Category Archives: LED Manufacturing

SEMICON West 2018 to spotlight smart technologies, workforce development

March 20, 2018

SEMICON West, the flagship U.S. event for connecting the electronics manufacturing supply chain, has opened registration for the July 10-12, 2018, exposition at the Moscone Center in San Francisco, California. Building on a year of record-breaking industry growth, SEMICON West 2018 will highlight the engines of future industry expansion including smart transportation, smart manufacturing, smart medtech, smart data, big data, artificial intelligence, blockchain and the Internet of Things (IoT). Click here to register.

Themed BEYOND SMART, SEMICON West 2018 sets it sights on the growing impact of cognitive learning technologies and other industry disruptors with programs and new Smart Pavilions including Smart Manufacturing and Smart Transportation to showcase interactive technologies for immersive, virtual experiences. Each Pavilion will feature a Meet the Experts Theater with an intimate setting for attendees to engage informally with industry thought leaders.

Smart Workforce Pavilion: Connecting Next-Generation Talent with the Microelectronics Industry

The SEMI Smart Workforce Pavilion at SEMICON West 2018 leverages the largest microelectronic manufacturing event in North America to draw the next generation of innovators. Reliant on a highly skilled workforce, the industry today is saddled with thousands of job openings and fierce competition for workers, bringing renewed focus to strengthening its talent pipeline. Educational and engaging, the Pavilion connects the microelectronics industry with college students and entry-level professionals interested in career opportunities.

In the Workforce Pavilion “Meet the Experts” Theater, industry engineers will share insights and inspiration about their personal working experiences and career advisors will offer best practices. Recruiters from top companies will be available for on-the-spot interviews, while career coaches offer mentoring, tips on cover letter and resume writing, job-search guidance, and more. Visitors will learn more about the industry’s vital role in technological innovation in today’s connected world.

This year, SEMI will also host High Tech U (HTU) in conjunction with the SEMICON West Smart Workforce Pavilion. The highly-interactive program supported by Advantest, Edwards, KLA-Tencor and TEL exposes high school students to STEM education pathways and stimulates excitement about careers in the industry.

Free registration with three-day access and shuttle service to SEMICON West are available to all college students. Students are encouraged to register for the mentor program, attend keynotes and tour the exposition hall to see everything the industry has to offer. To learn more, visit Smart Workforce Pavilion and College Track to preview how students can enter to win a $500 hiring bonus!

Three Ways to Experience the Expo

Attendees can tailor their SEMICON West experience to meet their specific interests. The All-In pass covers every program and event, while the Thought-Leadership and Expo-Only packages offer scaled pricing and program options. Attendees can also purchase select events and programs à la carte, including exclusive IEEE-sponsored sessions, the SEMI Market Symposium, and the STEM Rocks After-hours Party, a fundraising event to support the SEMI Foundation.

Si2 approves two IC design simulation standards for fast-growing gallium nitride market

March 14, 2018

The Silicon Integration Initiative’s (Si2) Compact Model Coalition (CMC) has approved two integrated circuit design simulation standards that target the fast-growing global market for gallium nitride semiconductors.

The approved standards are the 12^th and 13^th models currently funded and supported by the CMC, a collaborative group that develops and maintains cost-saving SPICE (Simulation Program with Integrated Circuit Emphasis) models for IC design.

John Ellis, president and CEO, said gallium nitride devices are used in many high-power and high-frequency applications, including satellite communications, radar, cellular, broadband wireless systems, and automotive. “Although it’s currently a small market, gallium nitride devices are expected to show remarkable growth over the coming years.”

To reduce research and developments costs and increase simulation accuracy, the semiconductor industry relies on the CMC to share resources for funding standard SPICE models. Si2 is a research and development joint venture focused on IC design and tool operability standards. “Once the standard models are proven and accepted by CMC, they are incorporated into design tools widely used by the semiconductor industry. The equations at work in the standard model-setting process are developed, refined and maintained by leading universities and national laboratories. The CMC directs and funds the universities to standardize and improve the models,” Ellis explained.

Dr. Ana Villamor, technology and market analyst at Yole Développement (Yole), Lyon, France, said that “2015 and 2016 were exciting years for the gallium nitride power business. We project an explosion of this market with 79% CAGR between 2017 and 2022. Market value will reach US $460 million at the end of the period¹. It’s still a small market compared to the impressive US $30 billion silicon power semiconductor market,” Villamor said. “However, its expected growth in the short term is showing the enormous potential of the power gallium nitride technology based on its suitability for high performance and high frequency solutions.”

