November 11, 2011 — Fujikura Ltd. and FlipChip International LLC (FCI) released ChipletT and ChipsetT embedded die packages for single die or multi-die semiconductor packaging applications.
ChipletT and ChipsetT package products are based on Fujikura’s flex-based laminate embedded die "WABE Technology." The roll-to-roll (R2R) flex fabrication process reportedly reduces costs and package profile (<250
November 10, 2011 — LED lighting maker Gem Hsin Electronics reduced the size of heatsinks in its LED products by drilling miniscule holes beneath LEDs. The holes allow heated air to escape the LED package.
The holes are drilled with laser-guided technology. The direct-air-release holes improve LED efficiency and lifespan, the company reports. It also wides the company’s lighting beam angles (up to 220). Gem Hsin also says that the finished LED products require 20% less energy than competing products and offer 30,000-hour LED life.
Also read: HB-LED packaging materials vs heat
Gem Hsin has started incorporating this advance into its line of T5/T8 LED Tube Lights.
Gem Hsin Electronics is a Taiwan-based manufacturer of LED lamps and other products. To find out more about Gem Hsin and the company’s line of products, go to www.GemHsin.com.
Subscribe to Solid State Technology/Advanced Packaging.
Follow Advanced Packaging on Twitter.com by clicking www.twitter.com/advpackaging. Or join our Facebook group
November 8, 2011 — Invenios developed a 3D Direct Write laser patterning technology for microelectronics packaging that integrates optical, mechatronic, and housing functionalities into the package substrate. The new microchip manufacturing technology, a challenge to deep reactive ion etch (DRIE), produces high angle walls on channels with sub-3
November 8, 2011 — PVA is introducing the PVA6000 flexible coating and dispensing tool at productronica in Munich, Germany. New features based on customer feedback improve accessibility for maintenance and improve ease of use.
The updated motion platform on the PVA6000 increases stability in motion. Conformal coating and dispensing tasks are performed with a high level of accuracy and repeatability.
The PVA6000 combines PVA’s traditional extruded aluminum frame with sheet metal finishing. A hatch replaces service doors for easier access. All pneumatics, ventilation, and facilities are fully enclosed in a cabinet at the rear of the machine.
The system operates on PVA’s Portal Software, including process control and monitoring, and unlimited program storage capability, fluid level monitoring, integration of vision systems, bar code readers, flow monitors, and other options.
productronica takes place November 15-18 in Munich, Germany. Visit PVA at stand 443, hall A2.
PVA supplies conformal coating systems and fluid dispensers for solar, semiconductor packaging, printed circuit board assembly, medical device manufacturing, and consumer electronics makers. Learn more at www.pva.net.
Subscribe to Solid State Technology/Advanced Packaging.
Follow Advanced Packaging on Twitter.com by clicking www.twitter.com/advpackaging. Or join our Facebook group
November 4, 2011 — Numerous global semiconductor suppliers maintain assembly and test operations in Thailand. Many of these facilities have been affected by the disaster. IHS iSuppli pulled together a list of those affected, and those that have thus-far escaped damage.
Semiconductor suppliers whose test and assembly operations have been affected include ON Semiconductor, ROHM Semiconductor, Lapis Semiconductor, Hana Semiconductor, Stars Microelectronics, Vigilant Technology, STATS ChipPac and Toshiba.
ON Semiconductor: ON Semiconductor Corporation (Nasdaq:ONNN) believes that its SANYO Semiconductor division’s Thai operations in the Rojana Industrial Park in Ayutthaya, Thailand have been severely damaged by the flood. Another facility in Bang Pa In, previously unaffected, is now flooded. Read details on ONNN’s closings here.
ROHM: Sole facility in Thailand has been closed since Oct. 19. The facility conducts assembly and test for integrated circuits, discrete transistors, diodes, resistors and tantalum capacitors. ROHM is attempting to shift production to other locations.
Lapis: Rojana Industrial Park operation is closed. Lapis is looking to supply product from alternative locations.
Hana Semiconductor, a subcontractor for Microchip, Texas Instruments (TI) and others: Thai facility is currently flooded, and no assessment is possible. TI and Microchip are relocating as much production as possible to other qualified locations.
Stars Microelectronics: Ayutthaya facility has been flooded. A subcontractor for Microchip, Stars is relocating operations to other sites and anticipates that the impact on production of Microchip
November 4, 2011 — Amkor Technology, Inc. (Nasdaq:AMKR) will convert all of its 19mm through 31mm body size plastic ball grid array (PBGA) packages to pin-gate molding (PGM) over the next few years.
Amkor cites better quality, reliability, and performance, and potentially lower cost than traditional corner gate molding. The transition to pin-gate molding for PBGAs will also extend the use of wire-bonding for smaller silicon nodes, said Pat O
November 4, 2011 – BUSINESS WIRE — Nordson Corporation will honor the life of Steven J. Adamson, former Nordson ASYMTEK marketing specialist and electronics industry mentor, by funding a $3,000 annual scholarship in Adamson’s name with the IMAPS Educational Foundation, whose role is to support student activities related to the study of microelectronic packaging, interconnect and assembly.
