Category Archives: Materials and Equipment

Boston Semi Equipment LLC (BSE) today announced it has completed the integration of the sales and service teams of MVTS and Aetrium into the BSE distribution channel. This forms a single worldwide sales and service team to serve BSE customers. The organization has fifty experienced semiconductor equipment industry professionals situated around the world to address the requirements of semiconductor companies from development lab to production facilities around the globe.

“With the completion of this integration activity, BSE’s customers have access to seventeen sales and applications specialists and thirty three service technicians in 10 countries,” commented BSE Executive Vice President Colin Scholefield. “We can provide solutions to meet the automatic test equipment, prober, handler and fab tool requirements of our customers around the world and in all of their facilities.”

Since late April, BSE has acquired the test handler assets of Aetrium, Inc. and has purchased MVTS Technologies (MVTS). These acquisitions bring complementary products and markets to the BSE family of companies and add R&D and production facilities in strategic locations.

Boston Semi Equipment LLC (BSE) is a semiconductor equipment company that has established a reputation as a reliable source for affordable back end test equipment, fab tools and service solutions for semiconductor manufacturers and OSATs worldwide.

Using graphene ribbons of unimaginably small widths – just several atoms across – a group of researchers at the University of Wisconsin-Milwaukee (UWM) has found a novel way to “tune” the wonder material, causing the extremely efficient conductor of electricity to act as a semiconductor.

In principle, their method for producing these narrow ribbons – at a width roughly equal to the diameter of a strand of human DNA – and manipulating the ribbons’ electrical conductivity could be used to produce nano-devices.

Graphene, a one-atom-thick sheet of carbon atoms, is touted for its high potential to yield devices at nanoscale and deliver computing at quantum speed. But before it can be applied to nanotechnology, researchers must first find an easy method of controlling the flow of electrons in order to devise even a simple on-off switch.

“Nano-ribbons are model systems for studying nanoscale effects in graphene, but obtaining a ribbon width below 10 nanometers and characterizing its electronic state is quite challenging,” says Yaoyi Li, a UWM physics postdoctoral researcher and first author of a paper published July 2 in the journal Nature Communications.

By imaging the ribbons with scanning-tunneling microscopy, researchers have confirmed how narrow the ribbon width must be to alter graphene’s electrical properties, making it more tunable.

“We found the transition happens at three nanometers and the changes are abrupt,” says Michael Weinert, a UWM theoretical physicist who worked on the Department of Energy-supported project with experimental physicist Lian Li. “Before this study, there was no experimental evidence of what width the onset of these behaviors is.”

The team also found that the narrower the ribbon becomes, the more “tunable” the material’s behaviors. The two edges of such a narrow ribbon are able to strongly interact, essentially transforming the ribbon into a semiconductor with tunable qualities similar to that of silicon.

The first hurdle

Current methods of cutting can produce ribbon widths of five nanometers across, still too wide to achieve the tunable state, says Yaoyi Li. In addition to producing narrower ribbons, any new strategy for cutting they devised would also have to result in a straight alignment of the atoms at the ribbon edges in order to maintain the electrical properties, he adds.

So the UWM team used iron nanoparticles on top of the graphene in a hydrogen environment. Iron is a catalyst that causes hydrogen and carbon atoms to react, creating a gas that etches a trench into the graphene. The cutting is accomplished by precisely controlling the hydrogen pressure, says Lian Li.

The iron nanoparticle moves randomly across the graphene, producing ribbons of various widths – including some as thin as one nanometer, he says. The method also produces edges with properly aligned atoms.

One limitation exists for the team’s cutting method, and that has to do with where the edges are cut. The atoms in graphene are arranged on a honeycomb lattice that, depending on the direction of the cut produces either an “armchair-shaped” edge or a “zigzag” one. The semiconducting behaviors the researchers observed with their etching method will only occur with a cut in the zigzag configuration.

