Category Archives: Materials and Equipment

November 2, 2011 — Henkel Corporation will launch several new electronics assembly materials at Productronica, November 15-18 in Munich, Germany. The new HYSOL underfill is a halogen free, reworkable epoxy capillary underfill with a high glass transition temperature (Tg).

The material is designed for chipscale packages (CSP) and ball grid array (BGA) devices and is particularly well suited for handheld communication and entertainment applications. This high Tg underfill also provides enhanced thermal cycling performance for small pitch wafer level chip scale packages (WLCSPs) unattainable with other low Tg reworkable underfills.

It cures quickly at moderate temperatures to minimize stress to other components and, when cured, provides excellent mechanical stress protection for solder joints.

The unique formulation offers superb reworkability while maintaining excellent drop and thermal cycling protection.

The underfill, as well as lead-free solders and new electrically conductive adhesives, among others, will debut on stand 263 in hall 4 of Productronica.

Henkel operates in three business areas: Laundry & Home Care, Cosmetics/Toiletries and Adhesive Technologies. Henkel

November 2, 2011 — Henkel Corporation will launch several new electronics assembly materials at Productronica, November 15-18 in Munich, Germany. The ABLESTIK ICP-4000 has been qualified to bond components to metal leadframes in plastic housings.

The high-end conductive silicone adhesive ABLESTIK ICP-4000 offers

November 1, 2011 – GLOBE NEWSWIRE — ATMI Inc. (Nasdaq:ATMI) has taken control of, and responsibility for, worldwide distribution of its proprietary Safe Delivery Source (SDS), gas storage and delivery system and related technologies from Matheson Tri-Gas, Inc. Matheson’s license, manufacturing, and distribution agreement was terminated in exchange for a $95 million cash payment.

SDS’s efficiency improvements to ion implant for semiconductor manufacturing was developed by ATMI and Matheson, said Doug Neugold, ATMI’s chairman, CEO, and president. "Both parties agree that now is the right time to change our relationship." While ATMI is taking over all aspects of the product — manufacturing, distribution, logistics, and the direct sales interface with customers — Taiyo Nippon Sanso Corporation, Matheson’s parent entity, has agreed to continue as ATMI’s distributor of the SDS product line in Japan. Also, Matheson will continue to manufacture a portion of the SDS products for up to two years and will provide distribution and logistics services to ATMI during a transitional period, Neugold explained.

ATMI expects the new agreement to strengthen its base revenues, margins, and earnings, said Tim Carlson, ATMI’s CFO: "The transaction will be highly accretive and is expected to generate $7-8 million of incremental product revenues and $0.08-0.09 of incremental earnings per diluted share on a quarterly basis, beginning in the second quarter of 2012. Over the fourth quarter of 2011 and the first quarter of 2012, revenue will be impacted by reversals related to previously recognized product shipments into the Matheson distribution channel, as well as inventory burn in regions where Matheson will continue to sell the product until ATMI secures the appropriate licenses and permits to fully conduct business. The expected unfavorable impact on revenues over the combined next two quarters could be up to $16 million, when compared to the expected post-transaction revenue level. Additionally, under existing accounting rules, we expect to take a one-time contract termination charge of approximately $80-$85 million in the fourth quarter, subject to completion of our fair value analysis."

ATMI Inc. provides specialty semiconductor materials and high-purity materials handling and delivery solutions designed to increase process efficiencies for the worldwide semiconductor, flat panel, and life sciences industries. For more information, please visit http://www.atmi.com.

Subscribe to Solid State Technology

October 28, 2011 — Semiconductor test equipment maker Multitest debuted the Quad Tech concept, next-generation vertical contact technology with a barrel-less architecture.

The design has 4 continuously engaged internal contact points. Quad Tech features high current capabilities, high bandwidth and low inductance. A large mechanical compliance window accommodates stack height tolerances.

Probe life and cleaning intervals are improved by the design, which enables excellent plating, Multitest reports.

