Category Archives: LED Packaging and Testing

October 15, 2012 – Researchers at the National Institute of Advanced Industrial Science and Technology (AIST) and the Chemical Materials Evaluation and Research Base (CEREBA) say they have evaluated molecules within a sealed organic light-emitting diode (OLED) in operation using laser spectroscopy, measuring both selectively and nondestructively

Their work, published in August in Applied Physics Letters, involves a method improving upon a laser spectroscopic technique to measure molecular vibrations at the interface of an organic layer inside the OLED device — specifically, evaluating a signal enhancement phenomenon that occurs at the interface with a concentrated electric field.

The problem with evaluating OLED devices, as with many other types of sensitive electronics components: the method itself often involves destroying the device or impacting its performance (e.g. introducing contaminants). Measuring OLED device degradation, particularly in devices with multiple and overlapping internal layers, is particularly difficult — yet much more needs to be known about the inner workings of OLED layer degradation to learn how to extend the device’s lifetimes for application in displays or lighting.

Key to AIST’s work is using "sum frequency generation" (SFG) spectroscopy, which employs wavelength-tunable lasers to collect information on specific interfaces of organic substances in complex organic devices. Specifically it has pursued two-color SFG spectroscopy to measure vibrational changes at the surface and interfaces in a solid; one tunable visible laser would still collect signals from multiple organic lasers, but implementing two lasers creates a "double resonance" that can be used to enhance and isolate signals from a targeted organic layer. They also tweaked the SFG spectrometer to maintain measurement resolution even at 1/100 laser power of conventional SFG spectrometers.

"By investigating in detail the ‘fingerprints’ of organic layers in an OLED device, the alteration and degradation of molecules in the operating device as well as the change in the electric field inside the device can be elucidated," AIST explains. Their goal is to determine, at the molecular level, the driving mechanisms of OLED devices and their degradation — and also seek ways to apply the work to other organic electronics fields, such as solar cells and transistors.

CERERA was established at AIST specifically to establish design and manufacturing technologies for OLED materials and devices, including evaluation and analysis techniques.

Top: Schematic drawing of the structure of the multilayered OLED device and the directions of the incident and emitted lights used for SFG spectroscopy. Bottom: Spectral changes in an operating multilayered OLED device, with +8 V application (light emission), no voltage application, and –5 V application. (Source: AIST)

October 8, 2012 – Solvay Specialty Polymers USA LLC has extended its line of high-performance polyester compounds with a new version targeting light-emitting diode (LED) TVs with higher heat and light stability.

Seeking to reduce product costs, TV manufacturers are finding ways to reduce the number of LEDs by sending more amps through the devices to hike brightness. (Another cost-lowering strategy: go the other way and give up some brightness in LED backlit models.) This raises the junction temperatures, though, and some materials can’t handle the higher heat and light output, e.g. discoloring more quickly in applications such as reflector cups.

Solvay’s new "Lavanta" 5115 WH 011 high-performance polyester line of liquid-crystal polymers, is a 15% glass fiber-reinforced injection molding compound developed specifically for LED electronic packaging applications that utilize surface mount technology. It has high reflectivity (>95%) with excellent whiteness retention even after thermal and light aging, translating to better reliability for LEDs that operate at high junction temperatures — e.g. filling very thin-walled sections required for low-profile, side-view LEDs. It also offers dimensional stability due to its low moisture absorption and exceptional weld line strength, according to the company.

The company plans to expand the Lavanta line with an enhanced version possessing even greater heat and light stability for longer product life and reliability. In addition to LED TV applications, the material is targeted for general lighting for indoor and outdoor applications.

ON Semiconductor (Nasdaq: ONNN) has joined imec to collaborate on the development of next-generation GaN-on-Si power devices. ON Semiconductor is presently building a GaN processing line in its Oudenaarde facility in Belgium Oudenaarde, Belgium. The Oudenaarde facility, which was acquired from AMI Semiconductors in 2008, has over 40,000 square feet of clean room space, is located on a 10 acre campus, and presently produces 0.35 µm to 2 µm low, medium, and high voltage analog CMOS and BCD technologies on 6 in. wafers (150mm). Denis Marcon, product marketing manager for the power electronics and LED programs at imec said the goal was produce GaN-on-Si at the facility.

GaN is characterized by superior electron mobility, higher breakdown voltage and good thermal conductivity properties, making it useful for power and radio frequency (RF) devices which need high-switching efficiencies. Today, GaN-based power devices are too expensive for large volume manufacturing, as they are fabricated on small diameter wafers using non-standard production processes, according to imec.

