Category Archives: Materials and Equipment

March 26, 2012 — Camtek Ltd. (NASDAQ and TASE:CAMT) sold $3.5 million of Falcon inspection tools to a leading global outsourced semiconductor assembly and test (OSAT) provider, for various applications in the backend semiconductor assembly process.

The OSAT installing Falcon tools operates multiple package fabrication facilities throughout the world. Deliveries will take place during the current and next two quarters.

Camtek’s Falcon line of automated wafer inspection systems are used by semiconductor manufacturers, bumping houses, and packaging foundries for defect detection and metrology. Falcon systems were introduced in 2003, and Samsung is among the line’s users. They offer 2D and 3D inspection and metrology capabilities for wafers before or after test, along the bumping process or after dicing. They are designed to handle the special inspection needs of MEMS structures.

Camtek Ltd. provides automated and technologically advanced imaging, image processing, adaptive ion milling (AIM) and digital material deposition (DMD) products for semiconductor, printed circuit board (PCB) and IC substrate industries. Learn more at www.camtek.co.il.

Subscribe to Solid State Technology

March 23, 2012 – BUSINESS WIRE — Test system supplier Keithley Instruments Inc. introduced the Model 2657A High Power System SourceMeter instrument, adding high voltage test to its line of high speed, precision source measurement units for power semiconductors. The test tool sources up to 5x power to the device under test (DUT) than competitive systems, Keithley asserts.

The Model 2657A uses a built-in 3,000V, 180W source. Its high-speed 6-1/2-digit measurement engine enables 1 femtoamp (fA) current measurement resolution. It tests power semiconductor devices — diodes, FETs, and IGBTs — as well as gallium nitride (GaN), silicon carbide (SiC), and other compound semiconductor materials. It can characterize high-speed transients and perform breakdown and leakage tests on a variety of electronic devices at up to 3,000V.

The Series 2600A family offers four-quadrant voltage and current source/load coupled with precision voltage and current meters. The Model 2657A combines functionality from multiple instruments in a single full-rack enclosure: semiconductor characterization instrument, precision power supply, true current source, 6-1/2-digit DMM, arbitrary waveform generator, voltage or current pulse generator, electronic load, and trigger controller, and is fully expandable into a multi-channel, tightly synchronized system via Keithley

March 22, 2012 – BUSINESS WIRE — The Dow Chemical Company (NYSE: DOW) inaugurated its Dow Seoul Technology Center, a global research & development (R&D) center with focus on technological advances in display technologies and semiconductor-related applications.

The Dow Seoul Technology Center is located in Hwaseong, Gyeonggi-do, strategically near to semiconductor and display customers. The 23,700sq.m., 5-story site will employ approximately 300 people at capacity.

With the addition of the new R&D Center, Dow has invested more than USD$400 million in Korea over the last decade to establish advanced manufacturing sites for semiconductor, display and light-emitting diode (LED) technologies, and to further new business development in the area of electronic materials.

Also read: DOW CMP slurry boasts lower defects and better removal rates

Major areas of research and development at the Dow Seoul Technology Center include lithography, organic light-emitting diodes (OLED), display materials, and advanced chip packaging to support growth.

The site will be the global hub for Dow’s OLED research, and Dow has also equipped the site with a Nikon 193nm immersion scanner and 300mm tool cluster. Dow also has a 193nm dry scanner at its Cheonan, Korea facility.

Dow Electronic Materials is a global supplier of materials and technologies to the semiconductor, interconnect, finishing, photovoltaic, display, LED and optics markets. Dow (NYSE:DOW) is a science and technology company. More information about Dow can be found at www.dow.com.

Subscribe to Solid State Technology

March 21, 2012 — Worldwide semiconductor manufacturing equipment spending is projected to total $38.9 billion in 2012, an 11.6% decline from 2011 spending of $44 billion, according to Gartner, Inc.

“Weak market conditions in the second half of 2011 caused pullbacks in expansion plans throughout the semiconductor manufacturing industry,” said Klaus Rinnen, managing vice president at Gartner. “This investment weakness will continue through the first half of 2012 and will surge in the second half of the year. We’re basing these assumptions on the aggressive spending plans announced by the major semiconductor manufacturers. There is a risk that some capacity expansion plans will slip from the second half of 2012 into 2013.”

“Downward pressure on utilization rates is easing, with the result that utilizations will begin to climb upwards again in the second quarter of 2012,” Rinnen said. “Once the supply is balanced, DRAM and foundry manufacturers will need to begin to increase spending to meet an increase in demand, as the PC market rebounds and consumers begin spending as the economy stabilizes.”

