Category Archives: LED Packaging and Testing

February 21, 2012 — Electronics System Integration Technology Conference (ESTC) 2012 seeks original papers describing research in all areas of electronic packaging, including LED packaging, flexible electronics, assembly and interconnect technologies, and more. ESTC takes place September 17-20 in Amsterdam, the Netherlands. Organized by IEEE-CPMT since 2006, in association with IMAPS-Europe, the ESTC conference series focuses on interconnect and packaging technologies for electronic system integration. Submit your abstract by April 1.
 
Paper abstracts may be submitted to the following tracks and application areas:

  • Assembly and Manufacturing Technology
  • Materials for Interconnect and Packaging
  • Reliability
  • Embedded Die and Wafer Level Packaging
  • 3D Integration Technology
  • Microsystem Packaging
  • Flexible and Stretchable electronics
  • Advanced and Emerging Technologies
  • Power Electronic Packaging
  • Optoelectronic Packaging
  • Thermal and Mechanical Modeling
  • Electrical Design & Modeling
  • Consumer Electronics
  • Automotive and Industrial Electronics
  • Avionics and Space Electronics
  • Medical Electronics
  • Solid State Lighting
  • Telecom System Electronics
  • Wireless Electronics
  • RF-ID and Smartcards
  • Display and Imager Electronics
  • Energy System Electronics

Submit a 300-500 word abstract that describes the scope, content and key points of your proposed paper. Abstracts must include results and graphics. Please visit www.estc2012.eu to upload your abstract. Submissions for poster presentations are also welcome. Submission deadline for abstracts is April 1, 2012.

ESTC will select the best paper and best poster presentations. For each, the author(s) will receive a personalized ESTC award and a monetary prize from the IEEE-CPMT Region 8 Director.

The official language of all presentations is English. All oral and poster presentation authors are invited to prepare a paper for the conference proceeding which will also be included in the IEEE XPLORE database after the conference.
 
Your submission must include the mailing address, business telephone number and email address of the presenting author and affiliations of all authors. All submitted abstracts will be reviewed by the committee to ensure a high-quality conference. At the discretion of the program committee, paper abstracts submitted may be considered for poster presentation. The work should be original and not previously published, and avoid inclusion of commercial content. Additional instructions about formatting the paper will be published on www.estc2012.eu.

Selected presenters will be notified on June 1, 2012. Final paper manuscript will then be due August 15, 2012.

Related story: Advanced packaging at the 2010 ESTC

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IRPS set for April in Anaheim


February 21, 2012

The IEEE International Reliability Physics Symposium (IRPS) is set for April 15, 2012 – April 19, 2012, in Anaheim, CA. The IRPS is celebrating 50 years of ground-breaking semiconductor physics of failure research. Covering advanced materials, 3D integration, product reliability, transistors and circuits, silicon/packaging interactions, MEMS, GaN, and photovoltaics, the technical program promises to bring attendees the latest in semiconductor reliability concerns. For more information and to register online, browse to http://www.irps.org.

February 20, 2012 — Verticle, Inc. began mass production of its hexagonal-shaped light-emitting diode (LED) chip Honeycomb, developed with a proprietary copper substrate and chemical chip separation technology.

Photo. Verticle Inc.’s hexagonal-shaped LED chip Honeycomb.

The vertically structured LED chip boasts higher light extraction, better optical efficiency, and more uniform beam profile than conventional square or rectangular LED chips based on sapphire or silicon substrates. The hexagonal architecture enables better current spreading control, for higher-current operation. Honeycomb chips can use same package flat form as square or rectangular chips.

Chemical chip separation is faster and easier than conventional laser scribing or dicing, according to Verticle, making the hexagonally shaped LED manufacturable beyond R&D quantities.

Photo. SEM image of the chemically separated hexagonal LED Honeycomb.

Main optical power range is 370-420mW at 350mA with a forward voltage range of 3.1-3.4V.

The mass production level Honeycomb chip will be introduced and available for sale at Guangzhou LED China 2012, February 20-23.

Specification and information are available at http://www.verticleinc.com.

Visit the new LEDs Manufacturing Channel on ElectroIQ.com!

February 20, 2012 — Strategies in Light Europe 2012, September 18-20 in Munich, Germany, is accepting presentation abstracts through February 29. Light-emitting diode (LED) industry professionals can submit papers on LED technology, LED manufacturing and the supply chain, markets, LED applications, and related topics.

