Category Archives: Materials and Equipment

Mentor Graphics Corp. today announced it has acquired the business assets of Tanner EDA, a tool provider for the design, layout and verification of analog/mixed-signal (AMS) and MEMS integrated circuits. With this acquisition, more designers will now have access to Tanner’s AMS products based on the strength and reach of the Mentor Graphics global sales organization. All Tanner EDA products as well as existing AMS products from Mentor will continue to be available and supported.

“Tanner EDA has built an outstanding reputation as the price performance leader for the design, layout and verification of AMS ICs, MEMS and IoT devices,” said Greg Lebsack, President of Tanner EDA. “We are excited to join Mentor Graphics where we can leverage their extensive technology leadership and global footprint. We view this transaction as very positive for Tanner EDA’s customers, employees and the industry as a whole.”

Harvest Management Partners, LLC advised Tanner Research, Inc. regarding the sale of the assets of Tanner EDA.  Terms of the deal were not disclosed.

AG Semiconductor Services, LLC (AGSS), one of the largest suppliers of used electronics manufacturing equipment, is pleased to announce that it has entered into a strategic relationship with JA Mitsui Leasing, Ltd. (JAML). As part of the relationship, JAML made a significant financial investment in AGSS, and JAML and AGSS together purchased a substantial portfolio of used semiconductor manufacturing equipment.

“Over the past several years, AGSS has undertaken a number of initiatives to strengthen and grow its business, including (a) a significant expansion of sales and support personnel in 2012 in connection with an engagement to remarket a substantial portfolio of equipment; (b) implementation of a robust CRM software system to support quoting, sales and inventory management activities, and (c) development of strategic relationships with key OEMs and third-party suppliers,” said Albert Vasquez, a managing director at AGSS. “The new relationship with JAML further expands our capabilities by enabling AGSS to offer low cost financing options to credit-worthy customers.”

AGSS continues to purchase and sell surplus semiconductor manufacturing equipment, while also providing customers with turnkey services such as refurbishment, reconfiguration, installation and warranty. Through its comprehensive support infrastructure, AGSS also continues to offer inventory management, market metrics and compliance control.

“JAML and AGSS are both committed to growing our businesses in the semiconductor industry. We are particularly excited about our new relationship because AGSS’s extensive data on used equipment values and its proven remarketing capabilities will enable JAML to give maximum credit to residual equipment values, which in turn will enable JAML to offer extremely competitive financing options,” said Kiyoshi Doi, general manager of the Global Electronics Department of JAML. “We look forward to working with existing and new AGSS customers to help meet their financing needs.”

Amkor Technology, Inc. today announced that Susan Y. Kim has been appointed as a new member of the Company’s Board of Directors. With this appointment, Amkor’s Board has been expanded to ten members.

“We are pleased to have Susan join us,” said James Kim, Amkor’s Executive Chairman. “Susan is an experienced director and will be a great addition to our Board.”

Ms. Kim is a former Board Member of EB Games Corp. She is an active philanthropist who currently sits on the Board of Directors of the Catholic Foundation of Greater Philadelphia. In the past she has served on numerous Boards of Directors including: The National Constitution Center, The Philadelphia Orchestra, The Franklin Institute, The GESU School, and The Shipley School. Ms. Kim holds a B.A. in Sociology from Hamilton College. She is the daughter of Amkor’s Executive Chairman, James Kim, and the sister of Amkor’s Vice Chairman, John Kim.

Amkor is a provider of semiconductor packaging and test services to semiconductor companies and electronics OEMs.

Driven by mobile and automotive applications, the CIS industry is expected to grow at a CAGR of 10.6 percent from 2014 – 2020. Yole Développement (Yole) announced a US$16.2B market by 2020 (in value).

“Smartphone applications still take the lion’s share of the CMOS Image Sensor (CIS) market”, announces Yole, the “More Than Moore” market research, technology and strategy consulting company, in its new report Status of the CMOS Image Sensor Industry, 2015 Edition, released this week. “Many different applications are part of CIS’ growth story,” details Yole in its technology & market analysis. It includes automotive, medical, and surveillance are areas where great opportunities have surfaced and are driving the market and technology efforts of existing and new players.

