Category Archives: Manufacturing

By Christian G. Dieseldorff, Industry Research & Statistics Group at SEMI 

Data from SEMI’s recently updated World Fab Forecast report reveal that 62 new Front End facilities will begin operation between 2017 and 2020.  This includes facilities and lines ranging from R&D to high volume fabs, which begin operation before high volume ramp commences.  Most of these newly operating facilities will be volume fabs; only 7 are R&Ds or Pilot facilities.

Between 2017 and 2020, China will see 26 facilities and lines beginning operation, about 42 percent of the worldwide total currently tracked by SEMI.  The majority of the facilities starting operation in 2018 are Chinese-owned companies. The peak for China in 2018 comes mainly from foundry facilities (54 percent). The Americas region follows with 10 facilities, and Taiwan with 9 facilities. See Figure 1.

Figure 1 depicts the regions in which new facilities will begin operation.

Figure 1 depicts the regions in which new facilities will begin operation.

By product type, the forecast for new facilities and lines include: 20 (32 percent) are forecast to be foundries, followed by 13 Memory (21 percent), seven LED (11 percent), six Power (10 percent) and five MEMS (8 percent). See Figure 2

Figure 2: New facilities & lines starting operation by product type from 2017 to 2020

Figure 2: New facilities & lines starting operation by product type from 2017 to 2020

Because the forecast extends several years, it includes facilities and lines of all probabilities, including rumored projects and projects which have been announced, but have a low probability of actually happening.  See Table 1.

FabForecast-table1

 

Probabilities of less than 50 percent are considered unconfirmed, while a probability of 80 to 85 percent means that the facility is currently in construction mode.  Projects with 90 percent probability are currently equipping. As the forecast gets farther out, more of the projects have lower probabilities.

The projects under construction, or soon to be under construction, will be key drivers in equipment spending for this industry over the next several years — with China expected to be the key spending market.

SEMI’s World Fab Forecast provides detailed information about each of these fab projects, such as milestone dates, spending, technology node, products, and capacity information. Since the last publication in August 2016, the research team has made 249 changes on 222 facilities/lines.

The World Fab Forecast Report, in Excel format, tracks spending and capacities for over 1,100 facilities including future facilities across industry segments from Analog, Power, Logic, MPU, Memory, and Foundry to MEMS and LEDs facilities.  Using a bottoms-up approach methodology, the SEMI Fab Forecast provides high-level summaries and graphs, and in-depth analyses of capital expenditures, capacities, technology and products by fab.

The SEMI Worldwide Semiconductor Equipment Market Subscription (WWSEMS) data tracks only new equipment for fabs and test and assembly and packaging houses.  The SEMI World Fab Forecast and its related Fab Database reports track any equipment needed to ramp fabs, upgrade technology nodes, and expand or change wafer size, including new equipment, used equipment, or in-house equipment. Also check out the Opto/LED Fab Forecast.

Learn more about the SEMI fab databases at: www.semi.org/en/MarketInfo/FabDatabase and www.youtube.com/user/SEMImktstats.

The next time you place your coffee order, imagine slapping onto your to-go cup a sticker that acts as an electronic decal, letting you know the precise temperature of your triple-venti no-foam latte. Someday, the high-tech stamping that produces such a sticker might also bring us food packaging that displays a digital countdown to warn of spoiling produce, or even a window pane that shows the day’s forecast, based on measurements of the weather conditions outside.

Engineers at MIT have invented a fast, precise printing process that may make such electronic surfaces an inexpensive reality. In a paper published today in Science Advances, the researchers report that they have fabricated a stamp made from forests of carbon nanotubes that is able to print electronic inks onto rigid and flexible surfaces.

A. John Hart, the Mitsui Career Development Associate Professor in Contemporary Technology and Mechanical Engineering at MIT, says the team’s stamping process should be able to print transistors small enough to control individual pixels in high-resolution displays and touchscreens. The new printing technique may also offer a relatively cheap, fast way to manufacture electronic surfaces for as-yet-unknown applications.

“There is a huge need for printing of electronic devices that are extremely inexpensive but provide simple computations and interactive functions,” Hart says. “Our new printing process is an enabling technology for high-performance, fully printed electronics, including transistors, optically functional surfaces, and ubiquitous sensors.”

Sanha Kim, a postdoc in MIT’s departments of Mechanical Engineering and Chemical Engineering, is the lead author, and Hart is the senior author. Their co-authors are mechanical engineering graduate students Hossein Sojoudi, Hangbo Zhao, and Dhanushkodi Mariappan; Gareth McKinley, the School of Engineering Professor of Teaching Innovation; and Karen Gleason, professor of chemical engineering and MIT’s associate provost.

