Category Archives: Materials and Equipment

SEMI announced today that the deadline for presenters to submit an abstract for the annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is October 17.  ASMC, which takes place May 15-18, 2017 in Saratoga Springs, New York, will feature technical presentations of more than 90+ peer-reviewed manuscripts covering critical process technologies and fab productivity. This year’s event features keynotes, a panel discussion, networking events, technical sessions on advanced semiconductor manufacturing, as well as educational tutorials.

ASMC, in its 28th year, continues to fill a critical need in our industry and provides a venue for industry professionals to network, learn and share knowledge on new and best-method semiconductor manufacturing practices and concepts.  Selected speakers have the opportunity to present in front of IC manufacturers, equipment manufacturers, materials suppliers, chief technology officers, operations managers, process engineers, product managers and academia. In addition to publication in the ASMC proceedings, select papers will be invited to participate in a special section of ASMC 2017 to be featured in IEEE Transactions on Semiconductor ManufacturingTechnical abstracts are due October 17, 2016. 

This year SEMI (www.semi.org) is including two new technology areas (3D/TSV/Interposer; Fabless Experience). SEMI is soliciting technical abstracts in these key technology areas:

  • Packaging and Through Silicon Via (3D/TSV)
  • Fabless Experience (FE)
  • Advanced Equipment Processes and Materials (AEPM)
  • Advanced Metrology
  • Advanced Patterning / Design for Manufacturability (AP/DFM)
  • Advanced Process Control (APC)
  • Contamination Free Manufacturing (CFM)
  • Defect Inspection and Reduction (DI)
  • Data Management and Data Mining Tools (DM)
  • Discrete Power Devices (DP)
  • Equipment Reliability and Productivity Enhancements (ER)
  • Enabling Technologies and Innovative Devices (ET/ID)
  • Factory Automation (FA)
  • Green Factory (GF)
  • Industrial Engineering (IE)
  • Lean Manufacturing (LM)
  • MOL and Junction Interfaces (MJ)
  • Smart Manufacturing (SM)
  • Yield Methodologies (YM)

Complete descriptions of each topic and author kit can be accessed at http://www.semi.org/en/node/38316.  If you would like to learn more about the conference and the selection process, please contact Margaret Kindling at [email protected] or call 1.202.393.5552.

Papers co-authored between device manufacturers, equipment or materials suppliers, and/or academic institutions that demonstrate innovative, practical solutions for advancing semiconductor manufacturing are highly encouraged.  To submit an abstract, click here.

Technical abstracts are due October 17, 2016.  To learn more about the SEMI Advanced Semiconductor Manufacturing Conference, visit http://www.semi.org/en/asmc2017.

According to the latest market study released by Technavio, the global front-end-of-the-line (FEOL) semiconductor equipment market recorded a revenue of over USD 22 billion in 2015 and this growth is expected to exceed $24 billion in 2020.

This research report titled ‘Global Front-end-of-the-line Semiconductor Equipment Market 2016-2020’ provides an in-depth analysis of the market in terms of revenue and emerging market trends. This market research report also includes up to date analysis and forecasts for various market segments and all geographical regions.

FEOL equipment experienced a decline in 2015 due to a decline in sales of PCs and oversupply of DRAM. However, it will gain pace 2016 onward with the growing memory market and the increasing investments in fabs. The semiconductor market will see a high demand for semiconductor chips and memory devices from 2017 onward due to the growing adoption of IoT, high demand for connected devices, and increased vehicle automation.

Sunil Kumar Singh, a lead analyst at Technavio, specializing in research on semiconductor equipment, says, “Semiconductor device manufacturers are increasing their capital spending by expanding their production facilities or constructing new fabs. The majority of the investment for new facilities will be for the development of memory and logic ICs due to their high demand.”