Pierre Cambou, Activity Leader, Imaging & Sensors at Yole Développement and Jean-Luc Jaffard, formerly at STMicroelectronics and part of Red Belt Conseil both pursue their investigation and highlight in this new study the CIS market issues.

Under the report Status of the CMOS Image Sensor Industry, Yole’s team provides key technical insight and analysis about future technology trends and challenges including manufacturing & devices technologies and a technology focus on game-changing areas such as BSI and 3D stacked BSI. This analysis also presents CIS revenue forecast, volume shipments and wafer production by application, market shares and application focus on key CIS growth areas: mobile, DSLR, automotive, medical, security, machine vision.

Exciting new emerging market trends are relevant to the CIS industry. In mobile, the addition of the secondary front-facing camera is already old news, as all high-end handsets and smartphones now have two cameras. In fact, Chinese manufacturers are actually pushing for higher resolution secondary cameras.

”This significantly impacts the average selling price (ASP) of micro camera modules, and is causing low-end players to abandon their focus on submega pixel production and move toward 5Mp+ territories,” explained Pierre Cambou.

Naturally, this has had a major impact on the capital expenditures and technology portfolio roadmaps of these CIS mobile players. This trend is even more crucial for main rear cameras, where compactness and performance are pushed to the extreme. Mobile has become a high-performance/high-volume domain in which one player has excelled so far: Sony Corp (Latest announcement in Nov. 2014)

Automotive is the big story this year, as car manufacturers like Tesla, Nissan and Ford are showing off their first camera-enabled features. Market traction is particularly impressive, with most CIS players enjoying growth rates of 30% – 50%. But this is only the beginning, with most CIS players looking at this market, total revenue should reach US$800M in 2020 – for CIS sensors only.

Automotive’s emerging importance promises profound implications for the CIS ecosystem. As CIS moves from a “for display” application towards a “for sensing” application, new players such as processor and software providers will become key partners for sensor design and marketing.

On the other hand, some CIS segments have suffered sharp decline. With feature phone cameras and digital still-cameras being replaced by more widely-used smartphone cameras, players in these applications are suffering, which is leading to industry consolidation. Yole’s analysts have seen a high level of M&A activity in 2014, which should continue in 2015.

Amkor Technology, Inc. today announced the settlement of its outstanding litigation and arbitration proceedings with Tessera, Inc.

Under the terms of the settlement, Amkor has agreed to pay Tessera a total of $155 million in equal quarterly installments over the next four years, and the parties have agreed to a mutual release and dismissal of all claims relating to their pending litigation and arbitration proceedings, including the previously awarded judgment of $128.3 million plus interest. The settlement agreement also provides that Tessera and Amkor will look for opportunities to engage in potential technology collaboration.

“We are pleased to have reached a comprehensive resolution in this long-running dispute and look forward to exploring technical collaboration with Tessera,” said Gil Tily, Amkor’s Executive Vice President, Chief Administrative Officer and General Counsel.

Amkor expects to record an after-tax charge to earnings in the fourth quarter of 2014 for most of the total settlement amount, net of amounts previously reserved. Amkor will provide more detail in its upcoming earnings release for the fourth quarter and full year 2014.

Amkor is a provider of semiconductor packaging and test services to semiconductor companies and electronics OEMs.

CEA-Leti will present its latest results on CoolCube, the technique for stacking transistors sequentially in the same process flow for 3D-VLSI, at a Dec. 14 workshop in San Francisco, Calif. The workshop precedes IEDM 2014, Dec. 15-17.

“The technology is designed to allow a connection of the stacked active layers on a nanometric scale, with a very high density, due to their alignment by a standard lithographic process,” said Maud Vinet, Leti’s advanced CMOS laboratory manager, who will give the presentation. “This 3D concept should allow a gain of 50 percent in area and 30 percent in speed compared to the same technology generation ​​in classic 2D – gains comparable to those expected in the next generation.”

Under development for eight years, CoolCube aims at cutting in half the thermal budget in manufacturing transistors, while maintaining their performance. This low-temperature fabrication allows vertical integration of a transistor without degrading the performance of the transistors beneath or the metal interconnects between the layers of the transistors.

During the continuation of the project over the next three years, Leti and its industrial partners will target development of a silicon component prototype of CoolCube.