A stamp from tiny pen quills

There have been other attempts in recent years to print electronic surfaces using inkjet printing and rubber stamping techniques, but with fuzzy results. Because such techniques are difficult to control at very small scales, they tend to produce “coffee ring” patterns where ink spills over the borders, or uneven prints that can lead to incomplete circuits.

“There are critical limitations to existing printing processes in the control they have over the feature size and thickness of the layer that’s printed,” Hart says. “For something like a transistor or thin film with particular electrical or optical properties, those characteristics are very important.”

Hart and his team sought to print electronics much more precisely, by designing “nanoporous” stamps. (Imagine a stamp that’s more spongy than rubber and shrunk to the size of a pinky fingernail, with patterned features that are much smaller than the width of a human hair.) They reasoned that the stamp should be porous, to allow a solution of nanoparticles, or “ink,” to flow uniformly through the stamp and onto whatever surface is to be printed. Designed in this way, the stamp should achieve much higher resolution than conventional rubber stamp printing, referred to as flexography.

Kim and Hart hit upon the perfect material to create their highly detailed stamp: carbon nanotubes — strong, microscopic sheets of carbon atoms, arranged in cylinders. Hart’s group has specialized in growing forests of vertically aligned nanotubes in carefully controlled patterns that can be engineered into highly detailed stamps.

“It’s somewhat serendipitous that the solution to high-resolution printing of electronics leverages our background in making carbon nanotubes for many years,” Hart says. “The forests of carbon nanotubes can transfer ink onto a surface like massive numbers of tiny pen quills.”

Printing circuits, roll by roll

To make their stamps, the researchers used the group’s previously developed techniques to grow the carbon nanotubes on a surface of silicon in various patterns, including honeycomb-like hexagons and flower-shaped designs. They coated the nanotubes with a thin polymer layer (developed by Gleason’s group) to ensure the ink would penetrate throughout the nanotube forest and the nanotubes would not shrink after the ink was stamped. Then they infused the stamp with a small volume of electronic ink containing nanoparticles such as silver, zinc oxide, or semiconductor quantum dots.

The key to printing tiny, precise, high-resolution patterns is in the amount of pressure applied to stamp the ink. The team developed a model to predict the amount of force necessary to stamp an even layer of ink onto a substrate, given the roughness of both the stamp and the substrate, and the concentration of nanoparticles in the ink.

To scale up the process, Mariappan built a printing machine, including a motorized roller, and attached to it various flexible substrates. The researchers fixed each stamp onto a platform attached to a spring, which they used to control the force used to press the stamp against the substrate.

“This would be a continuous industrial process, where you would have a stamp, and a roller on which you’d have a substrate you want to print on, like a spool of plastic film or specialized paper for electronics,” Hart says. “We found, limited by the motor we used in the printing system, we could print at 200 millimeters per second, continuously, which is already competitive with the rates of industrial printing technologies. This, combined with a tenfold improvement in the printing resolution that we demonstrated, is encouraging.”

After stamping ink patterns of various designs, the team tested the printed patterns’ electrical conductivity. After annealing, or heating, the designs after stamping — a common step in activating electronic features — the printed patterns were indeed highly conductive, and could serve, for example, as high-performance transparent electrodes.

Going forward, Hart and his team plan to pursue the possibility of fully printed electronics.

“Another exciting next step is the integration of our printing technologies with 2-D materials, such as graphene, which together could enable new, ultrathin electronic and energy conversion devices,” Hart says.

Researchers in AMBER, the Science Foundation Ireland-funded materials science research centre, hosted in Trinity College Dublin, have used the wonder material graphene to make the novelty children’s material silly putty (polysilicone) conduct electricity, creating extremely sensitive sensors. This world first research, led by Professor Jonathan Coleman from TCD and in collaboration with Prof Robert Young of the University of Manchester, potentially offers exciting possibilities for applications in new, inexpensive devices and diagnostics in medicine and other sectors. The AMBER team’s findings have been published this week in the leading journal Science*.

Prof Coleman, Investigator in AMBER and Trinity’s School of Physics along with postdoctoral researcher Conor Boland, discovered that the electrical resistance of putty infused with graphene (“G-putty”) was extremely sensitive to the slightest deformation or impact. They mounted the G-putty onto the chest and neck of human subjects and used it to measure breathing, pulse and even blood pressure. It showed unprecedented sensitivity as a sensor for strain and pressure, hundreds of times more sensitive than normal sensors. The G-putty also works as a very sensitive impact sensor, able to detect the footsteps of small spiders. It is believed that this material will find applications in a range of medical devices.