Based on end-user, the report categorizes the global FEOL semiconductor equipment market into three segments. They are:

  • Foundry
  • Memory
  • Integrated device manufacturers (IDMs)

Foundry

The foundry segment dominated the global FEOL semiconductor equipment market in 2015 and will grow at a CAGR of 2.25% during the forecast period. In 2015, the foundry segment saw a decline in capital expenditure due to a decline in the sales of tablets and PCs, which impacted the demand for new equipment by the foundries. However, the market will see a positive growth rate 2016 onward until 2019. The foundry segment will gain momentum during the forecast period due to the increasing number of fab construction — some of which are scheduled to start construction in 2016 while some already started construction in 2015. Around seven foundry fabs are expected to be completed by 2017. The R&D spending by TSMC, the industry’s biggest pure-play foundry, rose by 10% in 2015 compared with 2014.

Memory

The memory segment will grow at a CAGR of 2.58% during the forecast period. In 2015, the memory segment saw a strong growth primarily due to structural changes such as segment consolidation in DRAM, higher market entry barriers, and more diversified demand. The major change includes the transition from planar to second-generation 3D NAND. The memory market is gradually transitioning to 3D NAND and next-generation non-volatile memory (NVM) technologies. The major memory customers are ramping up 3D NAND volume production, which will result in the growth of production equipment. For instance, Intel entered the 3D NAND business in 2016, partnering with Micron, which will significantly increase the spending levels on semiconductor capital equipment such as FEOL semiconductor equipment.

IDM

The IDM segment will decline during the period of 2015-2016 due to the cyclical nature of the semiconductor industry. The manufacturing of ICs is a long and expensive process, from the conceptualization to the actual production and thus mandates high investment for the installation of equipment and machines like lithography equipment for chip fabrication. The shift of the IC manufacturing companies to the fabless model for reducing the pressure on their cash reserves and improving the focus on their core strengths will steady the decline in price after 2016.

The top vendors highlighted by Technavio’s research analysts in this report are:

  • Applied Materials
  • ASML
  • TEL
  • Lam Research
  • KLA-Tencor

Edwards Vacuum has been recognized as one of ten companies receiving a 2016 Supplier Excellence Award from Lam Research Corp. (NASDAQ: LRCX), a major global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. The awards, presented annually, acknowledge their commitment to exceeding performance standards. Edwards Vacuum earned Lam’s Supplier Excellence Award for exemplary Capacity Readiness and Responsiveness

“We take great pride in receiving the Lam Research Supplier Excellence Award for 2016 and see it as great recognition of how a collaborative approach to business can bring success to both companies. We look forward to continuing our work with Lam Research well into the future,” said Scott Balaguer, Vice President – North America Semi-DSL BLM.

The Lam Research Supplier Excellence Awards were announced on August 22 at the company’s Supplier Day, during which Lam Research focuses on enhancing collaboration and renewing opportunities for mutual success with its customers and suppliers. Executives from suppliers around the world attended the event, and Edwards Vacuum was among the companies honored for its achievements.

“We applaud the contributions of Edwards Vacuum as one of Lam’s preferred suppliers, and appreciate the important role they play in delivering industry-leading products and services to our customers,” said Tim Archer, chief operating officer, Lam Research. “We are pleased to present Edwards Vacuum with a Lam Research Supplier Excellence Award for Capacity Readiness and Responsiveness and we look forward to continuing our success together.”

A leading South Korean research university has successfully integrated two Advanced Vacuum plasma processing systems from Plasma-Therm into its nanotechnology fabrication lab, which supports multiple users engaged in wide-ranging nanotechnology research.

Seoul National University lab researchers recently installed two Apex SLR systems with the well-proven inductively coupled plasma (ICP) source technology from Plasma-Therm. One system is configured for dry etching, and the second system is configured for high-density plasma chemical vapor deposition (HDPCVD).

Jong-Seung Park, Team Manager/Fab. Operations of Seoul National University, said the university’s cleanroom facility serves many users who are employing the Apex SLR® systems’ etch and deposition capabilities.

“We are pleased to provide a good reference for these systems and their support,” Park said. “Both systems operate as we expected and deliver reproducible results over the last more than 16 months. The systems are reliable and we are pleased to be a customer of Plasma-Therm.”

Park said the Apex SLR ICP system utilizes chlorine-based chemistries for etching various materials, with an emphasis on aluminum interconnects. The Apex SLR® HDPCVD system has been employed for a wide range of silicon oxide and silicon nitride deposition processes, such as trench or gap filling for device fabrication.

