Category Archives: Materials and Equipment

September 23, 2008: Nanobiotix, an emerging nanomedicine company focused on cancer therapy, announced that the European Patent Office (EPO) has issued Patent No. 1744789 to the company, related to its “novel activable particles that can be used in the health sector.”

More specifically, the patent protects “composite particles that can generate free radicals or heat when excited by X-rays, and to the uses thereof in health, particularly human. The inventive particles comprise an inorganic-based, and optionally organic-based, nucleus and can be activated in vivo, in order to label or alter cells, tissues or organs. (The patent protection) also relates to methods for the production of said particles, and to pharmaceutical or diagnostic compositions containing same.”

“We are extremely pleased that our platform technology, nanoXray, is now patent-protected throughout the European Union. We are hopeful that we will soon receive similar patent protection in the United States as well,” said Laurent Levy, president and CEO of Nanobiotix and co-president of the French Technology Platform on Nanomedicine (FTPN). “NanoXray is designed to allow the precise destruction of cancer cells via the controlled application of an outside-the-body energy source-a standard X-ray. Protecting this intellectual property is key to long-term commercial success.”

“The nanoXray platform allows for the controlled generation of physical reactions in targeted cells when triggered by the application of an external energy source – a standard X-ray. This may have significant ramifications for cancer therapy in the not-too-distant future,” added Paras N. Prasad, co-founder of Nanobiotix and executive director of the Institute for Lasers, Photonics and Biophotonics at SUNY (Buffalo).

ACAMP appoints Yallup as CTO


September 24, 2008

September 23, 2008: ACAMP, the Alberta Centre for Advanced Microsystems and Nanotechnology (MNT) products has appointed Dr. Kevin Yallup as chief technology officer, to lead the center’s product development efforts to build a world-class capability in Alberta for the packaging and assembly of micro- and nano-scale technology devices, turning them into market-ready commercial or industrial products and applications.

“We are very pleased Kevin joined our team,” said Ken Brizel CEO of ACAMP. “Kevin brings over 15 years experience in MNT product development from Europe to Alberta. In this role, Kevin will lead the ACAMP engineering team in supporting companies producing MNT products, through consultation, hands on design and development of state of the art packaging and assembly technologies.”

Yallup’s initial focus will be to provide practical industrial engineering support, purchase specific equipment and hire and help train the engineers needed to complete the team. ACAMP has established a class 1000 clean room, wet lab, metrology and test lab. State of the art assembly and packaging equipment is being put in place over the remainder of 2008 and beginning of 2009 including laser dicing, probers, gluing stations, Flip-Chip bonding and a host of test and reliability equipment which will facilitate the challenge of packaging micro and nano-products for prototyping and volume production for applications in energy, biomedical, agriculture, the environment, and information and communications technology.

September 22, 2008: A consortium of UK universities is developing unique nanostructures that respond to stimuli, such as pH, heat, and light will pave the way for safer, greener and more efficient chemical reactors.

The work involves designing and producing molecular metal oxides and polymers as building blocks, and engineering those blocks to form nanoscale structures, which are responsive to internal and/or external stimuli. The nanostructures, which can be dispersed in fluid, or coated on the reactor walls, can regulate reactions, momentum, and heat and mass transfer inside chemical reactors. As conditions inside the reactor change, the nanostructured particles respond by changing their size, shape, or structure. These changes could in turn alter transport properties such as thermal conductivity and viscosity, and catalyst activity — and hence regulate the reactions.


Chemical factory. (Source: U. of Leeds)

Professor Yulong Ding at the U. of Leeds’ Institute of Particle Science and Engineering, calls the research program “an important step towards producing the next generation of smart ‘small footprint,’ greener reactors. The responsive reaction systems we are investigating could make the measurement systems currently used in reactors redundant.”

The technique is being developed through a collaborative research program initiated by Ding and Alexei Lapkin of the U. of Bath, and Lee Cronin at the U. of Glasgow.

Professor Ding also believes that these systems also have the potential to eliminate the risk of runaway, where a chemical reaction goes out of control.

by Debra Vogler, Senior Technical Editor, Solid State Technology

Sept. 19, 2008 – Among the presenters at DisplayBank’s 3rd annual San Jose Conference last week (Sept. 9) was Claus Habermeier, director at Invest in Germany, who presented data showing Germany’s formidable PV market (Fig. 1). The country enjoys a 49% market share with a turnover of €5.7B in 2007. According to Habermeier, the PV market boomed in Germany in 2004 following amendment of its Renewable Energy Sources Act (EEG), which helps secure the demand for PV technology by, among other provisions, enabling projects installed in 2008 to have a guaranteed 20-year constant feed-in tariff of 35.49 €cent/kWh for solar parks and up to 46.75 €cent/kWh for façade systems. A draft amendment to the EEG act proposes higher degression rates for PV feed-in-tariffs (Figs. 2, 3).