Prof Coleman said, “What we are excited about is the unexpected behaviour we found when we added graphene to the polymer, a cross-linked polysilicone. This material as well known as the children’s toy silly putty. It is different from familiar materials in that it flows like a viscous liquid when deformed slowly but bounces like an elastic solid when thrown against a surface. When we added the graphene to the silly putty, it caused it to conduct electricity, but in a very unusual way. The electrical resistance of the G-putty was very sensitive to deformation with the resistance increasing sharply on even the slightest strain or impact. Unusually, the resistance slowly returned close to its original value as the putty self-healed over time.”

He continued, “While a common application has been to add graphene to plastics in order to improve the electrical, mechanical, thermal or barrier properties, the resultant composites have generally performed as expected without any great surprises. The behaviour we found with G-putty has not been found in any other composite material. This unique discovery will open up major possibilities in sensor manufacturing worldwide.”

Professor Mick Morris, Director of AMBER, said: “This exciting discovery shows that Irish research is at the leading edge of materials science worldwide. Jonathan Coleman and his team in AMBER continue to carry out world class research and this scientific breakthrough could potentially revolutionise certain aspects of healthcare.”

The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, today announced worldwide sales of semiconductors reached $30.5 billion for the month of October 2016, an increase of 3.4 percent from last month’s total of $29.5 billion and 5.1 percent higher than the October 2015 total of $29.0 billion. All monthly sales numbers are compiled by the World Semiconductor Trade Statistics (WSTS) organization and represent a three-month moving average. Additionally, a new WSTS industry forecast projects roughly flat annual semiconductor sales in 2016, followed by slight market growth in 2017 and 2018.

“The global semiconductor market has rebounded in recent months, with October marking the largest year-to-year sales increase since March 2015,” said John Neuffer, president and CEO, Semiconductor Industry Association. “Sales increased compared to last month across all regional markets and nearly every major semiconductor product category. Meanwhile, the latest industry forecast has been revised upward and now calls for flat annual sales in 2016 and small increases in 2017 and 2018. All told, the industry is well-positioned for a strong close to 2016.

Regionally, year-to-year sales increased in China (14.0 percent), Japan (7.2 percent), Asia Pacific/All Other (1.9 percent), and the Americas (0.1 percent), but decreased in Europe (-3.0 percent). Compared with last month, sales were up across all regional markets: the Americas (6.5 percent), China (3.2 percent), Japan (3.0 percent), Europe (2.2 percent), and Asia Pacific/All Other (2.0 percent).

Additionally, SIA today endorsed the WSTS Autumn 2016 global semiconductor sales forecast, which projects the industry’s worldwide sales will be $335.0 billion in 2016, a 0.1 percent decrease from the 2015 sales total. WSTS projects a year-to-year increase in Japan (3.2 percent) and Asia Pacific (2.5 percent), with decreases expected in Europe (-4.9 percent) and the Americas (-6.5 percent). Among major semiconductor product categories, WSTS forecasts growth in 2016 for sensors (22.6 percent), discretes (4.2 percent), analog (4.8 percent) and MOS micro ICs (2.3 percent), which include microprocessors and microcontrollers.

Beyond 2016, the semiconductor market is expected to grow at a modest pace across all regions. WSTS forecasts 3.3 percent growth globally for 2017 ($346.1 billion in total sales) and 2.3 percent growth for 2018 ($354.0 billion). WSTS tabulates its semi-annual industry forecast by convening an extensive group of global semiconductor companies that provide accurate and timely indicators of semiconductor trends.

ClassOne Technology, manufacturer of cost-efficient wet processing equipment for ≤200mm substrates, has reported its best-ever sales quarter and is currently doubling its Kalispell manufacturing capacity to meet the demand.

“We’ve been seeing a steady increase in market interest and sales,” said ClassOne Technology President, Kevin Witt. “Most of these users are now focusing on capabilities they couldn’t get before, like wafer-level packaging and More than Moore technologies.”

Witt explained that wafer-level packaging (WLP) has been used for some time with 300mm and larger substrates — but the equipment has not been available for 200mm. “Fortunately, ClassOne focuses specifically on the smaller-wafer markets,” said Witt. “At a very affordable price, we deliver the new technology and advanced 3D features they’re looking for. For example, our Solstice® line of multifunctional electroplating systems enables high-efficiency Cu Through Silicon Via (TSV), Pillar, Bump and Barrier Plating and other capabilities that WLP requires. And that’s one major reason they’re coming to us.”