In addition to the CoolCube overview, the workshop for invited guests will include summaries of:

  • Leti’s innovative route with industry
  • Emerging material for future market opportunities
  • Leti’s vision towards 10nm and below
  • Embedded NVM for the future
  • Going further with disruptive designs and architectures
  • Electronic medicine: a new market needing new medical methodologies

Leti also will present 17 papers, including four invited papers, at IEDM 2014.

Interview with SEMI Europe’s Yann Guillou gives attendees a preview of the event

This year’s European 3D TSV Summit is fast approaching. Many actors from the 3D TSV supply chain will convene to Grenoble (France) on Jan 19-21, 2015. This year’s theme is “Enabling Smarter Systems”.

In a recent interview published by 3DIncites, Yann Guillou, the event’s architect, revealed the inspiration behind this year’s theme. “Each year, we try to have our conference theme reflect the current state of 3D technology as expressed by industry leaders,” he explained. “When we look at the most recent evolution of 3D TSV technology, we see that TSVs have become an indispensable part of the smarter systems development, so the theme ‘Enabling Smarter Systems’ seemed to stem quite naturally from this.”

The Summit will boast three keynote speakers who are experts in the field of 3D TSV.  In the interview, Guillou shares his excitement about the keynote choices, who all hail from companies particularly active in the 3D TSV sector. Of keynote speaker Timo Henttonen, Senior manager of packing at Microsoft, Guillou said: “For years, [he] has been a key person at Nokia in the packaging group driving new technology developments and implementing them in large volumes. Now, with Nokia’s mobile phone unit having been absorbed into Microsoft, what Timo will share with attendees should be a highlight of the Summit.” Also participating as keynote speakers will be Bryan Black, Senior Fellow at AMD and Bill Chen, Fellow and Senior Technical Advisor at ASE Group.Of the latter, Guillou says, “Bill rarely delivers talks in Europe, and I’m sure he will have key messages to pass on to attendees in his explanation of how ASE sees TSV contributing to their upcoming business activities.”

Along with keynote speakers, the conference will offer a host of invited speakers to discuss various topics that relate to 3D TSV. According to Yann Guillou, multiple criteria such as internationality and diversity of functions in the supply chain determine which speakers will be invited to present at the European 3D TSV Summit. To continue offering a program that deals with the most pressing challenges being faced by manufacturers, SEMI will include new subjects that have not been treated in previous editions of the Summit.

“For instance,” Mr. Guillou explains, “we wanted to have some presentations on ‘Interposers’, from a product and business perspective as well as from a technology perspective. In this regard, on the interposer technology side, we will take a closer look at the glass approach that is important not to neglect.”

For the first time ever, the Summit will also highlight 3D TSV technology in photonics hosting IBM and HP to present on the subject.

Since its debut, the organizers of the European 3D TSV Summit have insisted on the importance of presenting 3D TSV not only from a technology angle, but also from a business angle. “SEMI is a trade association,” states Guillou, “and one of our main goals is to inform and support our members in detecting business opportunities.” This year, SEMI will take this one step further, offering an entire Market Briefing dedicated to the outlook for the 2.5D and 3D markets, and hosting market analysts from Yole Développement, ATREG, TechSearch International and AlixPartners.

When asked what is unique about the event, Yann Guillou answers, “We are proposing a full ‘experience’ for attendees… The event is a unique combination of keynote and invited talks, industry-relevant panel discussion and a quite specialized exhibition that receives high foot traffic.” With over 330 attendees at each of the past two editions of the European 3D TSV Summit, it appears that the 3D TSV community has embraced the concept.

For more information about the European 3D TSV Summit, you can visit the website: www.semi.org/European3DTSVSummit

Scientists have developed a new light-sensitive film that could one day form the basis of a prosthetic retina to help people suffering from retinal damage or degeneration. Hebrew University of Jerusalem researchers collaborated with colleagues from Tel Aviv University and Newcastle University in the research, which was published in the journal Nano Letters.

The retina is a thin layer of tissue at the inner surface of the eye. Composed of light-sensitive nerve cells, it converts images to electrical impulses and sends them to the brain. Damage to the retina from macular degeneration, retinitis pigmentosa and other conditions can reduce vision or cause total blindness. In the United States alone, age-related macular degeneration (AMD) affects as many as 15 million Americans, with over 200,000 new cases diagnosed every year.