Dr. David Lishan, Director, Technical Marketing for Plasma-Therm, said that Apex SLR systems are ideally suited for corporate R&D and academic research settings. “The Apex SLR, with its very strong and successful processing history, excellent uniformity and reproducibility, has proven highly productive in research environments.” Dr. Lishan continued, “The ability for facilities like SNU’s to task Apex SLR systems and quickly achieve process specs for multiple users are big reasons for selection of Apex SLR over products that are less capable and more expensive.”

Advanced Vacuum Apex SLR systems are highly versatile, small-footprint, field-proven tools for all plasma processing applications. Apex SLR ICP is capable of etching a wide range of materials for semiconductor devices and other types of nanotechnology. Apex SLR HDPCVD performs deposition of high-quality thin films at relatively low temperatures for applications such as optical coatings, semiconductor device passivation layers, and other nano-electronic fabrication processes with limited thermal budgets.

SEMI announced today that over 43,000 visitors are expected to attend SEMICON Taiwan September 7-9 at the TWTC Nangang Exhibition Hall in Taipei. Over 550 exhibitors, 16 themed pavilions, and more than 20 international forums are being readied to connect attendees with companies, people, products, and information forming the future of advanced electronics, including a major focus on advanced packaging.

Douglas Yu, senior director of Integrated Interconnect and Packaging Technology at TSMC, recently announced that TSMC needs to transition – from the world’s leading IC foundry – to the industry’s first System in Package (SiP) foundry (SEMICON West; July 2016).  Yu stated, “We are a wafer foundry, but we are doing some packaging business to survive and grow . . . Moore’s law is becoming more challenging, so we are preparing for those days.”  Sources say that TSMC’s chip packaging changes have led to improvements of 20 percent in both speed and packaging thickness and 10 percent in thermal performance.

SEMICON Taiwan is an exceptional event to learn about the latest advances in packaging. On September 7, the SEMI Advanced Packaging Technology Symposium‘s theme is “Fan Out Solutions – Cost-effective FO Solutions, 3D/SiP FO Solutions, and Fine Patterning.” Industry experts from a wide range of companies will present, including: Amkor, APIC Yamada, ASE, ASM, IEK, Kulicke & Soffa, Lam Research, Protec, Senju, SPTS, SUSS MicroTec Photonic Systems, and Ueno SEIKI.

On September 8, SEMICON Taiwan’s SiP Global Summit begins with a 2.5/3D-IC Technology Forum with presentations from TSMC, Amkor, ANSYS, ASE Group, EVG, Fraunhofer IZM, Hitachi Chemical, IBM, IMEC, NMC, and SPIL.  On September 9, the SiP Summit features an Embedded and Wafer Level Package Technology Forum, with moderators from ASM Pacific Technology, ITRI, and SPIL.

Beyond packaging, many other innovation areas such as Smart Manufacturing, Semiconductor Materials and Executive Summit –Grand Opening Keynote session which always draws the most attention will be presented in technical and business programs, as well as on the show floor at the TechXPOTs, including:

  • High-Tech Facility TechXPOT: AccuDevice, Forbo Flooring, Hantech Engineering, Lumax International, Organo Technology, Particle Measuring, Rockwell Automation, Supenergy, Techgo Industrial, Trusval Technology, VIVOTEK, Wholetech Systems Hitech, and many more
  • Materials TechXPOT: AI Technology, Atotech Taiwan, CohPros International, CSI Chemical, Nippon Pulse Motor Trading (Taiwan), Tatsuta Electric Wire & Cable, and Uniwave Enterprise
  • New Product Launch TechXPOT: AblePrint Technology, Chemleader, Creating Nano Technologies, EVG-Jointech, First Elite Enterprise, SEIPI, Sigmatek, Sil-More Industrial, and YXLON/Teltec Semiconductor Pacific
  • Smart Manufacturing TechXPOT: Balluff Taiwan, Cimetrix, Dah Hsing Electric, and Gallant Precision Machining

For more information and registration for SEMICON Taiwan, please visit: www.semicontaiwan.org/en

Reno Sub-Systems, a developer of high-performance radio frequency (RF) matching networks, RF power generators and gas flow management systems for semiconductor manufacturing, today announced that it has secured its first platform design win for its Electronically Variable Capacitor (EVC) matching network. The order comes from a tier-one equipment manufacturer and will be installed as the default standard on its etch systems in a leading global semiconductor manufacturer’s high-volume production facility. Reno secured the design win following successful beta testing with the end customer.