Read about Strategies in Light 2012, Santa Clara, CA
 
Papers submitted should describe or demonstrate efforts to improve quality and performance of LED lighting, activities that help accelerate the market adoption of LED lighting, and/or results from real-world LED lighting applications and installations.

Strategies in Light Europe is in its 3rd year of providing a comprehensive conference and exhibition for the rapidly-growing LED lighting industry. The event offers a platform for the best networking opportunities and a forum for the sharing of ideas and experiences in the latest technologies.
Papers will be selected by the SIL Europe Advisory Board on the basis of technical content, audience

Papers can cover these suggested topics, or related fields of interest:
Applications

  • Market growth and outlook, penetration of LEDs into key applications, barriers to further market penetration
  • Case studies of specific installations: cost and performance analysis, user feedback, lessons learned 
  • Requirements and perspectives from lighting designers, specifiers, architects and other end-users

Supply chain & manufacturing

  • Supply and demand, capacity constraints, availability of materials and equipment
  • Advanced chip design and lower-cost manufacturing; epitaxial growth and processing
  • Luminaire design: role of thermal management, advanced packaging & optical concepts
  • Advances in LED cost, performance, lifetime and reliability 

Market transformation

  • Regional- and country-specific activities to promote LED lighting
  • European activities to develop high-quality LED lighting products
  • Quality control and labelling programs
  • Customer awareness and acceptance, incentives and subsidies
  • Funding from governments and investment community
  • Standards development and implementation 
  • EU Directives: development and impact on LED market

Technology

  • Color quality metrics, optical safety, test & measurement 
  • Development of OLEDs and other competing lighting technologies
  • Drivers, and dimming & control networks 
  • Replaceable modules and light engines

Submit your abstract today at http://www.sileurope.com/conference.html

In submitting an abstract you are indicating your availability and willingness to attend and present a paper at Strategies in Light Europe 2011, if selected, and to comply with all deadlines. The speaker and author details provided when submitting an abstract will be used for pre-event marketing purposes. Papers with an overt marketing/sales/commercial subject will be rejected. Please do not submit presentations that are scheduled to be presented at other LED-related conferences.

For information/assistance on submitting an abstract for the Call for Papers, contact: Emily Pryor, Conference manager, [email protected]; Tel: +44 (0) 1992 656 614.

Visit the new LEDs Manufacturing Channel on ElectroIQ.com!

February 17, 2012 — Shin-Etsu Chemical Co. Ltd.’s new KER-7000 Series silicone encapsulating materials offer a low (1.38) refractive index (RI) for high-brightness light-emitting diode (HB-LED) packaging with lower gas permeability.

Shin-Etsu Chemical’s silicone encapsulating materials include a methyl-group material for improved heat resistance and phenyl-group material that is characterized by low gas permeability.

The encapsulant targets low gas permeability, good photo-thermal stability in withstanding high temperatures, and optical transparency over the LED lifetime. The new materialset reduces gas permeability by 1/10, Shin-Etsu reports, to prevent oxidation that leads to light-intensity degradation. The highly transparent encapsulant suits flat-package HB-LEDs.

KER-7000 materials’ heat resistance is at the same level as that of the methyl-group. When compared with the phenyl group, the new product has the same level of gas permeability and much higher resistance to high temperatures.

The series includes 2 hardness-level products: KER-7080 A/B has a hardness level of (Durometer A) 80, and KER-7030 A/B has a hardness level of (Durometer A) 30.

The company is beginning sample shipments, mainly for applications in LED lighting.

Shin-Etsu Chemical, in addition to encapsulating materials, develops heat-radiating die-bond materials, lens materials, reflector materials and moisture-proof insulating materials for HB-LEDs. Learn more at www.shinetsu.co.jp.

Visit the new LEDs Manufacturing Channel on ElectroIQ.com!

February 15, 2012 — Electronics materials supplier Engineered Material Systems released the DA-5045-2 and DA-5045-4 high-thermal-conductivity die attach adhesives for light emitting diodes (LEDs) and small power semiconductor die packaging.