Scientists are currently designing a variety of medical devices to counter the effects of retinal disorders by sending visual signals to the brain. But these silicon-chip based solutions are typically hampered by their size, use of rigid parts, or requirement of external wiring such as to energy sources.

Carbon nanotube-semiconductor nanocrystals film for light stimulation of the retina. Absorption of light by semiconductor nanorods attached to carbon nanotube film (upper right) results in retina stimulation (upper left). Reused and adapted with permission from Bareket, Waiskopf et al, Semiconductor Nanorod–Carbon Nanotube Biomimetic Films for Wire-Free Photostimulation of Blind Retinas. Nano Letters, 2014; 14 (11): 6685 DOI: 10.1021/nl5034304. Copyright (2014) American Chemical Society

In the new study, Hebrew University researchers collaborated with colleagues from Tel Aviv University and Newcastle University to develop a novel approach for retina stimulation. Their device absorbs light and stimulates neurons without using wires or external power sources.

The Hebrew University researchers are Prof. Uri Banin, the Alfred & Erica Larisch Memorial Chair in Solar Energy, and his graduate student Nir Waiskopf, at the Institute of Chemistry and the Harvey M. Krueger Family Center for Nanoscience and Nanotechnology.

The researchers combined semiconductor nanorods and carbon nanotubes to create a wireless, light-sensitive, flexible implantable film. The film transforms visual cues to electric signals, mimicking the function of the photo-sensitive cells in the retina. Therefore, it could potentially form part of a future prosthetic device that will replace the damaged cells in the retina.

The researchers tested the new device on light-insensitive retinas from embryonic chicks and observed a neuronal response triggered by light.

According to the researchers, the new device is compact, capable of higher resolution than previous designs, and is also more effective at stimulating neurons. While much work remains until this can provide a practical solution, with additional research the researchers hope their carbon nanotube-semiconductor nanocrystals film will one day effectively replace damaged retinas in humans.

Prof. Uri Banin of the Hebrew University said: “This is a pioneering work demonstrating the use of highly tailored semiconductor nanocrystals in activation of biomedical functionalities. We hope this can lead to future implementation of this approach in retinal implants.”

The researchers received funding from the Israel Ministry of Science and Technology, the European Research Council and the Biotechnology and Biological Sciences Research Council.

The research was published in Nano Letters as “Semiconductor Nanorod-Carbon Nanotube Biomimetic Films for Wire-Free Photostimulation of Blind Retinas.”

Texas Instruments Incorporated (TI) today announced it will expand its manufacturing capacity in Chengdu, China, with a 300mm wafer bumping facility. The addition of this manufacturing process in Chengdu further increases TI’s 300mm analog capacity and its ability to support customer demand.

TI announced the new operation today in concert with an event celebrating the grand opening of its seventh assembly/test (A/T) facility. The 358,000 square-foot A/T facility was purchased from UTAC Chengdu Ltd. in December 2013 and is now qualified and in production using advanced quad-flat no-leads (QFN) packaging technology.

TI’s manufacturing investment in China began in 2010 with the opening of the company’s first wafer fabrication plant in Chengdu. TI extended its investment with the adjacent A/T facility, opening today. TI will now further extend its operations in Chengdu with a 300mm wafer bumping facility on its Chengdu High-tech Zone (CDHT) campus.

“The CDHT has been a dynamic area of economic development in West China, offering a strong environment for investment and government service,” said Kevin Ritchie, senior vice president of TI’s Technology & Manufacturing Group. “We’re pleased to extend our 300mm manufacturing capabilities at our world-class Chengdu facility to further ensure continuity of supply to our customers and support their growth.”

Wafer bumping is a manufacturing process for advanced packaging technologies, which is completed prior to assembly. The process replaces wire bonding as the interconnection by applying solder, in the form of bumps, or balls, to a device at the wafer level. Nearly 40 percent of TI’s wafer production is manufactured using bump techniques.

This investment plan does not change TI’s capital spending forecast. The company continues to expect its capital spending levels to remain about 4 percent of revenue.