Leading semiconductor manufacturers are driving semiconductor OEMs to improve film characteristics and process consistency between chambers and systems. These challenges are becoming greater as technology nodes shrink and move to multiple patterning, finFET logic gates, 3D NAND and through silicon via (TSV) devices.

“Our EVC matching network was specifically designed to address the most challenging plasma-related deposition and etch processes,” said Bob MacKnight, CEO of Reno Sub-Systems. “Microsecond RF tuning is essential for 14nm and below high volume manufacturing.”

The new, disruptive EVC technology enables unprecedented RF matching speeds not possible with vacuum variable capacitors (VVCs), which is the current industry standard. Reno’s patented EVC technology facilitates the speed, accuracy and plasma stability unachievable by RF matches being used for etch and deposition processes today.This run-to-run repeatable and accurate Instantaneous Match technology enables the precise, high-aspect ratio, selectively anisotropic sharp-edge plasma processing required for next-generation devices, including 3D structures.

“We recently completed our Series B round of funding to ramp to high-volume manufacturing,” said MacKnight. “Having received our first major production order validates our technology and we are proud to be shipping in volume.”

Busch, LLC, manufacturer and retailer of vacuum pumps, compressors and blowers with a reputation for reliable high-performing vacuum products, this week announced plans to build a new 44,000 sq. ft. building in Austin, Texas. The new facility will offer single piece flow re- manufacturing with four flow line capabilities, processing 16 modules per day from disassembly to testing. It also has the potential to serve as a distribution hub for pumps and parts.

Some upgraded features of the building include additional space, a training center, a fully exhausted disassembly area and visual production planning by way of large screens in each area tracking actual movements in the flow lines. Additionally, the new facility offers climate controls for the production area and process measurement capability of all hard parts. A visitor walkway will allow visitors to view the production area without entering it, and customers will be able to track their repairs via the web in real time.

Additionally, the entire workflow of the building is in line with the seven steps of flow line production: purge and de-systemize, disassembly/hot wash, blast, presentation, assembly, frame assembly, and testing.

Applied Materials, Inc. today announced the appointment of Judy Bruner to serve on its Board of Directors. Ms. Bruner has also been appointed to serve as a member of the Audit Committee of the Board.

“As a well-respected chief financial officer with deep experience in the global high-tech industry, Judy will be an asset to Applied Materials’ Board of Directors,” said Wim Roelandts, chairman of the board of Applied Materials. “Having built her career in increasingly sophisticated finance roles across some of Silicon Valley’s top hardware companies, she is a welcome addition to our team of directors and will be a valued member of our Audit Committee.”

Judy Bruner served as Executive Vice President, Administration and Chief Financial Officer of SanDisk Corporation, a supplier of flash storage products, from June 2004 until its acquisition by Western Digital in May 2016. Previously, she was Senior Vice President and Chief Financial Officer of Palm, Inc., a provider of handheld computing and communications solutions, from September 1999 until June 2004. Prior to Palm, Inc., Ms. Bruner held financial management positions at 3Com Corporation, Ridge Computers and Hewlett-Packard Company. She currently serves as a member of the board of directors of Brocade Communications Systems, Inc. and a member of the board of trustees of the Computer History Museum.

Worldwide semiconductor capital spending is projected to decline 0.7 percent in 2016, to $64.3 billion, according to Gartner, Inc. (see Table 1). This is up from the estimated 2 percent decline in Gartner’s previous quarterly forecast.