The new thermally and electrically conductive adhesives enable high thermal transfer for LEDs and power electronics. Thermal conductivities are greater than 20 W/mK when measured by laser flash. Both products feature high glass transition temperatures (Tg) and modulus, enabling wire bonding. They are electrically conductive for static drain. DA-5045-2 and -4 withstand JEDEC level 1/260

February 10, 2012 — Day 3 of the 2012 Strategies in Light conference continued the LED Manufacturing session. Presenters covered lithography for light emitting diode (LED) manufacture, advanced packaging, metrology and testing, high-performance materials, and other topics, such as the value of dimming.

First up, Thomas Uhrmann of EV Group with a review of the lithography and wafer bonding tools that they provide for HV manufacturing of LEDs. Nano-imprint is one of the applicable technologies identified on one chart, but only optical litho was discussed. Several different device structures are being scaled up in production, no longer limited to the original planar device. A variety of bonding schemes were shown, many driven by emerging 3D integration process flows. It remains to be seen whether there will be a process and materials convergence in our future.

Figure 1. Chip designs for GaN LEDs.

The subject switched to metrology and yield management with Mike Plisinski of Rudolph Technologies, focusing on epitaxial process metrology and feedback in LED production. MOCVD Epi process defects and variation are the largest LED cost drivers, impacting both yield and brightness directly.

Figure 2. Epi process defects and LED yield/brightness.

Dan Scharpf of Labsphere talked about optical testing of LEDs. Drive current, junction temperature, stray light and appropriate selection of sphere size are all important parameters for accurate testing that does places all products into the correct bin.

Ilkan Cokgor of Everlight Electronics led us into the LED Packaging session, speaking on packaging trends intended to drive down the cost per lumen. Specifically, he focused on performance and reliability improvements for PLCC packages because they are low cost but have not developed a reputation for reliability before now.

Figure 3. Advanced package — reliability improvement.

Ravi Bhatkal of Cookson took the packaging reliability story up a level to luminaire fabrication, including the introduction of SMT manufacturing methods to LED packaging. Issues in lead-free solder printing and reflowing were discussed. The talk provided some good guidance for engineers just starting to implement such processes.

Geoff Gardner, Lighting Marketing Manager for Dow Corning, talked about innovations in silicone technology as applied to LEDs. As the material most commonly used for the LED primary lens, thermal stability is critical for both transmittance and reflectance over the lifetime of the device. Silicones used in injection molding and screen printing have recently been brought to the market. The chemical physical and mechanical properties make silicones suitable if not preferred for a range of applications within LED modules and luminaries.

Figure 4. Material needs in lamps and luminaires.
Figure 5. Silicone technologies for LEDs.

Marc McClear of Cree, still well-known to those of us from the semiconductor materials business, opened the final session of the LEDs in Lighting track with The Next Big Thing. Among the discarded candidates discussed were LED droop, the green gap, remote phosphors and OLEDs. Rather, the correct answer is 3rd generation direct attach LED chip architecture as the vehicle that will deliver 200 lumens/watt for the industry. The payback time for installed fixtures will drop from 4.5 years to less than 1 year.

Figure 6. DOE LED roadmap.

Nadarajah Narendran, Director of the Lighting Research Center at RPI, gave a program overview of ASSIST, the Alliance for Solid-State Illumination Systems and Technology. In a philosophical observation worthy of “if a tree falls in the forest and no one hears it…” he opined that without a human eye to observe it, light is just another wavelength of radiation. “ASSIST recommends” is a series of publications that the organization has produced over the past decade to disseminate the research to its member companies and throughout the industry. Developing test methods, standards and educational curricula are among the ongoing activities that comprise its mission.

Figure 7. ASSIST publications.

Next on the agenda was Amy Olay (no relation) of the San Jose Department of Transportation talking about the energy savings programs associated with the city’s 62,000 streetlights with an annual operating budget of $6M. Implementation of a wireless control system in which each streetlight was its own node was chosen over hard wired designs for controlling power to and receiving operational data from the lamps. The longitude and latitude of each streetlight is known to itself, and it turns on and off based on its unique sunrise & sunset times, rather than using photocells. Warm white LEDs with a color temperature of 4500°K were found to be preferred by the public. The units could be reduced to 50% power without an adverse effect on safety or public perception. In a nod to scientific collaboration, the city can further dim these lights from midnight to 5am, which are the hours in which the James Lick Observatory above San Jose on Mount Hamilton conducts its astronomical research. The current deployment is for 2,000 streetlights, funded by federal stimulus money. An additional $30M in grants will be needed to complete the conversion to LED streetlights in San Jose.

