Category Archives: Materials and Equipment

July 31, 2008 — There’s a new “gold standard” in the sensitivity of weighing scales. Using the same technology with which they created the world’s first fully functional nanotube radio, researchers with Berkeley Lab and the University of California (UC) at Berkeley have fashioned a nanoelectromechanical system (NEMS) that can function as a scale sensitive enough to measure the mass of a single atom of gold. Alex Zettl, a physicist who holds joint appointments with Berkeley Lab’s Materials Sciences Division (MSD) and UC Berkeley’s Physics Department, where he is the director of the Center of Integrated Nanomechanical Systems, led this research. Working with him were members of his research group, Kenneth Jensen and Kwanpyo Kim.

“For the past 15 years or so, the holy grail of NEMS has been to push them to a small enough size with high enough sensitivity so that they might resolve the mass of a single molecule or even single atom,” Zettl said. “This has been a challenge even at cryogenic temperatures where reduced thermal noise improves the sensitivity. We have achieved sub-single-atom resolution at room temperature.”

The new NEMS mass sensor consists of a single carbon nanotube that is double-walled to provide uniform electrical properties and increased rigidity. One tip of the carbon nanotube is free and the other tip is anchored to an electrode in close proximity to a counter-electrode. A DC voltage source, such as from a battery or a solar cell array, is connected to the electrodes. Applying a DC bias creates a negative electrical charge on the free tip of the nanotube. An additional radio frequency wave “tickles” the nanotube, causing it to vibrate at a characteristic “flexural” resonance frequency.

When an atom or molecule is deposited onto the carbon nanotube, the tube’s resonant frequency changes in proportion to the mass of the atom or molecule, much like the added mass of a diver changes the flexural resonance frequency of a diving board. Measuring this change in frequency reveals the mass of the impinging atom or molecule. “Getting nanotubes to vibrate is fairly easy,” said Jensen. “The difficult part is detecting those small vibrations. We accomplished this by field-emitting, or spraying, electrons from the tip of the nanotube and detecting the resulting electrical current.”

Atoms landing on a double-walled carbon nanotube change the tube’s resonant frequency in proportion to the mass of the atoms, much like what happens when a diver hits a springboard. (Source: DOE/Lawrence Berkeley National Laboratory)

Using their NEMS mass sensor, Zettl, Jensen and Kim were able to weigh individual gold atoms and measure masses as small as two fifths that of a gold atom at room temperature and in just a little more than one second of time. A gold atom has a mass of 3.25 × 10-25 kilograms, which means that there are about 3 million million million million gold atoms in a single kilogram.

While there have been other NEMS that function as mass sensors before, most of these previous devices were fashioned from silicon, and none had achieved the single-atom resolution at room temperature. The carbon nanotube mass sensor of Zettl’s group is a thousand times smaller by volume than typical NEMS resonators — measuring only about a billionth of a meter in diameter and 200 billionths of a meter in length. “Carbon nanotubes are the ideal material for this purpose and their small size makes them sensitive enough to resolve single atoms even at room temperature,” Jensen said.

While scientists already have the ability to measure the mass of individual atoms through a complex technique known as mass spectrometry, this new carbon nanotube NEMS mass sensor offers some distinct advantages and opens the door to new possibilities, as Jensen explained.

“Unlike mass spectrometry, our device does not require the ionization of neutral atoms or molecules that can destroy samples such as proteins. Also unlike mass spectrometers, our carbon nanotube mass sensor becomes more sensitive at higher mass ranges, which makes it more suitable for measuring large biomolecules like DNA. Finally, our device is small enough so that, in time, it could be incorporated onto a chip.”

Zettl, Jensen and Kim described their NEMS mass sensor in a paper published in the journal Nature Nanotechnology, entitled: “An atomic-resolution nanomechanical mass sensor.” This research was supported by the U.S. Department of Energy’s Office of Science, Basic Energy Sciences Program’s Materials Sciences and Engineering Division, and by the National Science Foundation within the Center of Integrated Nanomechanical Systems.

July 31, 2008 — The National Institute of Standards and Technology (NIST) will use SouthWest NanoTechnologies Inc.’s SWeNT SG65 single-wall carbon nanotubes, manufactured by the CoMoCAT process, as the starting material for a Standard Reference Material (SRMs).