Feed-in tariffs are considered key because rates are locked in when the system is installed. Other countries that fare relatively favorably with respect to feed-in tariffs are Spain, Italy, France, and Greece. In the US, only California provides for them.

Among the PV success stories touted by Habermeier is that of First Solar (CdTe), which chose Frankfurt/Oder in eastern Germany for its first large production plant. Among the financial incentives provided to the company were €115Mil in investment volume (i.e., the amount invested in the project), €45.5 Mil in financial incentives, a 40% cash grant intensity (i.e., the percentage of total investment volume returned in the form of a cash grant). The location process was also streamlined: four months for EU comparison and site selection, four months for permits and incentives, and five months to complete the building construction. Other companies located in Germany include EverQ, Arise, Nanosolar, Sunfilm, and Signet Solar.


Figure 1. Germany is by far the worlds’ largest PV market, with a turnover of €5.7Bn in 2007. (Source: Invest in Germany.

Keshav Prasad, VP of business development at Signet Solar, a manufacturer of thin-film silicon PV modules on large area glass substrates, described the company’s first factory in Germany. The first product was released in May of this year, followed by pilot production in July; the first customer shipment is expected next month (October), and the first installed system is slated to be complete by year’s end. The company anticipates expanding its capacity in Germany later this year with a ramp up to 130MW by 1Q10. It also has a manufacturing facility in India being readied for 2009 with a ramp-up to 330MW by 2012.

Signet Solar’s base technology — micro-crystalline silicon thin-film PV — is licensed from Applied Materials, but Prasad noted that there is significant room for innovation, particularly in improving efficiencies in conversion, manufacturing, and the supply chain. “The goal is to take the core platform technology provided by Applied Materials and to further reduce the cost of manufacturing solar PV modules,” he told SST. Some of this work will be done by Applied Materials and some by module manufacturing companies such as Signet Solar, he added.

Examples of improvements cited by Prasad include: reduction of cost through new material development and advances in equipment design; manufacturing of high efficiency tandem (a-Si/μc-Si) and triple junction devices at industrial scale; new deposition approaches; and the design and construction of proprietary fabrication technology.


Figure 2. Recent amendments of the Renewable Energy Sources Act confirm strong incentives for PV investments in Germany. (Source: Invest in Germany.

Prasad made the case for thin-film solar PV technology, saying that it has a 40% lower module manufacturing cost than crystalline silicon (c-Si), and currently the installed thin-film PV system cost is $4/Watt vs. $6/Watt for a c-Si PV system. Citing EPIA (European Photovoltaic Industry Association) data, Prasad told attendees that the thin-film PV market share is forecasted to increase to 40% by 2020. The company is targeting grid parity for silicon thin-film PV modules by 2012. — D.V.


Figure 3. Feed-in tariffs following recent amendments of the Renewable Energy Sources Act remain a strong incentive for PV installations. (Source: Invest in Germany.

Disclaimer: All information provided by Invest in Germany has been put together with the utmost care. However, they assume no liability for the accuracy of the information provided.

September 19, 2008:The National Science Foundation and the Environmental Protection Agency have awarded $14.4 million to create the Center for Environmental Implications of NanoTechnology (CEINT) at Duke University to explore the potential ecological hazards of nanoparticles.

The CEINT research team plans to define the relationship between a vast array of nanomaterials — from natural to manmade to incidental, byproduct nanoparticles — and their potential environmental exposure, biological effects, and ecological consequences. Nanomaterials that are already in commercial use as well as several present in nature will be among the first materials studied.

“A distinctive element of the CEINT will be the synthesis of information about nanoparticles into a rigorous risk assessment framework, the results of which will be transferred to policy-makers and society at large,” said CEINT director Mark Wiesner at Duke’s Pratt School of Engineering, who specializes in nanoparticle movement and transformation in the environment.