ClassOne reports that many of the new buyers are keenly interested in More than Moore (MtM) technologies to increase functionality while reducing cost per device. They are producing compound semiconductors, LEDs, MEMS, RF, Wi-Fi and a range of IoT-related sensors and other devices. ClassOne cites the combination of ≤200mm-specific tools, advanced capabilities and affordable pricing as the primary driver behind the current equipment-buying surge in emerging markets.

ClassOne Technology offers a selection of new-technology wet processing tools designed for 75mm to 200mm wafer users. These include three different models of Solstice electroplating systems for production and development as well as the Trident families of Spin-Rinse-Dryers and Spray Solvent Tools. All are priced at less than half of what similarly configured systems from the larger manufacturers would cost — which is why the ClassOne lines are often described as delivering “Advanced Wet Processing for the Rest of Us.”

EV Group (EVG), a supplier of wafer bonding and lithography equipment, together with the Korea National NanoFab Center (President Jae Young Lee, NNFC), a nano-technology R&D infrastructure for academia, research institutes and the industry, announced preliminary results on improved transparent nanostructured anti-reflective coatings for next-generation displays. The ongoing work has been carried out within a joint-development program (JDP) established between the two partners in November 2015. This collaborative research has been partly funded by the Nano-Open-Innovation-Lab Project of the NNFC.

Korea National NanoFab Center (NNFC)

Korea National NanoFab Center (NNFC)

The goal of the EVG-NNFC JDP is the development of optimized materials, the process technology for structure replication, and the industrial implementation of the AR coatings for large-area substrates. The NNFC research team under its director Dr. Jae Hong Park is responsible for the development of the materials and the “reversible nano-molding” process, which can be compatible with EVG’s proprietary SmartNIL UV-nanoimprint lithography (UV-NIL) technology. EVG is responsible for optimizing the UV-NIL replication process and transferring the technology from the R&D phase on current 200mm round substrates to large panel sizes.

Outstanding preliminary results

EVG and the NNFC have successfully demonstrated an anti-reflective coating with excellent structure replication that provides over 97-percent transmittance and a surface hardness of 3H, which is superior to most other polymeric coatings. By contrast, current commercial thin-film coatings only provide up to 92-percent transmittance. The JDP partners achieved these results by applying EVG’s SmartNIL technology on 200-mm round substrates using a polymer material developed by the NNFC. This material was developed for performing the reversible nano molding process at the NNFC, and is compliant with commercial standards for display coating.

In the next phase of the program, EVG and the NNFC plan to promote these promising results to initiate partnerships with end-users that are interested in joining the JDP to help commercialize the new AR coating. The goal of this next phase is the qualification of the novel anti-reflective coating technology for industrial use through the NNFC, and the implementation of the process by EVG to high-volume panel manufacturing on large screen sizes, such as Gen 2 (370 mm x 470 mm) panels and beyond. In addition to this specific project, EVG and the NNFC plan to investigate other application areas leveraging nanostructures and NIL technology.

“As part of our Triple-i philosophy of invent-innovate-implement, EV Group has a long history of engagements with groups across the nanotechnology value chain–from research institutes and materials suppliers to manufacturers–to develop new processes and devices, and bring them into production,” stated WeonSik Yang, general manager of EV Group Korea, Ltd. “We’re pleased to have the opportunity to participate in this level of cooperation with our partners in Korea, namely the NNFC, and see the efforts of our previous cooperation bearing fruit. On behalf of EVG, I would like to extend my sincerest thanks to Dr. Jae Hong Park as well as NNFC President Jae Young Lee for their dedication and support for this project. We look forward to working with local industrial partners to commercialize this novel display coating technology and process to support large-area display manufacturing.”

EVG and the NNFC presented the results of this JDP at the recent NANO KOREA symposium and exhibition in Goyang, Korea. A copy of the poster summarizing the results can be downloaded at http://www.evgroup.com/en/about/news/2016_12_NNFC/.

 

The National NanoFab Center (NNFC) is a nanotechnology and semiconductors R&D center, located in Daejeon City, Korea.

Delivering a power punch


December 5, 2016

Energy storage units that can be integrated into wearable and flexible electronic systems are becoming increasingly important in today’s world. A research team from KAUST has now developed a microsupercapacitor that exploits three-dimensional porous electrodes. These micropower units are expected to enable a new generation of “smart”products, such as self-powered sensors for wearables, security, structural health monitoring and “internet of things” applications.