Gartner analysts said worldwide semiconductor manufacturing equipment spending will return to double-digit growth in 2013 when spending is projected to total $43 billion, a 10.5% increase from 2012 (see the table). Worldwide semiconductor capital spending is forecast to total $60.9 billion in 2012, down 7.3% from 2011 spending of $65.8 billion in 2011. Capital spending is expected to grow 3.5% in 2013.

Also read: Semiconductor fab equipment spending to hit a record in 2013 from SEMI

Table. Worldwide Semiconductor Manufacturing Equipment Spending Forecast, 2011-2016 (Millions of Dollars). SOURCE: Gartner, March 2012.

 

2011

2012

2013

2014

2015

2016

Semiconductor Capital Spending ($M)

65,754.4

60,937.4

63,042.4

66,863.6

62,540.2

67,894.4

Growth

16.3%

-7.3%

3.5%

6.1%

-6.5%

8.6%

Capital Equipment ($M)

44,041.6

38,926.6

43,030.4

46,293.1

42,862.6

46,474.4

Growth

8.4%

-11.6%

10.5%

7.6%

-7.4%

8.4%

Wafer Fab Equipment ($M)

35,822.4

31,289.5

33,487.0

37,100.0

34,090.8

36,542.5

Growth

13.3%

-12.7%

7.0%

10.8%

-8.1%

7.2%

Wafer-Level Packaging and Assembly Equipment ($M)

1,472.7

1,404.9

1,893.7

2,034.1

2,214.0

2,646.9

Growth

17.2%

-4.6%

34.8%

7.4%

8.8%

19.6%

Die-Level Packaging and Assembly Equipment ($M)

4,311.9

3,997.3

4,766.1

4,305.4

3,859.5

4,004.4

Growth

-12.0%

-7.3%

19.2%

-9.7%

-10.4%

3.8%

Automated Test Equipment ($M)

2,434.5

2,234.8

2,883.6

2,853.6

2,698.3

3,280.6

Growth

-14.9%

-8.2%

29.0%

-1.0%

-5.4%

21.6%

Other Spending ($M)

21,712.8

22,010.8

20,012.0

20,570.5

19,677.6

21,420.0

Growth

36.7%

1.4%

-9.1%

2.8%

-4.3%

8.9%

The wafer fab equipment (WFE) market closed out 2011 with spending up 13.3%, based on strong momentum in the first half, however, WFE spending is forecast to decrease 12.7%. WFE spending in 2012 will primarily be on leading-edge technology, as the 20mm and 28/32 nm ramp up.

Gartner analysts said wafer fab manufacturing capacity utilization will decline into the low-80% range by the middle of 2012, before slowly increasing to about 90% by the end of 2012. Leading-edge utilization will return to the low 90% range by the second half of 2012, providing for a positive capital investment environment.

Back-end equipment markets (which include wafer-level packaging and assembly equipment, die-level packaging and assembly equipment, and automated test equipment) will see a modest decline in 2012, but it will be followed by growth and sales of more than $9.5 billion in 2013.

“Above market action in advanced packaging will not be sufficient for a positive growth rate this year, but it will be the driver for growth in 2013,” Rinnen said.

The capital spending forecast estimates total capital spending from all forms of semiconductor manufacturers, including foundries, and back-end assembly and test service companies. This is based on the industry’s requirements for new and upgraded facilities to meet the forecast demand for semiconductor production. Capital spending represents the total amount spent by the industry for equipment and new facilities, as well as the outlay for land, buildings, furnishings, etc… Capital equipment spending includes all equipment needed to process, inspect, and test and package the chip.

This research is produced by Gartner’s Semiconductor Manufacturing program. This research program, which is part of the overall semiconductor research group, provides a comprehensive view of the entire semiconductor industry, from manufacturing to device and application market trends. More information on Gartner’s semiconductor research can be found in the Gartner Semiconductor Manufacturing Focus Area at http://www.gartner.com/technology/core/products/research/markets/semiconductorManufacturing.jsp. Gartner, Inc. (NYSE: IT) is a leading information technology research and advisory company.

March 20, 2012 – BUSINESS WIRE — Teradyne (NYSE:TER) uncrated its Magnum semiconductor test system with a proprietary scalable chassis design and tester-per-board architecture for high compound parallel test efficiency (PTE) on consumer digital devices (microcontrollers, touch screen controllers, standard logic, FPGAs and embedded memory).