CEINT’s core research team brings together internationally recognized leaders in environmental toxicology and ecosystem biology; nanomaterial transport, transformation, and fate in the environment; biogeochemistry of nanomaterials and incidental airborne particulates; nanomaterial chemistry and fabrication; and environmental risk assessment, modeling, and decision sciences.

CEINT deputy director Gregory V. Lowry from Carnegie Mellon University and co-principal investigator Kimberly Jones from Howard University each specialize in nanoparticle movement and transformations in the environment. Mike Hochella, a nanogeochemist from Virginia Tech, and Rich Di Giulio, an ecotoxicologist from Duke are also co-principal investigators. Rounding out the team are CEINT collaborators Gordon Brown, a geochemist from Stanford University and Paul Bertsch, a soil scientist from the University of Kentucky.

One activity for the research team over the coming year is to develop 32 tightly controlled and highly instrumented ecosystems in the Duke Forest in Durham, N.C. Known as mesocosms, these living laboratories provide areas where researchers can add nanoparticles and then study the resulting interactions and effects on plants, fish, bacteria and other elements.

“This mesocosm facility will be the nano-environment equivalent of the space station — a unique resource with tremendous potential that will be tapped by researchers throughout the center and beyond,” said Wiesner.


An aggregate of a nanomaterial called nC60 being dissolved by acetate. (Credit: Peter Vikesland, Virginia Tech)

The teams’ plan to study manufactured, naturally occurring, and incidental nanoparticles recognizes that if data on nanoparticle risk are to be meaningfully interpreted, it is critical to quantify the relative exposures presented by these various sources of nanomaterials. Given that the potential diversity of nanomaterials is staggering, with countless variations in size, shape, surface chemistry, chemical composition, coatings and composites, the team’s task is daunting, Wiesner said.

“Such research will address the influence of nanomaterials on processes ranging in scale from the subcellular to whole ecosystems,” Wiesner continued. “We hope to explain factors controlling nanomaterial exposure, persistence, bioavailability, toxicity, metabolism, transfer through the food chain, and impacts on population evolution and critical ecosystem functions.”

CEINT will also collaborate with the newly formedInternational Alliance for NanoEHS Harmonization, whose charter is to establish protocols for reproducible toxicological testing of nanomaterials in both cultured cells and animals. Universal standards for nanomaterials research and risk assessment will enable researchers to compare and contrast work conducted at laboratories around the world.

According to Lowry, another significant goal of the center is to develop the human capital needed for the US. to be competitive in the global nanotechnology marketplace. “CEINT will prepare undergraduate and graduate students for careers in technology, and will use nanotechnology as a platform to promote science, technology, engineering and math to primary and secondary school students,” he said.

The National Science Foundation and the Environmental Protection Agency also are funding a sister center based at the University of California system called UC-CEIN.

September 17, 2008:By discovering the physical mechanism behind the rapid transport of water in carbon nanotubes, scientists at the U. of Illinois have moved a step closer to ultra-efficient, next-generation nanofluidic devices for drug delivery, water purification, and nano-manufacturing.

“Extraordinarily fast transport of water in carbon nanotubes has generally been attributed to the smoothness of the nanotube walls and their hydrophobic, or water-hating surfaces,” said Narayana R. Aluru, a Willett Faculty Scholar and a professor of mechanical science and engineering at the university. “We can now show that the fast transport can be enhanced by orienting water molecules in a nanotube. Orientation can give rise to a coupling between the water molecules’ rotational and translational motions, resulting in a helical, screw-type motion through the nanotube.”

In addition to explaining recent experimental results obtained by other groups, the researchers’ findings also describe a physical mechanism that could be used to pump water through nanotube membranes in next-generation nanofluidic devices.

Aluru and graduate student Sony Joseph reported their findings in the journal Physical Review Letters.

RO3000 and RO4000 laminates, from Roger’s Corp. are antenna-grade materials that feature low passive intermodulation (PIM), low loss, and are suited for use in antennas for 3G, WiMAX and LTE cellular base stations, satellite earth stations, GPS systems, and RFID readers.