Manipulating for function

When cut, the carbon atoms at the edges of the resulting ribbons have only two of the normal three neighbors, creating a kind of bond that attracts hydrogen atoms and corrals electrons to the edges of the ribbon. If the ribbon is narrow enough, the electrons on opposite sides can still interact, creating a semiconductive electrical behavior, says Weinert.

The researchers are now experimenting with saturating the edges with oxygen, rather than hydrogen, to investigate whether this changes the electrical behavior of the graphene to that of a metal.

Adding function to graphene nano-ribbons through this process could make possible the sought-after goal of atomic-scale components made of the same material, but with different electrical behaviors, says Weinert.

Entegris Inc., a Billerica-based materials and solutions provider to the microelectronics industries, today inaugurated its new i2M Center for Advanced Materials Science (“The i2M Center”) in Bedford, Massachusetts. The facility is the company’s flagship innovation center for developing filtration and specialty coatings technologies, which are used to maximize production yields in the world’s most demanding and challenging microelectronics manufacturing environments.

Representing an investment of more than $55 million, the i2M Center will focus on R&D and manufacturing for filtration media, metal membranes, electrostatic clamps (E-Chucks) and proprietary advanced, low-temperature coatings.

“i2M stands for ‘ideas to market’ and we intend for this facility to be our flagship innovation center for solving very difficult materials science challenges,” Bertrand Loy, President and CEO of Entegris, said. “Our customers run extremely complex manufacturing processes and the i2M Center reflects our commitment to developing truly innovative solutions to support their process advancements. As a global company serving global customers, we evaluated a number of locations for this new building. We chose Massachusetts because it is at the epicenter of some of the best engineering talent in the world.”

Approximately 100 professionals will work at i2M Center, many of whom hold doctorates and advanced degrees in material/separation science and chemical engineering. Entegris has approximately 350 employees in Massachusetts and approximately 3,500 employees worldwide.

Entegris reported on April 30, 2014 that it completed the acquisition of Danbury-based ATMI for $1.1 billion.

A UC Riverside-led research project is among the 32 named today by U.S. Energy Secretary Ernest Moniz as an Energy Frontier Research Centers (EFRCs), designed to accelerate the scientific breakthroughs needed to build a new 21st-century energy economy in the United States. “Spins and Heat in Nanoscale Electronic Systems” (SHINES) will receive $12 million over four years from the Department of Energy. The lead researcher is UC Riverside Professor of Physics Jing Shi, who will work with researchers from seven universities.

SHINES is one of 10 new projects announced today, along with 22 other projects receiving new funding based on achievements to date. The Department of Energy announced a total of $100 million in funding to support fundamental advances in energy production, storage, and use.

“Today we are mobilizing some of our most talented scientists to join forces and pursue the discoveries and breakthroughs that will lay the foundation for our nation’s energy future,” Secretary Moniz said. “The funding we’re announcing today will help fuel innovation.”

He said the intent of the Energy Frontier Research Centers is to make fundamental advances in solar energy, electrical energy storage, carbon capture and sequestration, materials and chemistry by design, biosciences, and extreme environments.

“I am happy to hear the news,” said Shi, the UCR physics professor who has put together an interdisciplinary team of  researchers from UC Riverside, UCLA, Johns Hopkins, Arizona State University, University of Texas, Austin and Colorado  State University, Fort Collins.

“I’m looking forward to seeing the scientific advances that they come up with,” said Michael Pazzani, UC Riverside’s Vice Chancellor for Research and Economic Development. “This is exactly the kind of scientific leadership that UC Riverside has been encouraging and supporting This project will lay the groundwork for energy technology for the nation.”

SHINES will investigate several aspects of basic research: new ultrathin films, nanostructured composites, high resolution imaging, the transport of electrical signals, heat and light. “All of it will be studied, modeled and simulated in order to help the nation’s ability to advance in the way we use energy,” said Shi, the lead researcher.