An optional Magnum Precision Analog Channel (MPAC) enables the system to test embedded peripherals, including ADCs and DACs found in many consumer digital SoCs. The MPAC instrument includes analog source, analog capture and precision voltage reference resources.

The MPAC can configured with up to 48 channels of source/capture/Vref, or 24 channels of source/capture/Vref plus 32 device power supply channels. Multiple MPAC instruments can be configured in a single system to enable massive multi-site test.

The Magnum offers high-accuracy measurements and throughput for common DC tests such as contact, IDD and leakage. It has an algorithmic pattern generation feature for Flash memory and functional tests with various logic vector pattern depths. 12-bit ADC testing includes INL, DNL, gain and offset; 12-bit DAC testing includes INL and DNL.

Also read: Tektronix buys Teradyne testers for better test dev, IC test range

Teradyne will showcase the Magnum test system with high density precision analog instrumentation for consumer digital device test in Booth #2169 at SEMICON China in Shanghai, March 20-22. The demonstration will highlight multi-site scalability and test for a 32-bit microcontroller from Atmel

March 19, 2012 — Semiconductor fab equipment supplier SUSS MicroTec launched the RCD8 manual resist coat and develop platform for R&D and low-volume use in micro electro mechanical system (MEMS), semiconductor packaging, light-emitting diode (LED) and other applications.

The RCD8 can convert from a spin coater, with the proprietary GYRSET closed cover coating technology, to a spray developer. The convertion takes minutes. Install options range from basic manual operation to semi-automated to puddle & spray developer.

The processes developed on the manual RCD8 are easily transitioned to a SUSS MicroTec production tool.

The RCD8 combines SUSS’ multiple dedicated Delta Series tools that served specific applications in MEMS, advanced packaging, and LED fab or the R&D market. All necessary coating and developing processes for these applications are incorporated.

The GYRSET rotating closed cover coating option can be integrated into the RCD8 spin coating module to widen the process window and reduce consummables use on various photoresists and applications. GYRSET allows square substrates and pieces to be coated with a homogenous resist thickness.

Various options can be added in the field to adapt with process changes. The RCD8 hosts a large variety of available chucks and configurations.

SUSS MicroTec, listed on TecDAX of Deutsche Boerse AG, is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. For more information, please visit http://www.suss.com.

Subscribe to Solid State Technology

March 19, 2012 – BUSINESS WIRE — CVD Equipment Corporation (Nasdaq:CVV) purchased a new facility in Central Islip, NY, doubling the space for its chemical vapor deposition (CVD), gas control, and other wafer fab equipment assembly.

The new facility also unifies CVD Equipment Corp.’s Application Laboratory in one location, noted Leonard Rosenbaum, president and CEO, who said that the new space will enable "multiple growth opportunities." The Application Laboratory will focus on nano materials manufacturing, pilot/demo lines for nano materials usage in macro-materials and sub-assemblies, and technology transfer/partnerships around nano materials. These product development efforts will be marketed through CVD Materials Corporation, a wholly owned subsidiary.

CVD Equipment Corporation (NASDAQ:CVV) makes equipment for the development, design and manufacture of advanced electronic components, materials, and coatings. Customers research, design and manufacture semiconductors, solar cells, graphene, carbon nanotubes (CNTs), nanowires, light-emitting diodes (LEDs), micro electro mechanical systems (MEMS), smart glass coatings, battery and/or ultra capacitor materials, medical coatings, industrial coatings and equipment for surface mounting of components onto printed circuit boards (PCBs).

Subscribe to Solid State Technology

March 19, 2012 – GLOBE NEWSWIRE — ATE provider LTX-Credence Corporation (Nasdaq:LTXC) released the Diamondx test platform for application-specific standard products (ASSP) and the DragonRF for radio frequency (RF) devices. In addition, LTX-Credence launched a SerDes test instrument and new testing software.

The Diamondx tool increases tester throughput, offers better multi-site test capability, and has lower capital expenditure and operations costs than comprable tools, according to LTXC. The tool boasts a small footprint with an energy-efficient, air-cooled design. Diamondx is a universal slot architecture that allows for 20-slot, 40-slot and 60-slot configurations. It is compliant with Integrated Multi-System Architecture (IMA) technology, making it upgradeable on the production floor as needed. The tester can accommodate over 5000 pins, and be configured with a range of instruments. Its high-speed data bus is based on PCI-Express-2 industry standard to support high data, high site count and the emergent adaptive test data payload requirements

The Diamondx SerDes instrument Dx-HSIO debuts with the Diamondx platform. It offers 8 lanes of SerDes test capability to 6.4Gbps, enabling lower-cost embedded-clock SerDes lane testing. The Dx-HSIO performs parametric testing of SerDes Tx and Rx ports, aiming for the mobility and consumer ASSP markets.