Currently, Multitest offers Mercury, Gemini, and Gemini Kelvin probes based on Quad Tech.

Multitest is a designer and manufacturer of final test handlers, contactors and load boards used by integrated device manufacturers (IDMs) and final test subcontractors worldwide. For more information about Multitest

October 27, 2011 — ACM Research Shanghai, Ltd., introduced the integrated Ultra iSFP stress-free polishing (SFP) semiconductor manufacturing tool for 65-45nm copper (Cu) interconnects, improving through silicon vias (TSV) with better heat dissipation. SFP’s electrochemical mechanism is combined with ultra low down force chemical mechanical planarization (ULCMP) and thermal flow etch (TFE) to avoid damaging the underlying device structure while boosting performance.

The Ultra iSFP LDCMP uses endpoint detection to ensure a continuous 150nm Cu film, protecting the underlying low-k structure. A brush clean removes large particles and a space-alternating phase shift (SAPS) megasonic clean removes tiny particles and oxide. An in-tool non-contact component measures Cu thickness. SFP then selectively removes the non-recess Cu to the barrier, followed by a bevel cleaning step. The wafer finally enters the TFE process where the barrier is removed after pre-heat, and the wafer is cooled. An equipment front end module (EFEM) brings the wafer to the front opening unified pod (FOUP).

The Ultra iSFP forms SiO2-based air gap interconnect structures with a traditional SiO2 dielectric and damascene process and an automatic alignment structure, with no hard mask required. SFP is able to control global Cu line recess and dishing by using a pre-measured Cu film thickness map. There is no erosion or deformation to the dielectric layer and barrier during SFP. Air-gap interconnect structures are selectively formed in narrow line spaces for reportedly better heat dissipation and mechanical strength. Air gap interconnect structures can be fabricated with copper line-widths of less than 0.2

Researchers at the Georgia Institute of Technology have developed a prototype wireless sensor capable of detecting trace amounts of a key ingredient found in many explosives.

The device, which employs carbon nanotubes and is printed on paper or paper-like material using standard inkjet technology, could be deployed in large numbers to alert authorities to the presence of explosives, such as improvised explosive devices (IEDs).

Xiaojuan (Judy) Song, left, and Krishna Naishadham display two types of wireless ammonia-sensing prototype devices. (Georgia Tech Photo: Gary Meek)

“This prototype represents a significant step toward producing an integrated wireless system for explosives detection,” said Krishna Naishadham, a principal research scientist who is leading the work at the Georgia Tech Research Institute (GTRI). “It incorporates a sensor and a communications device in a small, low-cost package that could operate almost anywhere.”

Other types of hazardous gas sensors are based on expensive semiconductor fabrication and gas chromatography, Naishadham said, and they consume more power, require human intervention, and typically do not operate at ambient temperatures. Furthermore, those sensors have not been integrated with communication devices such as antennas.

The wireless component for communicating the sensor information — a resonant lightweight antenna – was printed on photographic paper using inkjet techniques devised by Professor Manos Tentzeris of Georgia Tech’s School of Electrical and computer engineering.  Tentzeris is collaborating with Naishadham on development of the sensing device.  

The sensing component, based on functionalized carbon nanotubes (CNTs), has been fabricated and tested for detection sensitivity by Xiaojuan (Judy) Song, a GTRI research scientist. The device relies on carbon-nanotube materials optimized by Song.

Pictured here are three wireless devices that use carbon nanotubes (CNTs) to achieve high sensitivity to ammonia. At left is a patch antenna, inkjet-printed on photographic paper, with the CNTs shown in black. At top center is an omni-directional segmented loop antenna on a soft substrate, designed for potential 5.8 GHz RFID integration. At bottom right is an inter-digitated capacitor on silicon substrate with CNT loading across the electrodes, being tested for its DC resistance. (Georgia Tech Photo: Gary Meek)

A presentation on this sensing technology was given in July at the IEEE Antennas and Propagation Symposium (IEEE APS) in Spokane, Wash., by Hoseon Lee, a Ph.D. student in ECE co-advised by Tentzeris and Naishadham.  The paper received the Honorable Mention Award in the Best Student Paper competition at the symposium.