SEMI today reported the worldwide PV manufacturing equipment billings and bookings for the first quarter of 2014. Worldwide billings declined to $240 million in Q1 2014, a decrease of 42 percent from the prior quarter though just 6 percent below the same quarter a year ago. Worldwide bookings for the first quarter grew to $296 million, 18 percent above Q4 2013 and 44 percent higher than Q1 2013. At 1.24, the book-to-bill ratio broke above parity for the first time since 1Q 2011 with bookings at the highest quarterly value since Q1 2012.

PV bookings

On the regional basis, equipment sales were dominated by Asia. For the first quarter, Asia represented over 70 percent of total billings and over 80 percent of the total bookings.

The worldwide PV equipment billings and bookings data is gathered jointly by SEMI and the German Engineering Federation (VDMA) from about 40 global equipment companies that provide data on a quarterly basis.

TowerJazz, a global specialty foundry, and Genoray Co. Ltd., a manufacturer of digital X-ray devices, today announced collaboration on the successful development of a CMOS image sensor (CIS) for medical diagnostic devices such as X-ray equipment, fluoroscopy and radiography. Genoray utilized TowerJazz’s 0.18um CIS stitch process to develop the novel device which has a 100um pixel size and contains higher resolution compared to other devices on the market. Also, it has a special feature to control the sensitivity of the pixel which can be applied in various types of medical equipment such as surgical C-Arms and portable X-ray machines.

This new device is a CIS detector whereas the existing market uses a silicon TFT type sensor. The advantage of CIS compared to TFT is that CIS uses active pixels so it obtains the image with less noise and helps minimize X-ray radiation exposure which is currently the biggest issue in the industry. Furthermore, Genoray’s single detector supports both CT mode and Panorama mode while the existing products in the market only support one by one (CT supports only CT mode, Panorama supports Panorama mode only). This means that by providing multi-functions through one detector, Genoray can satisfy customers who need both modes with a less expensive price point; a competitive advantage of this product.

Genoray is targeting to replace the current market solution with this new, more efficient detector, providing a more cost-effective solution for medical equipment. The imaging device was manufactured using TowerJazz’s optimized pixel and stitch process which is able to maximize performance and offers a strong pixel structure towards radiographic exposure.

Stitching is a technology that enables the manufacture of products where the die size is greater than the area available with a single photo mask. With this technology, it is possible to produce dies up to full wafer size. TowerJazz has many years of production experience with stitching and owns the related patents. In addition, TowerJazz provides a 0.18um CIS PDK with outstanding modeling which helps to implement a very accurate read-out peripheral circuit in a limited timeframe.

As Genoray’s device can be applied in different types of medical equipment, its expected production volume is sizable, reaching multiple thousand wafer per year run rates. Genoray is engaged with numerous local and global supply chains and mass production is expected to successfully start in the near future. According to IHS, the market for CMOS imaging for medical electronics is growing rapidly from $64 million in 2012 to a projected $195 million in 2017, a CAGR of 25.1 percent.

“We are pleased that Genoray has successfully developed its medical imaging sensor with TowerJazz’s CIS process and is gearing up to release it to the market. We fully believe that this product will generate great response and demand as Genoray is known for its stable technical solutions and strong business power locally and globally. We hope that this success will bring more opportunities to work continually with Genoray for further technological achievements,” said Dr. Avi Strum, Vice President and General Manager, CMOS Image Sensor Business Unit, TowerJazz.

“With great support from TowerJazz, finally a new CIS image sensor for X-ray equipment was developed. TowerJazz’s CIS process is well-known for superior performance. I have no doubt that the collaboration between TowerJazz and Genoray will bring a successful outcome for production in terms of quality and production size,” said In Jae Lee, Chief Technology Officer of Genoray.

Besides this CIS detector development, TowerJazz and Genoray are consistently working together and making investments to develop various other innovative applications.