With its higher thermal conductivity for increased power-handling capability, RO4000 laminates reportedly meet the needs of the antenna market for an enhanced-performance option to traditional PTFE materials. RO4000 materials are glass-reinforced hydrocarbon/ceramic laminates with dimensional stability and tight dielectric-constant tolerance across the panel. Its low dielectric loss tangent helps deliver high-performance antenna designs reliably and consistently. Low-loss RO4000 materials can be used in many applications where higher operating frequencies limit the use of conventional circuit board laminates

RO3000 series laminates are durable PTFE-based circuit materials with consistent mechanical properties. They combine lower loss and minimal variation in dielectric constant with a cost-effective price for commercial applications requiring higher performance. RO3000 materials can be used in applications through 40 GHz. Roger’s Corporation Chandler, AZ. www.rogerscorporation/acm

September 16, 2008: Nano-C, Inc., developer of nanostructured carbon materials, has been issued US Patent Nos. 7,335,344 and 7,396,520 by the Department of Commerce’s United States Patent and Trademark Office. These newly issued patents cover the manufacture of Nano-C’s core products, carbon nanotubes and fullerenes.

“The fundamental competitive advantage of our technology covered by these patents enables us to offer an array of unique carbon nanotubes and fullerene products, tailored to specific applications,” commented Viktor Vejins, president and CEO at Nano-C . “These technologies provide the needed scalability to meet the growing demands we see in organic photovoltaic (OPV) and electronics applications, including transparent conducting films for use in a variety of display, touch screen and traditional solar applications.”

September 16, 2008: El-Mul Technologies’ E-Beam On-a-Chip platform, which demands precision placement and step repeatability of vertically-aligned carbon nanotubes (CNTs), will be produced using Aixtron’s Black Magic system, a fully automatic deposition system capable of thermal and plasma-enhanced chemical vapor deposition (PECVD) of CNTs.

El-Mul says achieving pilot production for its E-Beam On-a-Chip CNT-based electron source device represents a paradigm shift for the industrial manufacture of electron sources. “Our technological achievement requires a highly-controlled growth process of carbon nanotubes,” said Sagi Daren, El-Mul’s nano-electron source project manager, in a statement. “The Black Magic systems’ rapid heater ensures that the metal catalyst we apply for growth stays precisely at the centre of the emitter structure, and plasma process deposits straight, vertical nanotubes. Our resulting fine-beam product achieves a divergence of ±5 degrees at 50nA/120eV beam current and is perfectly on-axis.”

Daren adds: “The reproducibility, uniformity and quick turnaround of Aixtron’s Black Magic system have contributed greatly to our success in moving our E-Beam-On-a-Chip toward commercial production. Thanks to these attributes, we are today approaching industrial yields, and will soon compete with conventional hand-made electron sources.”


Aixtron’s Black Magic System.

E-Beam On-a-Chip utilizes the unique electrical and mechanical properties of CNTs, which make excellent cold field emission electron sources. El-Mul’s platform is a low-energy electron generator of well-characterized fine beams as well as high-current broad beams. It is aimed at bringing new capabilities to electron microscopy, gas ionization and X-ray tools, flat-panel displays, sub-40nm semiconductor manufacturing nodes, and other applications.

Traditionally, electron sources have been made individually and assembled entirely by hand. El-Mul’s E-Beam On-a-Chip uses microelectronic-compatible processing to produce batched electron sources on semiconductor wafers. Benefits of the platform include parallel device production, scalability and small size, as well as micro precision in fabrication to eliminates alignment issues.

Using 2D and 3D X-ray Techniques to Find and Confirm Manufacturing Defects in Fip Chip Devices
By Evstatin Krastev, Ph.D. Dage Precision Industries, a Nordson Company
The basic, straightforward design of a flip-chip device calls for the conductive bumps of the silicon chip to be placed directly on the interconnection points of a substrate or PCB. This format eliminates excessive packaging, which offers operational benefits at high frequencies with low parasitics in a high I/O density. At the same time, high-density flip-chip devices place a greater burden upon device inspection during both the device manufacture and subsequent processing onto a substrate or PCB.

Flip-Chip Trends
The overall use of flip chips is increasing due primarily to performance advantages in multi-functional handheld devices where typical pin counts are in the 200-700 I/O range. Because of they’re inherently higher I/O density, the use of flip-chip devices for applications other than mobile or handheld products is generally limited to applications of 1,000 I/O or greater. However, the rising cost of gold has increased the demand for flip chip versus gold wire bonding to a point where the crossover point has come down to 500 I/O for several applications.1

Common Defects
Flip chip defects can occur when devices are reflowed and can include cracks, head-in-pillow and/or interfacial voiding. Tilt angle capability, or oblique angle viewing, is very critical for identifying flip chip defects and can be very easily accomplished using a modern 2D X-ray inspection system. It is good to use tilt or oblique angles of 55 to 70° and rotate the x-ray detector at 0 to 360° around the examined joint.
A flip chip crack less than 1mil is challenging for any X-ray inspection systems to detect. The proper use of tilt and rotation angles together with the right X-ray parameters including kilo volts (kV) and power is of crucial importance in detecting cracks (Figure 1).