“Economic instability, inventory excess, weak demand for PC’s, tablets, and mobile products in the past three years has caused slow growth for the semiconductor industry. This slowdown in electronic product demand has driven semiconductor device manufacturers to be conservative in increasing production,” said David Christensen, senior research analyst at Gartner. “Looking ahead, it appears the second half of 2016 may see improved demand. However, following Brexit, semiconductor inventory levels may rise in the third and fourth quarters, which could lead to reduced production volumes.”

Table 1

Worldwide Semiconductor Capital Spending and Equipment Spending Forecast, 2015-2018 (Millions of Dollars)

2015

2016

2017

2018

Semiconductor Capital Spending ($M)

64,750.8

64,278.3

66,010.5

68,523.7

Growth (%)

0.3

-0.7

2.7

3.8

Wafer-Level Manufacturing Equipment ($M)

33,248.1

32,890.9

34,842.2

37,704.3

Growth (%)

-1.1

-1.1

5.9

8.2

Wafer Fab Equipment ($M)

31,485.4

31,071.8

32,862.1

35,491.5

Growth (%)

-1.3

-1.3

5.8

8.0

Wafer-Level Packaging and Assembly Equipment ($M)

1,762.7

1,819.1

1,980.1

2,212.9

Growth (%)

4.1

3.2

8.9

11.8

Source: Gartner (July 2016)

The PC, ultramobile (tablet) and smartphone production forecast for the second half of 2016 has been lowered from 2015, as the industry slowdown continues. These reductions have resulted in a forecasted 3 percent decline for the semiconductor market. Memory revenue growth for 2016 is also revised downward compared with the previous forecast, due to a weaker pricing outlook.

“While currency exchange rates are another reason for the ongoing revenue decrease, the aggressive pursuit of semiconductor manufacturing capability by the Chinese government and related investment companies is becoming a major factor,” said Mr. Christensen. “This will dramatically affect the competitive landscape of the global semiconductor manufacturing in the next few years as China becomes a major market for semiconductor usage and manufacturing.”

This research is produced by Gartner’s Semiconductor Manufacturing program. This research program, which is part of the overall semiconductor research group, provides a comprehensive view of the entire semiconductor industry, from manufacturing to device and application market trends. Additional analysis on the outlook for the market can be found at “Forecast: Semiconductor Capital Spending, Worldwide, 2Q16 Update.”

By Pete Singer, Editor-in-Chief

The semiconductor industry is moving quickly to adopt a variety of new materials in an effort to increase chip performance. These new materials can create a host of safety concerns that must be addressed. Many of the new process chemicals have low vapor pressures, are highly reactive and present serious hazards to personnel and equipment. Many new CVD precursors and their associated reaction by-products are flammable, pyrophoric, toxic, corrosive or otherwise hazardous to personnel or destructive to equipment. “The problem’s always been there. It’s just becoming more acute as new processes emerge,” said Andrew Chambers, Senior Product Manager at Edwards Ltd., Clevedon, UK.

The Danger That Lurks Figure

Process byproducts are pumped through exhaust lines to a gas abatement system. Residual precursor materials or reaction byproducts often have a tendency to condense in pipe-work, including process exhausts. These exhaust pipes must be cleaned regularly, since condensed material will block the pipe, reduce its conductance and cause process problems.

Epitaxial silicon (“epi”) deposition processes, for example, are particularly notorious for the process decomposition products condensing in exhaust pipes or in the foreline of the pump. The hazard is greatest when the exhaust system is dismantled for cleaning. “The condensed material can react violently when it’s exposed to air and will burn vigorously or even explode. That presents a pretty serious hazard to the service engineers who are charged with taking the pipe apart and cleaning it,” Chambers said.

These problems can largely be avoided, however, by keeping the exhaust pipe or the pump foreline at a high temperature to avoid condensation of the material. If the surfaces in the exhaust system are warm enough, the processed products transit through the exhaust pipe and into the abatement system, where they can be combusted and dealt with in a safe fashion.

In many fabs, the heating is done with heating tape, but that’s not always the best (or safest) way to go. “In principle, that works up to a point but it’s quite difficult to apply that kind of technique when you’ve got accessories like a large ball valve in the line, where there are brackets attaching the exhaust pipe to the wall or there’s a system for injecting nitrogen dilution gas into the exhaust. The idea of heater tapes is convenient but not a very effective fix,” Chambers said. “Furthermore, removing heater tape to dismantle and clean the exhaust pipe can be inconvenient and time consuming” he added.