Sam Klepper of Redwood Systems wrapped up the conference by introducing us to the digital age of lighting. Being dimmable turns out to be a significant feature of LEDs that is not fully exploited. Dimming an LED by 30% reduces power consumption by 50% with no adverse effect. Dimming a CFL by 30% reduces power consumption by only 20%, and reduces the lifetime of the lamp. The digital control system that takes advantage of all of the features of LED lighting brings with it the capability to add a number of other functions of interest to building managers with little additional effort. For example, motion sensors used to turn off lights in unoccupied rooms can also indicate room occupancy for spontaneous roving team meetings searching for an available conference room. The same sensors can provide security warnings for restricted areas or after-hours tresspassers.

Figure 8. Key challenges in facilities.
Figure 9. Commercial electricity use by building type.

Observation from the exhibition floor: I’m accustomed to walking up and down the aisles and wondering how I might use the product being exhibited to build my own product. At this show, the dominant thought was “I wonder how that would look in my living room.” In that sense, it was a bit more like Home Depot than the technology conference that it was. On the other hand, it is so much more interesting to see all of the ready-to-install luminaire designs than it is to see bin after bin of bare and packaged chips and assembly components.

Next year is going to be a tough one for the LED industry, since the 2013 Strategies in Light conference will be held on February 12-14. I think it’s safe to say that not everyone will be able to get home in time for Valentine’s Day to keep peace in the family.

Michael A. Fury, Ph.D., is director & senior technology analyst, Techcet Group in North Plains, OR.

Read Fury’s other reports from Strategies in Light:

Visit the new LEDs Manufacturing Channel on ElectroIQ.com!

February 10, 2012 — The manufacturing conference at Strategies in Light focused on methods for reducing cost through the manufacturing supply chain. Presenters discussed various methods of reducing manufacturing costs, from improved automation and standards implementation, automation to new packaging technologies. Light emitting diode (LED) manufacturers must be aggressive to achieve such cost targets as the $2 per kilolumen which is highlighted in the R&D roadmap by the US Department of Energy (DOE).

This article originally appeared on LEDs Magazine, www.ledsmagazine.com.

In his keynote talk, Iain Black, vice president of manufacturing engineering and innovation at Philips Lumileds, said that one way LED manufacturers can be more efficient is to develop more flexible, scalable and responsive manufacturing processes. He said that his company is moving the differentiation of its products to the latter portions of the product flow, which allows for faster cycle times, potentially higher yields and better management of LED inventories. “This will simplify the front end processes, while also reducing the number of different die types,” he said.

Black said that manufacturing complexity is one of the greatest challenges he faces with a very diverse array of LED applications and thousands of LEDs, which need to be matched together. Philips Lumileds is moving to more standardized products that become differentiated toward the end of the manufacturing process. “We still will have custom solutions in cases of very large customers or niche products, but the practice of customizing single-die emitters for lighting is no longer practical,” he added. He said that Philips Lumileds is going to begin to emphasize LED arrays more, another strategy that will allow for product differentiation later in the process.

Black’s presentation was followed by an overview of LED fab activity by president of SEMI America, Karen Savala. SEMI has estimated that there are 142 LED fabs in operation worldwide, though some new fab tooling has been stalled recently due to the market slow down. “We see some overcapacity, but we believe this will be a short term issue,” she said. Savala also provided an update of sapphire substrate prices, which had fallen to a new low of $10 per 2" substrate by the end of 2011.

Savala talked about the some of the cost benefits that the LED industry could gain from standardization. She noted that current there are over 30 different 6" sapphire wafers products on the market, due to lack of standardization. In 2010, SEMI organized the HB-LED standards committee and there are currently four task forces for LED manufacturing. They cover the geometric standards for 6" sapphire wafers, hardware and software interfaces for automation, defect metrology for sapphire wafers and ESH (environmental, safety and health) aspects of LED manufacturing.
 
Jacob Tarn, president of TSMC Solid State Lighting Ltd. also discussed cost reduction strategies that TSMC has borrowed from semiconductor manufacturing and plans to apply to LED manufacturing. Tarn noted, however, critical differences between LED and semiconductor manufacturing. Most importantly, LED manufacturing requires extensive knowledge of materials engineering, bandgap engineering, defect engineering and stress management, all of which can affect LED light quality, reliability and lifetime. He said, for instance, that the understanding of defect behavior within specific materials is still being developed, as is the understanding of interface behavior between heterojunctions.

