Category Archives: Manufacturing

A recent study, affiliated with UNIST has created a three-dimensional, tactile sensor that could detect wide pressure ranges from human body weight to a finger touch. This new sensor with transparent features is capable of generating an electrical signal based on the sensed touch actions, also, consumes far less electricity than conventional pressure sensors.

The breakthrough comes from a research, conducted by Professor Jang-Ung Park of Materials Science and Engineering and his research team at UNIST. In the study, the research team presented a novel method of fabricating a transistor-type active-matrix pressure sensor using foldable substrates and air-dielectric layers.

This image shows the transistor-type active-matrix 3-D pressure sensors with air-dielectric layers. Credit: UNIST

This image shows the transistor-type active-matrix 3-D pressure sensors with air-dielectric layers. Credit: UNIST

Today, most transistors are created with silicon channel and silicon oxide-based dielectrics. However, these transistors have been found to be either lacking transparency or inflexible, which may hinder their utility in fabricating highly-integrated pressure sensor arrays and transparent pressure sensors.

In this regard, Professor Park’s team decided to use highly-conductive and transparent graphene transistors with air-dielectric layers. The sensor can detect different types of touch-including swiping and tapping..

“Using air as the dielectric layer in graphene field-effect transistors (FETs) can significantly improve transistor performance due to the clean interface between graphene channel and air,” says Professor Park. “The thickness of the air-dielectric layers is determined by the applied pressure. With that technology, it would be possible to detect pressure changes far more effectively.”

A convantional touch panel, which may be included in a display device, reacts to the static electrical when pressure is applied to the monitor screen. With this method, the position on screen contacted by a finger, stylus, or other object can be easily detected using changes in pressure, but can not provide the intensity of pressure.

The research team placed graphene channel, metal nanowire electrodes, as well as an elastic body capable of trapping air on one side of the foldable substrate. Then they covered the other side of the substrate, like a lid and kept the air. In this transistor, the force pressing the elastic body is transferred to the air-dielectric layer and alters its thickness. Such changes in the thickness of the air-dielectric layer is converted into an electrical signal and transmitted via metal nanowires and the graphene channel, expressing both the position and the intensity of the pressure.

This is regarded as a promising technology as it enables the successful implementation of active-matrix pressure sensors. Moreover, when compared with the passive-matrix type, it consumes less power and has a faster response time.

It is possible to send and receive signals only by flowing electricity to the place where pressure is generated. The change in the thickness of the air dielectric layer is converted into an electrical signal to represent the position and intensity of the pressure. In addition, since all the substrates, channels, and electrode materials used in this process are all transparent, they can also be manufactured with invisible pressure sensors.

“This sensor is capable of simultaneously measuring anything from lower pressure (less than 10 kPa), such as gentle tapping to high pressure (above 2 MPa), such as human body weight,” says Sangyoon Ji (Combined M.S./Ph.D. student of Materials Science and Engineering), the first co-author of the study. “It can be also applied to 3D touchscreen panels or smart running shoes that can analyze life patterns of people by measuring their weight distribution.”

“This study not only solves the limitations of conventional pressure sensors, but also suggests the possibility to apply them to various fields by combining pressure sensor with other electronic devices such as display.” says Professor Park.

The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, today announced worldwide sales of semiconductors reached $30.4 billion for the month of February 2017, an increase of 16.5 percent compared to the February 2016 total of $26.1 billion. Global sales in February were 0.8 percent lower than the January 2017 total of $30.6 billion, exceeding normal seasonal market performance. February marked the global market’s largest year-to-year growth since October 2010. All monthly sales numbers are compiled by the World Semiconductor Trade Statistics (WSTS) organization and represent a three-month moving average.

“The global semiconductor industry has posted strong sales early in 2017, with memory products like DRAM and NAND flash leading the way,” said John Neuffer, president and CEO, Semiconductor Industry Association. “Year-to-year sales increased by double digits across most regional markets, with the China and Americas markets showing particularly strong growth. Global market trends are favorable for continuing sales growth in the months ahead.”

Year-to-year sales increased across all regions: China (25.0 percent), the Americas (19.1 percent), Japan (11.9 percent), Asia Pacific/All Other (11.2 percent), and Europe (5.9 percent). Month-to-month sales increased modestly in Asia Pacific/All Other (0.5 percent) but decreased slightly across all others: Europe (-0.6 percent), Japan (-0.9 percent), China (-1.0 percent), and the Americas (-2.3 percent).

