Category Archives: Materials and Equipment

Update December 28, 2011 – Ahead of schedule, Rohm Co., Ltd., will resume full-scale production of all products affected by the flooding in Thailand on January 1, 2012.

Rohm makes ICs, transistors, diodes, resistors, and tantalum capacitors at LAPIS Semiconductor (Ayutthaya) Co., Ltd., in Rojana Industrial Park in Ayutthaya (closed due to the floods on October 8), and ROHM Integrated Systems (Thailand) Co. Ltd. in Navanakom Industrial Park in Pathumthani (floods closed it on October 15).

Read the details of Rohm’s Thailand recovery here.

—-

December 9, 2011 – More news this week from companies reassessing their plans following the devastating Thailand flooding. And one analyst puts a number to the total disaster’s industrywide impact: 3.8 million fewer PC units in the pipeline for 1Q11.

After initial suspending its local probe/assembly/test facilities sites in Ayutthaya’s Rojana Industrial Park, On Semiconductor now says analysis of the damage (and "prolonged inability of these sites to operate") means the cost to recover, rebuild, and restart those operations "is not financially viable […] for an indefinite period, if at all." So it is ceasing all production at its Sanyo Semiconductor sites in Ayutthaya, Thailand, and will keep limited production at the Bang Pa In facility, a decision that affects some 1600 employees. Most of the Thai output will be transferred to other internal sites in Malaysia, Philippines, and China plus some external subcons — a process helped by the company’s recovery of "certain key assets" from the affected sites "which will be crucial to reestablishing the supply line to these customers." Given the complexity of complex production transfers, a return to pre-flood production capacity is expected to "take multiple quarters."

In October On Semiconductor suspended indefinitely its local operations, formerly owned by Sanyo Semiconductor and acquired earlier this year. Damage to the Rojana sites, which produced ~10%-12% of the company’s total global output (by revenues), were thought to exceed the $50M of potential insurance proceeds. The Bang Pa In facility was later affected by the flooding as well.

Another firm affected by the Thailand flooding damage, STATS ChipPAC, says its operation in the Navanakorn Industrial Estate which has been offline since Oct. 17 will remain offline through January, and will resume "partial" operations sometime later in 1Q12. Originally the company had projected the plant would be suspended only to the beginning of December.

Flood water levels at the site have receded to where the company has regained access to the facility to begin assessing damage, including potential recovery of assets (with help from outside "equipment restoration specialists") and restoration planning. Production also has been shifted to other sites.

Despite the delay, the company is reaffirming its 4Q11 lowered expectations (from late-Oct.’s 3Q11 financial statements), saying 4Q11 sales will increase only single-digit growth sequentially (the Thai flooding taking an estimated -7% hit to revenues), with adjusted EBITDA of 20%-25% of sales and $50M-$60M in capex.

We’ve been tracking the Thailand flooding’s impact on our sector; here’s a list of test/assembly firms who’ve been affected. With many hard-disk drive suppliers concentrated in Thailand, the domino effect is expected to ripple up and down the supply chain — taking form as softer demand for components like DRAM (as if that sector needed more sluggishness), and ultimately PC supplies. IHS iSuppli calculates nearly a 4M unit shortfall in 1Q11 PC shipments as a result, exacerbating what is already a seasonally slow post-holiday period for PC demand. HDD supplies should rebound by 2Q12, though — and might even achieve oversupply before the year’s out.

December 9, 2011 – BUSINESS WIRE — Kulicke & Soffa Industries Inc. (NASDAQ:KLIC or K&S) named Chin Hu Lim to its Board of Directors, also serving on KLIC’s Management Development & Compensation Committee. Lim is the managing partner of Stream Global Venture Catalyst Pte Ltd., a venture fund providing seed funding for start-up companies in the social media and interactive digital media space.

Lim has over 28 years of experience in the information and communication industries.
Previous experience:

  • CEO BT Frontline Pte Ltd., a subsidiary of British Telecom Group.
  • CEO of Frontline Pte Ltd., a Singapore exchange listed company with operations in Asia Pacific, South East Asia, China and India. 
  • Sales, marketing and management positions with Sun Microsystems and Hewlett-Packard.

Lim has served as a council member of the Singapore Infocomm Technology Federation, the IT Standards Committee and the National Infocomm Manpower Council. He was also a board member of the Infocomm Development Authority of Singapore. He is currently a board member for the Changi General Hospital and G-Able (Thailand) Ltd., a leading information technology services company in Thailand.