Figure 1. LED manufacturing could benefit from an integrated development environment. Source: TSMC.

Tarn added that there is a need for an integrated development environment in LED manufacturing (Fig. 1) that includes device and process simulation such as that which exists in semiconductor manufacturing. “The GaN industry has not had enough databases to build the infrastructure so many developments have been empirical,” he stated.

TSMC has plans to utilize the advantages of 8" manufacturing throughputs in LED manufacturing. For instance, Tarn talked about growing epilayers on 4" or 6" substrates, then transferring the GaN epilayer to 8" wafers for further wafer processing including wafer-level packaging processes. Other mainstays of the semiconductor process control world, including run-to-run control, data mining and equipment tracking can be applied to LED manufacturing.

Tarn’s presentation was followed by a review of the DOE’s manufacturing roadmap by Jim Brodrick, the US DOE’s solid-state lighting program manager. “High first cost is the most frequently cited impediment to adoption of solid-state lighting,” said Brodrick. He added that the roadmap allows companies to identify common goals and best practices while addressing roadblocks. Two priorities in the roadmap include the development of flexible and cost-effective manufacturing methods for LED modules, light engines and luminaires as well as high-speed, non-destructive test equipment for key stages in the manufacturing process.

Brodrick emphasized that cost reduction while maintaining high-quality manufacturing all comes down to one metric: binning yield. The roadmap outlines improvements in upstream process control, non-destructive testing, manufacturing automation, and advanced packaging schemes that can lead to such higher binning yields. Some of the DOE active projects are summarized in the table.

 

Applied Materials Inc. Advanced epi tools for gallium nitride (GaN) LED devices
GE Global Research Roll-to-roll solution-processable small-molecule OLEDs
GE Lumination Development of advanced manufacturing methods for warm-white LEDs for general lighting
KLA-Tencor Corporation Automated yield management and defect source analysis inspection tooling and software for LED manufacturing
Philips Lumileds Lighting Company Low-cost illumination-grade LEDs
Ultratech Inc A low-cost lithography tool for high-brightness LED manufacturing
Universal Display Corporation Creation of a US phosphorescent OLED lighting panel manufacturing facility
Veeco Instruments Implementation of process-simulation tools and temperature-control methods for high-yield MOCVD growth
Veeco Process Equipment Development of production PVD-AlN buffer layer system and processes to reduce epitaxy costs and increase LED efficiency
Moser Baer Technologies Process and product yield improvements for low-cost manufacturing of OLEDs
Table. Projects and the companies working on them.

Raja Parvez, CEO of Rubicon Technology talked about the advantages of progressing to larger-diameter sapphire substrates. “I believe the LED industry will follow the same path as the semiconductor industry in progressing to larger wafers to reduce costs,” said Parvez. Interestingly, however, semiconductor manufacturers had two drivers pushing them to larger and larger wafers — increasing semiconductor die size and the need to produce more die at a lower cost. LED manufacturers only share one of these drivers because the LED die size is not increasing incrementally.

Abdul Lateef, CEO of Plasma-Therm, a maker of PECVD tools, discussed the need for different equipment platforms based on the stage of LED manufacturing. For instance, Plasma-Therm offers both single wafer PECVD systems as well as batch tools. He provided an example of how in-situ metrology is helping to automate the process. “We have equipped the tools with optical emission interferometry which uses the light from the plasma to monitor film thickness,” he said. Lateef also commented that in many instances, LED manufacturers would purchase only a single tool for a single processing step in early stages of manufacturing, which makes tool monitoring and data tracking more difficult. As LED manufacturers have ramped capacity and purchased more tools, the implementation of intelligent data analysis, centralized recipe management, tool utilization tracking and maintenance scheduling become more manageable.
 
Laura Peters is a Senior Technical Editor with LEDs Magazine. Contact her at [email protected].

Check out more reports from Strategies in Light:

Visit the new LEDs Manufacturing Channel on ElectroIQ.com!

February 9, 2012 — Day 2 of the 2012 Strategies in Light conference, and the first day of technical sessions, began with an adrenaline rush. The challenge posed to the audience was to identify the first ever Super Bowl TV commercial to feature a light emitting diode (LED) light. The first respondent would win $100, and it took only a few mental CPU cycles for someone to correctly shout out “Audi.” The conference has over 4,000 advance registrations, with a total of 5,000 attendees expected for conferences and to view the record 170 exhibitors.