Peter Lee, manager at Micron Memory Japan and CMC chair, said that “Gallium nitride devices are playing an increasingly important part in the field of RF and power electronics. With these two advanced models established as the first, worldwide gallium nitride model standards, efficiencies in design will greatly increase by making it possible to take into account accurate device physical behavior in design, and enabling the use of the various simulation tools in the industry with consistent results.”

Click here to download standard models.

UCLA researchers develop a new class of two-dimensional materials

March 9, 2018

A research team led by UCLA scientists and engineers has developed a method to make new kinds of artificial “superlattices” — materials comprised of alternating layers of ultra-thin “two-dimensional” sheets, which are only one or a few atoms thick. Unlike current state-of-the art superlattices, in which alternating layers have similar atomic structures, and thus similar electronic properties, these alternating layers can have radically different structures, properties and functions, something not previously available.

This is an artist’s concept of two kinds of monolayer atomic crystal molecular superlattices. On the left, molybdenum disulfide with layers of ammonium molecules, on the right, black phosphorus with layers of ammonium molecules. Credit: UCLA Samueli Engineering

For example, while one layer of this new kind of superlattice can allow a fast flow of electrons through it, the other type of layer can act as an insulator. This design confines the electronic and optical properties to single active layers, and prevents them from interfering with other insulating layers.

Such superlattices can form the basis for improved and new classes of electronic and optoelectronic devices. Applications include superfast and ultra-efficient semiconductors for transistors in computers and smart devices, and advanced LEDs and lasers.

Compared with the conventional layer-by-layer assembly or growth approach currently used to create 2D superlattices, the new UCLA-led process to manufacture superlattices from 2D materials is much faster and more efficient. Most importantly, the new method easily yields superlattices with tens, hundreds or even thousands of alternating layers, which is not yet possible with other approaches.

This new class of superlattices alternates 2D atomic crystal sheets that are interspaced with molecules of varying shapes and sizes. In effect, this molecular layer becomes the second “sheet” because it is held in place by “van der Waals” forces, weak electrostatic forces to keep otherwise neutral molecules “attached” to each other. These new superlattices are called “monolayer atomic crystal molecular superlattices.”

The study, published in Nature, was led by Xiangfeng Duan, UCLA professor of chemistry and biochemistry, and Yu Huang, UCLA professor of materials science and engineering at the UCLA Samueli School of Engineering.

“Traditional semiconductor superlattices can usually only be made from materials with highly similar lattice symmetry, normally with rather similar electronic structures,” Huang said. “For the first time, we have created stable superlattice structures with radically different layers, yet nearly perfect atomic-molecular arrangements within each layer. This new class of superlattice structures has tailorable electronic properties for potential technological applications and further scientific studies.”

One current method to build a superlattice is to manually stack the ultrathin layers one on top of the other. But this is labor-intensive. In addition, since the flake-like sheets are fragile, it takes a long time to build because many sheets will break during the placement process. The other method is to grow one new layer on top of the other, using a process called “chemical vapor deposition.” But since that means different conditions, such as heat, pressure or chemical environments, are needed to grow each layer, the process could result in altering or breaking the layer underneath. This method is also labor-intensive with low yield rates.

The new method to create monolayer atomic crystal molecular superlattices uses a process called “electrochemical intercalation,” in which a negative voltage is applied. This injects negatively charged electrons into the 2D material. Then, this attracts positively charged ammonium molecules into the spaces between the atomic layers. Those ammonium molecules automatically assemble into new layers in the ordered crystal structure, creating a superlattice.

“Think of a two-dimensional material as a stack of playing cards,” Duan said. “Then imagine that we can cause a large pile of nearby plastic beads to insert themselves, in perfect order, sandwiching between each card. That’s the analogous idea, but with a crystal of 2D material and ammonium molecules.”

The researchers first demonstrated the new technique using black phosphorus as a base 2D atomic crystal material. Using the negative voltage, positively charged ammonium ions were attracted into the base material, and inserted themselves between the layered atomic phosphorous sheets.”