Neuffer also noted the recent growth of foreign semiconductor markets is a reminder of the importance of expanding U.S. semiconductor companies’ access to global markets, which is one of SIA’s policy priorities for 2017. The U.S. industry accounts for nearly half of the world’s total semiconductor sales, and more than 80 percent of U.S. semiconductor company sales are to overseas markets, helping make semiconductors one of America’s top exports.

February 2017

Billions

Month-to-Month Sales                               

Market

Last Month

Current Month

% Change

Americas

6.13

5.99

-2.3%

Europe

2.84

2.82

-0.6%

Japan

2.79

2.77

-0.9%

China

10.15

10.05

-1.0%

Asia Pacific/All Other

8.72

8.76

0.5%

Total

30.64

30.39

-0.8%

Year-to-Year Sales                          

Market

Last Year

Current Month

% Change

Americas

5.03

5.99

19.1%

Europe

2.66

2.82

5.9%

Japan

2.47

2.77

11.9%

China

8.04

10.05

25.0%

Asia Pacific/All Other

7.88

8.76

11.2%

Total

26.08

30.39

16.5%

Three-Month-Moving Average Sales

Market

Sept/Oct/Nov

Dec/Jan/Feb

% Change

Americas

6.25

5.99

-4.2%

Europe

2.88

2.82

-2.3%

Japan

2.90

2.77

-4.6%

China

10.04

10.05

0.1%

Asia Pacific/All Other

8.94

8.76

-2.0%

Total

31.02

30.39

-2.0%

 

IEEE, the world’s largest technical professional organization dedicated to advancing technology for humanity, this week announced the next milestone phase in the development of the International Roadmap for Devices and Systems (IRDS)—an IEEE Standards Association (IEEE-SA) Industry Connections (IC) Program sponsored by the IEEE Rebooting Computing (IEEE RC) Initiative—with the launch of a series of nine white papers that reinforce the initiative’s core mission and vision for the future of the computing industry. The white papers also identify industry challenges and solutions that guide and support future roadmaps created by IRDS.

IEEE is taking a lead role in building a comprehensive, end-to-end view of the computing ecosystem, including devices, components, systems, architecture, and software. In May 2016, IEEE announced the formation of the IRDS under the sponsorship of IEEE RC. The historical integration of IEEE RC and the International Technology Roadmap for Semiconductors (ITRS) 2.0 addresses mapping the ecosystem of the new reborn electronics industry. The new beginning of the evolved roadmap—with the migration from ITRS to IRDS—is proceeding seamlessly as all the reports produced by the ITRS 2.0 represent the starting point of IRDS.

While engaging other segments of IEEE in complementary activities to assure alignment and consensus across a range of stakeholders, the IRDS team is developing a 15-year roadmap with a vision to identify key trends related to devices, systems, and other related technologies.

“Representing the foundational development stage in IRDS is the publishing of nine white papers that outline the vital and technical components required to create a roadmap,” said Paolo A. Gargini, IEEE Fellow and Chairman of IRDS. “As a team, we are laying the foundation to identify challenges and recommendations on possible solutions to the industry’s current limitations defined by Moore’s Law. With the launch of the nine white papers on our new website, the IRDS roadmap sets the path for the industry benefiting from all fresh levels of processing power, energy efficiency, and technologies yet to be discovered.”

“The IRDS has taken a significant step in creating the industry roadmap by publishing nine technical white papers,” said IEEE Fellow Elie Track, 2011-2014 President, IEEE Council on Superconductivity; Co-chair, IEEE RC; and CEO of nVizix. “Through the public availability of these white papers, we’re inviting computing professionals to participate in creating an innovative ecosystem that will set a new direction for the greater good of the industry. Today, I open an invitation to get involved with IEEE RC and the IRDS.”