Lim holds a bachelor of electronics & computer science degree from La Trobe University, Melbourne, Australia and a degree in electrical and electronics engineering from Ngee Ann Polytechnic, Singapore.

MacDonell Roehm, Chairman of the K&S Board of Directors, welcomed Lim, praising his expertise in the information and communication industries, finance and Asian markets.

Kulicke & Soffa (KLIC) designs and manufactures semiconductor and LED assembly equipment. Learn more at www.kns.com.

December 6, 2011 — SEMI projects that worldwide sales of new semiconductor manufacturing equipment will reach $41.8  billion in 2011, according to the year-end edition of the SEMI Capital Equipment Forecast, released by SEMI at the annual SEMICON Japan exposition. Equipment revenues of $41.8 billion are roughly equivalent with 2007 investment levels.

SEMI expects, following a 151% market increase in 2010, the equipment market to expand by 4.7% in 2011. Capex will decline about 10.8% in 2012, then resume growth in 2013.

Denny McGuirk, president and CEO of SEMI, called the modest rate of increase "expected" and "not surprising…given the exceptional growth in the market from 2009 to 2010." McGuirk notes that this is the nature of highly cyclical markets, like the semiconductor industry.

Wafer processing equipment, the largest product segment by dollar value, is expected to increase 9.3% in 2011 to almost $32.7 billion. Assembly and packaging equipment will decline by 12.5% to $3.4 billion in 2011. The market for semiconductor test equipment will decline by 10.3%, reaching $3.7 billion this year.

Growth is expected in Europe (66.9%), North America (53.0%), Japan (31.2%), and China (2.3%) year-over-year in 2011. North America became the largest market for equipment with $8.8 billion, followed by Taiwan ($8.1 billion), South Korea ($8.0 billion), and Japan ($5.8 billion). Taiwan, South Korea, and Rest of World experienced negative growth rates in 2011.

In 2012, only South Korea is expected to have positive growth (7.5%). In 2013, the market is expected to rebound for all regions except South Korea, due to high growth in 2012.

The following results are given in terms of market size in billions of U.S. dollars and percentage growth over the prior year:

Forecast by Equipment Segment

Equipment Type

2010**

2011 Forecast

% Chg

2012 Forecast

% Chg

2013 Forecast

% Chg

Wafer Processing

29.91

32.68

9.3%

28.90

-11.6%

31.27

8.2%

Test

4.15

3.72

-10.3%

3.56

-4.4%

3.58

0.5%

Assembly & Packaging

3.88

3.39

-12.5%

3.04

-10.4%

3.25

6.8%

Other*

1.99

2.00

0.8%

1.78

-11.0%

1.96

9.8%

Total

$39.93

$41.80

4.7%

$37.28

-10.8%

$40.05

7.4%

Forecast by Region

Region

2010**

2011 Forecast

% Chg

2012 Forecast

% Chg

2013 Forecast

% Chg

Taiwan

11.25

8.05

-28.4%

6.88

-14.6%

8.33

21.1%

South Korea

8.63

7.99

-7.5%

8.59

7.5%

8.36

-2.7%

N. America

5.75

8.80

53.0%

6.77

-23.1%

7.20

6.3%

Japan

4.44

5.82

31.2%

5.23

-10.2%

5.69

8.8%

Rest of World

3.84

3.47

-9.7%

2.93

-15.5%

3.15

7.5%

China

3.68

3.77

2.3%

3.53

-6.2%

3.80

7.7%

Europe

2.34

3.90

66.9%

3.35

-14.1%

3.52

4.9%

Total

$39.93

$41.80

4.7%

$37.28

-10.8%

$40.05

7.4%

Source: SEMI November 2011

* Totals and percentages may differ due to rounding of numbers
** 2010 data was revised upwards about one percent. The revision is due to the addition of missing company data and corrected input.

The Equipment Market Data Subscription (EMDS) from SEMI provides comprehensive market data for the global semiconductor equipment market. A subscription includes three reports: the monthly SEMI Book-to-Bill Report, which offers an early perspective of the trends in the equipment market; the monthly Worldwide Semiconductor Equipment Market Statistics (SEMS), a detailed report of semiconductor equipment bookings and billings for seven regions and over 22 market segments; and the SEMI Semiconductor Equipment Consensus Forecast, which provides an outlook for the semiconductor equipment market.