TI has served a broad array of customers in China for more than 27 years. In addition to its manufacturing footprint in Chengdu, TI has established 18 offices providing sales and applications support, four R&D centers and a product distribution center in Shanghai.

TI has manufacturing operations throughout the world, including the United States, Mexico, Germany, Scotland, China, Malaysia, Japan, Taiwan and the Philippines. Its 300mm operations include the industry’s first 300mm Analog wafer fab in Richardson, Texas as well as its DMOS6 wafer fab in Dallas and bump operations in the Philippines and Dallas.

SEMI today announced that Tetsuro (Terry) Higashi, chairman, president and CEO of Tokyo Electron Limited (TEL), has been selected as the 2015 recipient of the SEMI Sales and Marketing Excellence Award, inspired by the late Bob Graham. He will be honored for outstanding achievement in semiconductor equipment and materials marketing during ceremonies on December 3 at SEMICON Japan 2014 in Tokyo.

Terry Higashi will receive the 18th SEMI Sales and Marketing Excellence Award for being a catalyst in the development of the advanced semiconductor research infrastructure in Albany, New York; setting a new standard for partnerships with his trusted relationship-style with customers; as well as his early efforts to globalize the company he leads and promote a collaboration model of industry engagement.

“Higashi-san is recognized as a leader and visionary throughout the semiconductor manufacturing supply chain,” said Denny McGuirk, president and CEO of SEMI. “His significant marketing leadership has served to energize the industry, and as a result he has had an impact extending far beyond his own company.”

Factors considered by the award selection committee in the evaluation of nominees include: marketing contribution, market growth considerations, value to the customer, and strategic importance to the industry. Many prominent industry executives representing both customers and competitors that commented during the committee’s due diligence process noted that, during the course of Higashi’s 35-year career, he championed the concept of a connected Value Chain with customers, suppliers, employees, and industry colleagues.

His encouragement of open platform initiatives and industry collaboration helped bring customers and suppliers closer together, increase the return on R&D investments, and focus research spending on the most challenging technical and economic challenges of Moore’s law. His leadership was vital to driving cooperation among SEMI members and their customers at innovation centers and consortia around the world that have helped the industry share risk and drive technology roadmaps.

Higashi is recognized as an early proponent of global business model among Japanese equipment company leaders. Early in his management tenure, at a time when the industry was transitioning from regional markets served by local suppliers to a truly global manufacturing supply chain, Higashi supported the transformation of TEL from a domestic trading company to a major, international equipment manufacturer. His global vision for regionally based sales, support and marketing grew to be among the most effective and respected in all regions.

Higashi also has an established record of industry stewardship. He was elected to the SEMI International Board of Directors in 1999 and served as Chairman of the SEMI Board from 2004 to 2005. He was named Director Emeritus of the Board in 2010. He also served as Chairman of SEAJ (Semiconductor Equipment Association of Japan) from 2005-2011, and currently serves as its Vice Chairman.

Tetsuro (Terry) Higashi serves as the Chairman, President and CEO at Tokyo Electron Limited. He joined the company in 1977, having served as the President & CEO since 1996. He has worked in a variety of senior management positions. Higashi received an undergraduate degree from International Christian University in Tokyo, Japan and a master’s degree from Tokyo Metropolitan University, Hachioji City, Tokyo.

The SEMI Sales and Marketing Excellence Award was inspired by the late Bob Graham, the distinguished semiconductor industry leader who was part of the founding team of Intel and who helped establish industry-leading companies Applied Materials and Novellus Systems. The Award was established to honor individuals for the creation and/or implementation of marketing programs that enhance customer satisfaction and further the growth of the semiconductor equipment and materials industry.

Eligible candidates are nominated by their industry peers and are selected by an award committee. Previous recipients of this SEMI award include: Art Zafiropoulo (2000), Jim Healy and Barry Rapozo (2001), Jerry Hutcheson and Ed Segal (2002), Steve “Shigeru” Nakayama (2003), Edward Braun (2004), Archie Hwang (2005), Aubrey C. (Bill) Tobey (2006), Richard Dyck (2007), Richard Hong (2008), Peter Hanley (2009), Martin van den Brink (2010), Franz Janker (2011),  Dan Hutcheson (2012), JC Kim (2013), and Winfried Kaiser (2014).