Category Archives: Large Batteries

November 29, 2007 — /PRNewswire/ — NEW YORK, NY — CECO Environmental Corp., a leading provider of air pollution control and industrial ventilation systems, announced today that it has secured 10 new orders totaling approximately $13.5 million.

Rick Blum, president and COO, states, “These orders were secured by our Kirk & Blum, Effox, CECO Filters, H.M. White, CECO Abatement, and Busch International subsidiaries. They involve projects for the power, food processing, automotive, ethanol, and aluminum industries. The largest of the projects, secured by H.M. White, involves energy management work for a foreign owned automotive facility in the United States. The second largest, also secured by H.M. White, is a mist collection system for an automotive facility in Mexico.”

Phillip DeZwirek, chairman and CEO, states, “We are especially pleased to announce the new order in Mexico. CECO recently opened an office in Mexico City, which it plans to move to Monterrey in the near future. We expect to increase the level of business that we do in that country. Our newest acquisition, GMD, also has a long track record of doing business in Mexico. I am also happy to announce that, for the second month in a row, our bookings are approximately $20 million. Bookings for the year have now reached $183 million.”

About CECO Environmental
CECO Environmental Corp. is North America’s largest independent air pollution control company. Through its nine subsidiaries — Busch, CECOaire, CECO Filters, CECO Abatement Systems, kbd/Technic, Kirk & Blum, H.M. White, Inc., Effox, and GMD Environmental — CECO provides a wide spectrum of air quality services and products including industrial air filters; environmental maintenance, monitoring, and management services; and air quality improvement systems. CECO is a full-service provider to the steel, military, aluminum, automotive, ethanol, aerospace, electric power, semiconductor, chemical, cement, metalworking, glass, foundry, and virtually all industrial process industries.

Source: CECO Environmental Corp.

Visit www.cecoenviro.com

November 19, 2007 – Sanyo Electric Co.’s is looking to solar cells and rechargeable batteries (e.g., lithium ion) to power its growth starting in fiscal 2008, according to similar reports in the Nikkei and Yomiuri papers.

The new plan, the first by new president Seiichiro Sano, lays out spending of 100B yen (US ~$905M) over three years to ramp output of products for notebooks and computers, including production of next-generation lithium batteries for hybrid cars, notes the Nikkei. Sales of rechargeable batteries are targeted to rise 50% next year to exceed 450B yen ($4.07B). Meanwhile, Sanyo aims to double solar cell sales to 120B yen, partly with a previously-announced 230% jump in production capacity to 600MW, spending another 100B yen on the expansion and to procure silicon supplies, the paper notes.

The Yomiuri, which adds that Sanyo is only spending 37B yen (~$335B) on both businesses in the current fiscal year, is even more bullish in its predictions for Sanyo’s solar cell business, saying that instead of a previously planned ramp to 600MW, the firm will double that to 1200MW/year through fiscal 2010.

While focusing investments in solar cells and batteries, Sanyo will accelerate cutbacks and entire exits from other less profitable units, the Nikkei reports. In its “white goods” division, for instance, the company will lower domestic sales of fridges and air conditioners, to focus on other appliances including washer-dryers, vacuum cleaners, rice cookers, and other gear. The company’s Tottori subsidiary will become the core electronic appliance firm, with a special entity to be formed next spring to expand overseas sales. Sanyo also recently gave up trying to sell its semiconductor business, and instead will inject 20B yen (~$181M) mainly to overhaul equipment, the paper noted.

October 5, 2007 – SunPower and Korean energy company EnE System plan to build a 2MW solar electric power plant in Jeonju, Korea’s Jeolla province, on landfill property owned by Jeonju Solar Energy. Construction is expected to be completed in January, with the Korea Energy Management Corp. providing part of the project’s funding.

The company’s proprietary single-axis solar tracking system will be installed at the 53,000 sq. m. site, delivering up to 25% more energy than traditional fixed-tilt systems, the company claims.

SunPower already has a 2.2-MW site in Mungyeong and a 1MW plant in Gwangju, a multi-year polysilicon supply agreement with Korea’s DC Chemical Co. Ltd., and is investing in a JV with Woongjin Coway to manufacture monocrystalline silicon ingots, with polysilicon supplied primarily from DC Chemical.