Three-dimensional porous electrodes could lead to smaller and efficient integrated power sources.

Three-dimensional porous electrodes could lead to smaller and efficient integrated power sources.

However, for these units to be tiny yet still efficient, the highest energy density must go into the smallest area.

One approach to carrying this out is to construct microbatteries using films with a thickness of just a few micrometers or less and to replace traditional electrolytes with solid-state ones. Thin film batteries have demonstrated relatively high energy density, which is the amount of energy they can store in a given area. However, they are afflicted by limited cycle life and poor power density, meaning they are slow to charge and discharge.

Microsupercapacitors are a faster alternative, and these may prove suitable for applications requiring power pulsing and very long cycle life.

“Also, while batteries must be charged at a constant voltage, a supercapacitor charges most efficiently by drawing the maximum current that the source can supply, irrespective of voltage,” said KAUST Professor of Material Science and Engineering Husam Alshareef from the University’s Functional Nanomaterials & Devices group.

This makes supercapacitors more appealing for self-powered system applications where the power source may be intermittent.

Alshareef’s team has now developed integrated microsupercapacitors with vertically-scaled three-dimensional porous current collectors made from nickel foams to improve microsupercapacitor performance. The pores in the foam work to increase the surface area.

“This three-dimensional porous architecture allows excellent electrolyte permeability, good conductivity and faster ion transportation with maximum mass-loading of active material, which increase energy and power density in a given area,” Alshareef said.

The microsupercapacitors were also asymmetric, using two different electrode materials for the cathode (nickel cobalt sulfide) and anode (carbon nanofiber), which nearly doubled the operating voltage. As a result, while delivering high power density (four milliwatts per square centimeter), the microsupercapacitors had an energy density of 200 microwatt-hours per square centimeter.

This is superior to state-of-the-art microsupercapacitors, which achieve between one and forty microwatt-hours per square centimeter, and is comparable to various types of thin film batteries. These high capacities were maintained even after 10,000 operating cycles.

“The high energy and power density achieve in these devices may meet the demand of on-chip storage for various types of integrated microsystems,” noted KAUST Ph.D. student Qiu Jiang, the lead author of the study.

QuickLogic Corporation (NASDAQ: QUIK), a developer of ultra-low power programmable sensor processing, display bridge and programmable logic solutions, today announced that it has joined GLOBALFOUNDRIES’ FDXcelerator Partner Program, a collaborative ecosystem that facilitates 22FDX system-on-chip (SoC) design and reduces time-to-market for customers.

“QuickLogic’s partnership with GLOBALFOUNDRIES adds a unique dimension to the FDX program by offering customers ultra-low power embedded FPGA (eFPGA) Intellectual Property, complete software tools and a compiler,” said Brian Faith, president and CEO at QuickLogic Corporation. “This new capability provides users with a high level of design and product flexibility which will help lower costs and allow products to be easily customized to meet various and evolving market requirements.”

“GLOBALFOUNDRIES’ FDXcelerator program is a comprehensive design ecosystem that provides customers with the support and resources they need to get FDX FD-SOI technologies to market as quickly as possible,” said Alain Mutricy, senior vice president of Product Management at GLOBALFOUNDRIES. “Leveraging QuickLogic’s FPGA expertise will provide inherent hardware flexibility for FDX-based SoC designs and gain a critical time-to-market advantage for a broad range of embedded, battery powered and IoT applications.”

The FDXcelerator Partner Program builds upon GLOBALFOUNDRIES’ industry-first FD-SOI roadmap, a lower-cost migration path for designers on advanced nodes that is optimized for low power applications. By participating, FDXcelerator Partners commit to provide specific resources, including EDA tools, IP, silicon platforms, reference designs, design services and packaging and test solutions. The program is based on an open framework which enables members to minimize development time and cost while simultaneously leveraging the inherent power and performance advantages of FDX technology.

Current members of the FDXcelerator Partner Program also include Synopsys, Cadence, INVECAS, VeriSilicon, CEA Leti, Dream Chip, and Encore Semi.

The Electronic Components and Systems for European Leadership (ECSEL) Joint Undertaking announced the Lab4MEMS project as the winner of its 2016 Innovation Award during the European Nanoelectronics Forum, in Rome, Italy.