SEMI is a global industry association serving the nano- and microelectronics manufacturing supply chains. For more information, visit www.semi.org

More SEMICON Japan news and product launches:

December 6, 2011 — Tokyo Electron Limited (TEL) launched a suite of 3D packaging tools: the Tactras FAVIAS through silicon via (TSV) deep-silicon etch system; the TELINDY PLUS VDP polyimide film formation production equipment that uses vapor deposition polymerization technology; and the wafer bonder/debonder Synapse Series.

The Tactras FAVIAS deep silicon etch system is designed to improve mask selectivity for steady etching. It raises plasma density, increasing the etch rate from 10 to 15

December 6, 2011 — Tokyo Electron Limited (TEL) has successfully demonstrated dynamicing — device switching/dynamic characteristic (AC) — of a power device at the wafer level, which previous only took place after semiconductor assembly and packaging.

TEL developed the dynamicing technique based on Tokyo Electron’s experience in wafer probe technology. By detecting defects at the wafer-level, TEL’s method ensures that known-good die (KGD) are used in multi-die power devices, which provide higher electrical efficiency and performance than traditional designs.

Until now, only staticing — device static characteristic (DC) — has been performed at the wafer level, TEL reports.

Tokyo Electron Limited (TEL) manufactures semiconductor and FPD production equipment, including plasma and ion etchers, and deposition systems. Learn more at www.tel.com.

Subscribe to Solid State Technology/Advanced Packaging.

Follow Advanced Packaging on Twitter.com by clicking www.twitter.com/advpackaging. Or join our Facebook group

December 5, 2011 – Marketwire — Technic Inc. is entering the last development phase on technologies to reduce gold consumption in electronics packaging and connector applications, a product group it will call "Goldeneye."

Goldeneye comprises equipment, electroplating chemistry, and ancillary process chemistries. Newly developed barrier layers enable improved component performance, while gold replacement technology and post-treatment processes further reduce gold consumption.

Technic expected to release the first Goldeneye products this month, with further releases occurring in early 2012.

"With gold at record valuations, the demand for gold conservation in the electronics industry is intense. With Technic’s Goldeneye Gold Reduction Technology, we are creating an integrated portfolio of technically advanced products that enable low-cost finishes for electronic devices without compromise to the integrity or quality of our customers’ products," summarized Rob Schetty, VP, Technic Advanced Technology Division.

Also read: Analyst says gold price surge helping Cu wire shipments

Technic Inc. supplies specialty chemicals, custom finishing equipment, engineered powders, and analytical control systems to the electronic component, printed circuit board, semiconductor, photovoltaic, industrial finishing and decorative industries. For information, go to www.technic.com.

Subscribe to Solid State Technology/Advanced Packaging.

Follow Advanced Packaging on Twitter.com by clicking www.twitter.com/advpackaging. Or join our Facebook group

December 5, 2011 — SUSS MicroTec, equipment supplier for the semiconductor and related markets, launched the XBS300 temporary bonder for high-volume wafer manufacturing. The Bond Cluster is configured to temporarily bond 200mm and 300mm wafers for 3D integration applications as well as other processes that require thin wafer handling.

Key process steps include adhesive and release layer deposition, temporary bonding and curing and integrated metrology to determine the total thickness variation (TTV). Features include higher throughput and sophisticated process control, according to SUSS MicroTec.

Process configurations can be designed for very-low-force bonds such as the Thin Materials (TMAT) process or the 3M Wafer Support System (WSS), and higher-force thermo-compression bonds as used in the BrewerScience ZoneBOND process. SUSS today announced that ZoneBOND can be performed on its XBC300 wafer bonding platform as well.

The system supports all currently-available temporary bonding adhesives. Additionally, several materials manufacturers are developing new temporary bonding adhesives that are fully compatible with SUSS’ XBS300 equipment platform.

The XBS300 is based on SUSS’s ACS300 Gen2 cluster platform.

The first tool has been delivered to a world-leading IDM with the installation currently in progress.

SUSS MicroTec, listed on TecDAX of Deutsche Boerse AG, provides equipment and process solutions for microstructuring in the semiconductor industry and related markets. For more information, please visit http://www.suss.com.

Also read: Temporary wafer bonding market: More than 10 approaches today and Thin wafers win majority in electronics by 2016

Subscribe to Solid State Technology/Advanced Packaging.

Follow Advanced Packaging on Twitter.com by clicking www.twitter.com/advpackaging. Or join our Facebook group

December 5, 2011 – PRNewswire — EV Group (EVG), wafer bonding and lithography equipment supplier, introduced the XT Frame equipment platform for better process throughput and tool functionality. The platform will be used for all high-volume manufacturing tool offerings.

