www.i-micronews.com/reports/European-Microelectronic-Fab-Database-Report-2012/226/

UPDATE February 13, 2012 — Analysts from Jefferies & Company Inc., Jefferies Hong Kong Limited, and Barclays Capital attended the Strategy in Light conference, last week in Long Beach, CA, and report on a challenging light emitting diode (LED) market with near-term positive boosts.

End market demand for LEDs remains lackluster, with total LED component revenue expected to decline from $12.5 billion in 2011 to $12.3 billion in 2016. Industry expert Ms. Shum projected continued market declines, while Ms. Ella forecasted growth in LED lighting and auto headlamp but declines in all other end markets, said Jeffries attendees. Barclays does not anticipate a substantial snap-back in LED demand in China following Chinese New Year.

Presentations at Strategies in Light forecasted flat revenues for LED makers in 2012, though Barclays remains more optimistic. While revenues stagnate, total lumens generated by LED components will grow significantly, thanks to higher efficacy and lower cost manufacturing, Jeffries reports. This trend enables new applications while cannibalizing legacy applications. LED industry players are designing lighting products to eliminate components and make systems smarter and more user friendly.

China’s announcement of an LED approval list could be a near-term positive catalyst: Ms. Wu Ling, the head of China SSL Alliance, anticipated 125 plan details this year. Similar to the path of China’s solar PV "Golden Sun" program, the government will qualify vendors for the LED subsidies. Jeffries analysts expect the approval list to be announced in 2 months, with an LED subsidy announced shortly after. LED makers with meaningful China exposure, such as Cree and SemiLEDS, stand to benefit. The magnitude of the China LED subsidy is still uncertain and may come in below some more elevated expectations, Barclays warns. "The China market opportunity for LED lighting continues to be substantial, with the pace of adoption potentially overtaking other regions assuming both attractive price points and other supportive government efforts," noted Barclays Capital after Strategies in Light.

The LED industry is dealing with overcapacity, driven by overly optimistic flat panel display (FPD) penetration expectations and short-lived local government support of street light programs and LED manufacturing in China. LED TV demand led to significant investment by Samsung and LG in the supply chain. Both Korean and Taiwanese companies built up capacities in anticipation of strong LED TV demand. Reduction of LED chip counts in backlighting and lighting contributed to weak volume growth. This is a consequence of tremendous lumen improvement, allowing more efficient designs using fewer chips.

"Utilization levels for most LED makers remain below 50%, suggesting that the current pace of LED demand growth is unlikely to absorb the overcapacity," Barclays reports With no company failures or consolidation yet in China, this inevitability is still in our future.

While Barclays continue to estimate the 2012 MOCVD market at ~400 tools, with Veeco’s 2012 guidance implying a market size closer to the 300 tool level, we could see Aixtron following suit and setting this low bar as well.
 
Jeffries authors:
Jesse Pichel, Equity Analyst, (212) 323-3987, [email protected]
Min Xu, Equity Associate, (212) 336-7370, [email protected]
Elaine Kwei, CFA, Equity Analyst, (212) 284-2187, [email protected]
Joseph Fong, CFA, Equity Analyst, +852 3743 8074, [email protected]

Barclays authors:

Olga Levinzon, (212) 526-9134, [email protected]
Amir Rozwadowski, (212) 526-4043, [email protected]

 

Check out more reports from Strategies in Light 2012:

 

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February 10, 2012 – BUSINESS WIRE — GT Advanced Technologies Inc. (NASDAQ: GTAT) subsidiary, GT Crystal Systems, will supply 500,000 2" equivalent (TIE) 6" C-plane sapphire cores to Chongqing Silian Optoelectronics Science & Technology Co. Ltd. (Silian). Silian produces high-quality sapphire substrates for high-brightness light-emitting diode (HB-LED) manufacturing.

Large-diameter sapphire wafers enable higher yields in the LED industry, noted David Reid, COO and GM, Silian.

The sapphire ingots will be produced from boules grown in GT’s ASF sapphire growth furnaces installed in the company’s newly expanded sapphire manufacturing facility in Salem, MA. Silian is a standing customer of GT Crystal Systems, and Reid noted the "consistency and quality of ASF-grown sapphire."

GT Advanced Technologies Inc. provides polysilicon production technology, and sapphire and silicon crystalline growth systems and materials for the solar, LED and other specialty markets. For additional information please visit www.gtat.com.

Also read: Rubicon re-ups sapphire wafer contract with largest customer

Visit the new LEDs Manufacturing Channel on ElectroIQ.com!

February 10, 2012 — Day 3 of the 2012 Strategies in Light conference continued the LED Manufacturing session. Presenters covered lithography for light emitting diode (LED) manufacture, advanced packaging, metrology and testing, high-performance materials, and other topics, such as the value of dimming.

First up, Thomas Uhrmann of EV Group with a review of the lithography and wafer bonding tools that they provide for HV manufacturing of LEDs. Nano-imprint is one of the applicable technologies identified on one chart, but only optical litho was discussed. Several different device structures are being scaled up in production, no longer limited to the original planar device. A variety of bonding schemes were shown, many driven by emerging 3D integration process flows. It remains to be seen whether there will be a process and materials convergence in our future.