The Diamondx platform was designed with customer input, and purchase orders are in for testers, said David Tacelli, president and CEO at LTX-Credence. Deployment will soon occur at key outsourced semiconductor assembly and test (OSAT) providers.

LTX-Credence’s next-generation RF tester, DragonRF, targets low cost-of-test for RF devices. Universal RF ports with optional Port to Pin adapter enabling configurations up to 128 RF pins. DragonRF can be configured with 16, or 32 universal vector RF ports per module, with an optional port to pin expander doubling the number of RF ports to 64 pins. The flexible architecture enables price, test coverage, and time balancing. LTXC boasts that the tester’s RF switching technology provides industry-leading settling times. DragonRF provides 6GHz modulated source, 8GHz measure, less than 1ms settling time, and up to 8 receiver paths each with an analog bandwidth exceeding 200MHz for octal site parallel RF measurements. The RF generators are compact to save power and space. DragonRF has been designed to work across multiple test platforms. It will be available in Q2 2012.

The LTXC semiconductor testing software platform Unison features a common graphical test programming environment for Diamond, X-Series, and future product offerings; fast test program development with tools to streamline the validation process of complex system-on-chip and system-in-package devices; a flexible test program structure to serve an entire device family across wafer sort, final test, and different site counts; and the ability to run legacy test programs in the Unison software environment without modification.

Unison is currently available for Diamond test platform and will be available on other test systems later this year.

The Diamondx supports the DragonRF and the Unison test program development environment runs on the Diamondx along with existing Diamond and X-Series test platforms.

LTX-Credence is a global provider of ATE products for wireless, computing, automotive and entertainment market segments. Additional information can be found at www.ltxc.com.

Subscribe to Solid State Technology

March 19, 2012 – BUSINESS WIRE — Wafering tool supplier Silicon Genesis (SiGen) developed its second-generation production system for fabricating thin-silicon solar wafers, as well as high-brightness light-emitting diode (HB-LED), and 3D semiconductor packaging wafers. The system tailored for silicon, GaAs, germanium, SiC, GaN and sapphire materials.

The new GenII PolyMax system targets high volumes, aiming to replace wire wafer saws with a kerf-free wafering tool. The system creates thinner wafers than are possible with wire-based slicing. The proton beam-induced wafering design was created over 6 years with numerous equipment and solar cell partners.

SiGen has made free-standing 20um, 50um, 85um, 120um, and 150um of 125mm and 156mm industry standard square kerf-free monocrystalline silicon solar-cell wafers.

SiGen’s beam-induced wafering technology is capable of supplying thin high-quality materials to HB-LED and packaging/3D structures sectors, at a lower price point than competitive technologies, and with less waste, the company reports.

Silicon Genesis Corporation (SiGen) provides engineered substrate process technology for the semiconductor, display, optoelectronics, and solar markets. For more information on Silicon Genesis, visit http://www.sigen.com.

Also read: Silicon wafers sliced to 10% conventional bulk with Hyperion 3

March 16, 2012 — Tokyo Electron Limited (TEL) will acquire semiconductor packaging equipment supplier NEXX Systems Inc. NEXX makes advanced deposition equipment, including electrochemical deposition (ECD) and physical vapor deposition (PVD) tools, for wafer-level packaging (WLP).

TEL is acquiring the company to expand its position in advanced packaging interconnect toools. TEL praised NEXX’s ECD and PVD technologies for high performance, low cost of ownership, development flexibility and extendibility to future applications. Hiroshi Takenaka, president and CEO of TEL, called electrochemical deposition "a key differentiating technology" in wafer-level packaging.

These tools will now be available alongside TEL’s broad range of front-end semiconductor manufacturing equipment for global customers. "NEXX provides TEL with an immediate presence in the high growth, back-end packaging arena, while NEXX gains access to front-end growth markets and an unparalleled repository of cutting-edge intellectual property," summarized Tom Walsh, president and CEO of NEXX.

NEXX has 139 employees and is based in Massachusetts, USA. Its 2011 sales totaled $76.5 million. THe company has installed about 140 systems at 40 customers. Learn more about the company at www.nexxsystems.com.

Subscribe to Solid State Technology