The series of white papers delivers the starting framework of the IRDS roadmap—and through the sponsorship of IEEE RC—will inform the various roadmap teams in the broader task of mapping the devices’ and systems’ ecosystem:

“IEEE is the perfect place to foster the IRDS roadmap and fulfill what the computing industry has been searching for over the past decades,” said IEEE Fellow Thomas M. Conte, 2015 President, IEEE Computer Society; Co-chair, IEEE RC; and Professor, Schools of Computer Science, and Electrical and Computer Engineering, Georgia Institute of Technology. “In essence, we’re creating a new Moore’s Law. And we have so many next-generation computing solutions that could easily help us reach uncharted performance heights, including cryogenic computing, reversible computing, quantum computing, neuromorphic computing, superconducting computing, and others. And that’s why the IEEE RC Initiative exists: creating and maintaining a forum for the experts who will usher the industry beyond the Moore’s Law we know today.”

The IRDS leadership team hosted a winter workshop and kick-off meeting at the Georgia Institute of Technology on 1-2 December 2016. Key discoveries from the workshop included the international focus teams’ plans and focus topics for the 2017 roadmap, top-level needs and challenges, and linkages among the teams. Additionally, the IRDS leadership invited presentations from the European and Japanese roadmap initiatives. This resulted in the 2017 IRDS global membership expanding to include team members from the “NanoElectronics Roadmap for Europe: Identification and Dissemination” (NEREID) sponsored by the European Semiconductor Industry Association (ESIA), and the “Systems and Design Roadmap of Japan” (SDRJ) sponsored by the Japan Society of Applied Physics (JSAP).

The IRDS team and its supporters will convene 1-3 April 2017 in Monterey, California, for the Spring IRDS Workshop, which is part of the 2017 IEEE International Reliability Physics Symposium (IRPS). The team will meet again for the Fall IRDS Conference—in partnership with the 2017 IEEE International Conference on Rebooting Computing (ICRC)—scheduled for 6-7 November 2017 in Washington, D.C. More information on both events can be found here: http://irds.ieee.org/events.

IEEE RC is a program of IEEE Future Directions, designed to develop and share educational tools, events, and content for emerging technologies.

IEEE-SA’s IC Program helps incubate new standards and related products and services, by facilitating collaboration among organizations and individuals as they hone and refine their thinking on rapidly changing technologies.

Leti, a research institute of CEA Tech, is marking its 50th anniversary this year during industry events and workshops in Grenoble, Tokyo, and Taipei and at both SEMICON West and IEDM 2017 in San Francisco.

Founded in 1967 as an electronics research division of the French Atomic Energy Commission, Leti evolved into a global leader in micro- and nanotechnologies tailoring differentiating applicative solutions.

Leti solutions target a wide variety of sectors, including sustainable transport systems, telecommunications, health, consumer electronics, energy, smart cities, defense and security and space. Leti has formed partnerships with world leaders of industry, such as IBM, Intel, Qualcomm and Applied Materials.

Among Leti’s 60 startups are Soitec and the company that became STMicroelectronics.

Leti miniaturization technologies in everyday life

Leti’s iconic low-power FD-SOI technology can be found in game consoles, GPS receivers, connected watches and many other everyday connected devices.  The institute’s accelerometer that automatically switches between portrait and landscape can now be found in millions of smartphones, along with Leti’s radio-frequency technologies. Leti also develops technology for health care, such as scanners and exoskeletons to increase quality of life for people affected with quadriplegia. Leti serves the defense and security industries with infrared technologies.

“Leti is an innovation institute,” said Marie Semeria, Leti’s CEO. “It is unique in the world because it embraces a broad diversity of technologies: CMOS, sensors, communication systems, packaging and 3D integration, power electronics, imaging, integrated circuits and many more. We will emphasize both Leti’s cultural of pioneering research and its technological strengths throughout this 50th anniversary year and on our redesigned website.”

Leti 50th anniversary worldwide events throughout the year

JUNE 28-29: FRANCE

Leti Innovation Days 

Leti and partners will discuss how microelectronics can make a difference in health care, address environmental concerns in a competitive world and help industrials and society embrace the digital revolution during its Leti Innovation Days, June 28-29, in Grenoble. Keynote sessions on June 28 will be followed on June 29 by an immersive exhibition packed with technology demonstrators, proof of concepts, a start-up corner and offering dynamic presentations on three routes to innovation in digital transformation, new frontiers in health care and electronics-driven environmental change. The institute will host a gala anniversary dinner event at Chateau de Sassenage.