September 14, 2007 – A group of memory chipmakers and mobile device providers are backing a new industry spec for removable memory cards and embedded memory technologies, an effort spearheaded by standards org JEDEC Solid State Technology Association. The new “universal flash storage” (UFS) spec, expected to be finalized in 2009, will support very low access times for memories, reduce power consumption in consumer electronic devices, and enable high-speed access to large multimedia files.

The group is targeting significant reductions in performance levels for a range of consumer electronics applications, such as mobile handsets, digital still cameras, and other devices. For example, today a user might experience a three-minute access time for a 90min movie –UFS would reduce that to a few seconds. The UFS standard also aims to make flash cards interchangeable among the various CE devices.

All the participants chimed in with support in a statement:

– “Standardization of flash-based technologies will be crucial in determining how fast storage devices will be able to fully support industry demand for higher densities and faster transmission speeds.” Frankie Roohparver, VP of NAND development for Micron Technology.
– “This collaborative UFS effort will provide the industry with an open standard mass memory solution with optimal performance and interoperability.” Seppo Lamberg, SVP of technology platforms, Nokia
– Samsung’s Mobile handset division is happy to stand with our peers in support of standard technology for removable memory devices that will result in much simpler interconnectivity.” W.S. Lee, VP, handset R&D planning, telecommunication network business, Samsung Electronics Co., Ltd.
– “[The proposed UFS standard] not only provides significantly higher bandwidth, but also supports low latency accesses and is positioned to provide an essential infrastructure in future mobile devices.” George Minassian, VP of strategic planning and systems engineering, wireless solutions division, Spansion
– “We think that this Universal Standard will cover the needs of the embedded and removable markets for many years.” Giuseppe Crisenza, NAND flash group GM, STMicroelectronics.

August 8, 2007 – Cell phone maker Nokia says it will outsource development of its 3G chips to STMicroelectronics and has extended its partnership with Broadcom to include the supplier’s EDGE chips — deals that could dent business outlooks for Texas Instruments and Qualcomm.

Under the new deal, ST will design and manufacture 3G chipsets based on Nokia’s modem technologies, energy management and RF (radio frequency) technology, and the two are negotiating the possible transfer of part of Nokia’s IC operations to ST, including about 200 Nokia employees in Finland and the UK. The new structure has already borne its first fruit, with Nokia giving a design win for ST’s 3G high-speed packet access chipset supporting high data rates.

Nokia says it will still develop its modem technology, including protocol software and related digital design for WCDMA/GSM, which will be licensed to chipset manufacturers with product sent back to Nokia and into the open market.

“Nokia’s strategy will be to collaborate with its semiconductor partners for full chipset solutions,” said Niklas Savander, EVP of technology platforms at Nokia, in a statement. “We have worked with STMicroelectronics for many years and the company is a perfect partner for this expanded collaboration.”

In a separate announcement, Nokia said it will use Broadcom’s single-chip cellular baseband processor and companion power management unit for use in select future EDGE mobile phones. The processor, based on 65nm process technologies, offers “an advanced feature-set at low power, small size, and low system cost,” according to Nokia.

An exec told Reuters that the move “frees R&D resources for other areas […] like Internet, services, [and] user interfaces.” The paper also cited an ST exec saying that the new chip would be on the market by early 2010, adding that Nokia is ST’s biggest customer representing 20% of sales in 1H07.

Analysts were quick to pull apart the news for pros and cons not only for Nokia and ST but also market competitors. Some speculated that Nokia’s move to license the technology to the open market will widen the playing field for some phone makers who wouldn’t otherwise be able to develop or gain access to the technology.

Also, Texas Instruments, which has supplied the 3G and EDGE chips for Nokia, may be on the outs or at the least now face mounting margin pressure, according to some analysts. “We think it will damage Texas Instrument’s very healthy gross margins, as it now faces competition in all technologies that it supplies to Nokia,” said Nomura Securities analyst Richard Windsor, quoted by Reuters. Others, though, are still bullish that TI will continue to ride the wave if Nokia grows market share. 3G leading supplier Qualcomm may also feel the pinch and have to be more competitive on pricing, Windsor noted.


eTEC adds just 100 microns of height to a heat spreader. (Photo: Nextreme)

June 29, 2007 — Nextreme‘s new miniature thin film embedded thermoelectric cooler, eTEC, is designed to address the thermal management needs of the electronics, photonics, bio-tech and defense/aerospace industries. Manufactured using semiconductor processing techniques, the nanostructured eTEC promises high-power densities and microsecond response times in an ultra-small footprint — as small as 0.3mm x 0.3mm x 0.1mm.