The XT Frame can accommodate up to 9 process modules, twice EVG’s previous maximum processing capability, on a smaller overall footprint. Greater flexibility enables more process module combinations on the single tool platform, and parallel processing of several wafers. The platform boasts an ultra-fast handling system for high-volume frontend wafer processing steps. Up to 4 front opening unified pod (FOUP) load ports can be used. A local FOUP storage system (LFSS) acts as buffer. Upgradeability, and serviceability are reportedly improved.

"Greater-volume manufacturing" is a trend for advanced packaging and 3D interconnect, which led EVG to launch the XT Frame equipment platform on its EVG850TB/DB system, said Paul Lindner, executive technology director for EV Group. The EVG850TB/DB toolset performs automated temporary bonding and debonding as well as wafer bond metrology. Demo capabilities for the XT Frame are now available on the EVG850TB/DB, which can also accommodate EVG’s new EZR (Edge Zone Release) and EZD (Edge Zone Debond) modules to support ZoneBOND technology.

Products built on the new XT Frame platform are available immediately.

EVG’s standard equipment platform has also just recently been upgraded to provide enhanced automation capabilities and increased system throughput, as seen in the relaunch of the GEMINI FB fusion wafer bonder family at SEMICON Taiwan 2011.

EVG will be exhibiting at SEMICON Japan, December 7-9, at booth #6B-606 in Chiba, Japan.

More SEMICON Japan debuts:

EV Group (EVG) makes wafer-processing products for semiconductor, MEMS and nanotechnology applications. More information is available at www.EVGroup.com.

Subscribe to Solid State Technology

December 5, 2011 — Applied Materials Inc. (AMAT) launched the Applied Producer Optiva chemical vapor deposition (CVD) system for back-side-illuminated (BSI) image sensor manufacturing. It deposits low-temperature conformal films that boost the low-light performance of the sensor while improving its durability.

The product’s target customer makes image sensors for advanced smartphone, tablet, and digital camera applications, said Applied Materials’ representatives.

The Producer Optiva system coats the microlens of an image sensor with a transparent, durable, and thin film layer to avoid reflections, scratches, and other enviromental damage. The Optiva CVD tool enables >95% conformal deposition at temperatures below 200°C, enabling use of temperature-sensitive polymers and adhesives used in sensor fabrication. The microlens sits directly above image sensors’ photodiodes to increase light gathering.

Bill McClintock, vice president and general manager of Applied’s Dielectric Systems and Modules business unit, called BSI image sensors a "new opportunity" for AMAT’s manufacturing equipment expertise, and a "rapidly growing market…with an estimated 300 million BSI image sensors expected to be needed by 2014."

The Applied Producer Optiva CVD system can also be used to deposit conformal insulating liners for through-silicon vias (TSVs) in 3D chip packaging. In this application, low process temperatures protect the adhesive used to bond the wafer to its temporary carrier.

For more information on this product, please visit www.appliedmaterials.com/technologies/library/producer-optiva.

Applied Materials, Inc. (Nasdaq:AMAT) provides equipment, services and software to enable the manufacture of advanced semiconductor, flat panel display and solar photovoltaic products. Learn more at www.appliedmaterials.com.

Subscribe to our MEMS Direct newsletter

December 5, 2011 — Brewer Science Inc., materials and processes developer for thin wafer handling, will offer the ZoneBOND process on equipment supplier SUSS MicroTec’s XBC300 and XBS300 wafer bonding platforms, targeted for high volume bonding and debonding of 200/300mm wafers using silicon or glass carriers.

ZoneBOND is designed for total thickness variation control in wafer bonding processes, high-temperature stability, and low-stress wafer de-bonding. Brewer Science supports the ZoneBOND process with materials for carrier preparation, adhesives, removers, as well as small-scale debonding equipment.

Shortly after the ZoneBOND technology was commercialized, equipment supplier EV Group (EVG) launched ZoneBond-capable modules.

Brewer Science makes specialty materials, equipment, and process solutions for applications in semiconductors, advanced packaging/3-D ICs, MEMS, sensors, displays, LEDs, and printed electronics. For more information, please visit http://www.brewerscience.com/products/temporary-bonding-materials/zonebond

SUSS MicroTec (listed on TecDAX of Deutsche Boerse AG) provides equipment and process solutions for microstructuring in the semiconductor industry and related markets. For more information, please visit www.suss.com.

Subscribe to Solid State Technology/Advanced Packaging.

Follow Advanced Packaging on Twitter.com by clicking www.twitter.com/advpackaging. Or join our Facebook group