What’s really required is an approach that involves heating the pipe in a uniform fashion so that the pipe is universally at a high temperature to avoid the condensation. “You can’t afford to have cold spots in the pipe where there’s no heater or there’s no insulation because the moment you have a cold spot in the pipe, then material’s going to condense there and cause a local blockage,” he said.

Edwards offers a new Temperature Management System (SMART TMS) that ensures these compounds remain volatile until they enter the abatement device. SMART TMS is designed to heat both forelines and pump exhaust lines uniformly as far as the inlet of the abatement device. Molded high surface area heaters maximize contact with pipes and are designed to maintain them at a constant temperature between ambient and 180°C, recognizing that when choosing the temperature set point, knowledge of what process materials and byproducts are going to be in the exhaust pipe is invaluable.

Chambers said this approach is also superior to other heating methods using custom heater mats with integral insulation. “The difficulty you encounter with those kinds of systems is that the heater mat and jacket tend to be custom-designed to suit the particular installation. You spend a lot of time designing stuff, placing orders and waiting for it to be manufactured. Once it is manufactured and installed, there’s no flexibility. If you change the configuration of the exhaust pipe, you’ve got to go buy a whole set of new pipeline heating components,” he said.

With the Edwards SMART TMS approach, heater mats are provided separately from the insulation. “The heater mats are provided in standard lengths and as shaped components too, for elbows, valves, T-pieces and so on. You basically assemble the heater mats of sufficient length to heat your pipe from one end to the other. Then, since they’re made from low-particulate material, the insulation jackets can be cut to shape on assembly to fit the exhaust pipe. They’re all basically reusable,” Chambers said.

Success in thermal management goes well beyond mechanical considerations, however. “A lot of the skill and judgment in temperature management of exhaust pipes is knowing what factors you need to take care of to get decent temperature control throughout the system,” Chambers said.

When handling flammable gases, for example, nitrogen is often used to dilute them below their lower flammable limit to make them safe. “Typically, you pour a whole lot of nitrogen dilution gas into your exhaust pipe. The way in which you do that has a very significant impact on the temperature of the gas and the temperature of the exhaust pipe,” Chambers said. “If you’ve heated your exhaust pipe up to a temperature based on the process gases flowing through it and then you flow into it a couple of hundred liters per minute of cold nitrogen, then your heating system is no longer going to be fully effective. You start to run into the kind of condensation problem you were trying to avoid in the first place.”

The Edwards solution to that problem is to employ a system to heat up the nitrogen dilution gas. “Providing a nitrogen heater system as an accompaniment to a temperature management system for the exhaust pipe is sometimes a desirable thing to do,” Chambers added.

SMART TMS includes a sophisticated control system. “In our system, we have a controller which takes care of exhaust pipes on a zone by zone basis. The controller can control nine zones. All of those nine zones may be nine separate pipes. It may be one long pipe with nine zones in it over a long distance,” Chambers said.

The controller has useful operational features such as the ability to set and log different control temperatures and user-defined limits in each zone. If a temperature strays outside the user-defined band, an alert is transmitted from the controller to the process tool, the fab central monitoring system or other fault reporting system, depending on the nature of the fault. Furthermore, recognizing that some processes can cause very hazardous byproduct build-up in cold exhausts, SMART TMS includes a “fail-on” function to ensure that in the event of a component failure or loss of temperature indication a high pipeline temperature is maintained until servicing can be scheduled. In these cases the integrated health-check function provides an alert, while dual safety devices in each heater provide intrinsic safety and protection against thermal runaway.

“In the future, we can imagine the process which is running in the tool can be used to inform the set-up of the sub-fab equipment, the dry pumps or even the temperature management system,” Chambers said. “We’ve come a long way from relatively simple electrical heaters installed on an ad hoc basis to a sophisticated combination of process knowledge, a wide range of heater mats and shaped heaters, very efficient insulation materials and intelligent controllers with data acquisition capability.”