OCTOBER: JAPAN & TAIWAN

Leti Day

Leti also will host one-day Leti Day events in Tokyo and Taiwan during the second week of October.

JULY & DECEMBER: USA

Leti Workshops

Anniversary-year events will conclude with workshops July 11 at SEMICON West in San Francisco and the International Electron Devices Meeting (IEDM 2017) Dec. 3 in San Francisco.

aicha-evans_1Intel Corporation today announced the appointment of Aicha S. Evans as chief strategy officer, effective immediately. She will be responsible for driving Intel’s long-term strategy to transform from a PC-centric company to a data-centric company, as well as leading rapid decision making and company-wide execution of the strategy.

“Aicha is an industry visionary who will help our senior management team and the board of directors focus on what’s next for Intel,” Intel CEO Brian Krzanich said. “Her new role reflects her strong strategic leadership across Intel’s business, most importantly in 5G and other communications technology. Her invaluable expertise will contribute to the company’s long-term strategy and product portfolio.”

“I look forward to working across the company to advance Intel’s ongoing transformation,” Evans said. “We have an exciting future ahead us.”

Evans is an Intel senior vice president and has been responsible for wireless communications for the past nine years. Most recently, she was the general manager of the Communication and Devices Group. Evans joined Intel in 2006 and is based in Santa Clara, Calif. In her new role, she will report to Intel CFO Bob Swan.

An internal and external search is underway for a new general manager of Intel’s Communication and Devices Group.

Imec is granting its Lifetime of Innovation Award to Dr. Kinam Kim, President and General Manager of Semiconductor Business at Samsung Electronics. The selection recognizes Dr. Kim’s leadership and strategic vision, as well as his undeniable impact in the semiconductor industries.

The award ceremony will take place on May 16, during the global edition of the Imec Technology Forum (ITF), one of Europe’s leading tech events on technologies and solutions that will drive groundbreaking innovation across sectors in nano-electronics and the Internet of Things, smart health, smart cities, smart industries and smart energy.

“Dr. Kim has been a driving force at Samsung for more than 30 years, and the beacon the industry has used to navigate towards further innovations and technological breakthroughs in memory and computing,” states Luc Van den hove, president and CEO of imec. “His unparalleled contributions, leadership and strategic vision have not only paved the way for Samsung’s role as a world leader in the field, but have also shaped today’s society and our relation with computers, mobile and other similar devices.”

Dr. Kim joined Samsung Electronics in 1981, and led the development and advancement of various memory technologies such as DRAM and NAND flash, and logic technologies such as Application Processor and Communication Modem. As CEO of Samsung Advanced Institute of Technology (SAIT), he spearheaded the research and development of technologies that have significantly impacted the semiconductor industry, such as graphene, carbon nanotubes and quantum dots, advanced materials, 3D fusion technologies, batteries and printed electronics.

Imec’s Lifetime of Innovation Award was launched in 2015, in support of imec’s commitment to recognizing the prominent individuals who have made outstanding contributions to the industry. Previous recipients were Dr. Morris Chang in 2015 and Dr. Gordon Moore in 2016.

dr kim samsung

Brigham Young University researchers have developed new glass technology that could add a new level of flexibility to the microscopic world of medical devices.

A graduate student at BYU holds up a disc of microchips that have flexible glass membranes. Credit: Jaren Wilkey/BYU Photo

A graduate student at BYU holds up a disc of microchips that have flexible glass membranes. Credit: Jaren Wilkey/BYU Photo

Led by electrical engineering professor Aaron Hawkins, the researchers have found a way to make the normally brittle material of glass bend and flex. The research opens up the ability to create a new family of lab-on-a-chip devices based on flexing glass.

“If you keep the movements to the nanoscale, glass can still snap back into shape,” Hawkins said. “We’ve created glass membranes that can move up and down and bend. They are the first building blocks of a whole new plumbing system that could move very small volumes of liquid around.”

While current lab-on-a-chip membrane devices effectively function on the microscale, Hawkins’ research, recently published in Applied Physics Letters, will allow equally effective work at the nanoscale. Chemists and biologists could use the nanoscale devices to move, trap and analyze very small biological particles like proteins, viruses and DNA.