Figure 1: Cracks in flip-chip bumps imaged with 2D x-ray inspection>

Head-in-pillow defects are the phenomena that can occur when incomplete wetting of the entire solder joint results in the solder paste coalescing separately from the solder ball or solder bump after reflow. Also considered an open joint, head-in-pillow defects typically occur more frequently with ball grid array (BGA) devices but can also occur with flip chips (Figure 2).

Head-in-pillow defects are difficult to detect with lower performance 2D X-ray systems, and may require destructive cross sectioning in order to identify and confirm this deficiency when they fail at in-circuit test and functional test. However head-in-pillow defects can be easily identified with off-axis X-ray viewing using modern 2D X-ray inspection systems without destroying the flip chip, substrate or PCB.


Figure 2: Head-in-pillow defects in flip-chip device imaged with 2D X-ray

Detecting small cracks down to 1mil or finer, as well as head-in-pillow defects is a challenge but can be accomplished using modern 2D X-ray inspection systems. The tilt and rotation angles need to be adjusted carefully since the two angles are among the key factors playing a critical role in identifying small features.

3D Packages
With the continued emergence of subsystem integration, advanced 3D packages including flip chip devices are replacing standard lead-frame packages. Multiple stacked die packages such as package-in-package (PiP) and package-on-package (PoP) meet the demand for greater circuit density and improved electrical performance since they interface directly with solder bumps, solder land pads, or solder bumped pads.
However, to achieve these benefits, these packages contain multiple die stacked one on top of the other, with multi-level wire bonding or multi-level wafer bumping all within a single packaged device. Such increased level of complexity provides unique challenges for package inspection and quality control process qualification during device packaging and subsequent assembly. In particular, these more complicated packages now have the opportunity to exhibit defects both internal to the package as well as when assembled with the substrate or PCB. Such defects can include cracks, missing connections, interfacial voiding, wire bonding defects and/or die interface issues.

Computerized Tomography
In certain cases 2D X-ray inspection may be limited in what it can analytically provide when inspecting complex, multi-level 3D packages and is increasingly being complemented by computerized tomography (CT). CT is an imaging method where mathematical geometric processing is used to generate a 3D virtual model of a device by taking a large series of individual 2D X-ray images as the object is rotated about a single axis of rotation. Once the CT model has been produced, it allows ‘virtual micro-sectioning’ by investigating any two-dimensional plane within the entire model as well as real-time manipulation of the 3D model. This allows complete examination of features or defects within a device or package that would otherwise remain hidden by multi-level interconnections such as the cracked solder bumps within a multi-layered device (Figure 3).


Figure 3: 3D CT image of cracked bumps in flip-chip device.

Computerized tomography can also detect interfacial voiding within multi-layer devices since it is difficult to determine the exact location of voiding without using 3D CT imaging.

Complementary Techniques
Since flip chip solder bumps are small objects, they can be easily concealed by larger solder bumps or solder balls which makes the option of 3D imaging useful. Two-dimensional and 3D imaging work together as complementary inspection techniques within modern X-ray inspection systems where they can switch between 2D and 3D modes in a matter of minutes. This allows the benefits of both techniques &#151 2D being very fast and 3D helping to resolve obscured details and potential hidden defects. Both techniques have the added benefit of being non-destructive.2

Conclusion
Recent advancements in CT technology have made it an extremely useful tool in the analytical arsenal for the inspection of flip-chip devices and 3D packages. It enables complete viewing of interconnections with a package which otherwise may be obscured by other joints or objects when viewed only with 2D x-ray inspection. The combination of 2D x-ray and CT analysis offers powerful analytical capabilities need for the complete inspection of flip-chip devices and stacked packages.

References
1. Cole-Johnson, Sally, “Flip-Chip Changes on the Horizon,” Semiconductor International, July 2008
2.Bernard, David and Krastev, Evstatin, “Investigating Defects in 3D Packages Using 2D and 3D X-ray Inspection,” SMTA International, August 2008

EVSTATIN KRASTEV, Ph.D., applications manager for semiconductor packaging and PCB inspection, Dage Precision Industries, may be contacted at [email protected].