NIST certifies and provides SRMs that exhibit well-characterized and consistent composition and properties. SRMs are used to perform instrument calibrations, verify the accuracy of specific measurements and support the development of new measurement methods. Industry, academia and government use NIST SRMs to facilitate commerce and trade and to advance research and development. NIST supplies more than 1,300 reference materials.
“We are pleased to be able to provide SWeNT SG65 as the starting material needed for NIST to develop its single-wall carbon nanotube SRM single-wall carbon nanotube SRM,” said SWeNT CEO David Arthur. “This represents for us an additional confirmation that our efforts in the area of product quality and consistency have paid off. We support NIST’s work to create a SRM for single-wall carbon nanotubes.”

In June, SWeNT moved into a new manufacturing facility, where its single-wall carbon nanotube production capability has increased 100-fold single-wall carbon nanotube production capability has increased 100-fold . SWeNT also maintains an applications and business development center in the Route 128/Boston, Massachusetts area to help customers integrate SWeNT nanotubes into their applications.

(July 25, 2008) IRVINE, CA &#151 Following its acquisition of the Adhesives and Electronics Materials businesses from National Starch and Chemical Company, Henkel has announced its executive team to take the company forward. Under the direction of Alan Syzdek, corporate senior V.P. the electronics group of Henkel will be organized on a global basis by industry sector. The intention is to offer local support and flexibility within each region to afford operational and supply chain efficiencies while providing visibility of customers’ global requirements. The new leadership at Henkel reportedly draws on the talents of both the Henkel and National Starch teams.

Michael Todd, Ph.D., will lead Henkel’s global product development initiatives as V.P. of product development and engineering. Todd’s near-term priorities are said to include aligning the organization’s 13 global product development sites, the integration of the complimentary technologies and products brought together through the acquisition, and leveraging the strengths of certain materials to facilitate the widespread growth of synergistic product lines.

Todd said the company has committed significant investment increases for advanced materials development in the areas of new polymer technologies, applied nano-technology research, and manufacturing and process innovations. “With many acquisitions you see a tightening of the belt in this area but, with Henkel, quite the opposite is true,” he said.
“This enables our ability to anticipate technology requirements well into the future and develop materials solutions today.”

Former Ablestik general manager, Andreas Mader, has been tapped to head Henkel’s semiconductor group where he will focus on supporting customers’ transition to new technologies. Having spent over 20 years of his career working with specialty materials at Dow and National Starch, Mader brings perspective to his position and is said to be enthusiastic about the accelerated solution capabilities of the new organization.

For semiconductor packaging, Mader says he envisions several breakthrough materials advances which include further developments and more widespread adoption of film die attach materials as well as enhanced capabilities of the company’s Wafer Backside Coating (WBC) materials technology.

To direct its electronics assembly business, Henkel has selected former Emerson & Cuming general manager, Joe DeBiase, who has over 20 years of experience in electronic materials for the PCB fabrication and electronic assembly industries. The integration of two very broad product portfolios is intended to deliver front-to-back solutions in assembly materials requirements.

Rounding out the customer-facing executive appointments is Doug Dixon, global marketing director. “One of the most exciting, yet most challenging parts of this new organization is prioritizing brand and product rollout initiatives,” says Dixon.

Michael Reilly, Ph.D., former National Starch VP of global operations will handle management of the operational organization, and ZhiWei Cai, former Henkel global V.P. of product management, will oversee the development the business through organic growth, strategic partnerships and acquisition opportunities.

Other key appointments to the leadership team include Luc Godefroid, who heads up the project management office (PMO), with responsibility for developing and integrating the business and driving offensive synergies through best practices of both the Henkel and National Starch operations; and, Ms. Hilary Norris, who leads the company’s financial team.

“I have every confidence that this dedicated team will lead our organization with experience, integrity, ingenuity and passion while maintaining the customer as our top priority,” said Syzdek.

High Resolution SEM


July 22, 2008

With the Magellan XHR SEM, FEI Company has launched a class of instruments called extreme high-resolution scanning electron microscopes that allow scientists and engineers to view 3D surface images at different angles and at resolutions below one nanometer. The Magellan XHR SEM images samples at very low beam energies, avoiding distortions otherwise caused by the beam penetrating into the material below.