“Unlike conventional thermoelectric components made by manually assembling individual pellets together, we utilize semiconductor processing techniques to provide pin-point thermal control for high heat fluxes,” says Nextreme CTO Dr. Seri Lee. The process, Lee claims, increases product performance, reliability, and yield.

Nextreme says eTECs offer an industry first, the seamless embedding of an active cooling and/or heating device in close proximity to the die of an integrated circuit. The eTEC structure optimizes thermal and electronic transport for enhanced thermoelectric performance by operating as miniature heat pumps; for rapid cooling or heating semiconductors and other electronics; for thermal management of fiber-optic laser controls and integrated optoelectronics; or for power generation by converting waste heat into electricity to increase efficiency in thermal batteries and automotive energy management.

Nextreme’s eTECs are designed with thin films that add just 100 microns of height to a heat spreader, enabling unobtrusive integration close to the heat source. The device pumps a maximum heat flux of 150W/cm2 with some designs delivering as much as 400W/cm2 versus less than 10 – 20W/cm2 for typical bulk TECs.

May 15, 2007 — Multinational chemical giant BASF has announced the opening of a $2.6 million (S$4 million) R&D center for organic electronics in Singapore that will focus on nanotechnology and energy management, two important growth clusters for the company. The opening is part of BASF’s plan to expand global research activities and investments, especially in Asia Pacific.

The new center augments the April 2006 opening of BASF’s first nanotechnology research center in Asia, the Competence Center for Nanostructured Surfaces.

The total research expenditure for both centers between 2006 and 2009 is expected to be $19.8 million (S$30 million). BASF plans to hire a total of 40 employees for both research centers by end 2007.

BASF has embarked on a new project on organic photovoltaics with the Institute of Materials Research and Engineering (IMRE) in the center.

The organics electronics lab is a shared technology platform that cuts across BASF’s growth clusters energy management and nanotechnology. it will undertake research activities in the areas of printed electronics, OLEDs (organic light emitting diodes), organic biosensors and organic photovoltaics.


Bosch’s EBS integrates with a car battery’s pole for space savings (Photo: Bosch)

Feb. 23, 2007&#8212Bosch has begun manufacture of its Electronic Battery Sensor (EBS), which promises to help motorists avoid flat batteries, the most common cause of breakdowns. With its integrated evaluation electronics, the MEMS sensor determines the battery’s condition by measuring voltage, current, and temperature. The energy management system incorporated in modern cars uses these values to continuously guarantee sufficient battery energy, so that the vehicle can be started reliably even after a long stationary period. In 2007, more vehicles equipped with the sensor will go into series production.

The Bosch battery sensor consists of a chip that contains all the electronics, and a shunt for current measurement. These two components, along with the pole terminal, form a unit that can be connected directly to the car battery, fitting into the pole niche of standard automotive batteries. This yields a significant saving in both space and costs over previous solutions.

Bosch developed the associated software for battery-state detection in collaboration with Varta, and integrated the algorithms into the EBS chip. The sensor determines the battery’s capacity, state of charge, and expected performance, and sends this information via an LIN interface to the vehicle’s superordinate energy management system, which uses the data to optimize the state of charge.

If over a period of time more electric charge is used than the alternator can provide, the level of charge in the battery will fall. The energy management system compensates for this before a critical battery state is reached by reducing the power consumption of comfort items such as the seat heating, and may even switch them off altogether for short periods. It can also increase the combustion engine’s idle speed, and thus the alternator speed, if the vehicle is stuck in a traffic jam for a longer period. This improves the battery’s state of charge, which means that the period in which a vehicle can be re-started reliably is now much longer, even if a large number of electrical consumers drew on the battery on the vehicle’s previous journey or if the vehicle has been left standing for a considerable period.