So why work with glass? According to lead study author and BYU Ph.D. student John Stout, glass has some great perks: it’s stiff and solid and not a material upon which things react, it’s easy to clean, and it isn’t toxic.

“Glass is clean for sensitive types of samples, like blood samples,” Stout said. “Working with this glass device will allow us to look at particles of any size and at any given range. It will also allow us to analyze the particles in the sample without modifying them.”

The researchers believe their device could also mean performing successful tests using much smaller quantities of a substance. Instead of needing several ounces to run a blood test, the glass membrane device created by Hawkins, Stout and coauthor Taylor Welker would only require a drop or two of blood.

Hawkins said the device should also allow for faster analysis of blood samples: “Instead of shipping a vial of blood to a lab and have it run through all those machines and steps, we are creating devices that can give you an answer on the spot.”

There is an increased demand for portable on-site rapid testing in the healthcare industry. Much of this is being realized through these microfluidic systems and devices, and the BYU device could take that testing to the next level of detail.

“This has the promise of being a rapid delivery of disease diagnosis, cholesterol level testing and virus testing,” Hawkins said. “In addition, it would help in the process of healthcare knowing the correct treatment method for the patient.”

Intel Corporation today announced that Omar Ishrak and Greg Smith have been elected to Intel’s board of directors.

“We are very pleased to welcome two new, independent directors with the depth of leadership experience at innovative, global companies that both Mr. Ishrak and Mr. Smith bring,” said Intel Chairman Andy Bryant. “We look forward to their valuable contributions as Intel continues to transform itself for growth in emerging, adjacent market segments.”

Omar-IshrakIshrak, 61, is the chairman and chief executive officer of Medtronic, a global leader in medical technology. He has served in that role since 2011. Prior to joining Medtronic, he spent 16 years in various roles with General Electric Company, most recently as president and chief executive officer of GE Healthcare Systems, a division of GE Healthcare. He is a member of the board of trustees of the Asia Society, which promotes mutual understanding and strengthening partnerships among peoples, leaders and institutions of Asia and the United States in a global context, and a member of the board of directors for Minnesota Public Radio.

Smith, 50, is the chief financial officer and executive vice president of corporate development and strategy at Boeing, the world’s largest aerospace and defense company. He has served as Boeing’s finance leader since 2012 and its strategy leader since 2015. Previously, Smith held various leadership roles across Boeing’s finance function and operations. He rejoined Boeing in 2008 after serving for four years as vice president of global investor relations at Raytheon. Smith serves on the board of trustees for the Chicago Museum of Science and Industry, and the board of directors of the Economic Club of Chicago, the Chicago Botanic Garden and the Northwestern Medicine Community Physicians Group.

Over 60,000 attendees are expected at SEMICON China opening tomorrow at Shanghai New International Expo Centre (SNIEC). SEMICON China (March 14-16) offers the latest in technology and innovation for the electronics manufacturing industry. FPD China is co-located with SEMICON China, providing opportunities in this related market. Featuring nearly 900 exhibitors occupying nearly 3,000 booths, SEMICON China is the largest gathering of its kind in the world.

Worldwide fab equipment spending is expected to reach an industry all-time record, to more than US$46 billion in 2017, according to the latest version of the SEMI (www.semi.org) World Fab Forecast. In 2018, the record may break again, with spending close to the $50 billion mark.  SEMI forecasts that China will be third ($6.7 billion) for regional fab equipment spending in 2017, but its spending in 2018 may reach $10 billion – which would be a 55 percent increase year-over-year, placing China in second place for worldwide fab equipment spending in 2018.

On March 14, keynotes at SEMICON China include SMIC chairman of the Board Zhou Zixue. ASE Group director and COO Tien Wu, ASML president and CEO Peter Wennink, Intel VP Jun He, Lam Research CEO Martin Anstice, TEL CTO Sekiguchi Akihisa and imec president and CEO Luc Van den hove.