Sub-nanometer resolution has critical value in scientific research and industrial R&D. In addition, it is an absolute requirement in process development, monitoring, and control applications in advanced semiconductor manufacturing. The Magellan Family reportedly extends this capability to applications that were previously impossible or impractical with conventional SEM, transmission electron microscope (TEM) or focused ion beam (FIB) systems. This microscope makes it possible to generate high-resolution, surface-sensitive images of carbon nanotubes, nanowires, and catalysts without the image distortions caused by electrical charging from higher energy electron beams.

The Magellan Family’s performance derives from the integration of novel electron optical elements, proprietary electron gun technology, a highly accurate five-axis piezo-ceramic stage and high stability platform with fully configurable analytical chamber. The stage readily accommodates large samples or multiple smaller samples, while providing fast, accurate navigation and unequaled stability. Available in 2 models, the Magellan 400 is optimized for scientific research while the Magellan 400L is optimized for semiconductor labs. The semiconductor lab model comes with a load-lock feature that speeds-up sample throughput, and includes a retractable solid state backscatter electron detector (SSBSED) and S2 compliance kit. Both models have an optional, full environmental enclosure to isolate the instrument from thermal and acoustic interferences, ensuring peak performance while relaxing site requirements and facility preparation costs. FEI Company Hillsboro, OR. www.fei.com

by Katherine Derbyshire, Contributing Editor, Solid State Technology

Given the excitement surrounding the solar sector, it seems unlikely that a major solar cell supplier could remain below the radar, but Global Solar has. Part of the company’s low profile may have to do with its location in Tucson, far from the nurturing environs of Silicon Valley and Austin, TX, and the venture capitalists that have poured funds into companies like NanoSolar and HelioVolt. Part may stem from its longevity: the company was incorporated in 1996. By the time the current boom began, it was already old news.

And yet, unlike its flashier competitors, Global Solar’s products are fully commercialized and readily available. The company deposits CIGS (copper indium gallium diselenide) films on stainless steel foil, and supplies portable chargers for military, expedition, and other outdoor applications. When a climber on Mt. Everest calls home, there’s a good chance his satellite phone is powered by a Global Solar charger. For permanent installations, the company supplies “stringers,” square cells connected by silver tape that can be dropped directly into modules designed for crystalline silicon.

According to Tim Teich, VP for sales and marketing, such products taught the company a lot about durability and encapsulation. Barrier layers that work for amorphous silicon solar cells won’t work for CIGS, which is much less tolerant of water vapor. Adhesion on polyimide films tends to be poor, and is the reason why Global Solar uses steel foil substrates instead. With both problems nearing resolution, the company is now focusing on throughput and efficiency.

Global Solar aims to improve efficiency by 1%/year, and hopes to reach 14% average efficiency within five years. (Teich is highly skeptical of NanoSolar’s claim to have achieved that mark already.) To increase throughput, Global Solar is scaling up production. The Tucson plant should reach 40MW of capacity this year, with 30MW coming online in Berlin in 2009. For 2010, an additional building in Tucson can accommodate up to 100MW of production. Scaling up production will help bring costs down, Teich noted.

Though utility-driven solar farms consume large numbers of cells, Teich believes the rooftop solar market is more promising. Solar farms are a relatively unproductive use of land; economic considerations suggest they should be sited in remote areas where land is inexpensive. Yet transmission losses are one of the largest consumers of electrical power — fully 40% of all power generated is lost in the grid. Rooftop locations minimize transmission losses by putting the source of electricity close to the end user, and take advantage of space that would otherwise be wasted.

Teich also emphasized that installed cost matters more than cell cost. The current landscape, littered with custom module assemblers and small system installers, contributes enormous overhead to the total system cost. Reducing cell cost means nothing as long as the installed cost stays near $7/W. Development of standard building-integrateable products, such as architectural glass and solar roofing shingles, is one goal of Global’s recently announced partnership with Dow Chemical’s building solutions division. — K.D.

by Debra Vogler, senior technical editor, Solid State Technology
by James Montgomery, news editor, Solid State Technology

ISMI provided SST with tidbits from its closed-door meeting on Wednesday where discussions continued between its members and equipment suppliers about key programs and topics including the next-generation fab (NGF) targeting 300mm improvements and the 450mm transition, including updates on the interoperability test bed for 450mm wafer automation and handling.