Besides the present state of charge, the software can also forecast the battery’s future charging condition. And, it will be possible to control power generation by the alternator more precisely. This promises to reduce fuel consumption, and thus also emissions of pollutants.

Accurate information about the battery is also needed in vehicles with stop-start systems. For example, the engine will only be switched off if there is sufficient power available to restart it subsequently without any difficulty. And even when the vehicle is being manufactured, a quiescent current test can be done, allowing any problems to be detected. The sensor opens up greater diagnostic possibilities for garages&#8212for example, when a customer is having recurring problems with a flat battery.

February 12, 2007 – As a teaser for announcements it’s making at this week’s Integrated Solid State Circuits Conference (ISSCC), Intel Corp. says it’s developed a futuristic programmable processor with a single 80-core chip that achieves “teraflops performance” (trillions of calculations/sec), and consumes just 62W of power, less than that of some of today’s single-core processors.

The chip is made with a tile design in which smaller cores are replicated as “tiles,” making it easier to design multicore processors — a single-core chip of this size (100 million transistors) would take twice as long with twice as many people to design, the company said. Also, each core contains a five-port messaging passing router, connected in a 2D mesh interconnect scheme, creating a “network-on-a-chip” architecture that allows super-high bandwidth communications between the cores. And each individual compute engine and data router in each core can be activated or put to sleep independently so that only ones needed to complete a task are used. Other improvements in the chip are incorporated in sleep transistors, esochronous clocking, and clock gating. (See summary of performance results below.)

Intel emphasized that this is purely a “research chip,” and the company has no current plans to bring “this exact chip designed with floating-point cores to market.” However, it did say that the chip has “offered specific insights in new silicon design methodologies, high-bandwidth interconnects and energy management approaches.”

Further “tera-scale” research will involve developing more prototypes with general-purpose Intel Architecture-based cores, and adding 3D-stacked memory.

By the numbers — Intel’s research chip results

Frequency……..Voltage………Power…….Aggregate bandwidth…….Performance

3.16 GHz………..0.95 V…………62W…………1.62 Terabits/s…………1.01 Teraflops
5.1 GHz………….1.2 V………….175W…………2.61 Terabits/s…………1.63 Teraflops
5.7 GHz………….1.35 V………..265W…………2.92 Terabits/s…………1.81 Teraflops

Source: Intel Corp.

Sensors, software protocols have reached a point of maturity where real world rollouts are finally feasible

By Jo McIntyre

Various technological developments related to monitoring operations within electric grids, industrial plants and commercial buildings have converged recently to make more sophisticated sensor networks possible.

Refined IEEE wireless communication standards for sending data, and falling prices on sensors have brought costs down far enough to get products into the marketplace. And mesh networking has developed enough to allow for continuous connections and reconfiguration around broken or blocked paths, so a network can still operate even when a node breaks down or a connection goes bad. The next step is to monitor usage at the residential or even appliance level and transmit that data to the electric grid.

The power generation industry also needs to be able to regulate renewable energy inputs into the grids, says Dan Rastler, technical leader of the distributed energy resources program at the Electric Power Research Institute, or EPRI, based in Palo Alto, Calif.

The Institute has long applied new technologies to the power generation and utility industries to manage distribution systems. Today, EPRI is trying to integrate sensors into technologies for load control of, for example, air conditioning systems transmitting data through wireless or fiber optic systems.

“As we see more expansion of distributed power and renewables, like photovoltaics, we’ll need to have more capability to provide information to the service network,” Rastler says.


Harry Roman, former emerging technology and transfer consultant at PSE&G and a longtime proponent of sensor networks, displays a MEMS acoustic sensor. Photo by John Madere
Click here to enlarge image

Public Service Electric & Gas (PSE&G) in New Jersey is also incorporating some of the new technology into its operations.

On July 4 this year, PSE&G received a patent on MEMS-actuated fiber optic-based acoustic emission sensors, two to five microns in size, to monitor transformers, and is developing similar technologies for cables and power lines.

“We have to think about how to overlay a system onto what exists to improve its operation,” says John Del Monaco, manager of emerging technology and transfer at PSE&G.

“We’re focused on incorporating sensors into our system and getting information back, all done in real-time, to understand what’s happening in the system.” He said the company is striving to make its existing infrastructure work as a “smart and reliable utility.”