Figure 1. Chip designs for GaN LEDs.

The subject switched to metrology and yield management with Mike Plisinski of Rudolph Technologies, focusing on epitaxial process metrology and feedback in LED production. MOCVD Epi process defects and variation are the largest LED cost drivers, impacting both yield and brightness directly.

Figure 2. Epi process defects and LED yield/brightness.

Dan Scharpf of Labsphere talked about optical testing of LEDs. Drive current, junction temperature, stray light and appropriate selection of sphere size are all important parameters for accurate testing that does places all products into the correct bin.

Ilkan Cokgor of Everlight Electronics led us into the LED Packaging session, speaking on packaging trends intended to drive down the cost per lumen. Specifically, he focused on performance and reliability improvements for PLCC packages because they are low cost but have not developed a reputation for reliability before now.

Figure 3. Advanced package — reliability improvement.

Ravi Bhatkal of Cookson took the packaging reliability story up a level to luminaire fabrication, including the introduction of SMT manufacturing methods to LED packaging. Issues in lead-free solder printing and reflowing were discussed. The talk provided some good guidance for engineers just starting to implement such processes.

Geoff Gardner, Lighting Marketing Manager for Dow Corning, talked about innovations in silicone technology as applied to LEDs. As the material most commonly used for the LED primary lens, thermal stability is critical for both transmittance and reflectance over the lifetime of the device. Silicones used in injection molding and screen printing have recently been brought to the market. The chemical physical and mechanical properties make silicones suitable if not preferred for a range of applications within LED modules and luminaries.

Figure 4. Material needs in lamps and luminaires.
Figure 5. Silicone technologies for LEDs.

Marc McClear of Cree, still well-known to those of us from the semiconductor materials business, opened the final session of the LEDs in Lighting track with The Next Big Thing. Among the discarded candidates discussed were LED droop, the green gap, remote phosphors and OLEDs. Rather, the correct answer is 3rd generation direct attach LED chip architecture as the vehicle that will deliver 200 lumens/watt for the industry. The payback time for installed fixtures will drop from 4.5 years to less than 1 year.

Figure 6. DOE LED roadmap.

Nadarajah Narendran, Director of the Lighting Research Center at RPI, gave a program overview of ASSIST, the Alliance for Solid-State Illumination Systems and Technology. In a philosophical observation worthy of “if a tree falls in the forest and no one hears it…” he opined that without a human eye to observe it, light is just another wavelength of radiation. “ASSIST recommends” is a series of publications that the organization has produced over the past decade to disseminate the research to its member companies and throughout the industry. Developing test methods, standards and educational curricula are among the ongoing activities that comprise its mission.

Figure 7. ASSIST publications.

Next on the agenda was Amy Olay (no relation) of the San Jose Department of Transportation talking about the energy savings programs associated with the city’s 62,000 streetlights with an annual operating budget of $6M. Implementation of a wireless control system in which each streetlight was its own node was chosen over hard wired designs for controlling power to and receiving operational data from the lamps. The longitude and latitude of each streetlight is known to itself, and it turns on and off based on its unique sunrise & sunset times, rather than using photocells. Warm white LEDs with a color temperature of 4500°K were found to be preferred by the public. The units could be reduced to 50% power without an adverse effect on safety or public perception. In a nod to scientific collaboration, the city can further dim these lights from midnight to 5am, which are the hours in which the James Lick Observatory above San Jose on Mount Hamilton conducts its astronomical research. The current deployment is for 2,000 streetlights, funded by federal stimulus money. An additional $30M in grants will be needed to complete the conversion to LED streetlights in San Jose.

Sam Klepper of Redwood Systems wrapped up the conference by introducing us to the digital age of lighting. Being dimmable turns out to be a significant feature of LEDs that is not fully exploited. Dimming an LED by 30% reduces power consumption by 50% with no adverse effect. Dimming a CFL by 30% reduces power consumption by only 20%, and reduces the lifetime of the lamp. The digital control system that takes advantage of all of the features of LED lighting brings with it the capability to add a number of other functions of interest to building managers with little additional effort. For example, motion sensors used to turn off lights in unoccupied rooms can also indicate room occupancy for spontaneous roving team meetings searching for an available conference room. The same sensors can provide security warnings for restricted areas or after-hours tresspassers.

Figure 8. Key challenges in facilities.
Figure 9. Commercial electricity use by building type.

Observation from the exhibition floor: I’m accustomed to walking up and down the aisles and wondering how I might use the product being exhibited to build my own product. At this show, the dominant thought was “I wonder how that would look in my living room.” In that sense, it was a bit more like Home Depot than the technology conference that it was. On the other hand, it is so much more interesting to see all of the ready-to-install luminaire designs than it is to see bin after bin of bare and packaged chips and assembly components.

Next year is going to be a tough one for the LED industry, since the 2013 Strategies in Light conference will be held on February 12-14. I think it’s safe to say that not everyone will be able to get home in time for Valentine’s Day to keep peace in the family.

Michael A. Fury, Ph.D., is director & senior technology analyst, Techcet Group in North Plains, OR.

Read Fury’s other reports from Strategies in Light:

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