Following that success, the team inserted different types of ammonium molecules with various sizes and symmetries into a series of 2D materials to create a broad class of superlattices. They found that they could tailor the structures of the resulting monolayer atomic crystal molecular superlattices, which had a diverse range of desirable electronic and optical properties.”The resulting materials could be useful for making faster transistors that consume less power, or for creating efficient light-emitting devices,” Duan said.

Samsung enhances chip-scale LED package lineup with industryâs highest luminous efficacies

March 8, 2018

Samsung Electronics Co., Ltd. today announced that it has achieved the industry’s highest light efficacies for its fillet-enhanced chip-scale package (FEC) LED lineup – LM101B, LH181B and LH231B.

Initially chip-scale package (CSP) LEDs had not been widely used in mainstream LED lighting markets due to relatively lower efficacy levels compared to conventional LED packages. However, the newly upgraded, efficacy-leading FECs can be applied to most mainstream LED lighting environments, including ambient, downlight, spotlight, high bay, canopy and street lighting applications.

“Since introducing CSP technology to the industry in 2014, we have put extensive effort into advancing the performance levels and design flexibility of every one of our CSP LEDs,” said Yoonjoon Choi, Vice President of the LED Business Team at Samsung Electronics. “Samsung will continue to bolster its competitive edge in CSP technology, enabling the widest variety of luminaire designs with exceptional performance, reliability and cost benefits for lighting manufacturers worldwide.”

The enhanced FEC LEDs are based on Samsung’s most up-to-date CSP technology which builds TiO₂ (Titanium dioxide) walls around the side surfaces of the chip to direct light output upwards. The technology provides considerably higher light efficacy than conventional CSP LEDs while offering greater flexibility for luminaire designers. Moreover, dramatically reduced cross-talk between neighboring packages allows each package to be placed in close proximity to one another.

Building on these advancements, the revamped FEC LED packages achieve the industry’s highest light efficacy levels, to suit an even wider range of lighting applications. The mid-power CSP, LM101B, features an increased efficacy of 205 lm/W (65mA, CRI 80+, 5000K), which is the highest among 1W-class, mid-power CSP LEDs. The 3W-class LH181B provides the highest light efficacy in its class with 190lm/W (350mA, CRI 70+, 5000K), which represents a more than 10-percent enhancement over the previous version. The 5W-class LH231B package continues to offer 170lm/W (700mA, CRI 70+, 5000K), the industry’s highest efficacy for the 5W class.

With Samsung FEC’s small form factor and reduced cross-talk, the LM101B is particularly well suited for spotlighting applications where packages can be densely placed within a small light-emitting surface area. Samsung also made the LM101B much simpler to mount compared to other mid-power CSP LEDs, by modifying the electrode pad.

In addition, the LH181B operates at a maximum current of 1.4A (Amps), making it an ideal component for high-power LED luminaires requiring superior lumen density.

The Samsung FEC lineup, now in mass production, is available in a full range of color temperature (CCT) and color rendering index (CRI) options.

Kevin Martin joins Lumileds as SVP of Quality

March 5, 2018

Lumileds announced the appointment of Kevin Martin as Senior Vice President of Quality, effective March 1. Martin has over 30 years of experience in Quality, most recently serving as VP of Global Quality at Flextronics.

“We are thrilled to have Kevin join our organization to continue to strengthen how we deliver advanced lighting solutions at the highest quality level,” said Mark Adams, CEO of Lumileds.

During his time at Flextronics, Martin led the worldwide Quality team supporting global operations in North and South America, China, Europe and India. Prior to Flextronics, Kevin served as VP of Total Customer Satisfaction at Nissan Motor, where he was responsible for North and South America field quality and customer satisfaction for all Nissan and Infiniti vehicles. Prior to Nissan, Kevin was the General Manager of Customer Quality Engineering at Toyota. In addition to roles in Quality, Martin has held positions in production, manufacturing operations and engineering. Martin has a Bachelor’s Degree in Manufacturing Engineering from Western Carolina University.

“I am excited to join Lumileds and help further our commitment to quality across our growing customer base,” added Martin.

Executive viewpoints: 2018 outlook

March 5, 2018

Each year, Solid State Technology turns to industry leaders to hear viewpoints on the technological and economic outlook for the upcoming year. Read through these expert opinions on what to expect in 2018.