Caption:  Imec’s power devices on 200mm CMOS-compatible GaN-on-Si

Imec’s research program is focused on developing GaN-on-Si technology on 200 mm wafers, as well as reducing the cost and improving the performance of GaN devices. Last year, imec’s research program successfully produced 200 mm GaN-on-Si wafers, bringing processing within reach for standard high-productivity 200 mm fabs. Moreover, imec developed a fabrication process compatible with standard CMOS processes and tools, the second prerequisite for cost-effective processing.

“As a top 20 global semiconductor supplier with a portfolio focused on energy efficient devices, ON Semiconductor has been researching GaN silicon technologies for several years,” said Hans Stork, senior vice president and Chief Technology Officer (CTO) at ON Semiconductor. “Partnering with imec will help strengthen our current market position and potentially assist us in adding a competitive leading-edge technology to our customer offerings. We look forward to collaborating with a broad consortium of like-minded companies on forward-looking research in this field.”

According to Rudi Cartuyvels, vice president of smart systems and energy technology at imec: “Extraordinary developments continue to emerge from our GaN-on-Si Affiliation Program, creating further inroads to drive down production costs The newest addition, of ON Semiconductor as a strategic program partner, further advances our collective expertise. Leveraging joint efforts will help us overcome the next hurdle toward economical volume manufacturing, ultimately bringing GaN power devices to the market.”

August 13, 2012 — OSRAM AG, light-emitting diode (LED) manufacturer, laid the foundation for its Wuxi, China, plant, in a ceremony attended by high-ranking representatives of the Jiangsu province.

The groundbreaking begins construction; the back-end LED packaging facility is scheduled to be completed by the end of 2013. The Wuxi plant will be 100,000sq.m. with a “low three-digit million euro” investment from OSRAM over 5 years. It is also securing comprehensive support from its Chinese partners. In the final completion stage, the new assembly plant will be able to accommodate up to 1,600 employees.

OSRAM will continue to produce its LED chips at its Regensburg (Germany) and Penang (Malaysia) front-end plants. The Wuxi LED facility was announced earlier this year. It will join Penang in performing back-end packaging.

“Growing at a remarkable rate, Jiangsu Province’s LED industry is at the forefront in China. We will fully support Osram’s development in Wuxi with the highest quality service, and we also hope Osram can expand its investment in Wuxi to have the plant up and running as soon as possible,” said Xueyong Li, Governor of Jiangsu Province.

OSRAM said it based the packaging facility in Wuxi because China is a huge potential LED market. “With highly skilled personnel, a good infrastructure and experienced partners, Wuxi provides the best conditions for our new LED assembly,” said Aldo Kamper, CEO of the Osram Opto Semiconductors business unit.

In fiscal year 2011, Osram generated about one fifth of its revenue in the Asia-Pacific region, where it employs over 16,000 employees, roughly half in China.

OSRAM is part of the Industry Sector of Siemens and one of the two leading lighting manufacturers in the world. Learn more at www.osram.com.

Visit the LED Manufacturing Channel on Solid State Technology and subscribe to the LED Manufacturing News monthly e-newsletter!

August 8, 2012 — The light-emitting diode (LED) industry is entering its third growth cycle, general lighting, according to Yole Développement and EPIC’s report, “Status of the LED Industry.” However, the cost of a packaged LED still needs to be reduced by a factor x10 to enable massive adoption. New business models are mandatory to capture added value of LED lighting.

Growth of the LED industry has come initially from the small display application and has been driven forward by LCD applications. LED TV was expected to be the LED industry driver for 2011 but the reality was quite different. Lower adoption of LEDs in the TV market and the entry of several new players, mostly from Asia, created a climate of overcapacity, price pressure and strong competition. As a consequence, packaged LED volume was about 30% lower than expected and revenue shrank due to strong ASP pressure.

Figure. Packaged LED revenue, by application. SOURCE: Yole, Status of the LED Industry, August 2012.

Yole and EPIC estimate packaged LED revenue will reach a market size of $11.4 billion in 2012 and will peak to $17.1 billion by 2018. Growth will be driven both by the display (LCD TV) and general lighting applications until massive adoption of LEDs in lighting.

From 2014, the third growth cycle of the LED business will accelerate with the general lighting application representing more than 50% of the overall packaged LED business. In terms of volume, LED die surface will increase from 22.5 billion mm² (2012) to 80 billion mm² (2018). This will prompt substrate volume growth from 8 million x 2” wafer equivalent (TIE) in 2011 to 39.5 million TIE in 2018, with a CAGR of 26%.