This is not the first inkjet-printed ammonia sensor that has been integrated with an antenna on paper, said Tentzeris.  His group produced a similar integrated sensor last year in collaboration with the research group of C.P. Wong, who is Regents professor and Smithgall Institute Endowed Chair in the School of Materials Science and Engineering at Georgia Tech.

“The fundamental difference is that this newest CNT sensor possesses dramatically improved sensitivity to miniscule ammonia concentrations,” Tentzeris said. “That should enable the first practical applications to detect trace amounts of hazardous gases in challenging operational environments using inkjet-printed devices.”

Tentzeris explained that the key to printing components, circuits and antennas lies in novel “inks” that contain silver nanoparticles in an emulsion that can be deposited by the printer at low temperatures – around 100 degrees Celsius.  A process called sonication helps to achieve optimal ink viscosity and homogeneity, enabling uniform material deposition and permitting maximum operating effectiveness for paper-based components.

“Ink-jet printing is low-cost and convenient compared to other technologies such as wet etching,” Tentzeris said.  “Using the proper inks, a printer can be used almost anywhere to produce custom circuits and components, replacing traditional clean-room approaches.”

Low-cost materials – such as heavy photographic paper or plastics like polyethylene terephthalate — can be made water resistant to ensure greater reliability, he added. Inkjet component printing can also use flexible organic materials, such as liquid crystal polymer (LCP), which are known for their robustness and weather resistance.  The resulting components are similar in size to conventional components but can conform and adhere to almost any surface.

Naishadham explained that the same inkjet techniques used to produce RF components, circuits and antennas can also be used to deposit the functionalized carbon nanotubes used for sensing.  These nanoscale cylindrical structures — about one-billionth of a meter in diameter, or 1/50,000th the width of a human hair — are functionalized by coating them with a conductive polymer that attracts ammonia, a major ingredient found in many IEDs.

Sonication of the functionalized carbon nanotubes produces a uniform water-based ink that can be printed side-by-side with RF components and antennas to produce a compact wireless sensor node.  

"The optimized carbon nanotubes are applied as a sensing film, with specific functionalization designed for a particular gas or analyte,” Song said. “The GTRI sensor detects trace amounts of ammonia usually found near explosive devices, and it can also be designed to detect similar gases in household, healthcare and industrial environments at very low concentration levels."

The sensor has been designed to detect ammonia in trace amounts – as low as five parts per million, Naishadham said.  

The resulting integrated sensing package can potentially detect the presence of trace explosive materials at a distance, without endangering human lives. This approach, called standoff detection, involves the use of RF technology to identify explosive materials at a relatively safe distance. The GTRI team has designed the device to send an alert to nearby personnel when it detects ammonia.  
The wireless sensor nodes require relatively low power, which could come from a number of technologies including thin-film batteries, solar cells or power-scavenging and energy-harvesting techniques.  In collaboration with Tentzeris’s and Wong’s groups, GTRI is investigating ways to make the sensor operate passively, without any power consumption.    

“We are focusing on providing standoff detection for those engaged in military or humanitarian missions and other hazardous situations,” Naishadham said.  “We believe that it will be possible, and cost-effective, to deploy large numbers of these detectors on vehicles or robots throughout a military engagement zone.”

EV Group (EVG) launched a suite of temporary bonding and debonding (TB/DB) equipment modules that support ZoneBOND technology.  ZoneBOND defines two distinctive zones on the carrier wafer surface with strong adhesion in the perimeter (edge zone) and minimal adhesion in the center zone.  As a result, low separation force is only required for carrier separation once the polymeric edge adhesive has been removed by solvent dissolution or other means.

EVG is also pursuing an

PRNewswire via COMTEX/ — Materials company Brewer Science Inc. and equipment supplier EV Group (EVG) will both commercialize ZoneBOND technology for temporary wafer bonding, thin wafer processing, and debonding applications.