By Dr. Phil Garrou, Contributing Editor

The 2014 Electronic Component Technology Conference (ECTC) took place last week in Orlando, Florida. The ECTC is widely regarded as the premier microelectronic packaging conference in the world. This years meeting, headed up by General Chair Wolfgang Sauter (IBM) and Program Chair Alan Huffman (RTI Int) included: 1170 attendees, 369 oral presentations, and 101 exhibitors.

huffman

Alan Huffman –Program Chair

Presentation of IEEE Packaging Awards were made at the IEEE CPMT (Components, Packaging and Manufacturing Technology) Society luncheon at ECTC.

Avi

Avi Bar-Cohen – Packaging Field Award

The most prestigious of all awards, the IEEE CPMT “Field Award” went to Dr. Avram Bar-Cohen for “…contributions through leadership, education, and advocacy to thermal design, modeling and analysis of electronic components and for original research on heat transfer and liquid phase cooling.” Dr. Bar-Cohen is currently Distinguished Professor of Mechanical Engineering at Maryland and DARPA program manager for their thermal programs known as “ICECool.” It is the goal of the “field award” to give them to individuals whose names are synonymous  with their field of interest and Avi Bar-Cohen is certainly synonymous with thermal issues in microelectronic packaging.

 

The Electronics Manufacturing Technology Award went to Dr. Raj Master (Microsoft), the Sustained Technical Contribution award to Prof Madhaven Swaminathan (GaTech), the Exceptional Technical Achievement Award to Prof Pradeep Lall (Auburn) and the David Feldman Outstanding Contribution Award to Prof. SW Ricky Lee (Hong Kong Univ).

As smart materials become one of the fastest growing areas of materials technology, SABIC and Cima NanoTech, a Singapore and US-based company, have announced the joint development of a plastics industry first: a transparent conductive polycarbonate film that has the potential to revolutionize the materials used in consumer electronics, household goods, automotive, architecture and healthcare.

Related news: Non-ITO film to make up 34% of transparent conductive film market in 2017

The new material, designed to provide “next generation” functionality, has the potential to further enhance performance, enable new innovative applications and open doors for new product designs, Ernesto Occhiello, SABIC Executive Vice President, Technology and Innovation, explained. This could translate into faster response touch screens for consumer electronics, transparent “no-line” anti-fogging capabilities for automotive windows, better EMI shielding effectiveness for electronics, and transparent WiFi/Bluetooth antennas for mobile devices like smartphones, tablets, laptops and all-in- one computers.

Aligned with SABIC’s focus to provide solutions that will solve industry challenges, SABIC engaged in a joint collaboration with Cima NanoTech in the latter half of 2013 to develop the promising new material, which will be available for customer trials later this year.

“Transparent conductive polycarbonate is a breakthrough material that customers in consumer electronics and other important industries have been seeking,” Matt Gray, Director of Marketing, Consumer Electronics for SABIC’s Innovative Plastics business, said. “Our work with Cima NanoTech is strategically aligned with our commitment to continuous innovation in areas of importance to our customers,” Gray noted.

The collaboration, leveraging both Cima NanoTech’s proprietary SANTE nanoparticle technology and SABIC’s LEXANTM film, a polycarbonate material, has resulted in the development of a new series of transparent conductive materials that are lightweight with excellent transparency, outstanding conductivity and high flexibility. Cima NanoTech worked with SABIC’s scientists to jointly develop materials that not only meet the requirements of existing industries, but also stretches the possibilities for exciting opportunities by breaking boundaries faced with current materials.

“We are very pleased to be working with SABIC to bring the key advantages of SANTE nanoparticle technology forward into a number of diverse consumer and industrial markets,” Jon Brodd, Chief Executive Officer, Cima NanoTech, stated. SANTE technology, a patented self-assembling nanoparticle technology platform, stands alone in providing high transparency with ultra-low electrical resistance, which is ten times better than the incumbent indium tin oxide (ITO). “In addition to its ability to meet optical grade specifications for display and touch applications, SANTE nanoparticle technology is also more cost effective as coating is performed via a wet coating, roll-to-roll process versus sheet-to-sheet,” Brodd said.