The adoption of LEDs for general lighting applications strongly depends on technology and manufacturing improvements, improving performance and cost to hit an LED adoption trigger point. Industry consensus points out a cost reduction per lumen of packaged LEDs by a factor x10. This can be achieved through a combination of manufacturing efficiency and performance improvement, such as access to larger size wafers, improvements in LED epitaxy cost of ownership through yield and throughput, and improved packaging technologies (phosphors, optics, etc).

Additionally, improved package and luminaire design will also enable significant cost reduction.

Ultimately, the long life of solid state lighting (SSL) technology will totally change the lighting market by dramatically increasing the length of the replacement cycles. The replacement market (aftermarket) will be strongly impacted, pushing traditional players of the lighting industry to define new strategies to capture profit (intelligent lighting, lighting solutions, etc).

“In addition, as value is moving to the top of the value chain (module and luminaire levels), several players that were originally involved only at LED device levels will develop strategies of vertical integration in order to capture more value,” added Tom Pearsall, general secretary, EPIC. But accessing distribution channels represents a big challenge for those players who develop new approaches to sell their lighting products (e-commerce, new distributors). The rise of LED lighting will therefore depend on the right merger of the emerging LED industry with the traditional lighting industry.

The researchers also found that China’s GaN MOCVD reactor capacity has increased by a factor of 20 in the last 3 years. The capacity for GaN LED epitaxy has increased dramatically in 2010 and 2011. This increase took place across all regions but was most dramatic in China (increased by a factor x20 of the reactor capacity between Q4 2009 and Q1 2012).

“Most emerging Chinese LED epiwafer and die manufacturers are still lagging significantly behind their competitors in term of technology maturity and LED performance,” says Dr Eric Virey, senior analyst, LED at Yole Développement.

The bulk of those new companies are not yet capable of manufacturing LEDs to address the large display and general lighting applications that are currently driving the market. In the mid-term, consolidation of the Chinese LED industry will occur (scenario in the central government’s new five-year plan), and China should became a major actor in the LED industry.

The report presents all applications of LEDs and associated market metrics, LED cost reduction opportunities, entire LED value chain, a deep analysis of the general lighting application and an analysis of geographical trends. Authors include Pars Mukish, market and technology analyst and Dr Eric Virey, senior analyst at Yole Développement, amd Tom Pearsall, general secretary, EPIC.

Companies cited in the report: A-Bright, Advanced Photonics, American Bright, American Opto Plus, AOT, ApexScience & Engineering, APT Eelctronics, Aqualite Co, Arima, AUO, Avago, Bridgelux, Bright LED, Brightview electronic, CDT, Century Epitech, Chi Mei Lighting Technology, Citizen Electronics, CREE, CS Bright, Daina, Dominant Semiconductors, Edison, Elec-tech, Enfis, Epiled, Epilight Technology, Epistar, EpiValley, Everlight, Excellence Opto, Fangda group, Formosa epitaxy (Forepi), Galaxia Photonic, GE, Genesis Photonics, Golden Valley Optoelectronics, Hangzhou Silan Azure, Harvatech, HC SemiTek, Heesung, High Power Opto, Hi-Light, Hueyjann Huga, Huiyuan Optoelectronic, Hunan HuaLei Optoelectronic, Hunin Electronic, Idemitsu Kosan, Illumitex, Invenlux, Itswell, KingBright, Kodenshi, Konica Minolta, Korea Photonics Technology Institute (KOPTI), Kwality group, Lattice Power Corporation, LedEngin, LEDTech, Lemnis, Lextar/Lighthouse, LG Display, LG Innotek, Lighting Science, Ligitek, Lite-On, LongDeXin (LDX), Lumei Optoelectronics, Lumenmax, Lumex, Lumileds, LumiMicro, Lumination, Luminus, Lumitek, Lustrous Technology, Luxpia, LuxtalTek, MokSan Electronics, Moser Baer, Nanosys, Nanya, Nationstar, Neo-Neon, Nichia, NiNEX, Oasis, Optek Technology, Opto Tech, Osram, ParaLight, Philips, Power Opto, Powerlightec, Rainbow Optoelectronics, Rohm, Samsung SEMCO, Sanan Optoelectronics, Sanken Electric, Seiwa Electric, SemiLEDs, Seoul semi / Optodevice, Shandong Huaguang Optoelectronics, Sharp, Shenzen Mason Technology, Shenzen Mimgxue, Shenzen Yiliu Electronic, Shenzhen Refond, Showa Denko, Stanley Electric, Sunpu Opto, Supernova, Sylvania, Tekcore, TESS, Tonghui Electronic Corporation, Toshiba, Toyoda Gosei, TSMC, Tyntek, UDC, Unity Opto, Visera Tech, Vishay, VPEC, Walsin Lihwa, Wellipower, Wenrun Optoelectronic, Wooree LED, Xiamen Changelight, Xiamen Hualian, Ya Hsin, Yangzhou Huaxia Integrated Photoelectric (DarewinChip), Yangzhou Zhongke Semiconductor, YoungTeck, Yuti Lighting Shanghai, Zoomview (Xi An Zoomlight), and more.