Enabling the AI Era with Materials Engineering

Prabu Raja, Senior Vice President, Semiconductor Products Group, Applied Materials

A broad set of emerging market trends such as IoT, Big Data, Industry 4.0, VR/AR/MR, and autonomous vehicles is accelerating the transformative era of Artificial Intelligence (AI). AI, when employed in the cloud and in the edge, will usher in the age of “Smart Everything” from automobiles, to planes, factories, buildings, and our homes, bringing fundamental changes to the way we live

Semiconductors and semiconductor processing technol- ogies will play a key enabling role in the AI revolution. The increasing need for greater computing perfor- mance to handle Deep Learning/Machine Learning workloads requires new processor architectures beyond traditional CPUs, such as GPUs, FPGAs and TPUs, along with new packaging solutions that employ high-density DRAM for higher memory bandwidth and reduced latency. Edge AI computing will require processors that balance the performance and power equation given their dependency on battery life. The exploding demand for data storage is driving adoption of 3D NAND SSDs in cloud servers with the roadmap for continued storage density increase every year.

In 2018, we will see the volume ramp of 10nm/7nm devices in Logic/Foundry to address the higher performance needs. Interconnect and patterning areas present a myriad of challenges best addressed by new materials and materials engineering technologies. In Inter- connect, cobalt is being used as a copper replacement metal in the lower level wiring layers to address the ever growing resistance problem. The introduction of Cobalt constitutes the biggest material change in the back-end-of-line in the past 15 years. In addition to its role as the conductor metal, cobalt serves two other critical functions – as a metal capping film for electro- migration control and as a seed layer for enhancing gapfill inside the narrow vias and trenches.

In patterning, spacer-based double patterning and quad patterning approaches are enabling the continued shrink of device features. These schemes require advanced precision deposition and etch technologies for reduced variability and greater pattern fidelity. Besides conventional Etch, new selective materials removal technologies are being increasingly adopted for their unique capabilities to deliver damage- and residue-free extreme selective processing. New e-beam inspection and metrology capabilities are also needed to analyze the fine pitch patterned structures. Looking ahead to the 5nm and 3nm nodes, placement or layer-to-layer vertical alignment of features will become a major industry challenge that can be primarily solved through materials engineering and self-aligned structures. EUV lithography is on the horizon for industry adoption in 2019 and beyond, and we expect 20 percent of layers to make the migration to EUV while the remaining 80 percent will use spacer multi- patterning approaches. EUV patterning also requires new materials in hardmasks/underlayer films and new etch solutions for line-edge-roughness problems.

Packaging is a key enabler for AI performance and is poised for strong growth in the coming years. Stacking DRAM chips together in a 3D TSV scheme helps bring High Bandwidth Memory (HBM) to market; these chips are further packaged with the GPU in a 2.5D interposer design to bring compute and memory together for a big increase in performance.

In 2018, we expect DRAM chipmakers to continue their device scaling to the 1Xnm node for volume production. We also see adoption of higher perfor- mance logic technologies on the horizon for the periphery transistors to enable advanced perfor- mance at lower power.

3D NAND manufacturers continue to pursue multiple approaches for vertical scaling, including more pairs, multi-tiers or new schemes such as CMOS under array for increased storage density. The industry migration from 64 pairs to 96 pairs is expected in 2018. Etch (high aspect ratio), dielectric films (for gate stacks and hardmasks) along with integrated etch and CVD solutions (for high aspect ratio processing) will be critical enabling technologies.

In summary, we see incredible inflections in new processor architectures, next-generation devices, and packaging schemes to enable the AI era. New materials and materials engineering solutions are at the very heart of it and will play a critical role across all device segments.

Pages: 1 2 3 4 5 6 7

Cree, Inc. announces long-term silicon carbide wafer supply agreement with Infineon

February 26, 2018

Cree, Inc. (Nasdaq:CREE) announces that it signed a strategic long-term agreement to produce and supply its Wolfspeed silicon carbide (SiC) wafers to Infineon Technologies AG (FSE:IFX) (OTCQX:IFNNY). The agreement governs Cree’s supply of advanced 150 mm SiC wafers to Infineon, which will broaden Infineon’s product offering to address today’s high-growth markets, such as photovoltaic inverters and electro mobility.

“Infineon is a longstanding, valuable commercial partner with an excellent reputation,” said Gregg Lowe, CEO of Cree. “This agreement validates the quality of Cree’s SiC wafer technology and our capacity expansion, as well as the accelerated adoption of SiC-based solutions that are critical to enabling faster, smaller, lighter and more powerful electronic systems.”