PSE&G has installed a prototype sensor system in a 230kV-to-13kV transformer, which steps bulk energy transmission voltage down to primary distribution voltage.

The company monitors data from the sensor, which is installed in an eight-inch probe that goes into transformer oil. The probe measures certain frequencies in acoustic emissions and compares that data to data from existing acoustic sensors outside the transformer.

PSE&G is working on another sensor that will monitor relay settings, water levels, pre- and post-fault conditions, transformer oil temperatures, moisture and ambient temperature.

With their research partner, New Jersey Institute of Technology, PSE&G is also developing temperature sensors that will be on transmission lines, looking for problems in splices, and transmitting information wirelessly to a company location.

Farther into the future is a project designed to understand information for network protectors for the company’s distribution system. Information will be sent to division locations via a fiber optic network. This is a joint project envisioned being done with a manufacturer and EPRI. Other areas under development are communication devices to transmit data back to division locations, and the software to interpret the data.

To address what could be a burgeoning market, several manufacturers are already making sensor network products. For example, in mid-October, Emerson Process Management and Dust Networks announced that the division will use Dust Networks’ time synchronized mesh protocol as the communications technology to run Emerson’s new in-plant wireless field networks.


Dust Networks’ approach to mesh networking connects monitoring and control systems with sensors, actuators and other devices that interact with the physical world. Illustration courtesy of Dust Networks
Click here to enlarge image

Emerson Process Management is a division of St. Louis-based Emerson. The company has fluid level, temperature and acoustic sensors, built specifically for the process control industry, including oil fields and refineries, as well as companies monitoring switching stations and power plants.

After three years of evaluations, Emerson now has supply systems ready for mainstream manufacturing use. Features include a rugged design for industrial environments, vibration resistance and an industrial temperature range of -40 to +85 degrees Celsius.

Dust Networks, based in Hayward, Calif., makes low-power wireless sensor networking systems facilitated by their mesh protocol. Rob Conant, co-founder and vice president of business development for Dust, said a key change in the industry has been agreement on the IEEE 802.15.4 radio standard for low power radio signals.

“I think that ultimately what will happen will be more effective monitoring and control,” Conant says. “This technology reduces the cost of collecting data by a factor of ten.”

Another technological development, Conant said, is more extensive predictive maintenance. By monitoring vibrations in motors, pumps, generators and turbines, he said, one can see failures developing and prevent unplanned downtime.

These technologies are converging as costs come down, especially wireless technology. “It has happened in the past couple of years, but it’s just coming into end user products right now,” Conant said.

T.J. Glauthier, an EPRI alum, is a member of the strategic advisory board formed by EnerNOC Inc., a Boston-based company that makes demand response and energy management products. He is working on renewable energy and issues related to climate change.

EnerNOC products enable energy users and suppliers, system operators, and utilities to manage distributed energy resources with network operations centers for online monitoring and control of power usage at remote sites.

“Economists argued years ago that this made sense, but we didn’t have online communications before,” Glauthier says. “EnerNOC is working with IBM, grocery stores (and) hospitals to help them reduce power in non-crucial ways like lighting or air conditioning.”

The role for MEMS sensors may be in some of these applications – to cut back lighting some, but not all, he said. “What we’re going to find is that the sensors will allow us to go to another level – monitoring usage or temperature very carefully. Sensors need to be cheap, effective, reliable.”

Kurt Yeager, another EPRI alum, is now leading a study on energy policy and climate change for the World Energy Council. He is working with Bob Galvin, the former chairman of Motorola, on the Galvin Electricity Initiative.

They are seeking to develop so-called micro-grids that incorporate advanced electronic control systems to go between consumers and the grid to raise quality and reliability of bulk power by moderating the power in the micro-grids. Micro-grids use electricity from the bulk power system and also can operate independently of the bulk power system with whatever renewable power sources they have available, like photovoltaics.

Yeager says that while it’s hard to incorporate renewable energy into the electric grid system, sensors and controls using MEMS technology are at the heart of networking systems that can facilitate a change.

“They are all micro-controls,” Yeager says. “(They are) the brains of the system. The first step is to put in sensors that can detect disturbances before they happen, to take corrective action. That’s driving the sensor revolution today.”