Despite how contentious and polarizing this debate has become, in a pre-SEMICON West briefing with Scott Kramer, VP of manufacturing at ISMI, indicated some progress trying to get both sides to work together without the pressure of an immutable deadline. “One key lesson learned from the 300mm transition is that the consortium should not set a date for timing [for implementation],” Kramer told SST. “We’re in the business of productivity improvement as quickly as possible, considering all possible solutions; we don’t rule things out. When the time comes to decide what companies buy and sell, that interplay is the free and open market and that decides when fabs install equipment and buy things. We don’t make proclamations about timing for some particular productivity improvements.”

ISMI sees complementary, forward-compatible paths for NGF and 450mm, with 450mm activities built upon coordinated improvements from NGF and efficiently utilizing industry resources. (Image courtesy of ISMI)

Here’s a quick rundown of the salient points made during the\is week’s closed-door ISMI session:

– NGF improvements. The NGF target remains unchanged: 50% cycle time improvement and 30% lower costs. More productivity improvement opportunities have been identified that enable both cycle time and cost improvements at the same time. Equipment productivity improvement projects have progressed to a stage of active supplier engagement — e.g., equipment chamber matching (ECM), first wafer delay (FWD), predictive/preventative maintenance (PPM), and enhanced equipment quality assurance (EEQA).

– Maintenance leads productivity efforts. PPM is seen as the most promising project, with EDA/DQ usage by supplier and IDMs as a fundamental enabler. Testing of software and EDA functionalities is seen as critical for enabling and implementing new NGF capabilities; factory operations and environment is seen as the next step (while still focusing on productivity). Approaching waste reduction is becoming a strategic part of productivity improvement. Also deemed “highly desirable” is retrofit of new capabilities into existing factories. Identifying more leverage-points will enable further productivity improvements.

– Stepping up 450mm evals. ISMI says it is “committed to continued communication and collaboration between suppliers and IDMs,” and Exhibit A of the consortium’s efforts may very well be its work with the three vocal leading chipmakers (Intel, Samsung, and TSMC) who have asked for a 450mm pilot line ready by 2012. Nevertheless, ISMI is reporting a number of progress fronts with this 450mm work. Development of 450mm wafers will progress this year from sintered mechanical handling of test wafers to single-crystal wafers, with 100 mechanical handling test wafers of five different thicknesses already delivered to ISMI for measurement and evaluation on the Interoperabilty Test Bed (and available on loan). The sag of polysilicon wafers are said to be comparable to single-crystal. Factory testing is already underway on the 450mm testbed, with an undisclosed number of signed contracts from suppliers to demo prototype hardware, with more said to be “under discussion.” A testbed user group is now discussing interoperability challenges, and ISMI has agreed to work with Japan’s Interoperability Test Group.

– Clarifying 450mm guidelines. ISMI’s 19-point “unified guidelines” relating for 450mm are being clarified to help them be better understood, and foster early discussion of challenges. There have been what ISMI calls “constructive two-way exchanges” with SEMI’s IPIC Task Force, and information and proposals are being reviewed with individual suppliers and SEMI’s Equipment Suppliers Group (ESG). ISMI also is assessing related environmental/health/safety with the larger 450mm wafers, such as carrier handling and fall protection.

ISMI stressed that it is continuing to engage with the industry and suppliers in several ways at different levels on 450mm: conducting briefings and workshops at industry forums, interactions in SEMI Standards efforts, and continuing/expanding its engagement with production equipment, factory interface, and silicon infrastructure suppliers. — J.M., D.V.

(July 16, 2008) SAN FRANCISCO &#151 In a round table discussion over lunch, Scott Kulicke, CEO, Kulicke & Soffa, responded with candor to questions posed by analysts from Prismark Partners, VLSI Research, and TechInternational; and editors from a variety of industry publications. Topics ranged from the success of the company’s recent tool launch, last year’s acquisition of the Swiss die bonder company, Alphasem, the transition to copper wire bonding from gold wire, and the state of the industry as a whole.