“We have known Cree for a long time as a strong and reliable partner with an excellent industry reputation,” said Reinhard Ploss, CEO of Infineon. “Based on the secured long-term supply of SiC wafers, we strengthen our strategic growth areas in automotive and industrial power control. As a consequence, we will create additional value for our customers.”

Wolfspeed, A Cree Company, is a manufacturer of silicon carbide wafers and epitaxial wafers. The supply agreement, valued at well over $100 million, enables SiC applications in broad markets such as photovoltaic, electro mobility, robotics, charging infrastructure, industrial power supplies, traction and variable speed drives.

Smart lighting market to grow at 21.50% CAGR to 2023

February 23, 2018

ReportsnReports.com adds Smart Lighting Market is forecast to reach $20.98 billion by 2023 from $7.93 billion in 2018 at a CAGR of 21.50% during (2018-2023) driven by the modernization and development of infrastructure to transform cities into smart cities, need for energy-efficient lighting systems, increasing adoption and decreasing cost of LEDs, increased demand for intelligent solutions for street lighting systems, and growing awareness about energy savings among consumers and governments worldwide.

Browse 68 Market Data Tables and 50 Figures spread through 169 Pages and in-depth TOC on “Smart Lighting Market by Offering (Hardware (Lights & Luminaires, Lighting Controls), Software, and Services), Communication Technology (Wired and Wireless), Installation Type, Application Type, and Geography – Global Forecast to 2023” http://www.reportsnreports.com/reports/226128-global-smart-lighting-market-2013-2018-by-component-sensors-controllers-chipsets-others-lighting-type-led-fl-cfl-hid-connectivity-wired-wireless-application-commercial-industrial-public-government-residential-geography.html .

The report profiles the top players in the smart lighting market along with providing their respective market ranking. Prominent players in the market include Philips Lighting (Netherlands), Hafele Group (Germany), Acuity Brands (US), OSRAM (Germany), Cree (US), Hubbell Lighting (US), Zumtobel Group (Austria), Honeywell (US), Legrand (France), Eaton (Ireland), Lutron Electronics (US), and General Electric (US).

The smart lighting market in APAC expected to grow at the highest CAGR between 2018 and 2023. The growth of the market in APAC is attributed to the rapid infrastructure building activities being undertaken in APAC, mainly China, India, and Japan, where smart lighting paves the way for the modernization of infrastructure. Further, the increasing investments from the government sector also enhance the infrastructure facility in the country. Moreover, rising government expenditure on public infrastructure and increasing adoption of energy-efficient lighting systems are the major driving factors for the growth of the smart lighting market in APAC.

Inquire for DISCOUNT on “Smart Lighting Market by Offering (Hardware (Lights & Luminaires, Lighting Controls), Software, and Services), Communication Technology (Wired and Wireless), Installation Type, Application Type, and Geography – Global Forecast to 2023″ research report at http://www.reportsnreports.com/contacts/discount.aspx?name=226128 .

The smart lighting market for wireless connectivity will grow at higher CAGR between 2018 and 2023. However, factors such as perception of higher costs of installation and limited awareness about payback periods, and security and privacy issues in smart lighting systems are restraining the growth of the smart lighting market. Exhaustive information about new products, untapped geographic regions, and recent developments in the overall smart lighting market

Wired technology is expected to hold a larger share of the Smart Lighting Market by 2023. Currently, the smart lightings based on wired technology are widely adopted for different types of structures as this technology offer reliable connectivity, with no limitation on long-distance data transfer. Wired communication technologies for smart lightings include Digital Addressable Lighting Interface (DALI), Power-Line Communication (PLC), and Power over Ethernet (PoE), and various wired hybrid protocols which include various company-specific proprietary protocols. Wired communication protocols are preferred in the applications where performance and reliability are crucial.

The smart lighting market for services will grow at highest CAGR between 2018 and 2023. From an insight perspective, this research report has focused on various levels of analysis – market ranking of top players; value chain analysis; company profiles that provide the basic views on the competitive landscape; emerging and high-growth segments of the market; high-growth regions; and market dynamics such as drivers, restraints, opportunities, and challenges.

Order a copy of “Smart Lighting Market by Offering (Hardware (Lights & Luminaires, Lighting Controls), Software, and Services), Communication Technology (Wired and Wireless), Installation Type, Application Type, and Geography – Global Forecast to 2023” research report at http://www.reportsnreports.com/purchase.aspx?name=226128 .