Read Fury’s report from Day 1: Strategies in Light: Day 1, LED Lighting Report, New Start-ups

and from Day 3: Lithography, direct-attach LED architectures, packaging trends

The session was opened by Ella Shum, LED practice director at Strategies Unlimited. One prognosis is that China will soon be taking over the global sign market; it commanded 87% of the W/W market in 2011. Many smart phones are going to OLED displays. It was suggested that the iPhone will not go OLED until someone other than Samsung commands the majority of OLED manufacturing capacity. Even though the LED lighting market is growing at a 20% CAGR to 2016, the LED chip market is flat (CAGR -0.2%) because of price pressure even as unit growth is strongly positive.

Ling Wu, Secretary General of the Chinese Solid State Lighting Alliance, provided an overview of their strategy as captured in the next Five Year Plan. Energy savings is the dominant driver, with a target of 100B kWh saved. The 20M rural families still without electricity are driving a market for off-grid LED lighting.

Eric Kim of Soraa, Inc. took a holistic approach to LED lighting for space illumination. Readers are referred to an article in today’s (Feb 08, 2012) Wall Street Journal on the company. Unlike most LEDs that use blue emission to pump phosphors for their range of colors, the Soraa products use violet light to pump a different set of phosphors, giving characteristics distinct from others in the market.

Editor of LEDs Magazine Tim Whitaker provided his observations on the European LED lighting industry. General lighting LED market share is just shy of 10% in 2011, in spite of being two years into a mandated conversion roadmap away from incandescents. This transition is expected to inject €20B into the European economy.

Ned Tozun of d.light Design is turning to LED solutions for off-grid household lighting in third world rural areas. There is still a surprisingly large population that has no access to electricity, or unreliable limited access. The primary means for night lighting are kerosene lanterns and electric bulbs powered by lead acid batteries that must be carried to a local diesel generator  for daily recharging. In India, the government subsidy to keep kerosene prices affordable is ~$6B, approximately the same as the national budget for education. The sociological benefits from relatively low-tech implementations of solar chargers and LED lighting at night extend to increased study time and improved health for children due to the elimination of kerosene (which is typically several grades below what is available in the US in terms of adulterated effluents).

Figure 1. Population without electricity.

Overheard mid-morning: “I’m surrounded by a bunch of technical propeller-heads talking about LED chip manufacturing and I’m not sure I can keep up.” Funny, I felt like I was surrounded by marketeers who were excited about upside market potential but had no idea what the inside of a fab looks like, at least through the morning plenary session. Fortunately, I was able to take refuge all afternoon in the LED Manufacturing track, where my propeller spun freely.

Seth Coe-Sullivan of QD Vision opened the session on phosphors with his overview of the only company focused on quantum dots exclusively for the lighting industry. Their quantum dots can operate in both photoluminescent and electroluminescent (for QLEDs) modes. The underlying physics is said to provide greater efficiency and spectral purity than phosphor technology.

Iain Black of Philips Lumileds Lighting talked about the challenges of LED manufacturing from the perspective of rapidly delivering products to market that are responsive to rather fast changes in consumer mood. One important element is to move the product customization point as late in the production process as possible, allowing many products to draw from a common substock. Lumileds manufactures on 150mm wafers; most LED fabs still run smaller wafers.

Karen Savala, President of SEMI Americas gave the supplier-side perspective on consolidation, expansion and long-term planning for LED manufacturing. Global manufacturing is normalized to 4” wafer equivalents; capacity is expected to reach 2M wafers/month this year. Sapphire LED substrates are expected to reach 50% 6” wafers in 2014, and this wafer size is where the SEMI Standards activity is focused for LED.

Figure 2. LED dedicated fabs, 10-year span. SOURCE: SEMI Opto/LED Fab Forecast, November 2011.

Jacob Tam, President of TSMC Solid State Lighting Ltd., explored the question of whether a large semiconductor manufacturer can accelerate LED cost reduction. He started with a very nice spider chart comparing the state of manufacturing in the two technologies. Various manufacturing and design tools were compared between the two, but in the end he remained quite silent on the details of what TSMC had in mind for its own LED manufacturing future. One expectation is that binning control will be much tighter when leveraging TSMC’s process control experience.