SEMICON China programs expand attendees’ knowledge, networking reach, and business opportunities. Programs this year feature a broad and deep range:

  • CSTIC: On March 12-13, the China Semiconductor Technology International Conference (CSTIC) precedes SEMICON China. CSTIC is organized by SEMI and imec and covers all aspects of semiconductor technology and manufacturing.
  • Technical and Business Programs: 
    • March 14: China Memory Strategic Forum.
    • March 15: Building China’s IC Ecosystem, Green High-Tech Facility Forum, and Smart Manufacturing Forum, in addition Power & Compound Semiconductor Forum (Day 1).
    • March 16: Smart Automotive Forum, MEMS & Sensors Conference Asia, plus Power & Compound Semiconductor Forum (Day 2)
  • Tech Investment Forum: On March 15, an international platform to explore investment, M&A, and China opportunities.
  • Theme Pavilions:  SEMICON China also features six exhibition floor theme pavilions: IC Manufacturing, LED and Sapphire, ICMTIA/Materials, MEMS, Touch Screen and OLED.
  • Networking Events: SEMI Industry Gala, China IC Night, and SEMI Golf Tournament

For additional information on sessions and events at SEMICON China 2017, please visit www.semiconchina.org/en/4.

Eutelsat Communications (NYSE Euronext Paris: ETL),a satellite operator, and STMicroelectronics (NYSE: STM) have achieved a new milestone with a new-generation chip that will power Eutelsat’s SmartLNB interactive terminal.

ST’s advanced, low-power System-on-Chip (STiD337) represents a big step down in the overall cost of interactive satellite terminals. The STiD337’s first adoption is in Eutelsat’s SmartLNB, lowering cost, upgrading service, and significantly reducing power consumption.

The SmartLNB is an electronic feed that replaces the traditional Ku-band reception of DTH satellite signals, embedding one or more satellite tuners/demodulators directly inside the LNB (low-noise block) and adding a narrowband return link optimized for transmissions of IP packets. The SmartLNB enables a wide range of connected TV applications, providing a transparent bidirectional IP link compatible with existing services. Not limited to the TV and broadcast market, applications also cover the exploding sector of connected objects (Machine-to-Machine, Internet of Things, SCADA, home-automation, Smart Buildings, etc.) with a cost-effective solution via satellite.

ST has employed its very low-power 28nm FD-SOI (Fully Depleted Silicon on Insulator) process technology that enables deep sleep and auto wake up for the system. With a maximum 3.5W power dissipation at full speed and less than 50mW (typical) during sleep, the STiD337 is the most power-efficient device available today to take the SmartLNB to a new level of performance and efficiency.

The STiD337 adds the latest DVB-S2X satellite standard for the forward link, as well as GSE (Generic Stream Encapsulation) for efficient data handling; it can achieve throughput of over 100Mb/sec. The return path implements a software-radio approach that is optimized for the enhanced spread-spectrum technique with asynchronous access typically used for the SmartLNB. The device also includes the full complement of hardware mechanisms to support real-time multiple-access techniques. The return modulation is calculated on the internal processors. The platform includes a dual ARM Cortex-A9 core with NEON co-processors and four ST231 DSP offload coprocessors to enhance its compute power and ensure complete flexibility in the choice of return-channel modulation type.

The new SoC will be available in secure and standard versions. The secure version includes pre-loaded encryption keys, serial numbers, safe-boot, and many other features to increase the level of protection of data-delivering and gathering operations by the SmartLNB.

“We wanted a step change in the cost and performance for the next generation of our SmartLNB interactive service. We know from our customers that security is a major concern and we wanted to address that head on. Furthermore, with satellite terminals becoming more ubiquitous and employed in a greater range of use cases we needed to pay even greater attention to power consumption,” said Antonio Arcidiacono, Director of Innovation at Eutelsat. “The design objectives we set have all been met and we’re aiming to roll out higher-performance, lower-cost, secure, and above all, lower-power consumption SmartLNB terminals based on ST’s new satellite SoC by the end of 2017.”

“Working closely with Eutelsat, we’ve developed the lowest-cost, lowest-power, secure, and most advanced interactive satellite-modem SoC to date,” said Jocelyne Garnier, Group VP, General Manager, Aerospace, Defense, and Legacy Division, STMicroelectronics. “From the outset we knew we could bring innovations to the market that played to many of the strengths we have in ST, especially in digital satellite systems, our system-on-chip experience, our low-power technologies, and of course, our security IP.”

ST provides a hardware evaluation platform, a Linux-based operating system, and a basic driver set. Final production samples of the STiD337 are available now and full production is scheduled for May 2017. Further information is available on ST.com and under NDA.