Yole Développement is a group of companies providing market research, technology analysis, strategy consulting, media, and finance services. For more information, please visit www.yole.fr.

The European Photonics Industry Consortium, EPIC, has three important activities: dialogue with the European Commission, ownership of the European roadmap for photonic technologies, and developing the critical human resource of trained scientists and engineers in the European economic area. EPIC is composed of 80 member organizations and over 400 associate members. For more information: www.epic-assoc.com.

Visit the LED Manufacturing Channel on Solid State Technology and subscribe to the LED Manufacturing News monthly e-newsletter!

July 31, 2012 — NanoMarkets issued a new white paper on LED phosphors, "LED Lighting Driving Demand for New Phosphors," that covers the shifting use of phosphors, which modulate the light emitted by LEDs, from LCD backlighting to solid-state lighting.

Today, the majority of phosphors used in light-emitting diodes (LEDs) go into LCD backlighting units. Blue LEDs are coated with yellow or other down-conversion phosphors to make “white” LEDs. In the next several years, saturation will slow growth for LED-based backlighting, phosphor prices will fall, LED-per-unit values will be reduced, display demand will soften, and backlight-free display technologies like active matrix organic light-emitting diodes (AMOLEDs) will take over market share in smartphones/tablets and TVs, NanoMarkets reports.

Figure. Phosphor growth for LED applications, 2012-2019. SOURCE: NanoMarkets.

The situation is very different in the solid-state lighting sector. In fact, a major shift is occurring in the lighting industry toward more-efficient, longer-lifetime, LED-based lighting, which will more than make up for the slowing display market. Governments are encouraging use of higher-efficiency lighting products with new regulations and subsidies. Since LEDs are potentially more efficient than any other alternative lighting source, LED lighting will preferentially enjoy the benefits of these mandates.

Going forward, growth in sales of LED phosphors will be driven by sales to the LED lighting industry. Backlighting LEDs are growing at <5% annually; LED lighting is growing at about 30% compound annual growth rate (CAGR), by LED count.

Better phosphors are needed to bring LED lighting into wider use. Phosphors are one of the keys to achieving the ambitious LED lighting market penetration goals and differentiating the quality of LED lighting products versus other technologies, NanoMarkets reports. Phosphors can improve the quality of LED light to meet what consumers want, an important factor when LEDs are still many times more expensive than incandescent bulbs.

NanoMarkets tracks and analyzes emerging market opportunities in energy, electronics and other markets created by developments in advanced materials. Access the white paper at http://www.nanomarkets.net/Downloads/LEDPhosphors.pdf.

Visit the LED Manufacturing Channel on Solid State Technology and subscribe to the LED Manufacturing News monthly e-newsletter!

July 31, 2012 — Light emitting diodes (LEDs) comprise an LED chip, package frame, phosphor for light modulation, and encapsulants, which protect the LED from external environment moisture and other elements. The functional properties of these LED packaging elements are being increased as LEDs are more widely adopted.

LED encapsulants are closely related to the LED’s lifespan and light transmittance. With high-power and high-brightness LEDs emerging, the encapsulant’s role is becoming more important, says Displaybank.

Epoxy resin was the common encapsulant for lamp-type LEDs in the 1990s. As LEDs were adopted for mobile phones and LCD TVs, silicone encapsulants began to be used to meet the various functional property needs such as refractive index, heat resistance, light resistance, and so forth. Today, by revenue, more than 97% of the LED encapsulant market uses silicone encapsulant, a trend expected to continue in the future, Displaybank reports.

Figure 1. LED encapsulant market forecast, based on quantity.

LED use in LCD TVs began to grow significantly in 2009, which kickstarted a growth spurt in LED package-use encapsulants in 2010. As the LED industry declined in 2011, demand also declined for encapsulants. The encapsulant market is forecasted to continue to grow in the future, as LED lighting grows globally.