Adamson passed away October 28, 2011, after a 15-month battle with cancer. Donations to the fund in his honor can be made at: www.microelectronicsfoundation.org. "This donation supports the mission of the educational fund, which Steve was instrumental in establishing. We are glad we can honor the memory of Steve in this way," said Michael O’Donoghue, executive director, IMAPS.
Just days before he passed away, Adamson received the Daniel C. Hughes, Jr., Memorial Award from IMAPS. He was IMAPS president in 2008 and chairman of the Society’s Microelectronics Foundation in 2009. Last year, he was given IMAPS’ President’s Award.
Adamson started with Nordson ASYMTEK in 1998 as applications lab manager, and most recently was market development manager for the semiconductor packaging and hard disk drive industries. He contributed to the Axiom and DispenseJet product lines. Adamson previously held positions with Kodak, Motorola in the US, and Plessey International Computers Ltd in the UK. He was awarded five US and two UK patents. Originally from the UK, he held a Higher National Certificate in Electrical Engineering from Stockport College of Technology. In 2005 he was presented an award by the San Diego Engineering Council for "Outstanding Service to Electrical Engineering."
"We will miss Steve’s creativity, intellectual curiosity, and friendship. And the industry will miss his active participation and leadership," stated Greg Hartmeier, vice president, Nordson ASYMTEK.
Memorial services will be held 4pm, Monday, November 7, 2011 at the Oaks North Golf Course Community Center, 12578 Oaks North Drive, San Diego, in the Rancho Bernardo community.
The International Microelectronics And Packaging Society (IMAPS) leads the microelectronics packaging, interconnect and assembly community. Find out more at www.imaps.org.
Nordson ASYMTEK supplies precision automated fluid dispensing, conformal coating, and jetting technologies and designs and manufactures a full line of dispensing and coating systems. For more information, visit www.nordsonasymtek.com.
Nordson Corporation information can be found on the web at www.nordson.com.
Subscribe to Solid State Technology/Advanced Packaging.
Follow Advanced Packaging on Twitter.com by clicking www.twitter.com/advpackaging. Or join our Facebook group
November 4, 2011 — Test equipment maker Multitest‘s Mercury contactor passed a "thorough BGA test evaluation," landing on the qualified contactors list for all business units of an international IDM.
The IDM evaluated cost-effective test contacting with strong first pass yields (FPY). Long probe life was also an important factor.
Multitest
November 3, 2011 — Ziptronix Inc., semiconductor bonding technology developer, shared the results of recent collaborations with major image-sensor manufacturers: Ziptronix ZiBond direct bonding process contributed minimum distortion in backside illuminated (BSI) image sensors.
The Ziptronix direct bonding technology delivered the lowest distortion of any process for manufacturing BSI image sensors, said Ziptronix CEO Dan Donabedian. "Minimal distortion means pixels can be scaled smaller, and that means increased image sensor resolution, more die per wafer, improved image sensor yields and lower production costs."
BSI image sensor manufacturing typically requires bonding a silicon CMOS wafer to a non-CMOS handle wafer. Because this bonding technology does not involve a large coefficient of thermal expansion (CTE) mismatch, it does enable very low distortion which is required for scalable color filter array overlay on the exposed photodiodes after thinning of the bonded CMOS wafer.
Wafer distortion introduced during the bonding process can compromise the overlay and limit pixel scaling. ZiBond’s inherent capacity for high bond strength at low temperature effectively minimizes this distortion compared to the competing bond technologies (adhesive and copper thermo-compression), the company reports. This enables submicron pixel scaling; 0.9um pixel BSI image sensors have already been fabricated and work on 0.7um pixel BSI is underway.
BSI image sensors are replacing frontside illuminated image sensors for digital cameras and smartphone cameras, as well as other applications.
Sony Corp. recently licensed the Ziptronix ZiBond technology for BSI image sensor manufacturing.
Ziptronix develops low-temperature direct bond technology for a variety of semiconductor applications, including backside-illuminated (BSI) sensors, RF front-ends, pico projectors, memories and 3D integrated circuits. Visit www.ziptronix.com.
November 3, 2011 — Amkor Technology Inc. (NASDAQ:AMKR) honored 7 companies with its 2011 Supplier Award, presented at Amkor Supplier Day in Seoul, South Korea.
Substrate suppliers:
Samsung Electro-Mechanics Co., LTD
Unimicron Technology Corp
Samsung Techwin Co. LTD
Raw materials suppliers:
Namics Corporation
Daewon Semiconductor Packaging Industrial Co., Ltd
Equipment suppliers:
EO Technics Co., Ltd.
Oerlikon Systems
These recipients "clearly demonstrated their excellence," said JooHo Kim, Amkor’s executive vice president, worldwide manufacturing operations, noting 2011’s "extraordinary supply chain challenges" caused by the Japan earthquake and tsunami in March.
Amkor is a leading provider of semiconductor assembly and test services to semiconductor companies and electronics OEMs. Amkor’s website: www.amkor.com.
Subscribe to Solid State Technology/Advanced Packaging.
Follow Advanced Packaging on Twitter.com by clicking www.twitter.com/advpackaging. Or join our Facebook group