Figure 3. The fundamental differences between semiconductors and LEDs.

James Broderick of US DOE talked about the government-industry roadmap for improving solid-state lighting manufacturing in the US. The underlying motivator is the creation of sustainable US manufacturing jobs. The metrics call for OEM lamps priced at $5 by 2020, compared to $23 today. There are ~$45M in projects funded today, with a planned pathway to $114M. A funded KLA inspection tool tested at Philips Lumileds reduced production costs by 10%.

Figure 4. DOE funding by program pathway.

Raja Parvez, CEO of Rubicon Technology spoke about the move to larger diameter sapphire wafers. Solid state lighting is the largest consumer of their products, followed by silicon on sapphire and optical windows (aerospace). Rubicon expects 6” wafer share to be 70% by 2020, with a subsequent trend to 8”, following the semiconductor trend.

Figure 5. Sapphire wafer diameter trends. SOURCE: Yole Developpement.
LED chip manufacturers transitioning to larger-diameter substrates to reduce cost
 –Several chip manufacturers announced plans to move into volume production on 6" substrates in 2011
 –We have been supplying R&D volumes of 8" epi-polished wafers and are ready for high-volume production.

Abdul Lateef of Plasma-Therm talked about the advancements of front end PECVD deposition in adapting to LED manufacturing. Real time process control using optical emission interferometry is one of the innovations contributing to higher production repeatability and yield, with a control resolution of 50nm.

Michael A. Fury, Ph.D., is director & senior technology analyst, Techcet Group in North Plains, OR.

Visit the new LEDs Manufacturing Channel on ElectroIQ.com!

UPDATE February 8, 2012 — Chung Hoon Lee, CEO of LED manufacturer Seoul Semiconductor Co. Ltd. keynoted at the Strategies in Light Conference and Exhibition in Santa Clara, CA, today. Lee’s keynote, "A View from Seoul," marks the first time a Korean LED maker has spoken at the conference.

As the CEO of Seoul Semiconductor, Lee has guided the company from $1 million in revenue since the company’s inception, to over $700 million today. Lee holds the first patent technology for white LEDs in Korea and drove the innovation of Acrich, a mass-produced AC LED, for which he was awarded the Silver Tower Order of Industrial Service Merit in South Korea.

Mr. Lee described the "unique technology" of Seoul Semiconductor — UV LEDs, non-polar LEDs, and AC LEDs named Acrich that do not need a converter. "We spend 10-20% of our revenue for R&D. Based on this R&D we now have more than 10,000 IPs," he said.

Also read: Seoul Semiconductor LED patents top 10K mark

"People say Acrich is an Asia technology, but that’s wrong," Lee said. Acrich is the world’s first semiconductor light source that operates directly from AC power without a converter. This makes it suitable for many residential and commercial lighting applications where the main source of available power is AC. A design with Acrich LEDs minimizes component count and board space.

Speaking on the future of lighting systems, Lee showed a chart that compared Acrich to the converter-based technology of other companies (Company A through Company E). Holding up the components of an AC/DC converter system, Lee asked “What is this?” His answer, “This is junk,” was met with applause. Lee explained that the less-than-10K-hours lifetime of convertors sabotages the 50,000 hour lifetime of LEDs. Acrich, by comparison, uses a “tiny IC chip.” He said Acrich provides better power factors, better power efficiency and better THD. “We can reduce the heatsink, protect the environment and provide more design freedom,” Lee said.

Led also described an evolution in white LED chips, saying he believed the 3rd generation will be phosphor-free. How? He showed two approaches: a 3-chip (RGB) solution, and one based on quantum dots (QD). “Which will be successful? We cannot say yet,” he concluded.

Strategies in Light Conference and Exhibition focuses on developments in high brightness light-emitting diode (HB-LED) applications, technology and manufacturing. Stay tuned for daily news and product announcements from the show, such as:

Seoul Semiconductor is an LED supplier and holds more than 10,000 patents. Seoul Semiconductor owns a wide range of LED technology and production capacity in the following areas: high brightness LEDs and mid-power top view LEDs as well as Acrich. The company is pioneering in the productization of deep UV LEDs and non-polar LEDs.

Visit the new LEDs Manufacturing Channel on ElectroIQ.com!