At its launch in January 2014, Lab4MEMS was identified as a Key Enabling Technology Pilot-Line project for next-generation Micro-Electro-Mechanical Systems (MEMS) devices augmented with advanced technologies such as piezoelectric or magnetic materials and 3D packaging to enhance the next generation of smart sensors, actuators, micro-pumps, and energy harvesters. These technologies were recognized as important contributors to future data-storage, printing, healthcare, automotive, industrial-control, and smart-building applications, as well as consumer applications such as smartphones and navigation devices.

In accepting the award, Roberto Zafalon, General Project Coordinator of Lab4MEMS and the European Programs Manager in R&D and Public Affairs for STMicroelectronics Italy said, “The ECSEL Innovation Award highlights the excellent results the Lab4MEMS team achieved through the project’s execution and the high impact of its successes. In particular, Lab4MEMS developed innovative MEMS solutions with advanced piezoelectric and magnetic materials, including advanced 3D Packaging technologies.”

In coordinating the €28m[1], 36-month Lab4MEMS project, ST led the team of twenty partners, which included universities, research institutions, and technology businesses across ten European countries. ST’s MEMS facilities in Italy and Malta contributed their complete set of manufacturing competencies for next-generation devices, spanning design and fabrication to test and packaging to the project.

Lab4MEMS’ devices, technologies, and application improvements emphasized:

  • Micro-actuators, micro-pumps, sensors, and energy scavengers integrated on silicon-based MEMS using piezoelectric thin-films (PZT), for applications in Data Storage, Printing, Health Care, Automotive, Energy Scavenging, and Autofocus Lenses.
  • Magnetic-field sensors, for applications in consumer applications such as GPS positioning, indoor navigation, and mobile phones.
  • Advanced packaging technologies and vertical interconnections, including flip chip, Through Silicon Via (TSV) or Through Mold Via (TMV) for full 3D integration, which could be used in Consumer and Healthcare applications such as body-area sensors and remote monitoring.

All of these successes contributed to the Lab4MEMS project and are available to benefit the contributors. These participants were Politecnico di Torino (Italy); Fondazione Istituto Italiano di Tecnologia (Italy); Politecnico di Milano (Italy); Consorzio Nazionale Interuniversitario per la Nanoelettronica (Italy); Commissariat à l’Energie Atomique et aux énergies alternatives (France); SERMA Technologies SA (France); STMicroelectronics Ltd. (Malta); Universita ta Malta (Malta); Solmates BV (Netherlands); Cavendish Kinetics BV (Netherlands); Okmetic OYJ (Finland); VTT (Finland); Picosun OY (Finland); KLA-Tencor ICOS (Belgium); Universitatea Politehnica din Bucuresti (Romania); Instytut Technologii Elektronowej (Poland); Stiftelsen SINTEF (Norway); Sonitor Technologies AS (Norway); BESI GmbH (Austria).

Semiconductor Manufacturing International Corporation, the largest and most advanced foundry in mainland China, and The Institute of Microelectronics of the Chinese Academy of Sciences announced the signing of a cooperation agreement for a MEMS R&D foundry platform to jointly develop MEMS sensor standard processes and build a complete MEMS supply chain.

According to the agreement, SMIC and IMECAS will work together closely to take advantage of IMECAS’s experiences in MEMS Sensor design and packaging technology design and SMIC’s standardized process technology platforms, industry and market influence. Starting with the development of a MEMS environmental sensor and combining the features of other types of MEMS Sensors, SMIC and IMECAS will collaborate to create a platformbased standard as well as mass production technologies to shorten the development cycle from design to production, thus helping the MEMS industry grow more effectively and efficiently.

“SMIC’s R&D team has made a lot of achievements in developing new sensor technology platforms and introducing new customers. SMIC is willing to open our platforms to support commercialized production and the R&D of universities and research institutions,” said Dr. Tzu-Yin Chiu, Chief Executive Officer and Executive Director of SMIC. “SMIC and IMECAS have cooperated in numerous logic process development projects. This time we will expand our collaboration and promote the R&D of complete standardized MEMS sensor technologies to help integrate and improve the MEMS supply chain.”

Ye Tianchun, Director of IMECAS, visited SMIC’s middle-end production line of MEMS sensors and said, “Through the cooperation between SMIC and IMECAS, we can exploit our advantages and jointly build an open MEMS technology service platform and an electronic information integration platform for the MEMS supply chain. With the integration of design, manufacturing, packing, testing, public platform and venture investment, we can form a supply chain ecosystem and support the development of a global as well as domestic Chinese MEMS industry.”