The smart lighting market based on offering covers hardware, software, and services. The smart lighting market based on communication technology has been segmented into wired and wireless technologies. The smart lighting market based on application type covers indoor and outdoor applications. The smart lighting market based on installation type includes new installations and retrofit installations. The geographic analysis has been conducted with regard to North America, Europe, APAC, and RoW.

In the process of determining and verifying the smart lighting market size for several segments obtained through secondary research, extensive primary interviews have been conducted with the key industry people. The break-up of the profile of primary participants has been given below.

By Company Type: Tier 1 – 20%, Tier 2 – 45%, and Tier 3 – 35%
By Designation: C-Level Executives – 35%, Directors – 25%, Others – 40%
By Region: Americas – 45%, Europe – 25%, APAC – 20%, and RoW – 10%

Another research titled Ambient Lighting Market Global Forecast to 2023 says, the ambient lighting market is expected to grow from $46.48 billion in 2016 to $96.09 billion by 2023, at a CAGR of 10.71% between 2017 and 2023. Hardware to hold a major share of the ambient lighting market in 2017. Ambient lighting market in APAC to grow at a high rate between 2017 and 2023. Companies such as Philips Lighting Holding B.V. (Netherlands), Cree Inc. (US), General Electric (US), Acuity Brands Inc. (US), OSRAM Licht AG (Germany) have been profiled in this 148 pages research report available at http://www.reportsnreports.com/purchase.aspx?name=1150242 .

Explore more reports on Semiconductor and Electronics Market at http://www.reportsnreports.com/market-research/semiconductor-and-electronics/ .

Seoul Semiconductor files thirdÂ patent infringement litigation against Mouser for sale of Everlight products in Italy

February 9, 2018

On February 2, 2018, Seoul Semiconductor Co., Ltd (“Seoul”) filed a patent infringement lawsuit in Italy in the Court of Milan against Mouser Electronics Inc. (“Mouser”), a global electronic components distributor, as well as its Italian subsidiary – for the sale of certain Everlight LED products.

According to the complaint, Seoul has asserted that Mouser is liable for selling such LED products that infringe Seoul’s patent rights. Based on the alleged infringement, Seoul has sought a permanent injunction, damages, withdrawal from the market, and destruction of such products.

Prior to this litigation, Seoul already filed two patent infringement lawsuits against Mouser in Germany in the District Court of Düsseldorf in 2017, accusing high-power and mid-power LED products manufactured by Everlight of infringement.

Despite such lawsuits, however, Mouser has continued to sell products accused of infringement in other countries. For that reason, Seoul launched its third patent infringement lawsuit against Mouser for the sale of Everlight LED products in Italy. Seoul is committed to pursuing enforcement against those that infringe its patent rights.

Seoul has invested 10% of its revenue, more than 100 million dollars per year, in research and development to develop innovative technology and strengthen its patent portfolio since its inception. Seoul has also made a significant commitment to protecting its intellectual property rights against suspected infringement since it successfully obtained a preliminary injunction order against Taiwan LED maker AOT in 2005. For example, in 2014, Seoul filed patent infringement lawsuits against two North American TV makers in 2014, resulting in a judgment based upon one maker’s admissions of infringement, and royalty-bearing licenses by both makers. In 2016, Seoul secured a willful infringement judgment for its LED lens patent against Japanese LED lens maker Enplas from the U.S. district court. In 2017, Seoul resolved a patent infringement litigation that it had against Kmart, and as part of the settlement, Kmart agreed to stop selling certain filament LED bulbs. Seoul also recently began an enforcement campaign for protecting its Acrich technology, and has filed a patent litigation against a U.S. lighting maker for infringement of 12 Acrich patents. Throughout this period, Seoul has continued to put other companies on notice that it suspects of patent infringement.

Seoul plans to continue and expand its patent enforcement against market participants involving suspected-infringement across the world – until they cease suspected-infringement and Seoul secures court remedies to address harm caused by the suspected-infringement.

An official of Seoul’s IP team explained, “In order to fundamentally block distribution of suspected-infringing products, we will have to expand our enforcement efforts to include direct manufacturers, secondary product manufacturers who have purchased or used suspected-infringing components, as well as their distributors.”

He added, “For young entrepreneurs and small businesses that try to realize their dreams with a creative idea, we believe that intellectual property should be respected.”