Launching right in during the salad course, Brian Swigget, managing partner of Prismark Partners, inquired about the integration of Alphasem die bonders into the K&S portfolio. Kulicke responded that although the process had been arduous, the company had achieved a full and dramatic integration that had been intense and rigorous. But all in all, he said the team was stabilized, and a next-generation die bonder tool is on schedule for launch in the first quarter of 2009.

In answer to VLSI CEO Dan Hutchison’s question about capacity in the back-end, Kulicke responded that although relatively healthy, he’s seeing lots of indecision in that space. He cited macroeconomic risks &#151 such as the real estate crisis &#151 rather semiconductor industry risks at the center. “We’re working in an environment where the economics are more interconnected than they’ve ever been..” he said. “We’re in uncharted territory.”

Despite a cautious outlook on capital equipment expenditures, Kulicke says he wasn’t concerned about the launch of the two new wire bonders in this economic climate. “We were launching in reaction to our internal forecast of customer requirements,” he said, adding that it was technology driven. Qualifications are going well, he said, and the company is meeting performance numbers with the tools. He expects to reach gross margin volume by the end of September.

On the topic of transition to copper from gold wire bonding, Kulicke said there is a lot of momentum, driven largely by a 25% cost savings, despite any minor process expenses due to conversion kits for the tools, and the addition of forming gas needed for copper wire processes. “We think you’ll see a relatively quick transition to copper,” he noted, predicting that the half of the industry will have made the switch in three years.

By dessert, conversation had turned to industry philosophy, and the need for parallel development across the supply chain, something that was a given in the days of vertical integration. The industry has become fragmented and disconnected, he noted, saying that it was a barrier to innovation. Although Kulicke doesn’t see a return to vertical integration, he did stress the need for a reconnect.

by James Montgomery, news editor, Solid State Technology

July 16, 2008 – Where to turn for inspiration in a tough year 2008 for semiconductor suppliers? Try Yankee baseball great Yogi Berra and famously underappreciated comic Rodney Dangerfield, according to analyst John Housley of Techcet, in a Wednesday talk about materials forecasts at SEMICON West.

Despite handwringing on the semiconductor equipment side of the industry, materials firms actually are still chugging right along with growth as they have for decades, Housley pointed out, adding that in fact he’s found very little correlation between semiconductor sales and materials sales.

In his southern drawl, Housley invoked favorite and relevant Berra-isms about forecasting (“It’s tough to make predictions, especially about the future”) and market slowdowns (“I’m not in a slump, I’m just not hitting,” which he said is roughly equivalent to materials firms “not being in a downturn, we’re just not selling”). Still, he predicts a $43B market this year, and a 8%-9% CAGR through 2011 to $55B.


Spending per node for resists/ancillaries and interconnect materials. (Source: Techcet)

Among hot topics touched on in his brief (~25min) presentation, Housley countered general industry concerns about shortages of polysilicon, noting that most if not all of the top 10 major polysilicon suppliers plan to double or triple (or more) their capacity in the next five years, and there’s another 16 new players coming into the market — all together that could push Si capacity by 5× by 2011, to feed hungry markets in semiconductors and elsewhere. Solar, for example, is going “berserko, bonkers” to get its hands on silicon, he said, emphasizing his point by asking whom among the roomful of participants are playing in some way in solar — and nearly all raised their hands.

Housley paused briefly to mention 450mm, noting that many significant questions still need to be answered, e.g. how usage of things like photoresists will be reworked. “God help us,” he said, and quickly moved on.

Housley spent several minutes on why the typical “confrontational” style of procurement relationship between chemicals/materials producers, their suppliers, and their IC customers needs to change right now. First, heavy demand means materials suppliers are having to compete with much bigger players (e.g. in aerospace) to provide things like titanium, copper, and tungsten — and other industries who want those materials are less picky about purity or even cost. And second is pricing. Years ago price quotes were good for 30, 60, 90 days, he said — but today, he knows someone who has to call back four hours after a price quote or it’ll be gone. The risk to either of these factors is simple, Housley said — consolidation, citing Air Products and Ashland as examples.

For materials firms, who historically feel they’ve been burdened to shoulder much of the initial cost for new technology development while still getting squeezed on pricing and thus not reaping the benefits, the best defense is to stick to their guns. “Learning to say ‘no’ is something the people in this business need to learn to do,” Housley said. This hard-line stance also opens up opportunities, he said, citing as an example customers’ increasing desire to find softer, greener strip technologies while still pressing suppliers on prices. Look for “a disruptive technology in resist strip and removal” in the next two years, he predicted.