Figure 2. Regional LED encapsulant market proportion forecast, based on revenue.

Regionally, China will become the biggest market globally, accounting for more than 30% of the global LED encapsulant market in 2015, thanks to government support, continued investments from related companies, and the increased demand for LED lighting.

Based on such trend, Displaybank analyzed the overall industry overview of encapsulant and LED package-use encapsulant market, especially, focusing on the market by type and by region in the silicone encapsulant field, of the LED package-use encapsulant market. This report intends to assist LED encapsulant and LED package companies, the companies with interests in LED-related parts materials and new LED business, and the companies that belong to all LED related fields.

Learn more about Displaybank’s report, “LED Package-use Encapsulant Market Forecast,” at http://www.displaybank.com/_eng/research/report_view.html?id=873&cate=8

Visit the LED Manufacturing Channel on Solid State Technology and subscribe to the LED Manufacturing News monthly e-newsletter!

July 19, 2012 — Osram Opto Semiconductors developed a concept for uniform solder pads based on the Oslon light-emitting diode (LED) component family. This enables second sourcing by Osram’s LED customers without an additional soldering board, potentially reduces the costs of storage and process modification.

LED components from different manufacturers can differ in the dimensions and shape of their solder pads. For second sourcing, two different soldering boards are made, to suit the LEDs from two different manufacturers.

The combined board design comes from the design of one of the two LED components. The individual solder surfaces are divided into segments, electrically connected and electrically disconnected. By selecting appropriate spacings between the solder surfaces, makers can attach the second LED product — rotated 90° — to the uniform board design. The anode and cathode of the two LED components are connected to the same electrically contacted segments. Because solder surfaces are divided, the two LED types automatically align themselves to the edges of the solder surfaces during the reflow solder process.

Osram Opto Semiconductors has developed a concept for ceramic LED components, such as the Oslon family, that makes the board solder pad design so adaptable that it can be used for LED components from at least two different manufacturers. The concept can also be used for metal core, FR4, and ceramic boards.

For both LED components, the luminous area is in the same lateral position on the board. If the LEDs have the same emission behavior, the same secondary lenses and reflectors can be used. This means that neither the LED components nor the end application are changed in terms of their characteristics.

OSRAM AG, a wholly owned subsidiary of Siemens, is a leading lighting manufacturer. Its subsidiary, OSRAM Opto Semiconductors GmbH, offers semiconductor-based technology for lighting, sensor and visualization applications. For more information, go to www.osram-os.com.

Visit the LED Manufacturing Channel on Solid State Technology and subscribe to the LED Manufacturing News monthly e-newsletter!

July 17, 2012 – BUSINESS WIRE — Avnet Electronics Marketing Americas, part of Avnet Inc. (NYSE:AVT) opened a lighting lab in Chandler, AZ, to measure light-emitting diode (LED) properties for various applications.

Avnet LightLab’s 900sq.ft. facility is equipped with the latest LED metrology suite from Instrument Systems. Tools measure the key optical, electrical and thermal characteristics of high power LEDs, modules and luminaires. Typical tests measure total flux, illuminance, thermal intensity and distribution, luminous efficiency, spectral power disruption (SPD), and the LED’s color rendering index (CRI). All photometric, radiometric and colormetric testing is conducted in accordance with specifications from the Commission Internationale de l’Eclairage (CIE), the international commission on light.

Avnet opened the lab to support the “explosive” growth in demand for LEDs, said George Kelly, technical specialist and LightLab manager, Avnet Electronics Marketing Americas. Avnet also has a national team of LED-focused illumination engineers (the company calls them “illumineers”). The illumineers and test labs (in Chandler and in Munich, Germany) are meant to enable lighting designers to compare various design options and optimize products.

Avnet’s LightLab supports a broad range of LED applications including general illumination, medical, industrial, transportation, military, signage, and security applications. Watch a video about the new lab here.

Avnet Electronics Marketing is an operating group of Avnet, Inc. that serves electronic original equipment manufacturers (OEMs) and electronic manufacturing services (EMS) providers, distributing electronic components from leading manufacturers and providing associated design-chain and supply-chain services. The group’s website is located at www.em.avnet.com. Avnet Inc. (NYSE:AVT) is one of the largest distributors of electronic components, computer products and embedded technology.

Visit the LED Manufacturing Channel on Solid State Technology and subscribe to the LED Manufacturing News monthly e-newsletter!