ZoneBOND works with silicon, glass, and other carriers and existing adhesive platforms. Debonding can take place at room temperature with virtually no vertical force on the device wafer. ZoneBOND defines 2 carrier wafer zones, with strong perimeter adhesion and minimal center adhesion. This allows wafer grinding and backside processing at high temperatures, while enabling low-force separation. The polymeric edge adhesive can be removed by solvent dissolution or other means.

Paul Lindner, executive technology director of EV Group, said, "Combining Brewer Science’s advanced material development and process integration and EVG’s field-proven equipment and process solutions, ZoneBOND will enable customers to achieve a quantum leap in thin wafer processing."

Brewer Science makes specialty materials, equipment, and process solutions for applications in semiconductors, advanced packaging/3D ICs, MEMS, displays, LEDs, and printed electronics. Learn more about Brewer Science at www.brewerscience.com.

EV Group (EVG) makes wafer-processing solutions for semiconductor, MEMS and nanotechnology applications. More information is available at www.EVGroup.com.

Subscribe to Solid State Technology/Advanced Packaging.

Follow Advanced Packaging on Twitter.com by clicking www.twitter.com/advpackaging. Or join our Facebook group

October 19, 2011 – Marketwire — Semiconductor fab tool maker Mattson Technology Inc. (NASDAQ: MTSN) won acceptance for its Helios XP rapid thermal processing (RTP) system for process of record from a major Asian foundry.

The foundry performed an extensive evaluation of the system, and is now using it in volume production of advanced semiconductors. This is MTSN’s first sale of the Helios XP to a major foundry.

The Helios XP uses Hotshield differential energy control (DEC) technology to minimize pattern loading effects on smaller geometries, larger die-sizes, and more complex intra-dies structures at sub-4X nanometer nodes, noted Andreas Toennis, senior vice president and general manager of Mattson Technology’s Thermal Products Group.  

Mattson Technology Inc. designs, manufactures and markets semiconductor wafer processing equipment used in the fabrication of integrated circuits. MTSN operates in three primary product sectors: Dry Strip, Rapid Thermal Processing and Etch. Internet: www.mattson.com.

Subscribe to Solid State Technology

October 19, 2011 – PRNewswire-Asia — NEXX Systems shipped a Stratus electrochemical deposition tool to Nantong Fujitsu Microelectronics Co. Ltd. (NFME), based in Jiangsu province, China. NFME will use the Stratus for copper pillar and re-distributed layer (RDL) advanced packaging applications.

The Stratus is a fully automated electrochemical deposition system that deposits thick metal layers. Wafers are processed in a vertical orientation for higher quality results and higher-throughput concurrent processing.

The Nexx tool will help NFME "keep pace with [its] aggressive roadmap," said NFME’s president, member of board, Mr. Shilei, adding that the tool will be used to package diverse chips for international customers. NEXX CEO Tom Walsh noted that the Stratus deposition system is well suited to packaging consumer mobile ICs.

The sale into China is a milestone in NEXX’s infrastructure and staff expansion in the region, where NEXX added a Shanghai office. NEXX sees China’s semiconductor packaging industry shifting to leading-edge packaging technologies, citing Prismark Partners’ Brandon Prior, who notes that China is becoming "a key region" for advanced packaging such as wafer-level technologies (WLCSP, FOWLP), through silicon vias (TSV), and copper pillar bumps.

NFME is a technology and market leader that focuses on testing and assembling semiconductors for more than half of the top semiconductor manufacturers. Learn more at http://www.fujitsu-nt.com/en/

NEXX provides the global semiconductor industry with productive, flexible and efficient deposition technology for advanced packaging applications. Learn more at http://www.nexxsystems.com/

Subscribe to Solid State Technology/Advanced Packaging.

Follow Advanced Packaging on Twitter.com by clicking www.twitter.com/advpackaging. Or join our Facebook group