Rushed to close out his short talk, Housley zipped through a few final slides about continued demand for SiC and CMP characterized as “the darling of the materials business.” A pie chart showing regional demand was called out because it showed US demand at 18% — a figure Housley said was “very generous” — down from 30% not too long ago. This is a trend that materials firms need to recognize and adapt to, he said.

Housley also spotlighted efforts from Jenoptik to address customers’ desire to get more silicon for their investment, namely by pulling it out of scribe lines. Their technology essentially uses a laser to put a hot and cold spot on a silicon wafer to cleave off excess for reuse. — J.M.

by Sarah Fister Gale, contributing editor, Solid State Technology

FEI Co. is debuting a new line of SEM tools designed to give researchers a sharper picture of sub-nanometer surface detail than with a scanning electron microscope (SEM), and extend this capability to future technology nodes.

The Magellan family of extreme high-resolution (XHR) SEMs aims to extend sub-nm resolution to applications that were previously impossible or impractical with conventional SEM, STEM, or focused ion beam (FIB) systems. The company claims it can provide views of critical details of complex 3D structures at many different angles with <1nm resolution. It also requires very low beam energies (<1kV to 30kV) so as to avoid distortions otherwise caused by higher-energy beam penetration into the material below.

Part of FEI’s message with the Magellan XHR SEMs is to help researchers balance the need for greater resolution images of smaller features with the time and financial cost of investing in STEM, explained Todd Templeton, product marketing manager for FEI. “Researchers are looking for ways to extend the lifetime of SEM into the next one to two node generations to put off capital investments,” he said. “XHR SEMs extend sub-nanometer resolution to applications that were impossible or impractical with SEMs, TEMs or FIBs.” He listed potential applications including generating high-resolution, surface-sensitive images of carbon nanotubes, nanowires, and catalysts.

The Magellan XHR SEMs come in two flavors: the 400 for scientific research, and the 400L for semiconductor labs. The semiconductor lab model includes a load-lock feature to speed up sample throughput, and a retractable solid state backscatter electron detector and S2 compliance kit. An integrated plasma cleaner and liquid nitrogen cold trap ensure sample cleanliness.

Nanotubes imaged at 200V at 10k×, 20k×, 40k×, and 600k× magnification. (Images courtesy of McGill U. and FEI)

Faster throughput for TEM

Meanwhile, FEI also is introducing a new suite of tightly integrated connectivity solutions for its focused ion beam and electron microscope tools, to smooth a SEM-to-STEM transition and improve the speed and reliability of high-resolution imaging and analysis.

The bundling of existing technologies automates and accelerates preparation of ultrathin samples required for TEM and STEM, resulting in reduction times from days to hours, and pushing closer to the throughput of SEMs — which translates directly to cost-of-ownership, according to Rob Krueger, technology manager of FEI’s electronics division. “It will have a dramatic impact on iterative, analysis intensive activities, such as the development of new processes and products and recovery from yield excursions,” he said. “Speeding up the process makes labs more efficient.” — S.F.G.

July 10, 2008 — Understanding electron interaction is crucial to bring quantum computers to fruition, and now, researchers have determined that carbon nanotubes are a useful tool toward that end. Carbon nanotubes are ideal for studying spin-based, two-atom systems because of their long spin coherence time, say researchers at Hitachi Cambridge Laboratory (Cambridge, England) and the Nano-Science Center, Niels Bohr Institute, University of Copenhagen (Copenhagen, Denmark). Post-doc Henrik Jørgensen and colleagues created a so-called “double quantum dot” by placing two 50 nm titanium electrodes on the carbon nanotube to act as source and drain, along with three central top-gate electrodes of aluminum oxide and titanium. A small voltage applied across the device created two strongly coupled quantum dots with a clear shell structure of electrons. Surface plots of current as a function of voltage across the device confirmed shell occupation numbers where the quantum dots formed in series. The device exhibited inelastic cotunneling via the singlet and triplet states, which can be used to probe splitting of those states. Such manipulation of quantum dots could be the key to creating a quantum bit, the cornerstone of quantum computing.