The conductive SANTE network is also mechanically robust, thus allowing it to withstand flexing, stretching, torsion and tension for flexible applications. The substrate can also be thermoformed into various curved and 3D form factors.

Amkor Technology, Inc. and Carsem today jointly announced the settlement of the litigation initiated by Amkor against Carsem alleging infringement of Amkor’s MicroLeadFrame (MLF) patents.

The parties have entered into a settlement agreement to end all pending proceedings related to the dispute and Carsem will pay Amkor an agreed sum for such settlement.

Under the terms of the agreement, Carsem and Amkor have granted each other non-exclusive licenses to their respective MLF and MLP patents worldwide.

“We are pleased that Carsem has agreed to take a license to our industry leading MLF patent family, and that we can finally close this long-running dispute,” said Steve Kelley, Amkor’s president and chief executive officer.

“With this settlement, we are happy that the dispute is behind us and our customers will have the benefits of the license,” said Peter Yates, managing director of Carsem.

Amkor is a provider of semiconductor packaging and test services to semiconductor companies and electronics OEMs.

­Ziptronix Inc. and EV Group today announced they have successfully achieved submicron post-bond alignment accuracy on customer-provided 300mm DRAM wafers. The results were achieved by implementing Ziptronix’s DBI Hybrid Bonding technology on an EVG Gemini FB production fusion bonder and SmartView NT bond aligner. This approach can be used to manufacture fine-pitch 3D ICs for a variety of applications including stacked memory, advanced image sensors and stacked systems-on-chip (SoCs).

“The performance of DBI Hybrid Bonding technology is not limited by connection pitch, but requires the right alignment and placement tool with an ability to scale that has been a challenge to find until now,” said Paul Enquist, CTO and VP Engineering at Ziptronix. “EVG’s fusion bonding equipment has been optimized to achieve consistent submicron post-bond alignment accuracy. This advancement in alignment accuracy provides a clear path to high-volume manufacturing (HVM) of our technology.”

Pitch scaling on next-generation 3D technologies is expected to continue for many years to come. Fine-pitch hybrid bonding is already in use in high-performance 3D memory products, and has been announced for HVM of 3D image sensors. DBI Hybrid Bonding can be used at the die or wafer level; however, wafer-level bonding enables a great cost benefit by bonding all the die at once. With much of the processing for DBI Hybrid Bonding taking place at wafer scale, there is the added benefit of low cost-of-ownership.

“Demonstrating submicron accuracy is critical to achieving fine-pitch connections in HVM for a wider variety of applications,” said Paul Lindner, Executive Technology Director at EVG. “As the industry pushes to realize 3D ICs, joint efforts such as our work with Ziptronix to develop manufacturing approaches offer customers a tremendous value-add.”

Ziptronix Direct Bond Interconnect Hybrid Bonding is a conductor/dielectric bonding technology that includes a variety of metal/oxide and/or nitride combinations, does not use adhesives and is currently the most suitable for volume manufacturing in the marketplace. It allows for strong, room temperature dielectric bonding, low temperature conductive bonding and finer-pitch interconnect over Cu/Cu or other metal bonding because the bond occurs between both the dielectric and the conductive surfaces, which effectively bonds the entire substrate interface area.

EVG’s SmartView Automated Bond Alignment System for Universal Alignment offers a proprietary method of face-to-face wafer-level alignment, which is key to achieving the required accuracy in multiple wafer stacking for leading-edge technologies. In addition to improving alignment capabilities on its SmartView bond aligner to reach submicron accuracies, EVG has optimized it so that surfaces can be prepared simultaneously for bonding, electrical connectivity and mechanical strength.