Category Archives: Materials and Equipment

December 3, 2010 – Eleven semiconductor equipment manufacturers earned VLSI Research’s five-star rating this year, earning top marks in various metrics adding up to "exceptional customer satisfaction," the analyst firm reports.

First-glance takeaways from the list:

  • Varian Semi is once again on the list, six years in a row now — since it started in 2005.
  • New entrants on the list: BE Semi and Hitachi High-Tech (fka Renesas Eastern Japan Semiconductor). Both are assembly firms, making 4 assembly firms out of 11 five-star earners.
  • Those who fell off the list from 2009: ASML, Hanmi, Nissin, and Rite Track.
  • Verigy is the only test equipment supplier to earn consecutive five-star awards.

The five-star metrics aim to identify companies offering both superior performance in both their equipment and organization. Categories include cost-of-ownership, quality of results, product performance, customer service, technical leadership, and commitment. Data were normalized to fit a five-star rating system, based on thirteen categories (see table below and this link for more on those categories and the survey metrics). The 15th largest chip toolmakers were grouped together, with a 20th-percentile cutoff for a five-star rating; All other companies (smaller than those 15) were grouped with a cutoff point of 23rd percentile. Basically the rankings indicate, on average, how a supplier stands out vs. other companies in the industry.

(December 3, 2010) — Rice University researchers have discovered a simple way to make carbon nanotubes shine brighter. Rice researcher Bruce Weisman, a pioneer in nanotube spectroscopy, found with his lab that adding tiny amounts of ozone to batches of single-walled carbon nanotubes (SWCNT) and exposing them to light decorates all the CNTs with oxygen atoms and systematically changes their near-infrared fluorescence.

Chemical reactions on nanotube surfaces generally kill their limited natural fluorescence, Weisman said. But the new process actually enhances the intensity and shifts the wavelength.

He expects the breakthrough, reported online in the journal Science, to expand opportunities for biological and material uses of CNTs, from the ability to track them in single cells to novel lasers.

Best of all, the process of making these bright nanotubes is incredibly easy — "simple enough for a physical chemist to do," said Weisman, a physical chemist himself.

He and primary author Saunab Ghosh, a graduate student in his lab, discovered that a light touch was key. "We’re not the first people to study the effects of ozone reacting with nanotubes," Weisman said. "That’s been done for a number of years. But all the prior researchers used a heavy hand, with a lot of ozone exposure. When you do that, you destroy the favorable optical characteristics of the nanotube. It basically turns off the fluorescence. In our work we only add about one oxygen atom for 2,000-3,000 carbon atoms, a very tiny fraction."

Ghosh and Weisman started with a suspension of nanotubes in water and added small amounts of gaseous or dissolved ozone. Then they exposed the sample to light. Even light from a plain desk lamp would do, they reported.

Most sections of the doped nanotubes remain pristine and absorb infrared light normally, forming excitons, quasiparticles that tend to hop back and forth along the tube — until they encounter oxygen.

"An exciton can explore tens of thousands of carbon atoms during its lifetime," Weisman said. "The idea is that it can hop around enough to find one of these doping sites, and when it does, it tends to stay there, because it’s energetically stable. It becomes trapped and emits light at a longer (red-shifted) wavelength. Essentially, most of the CNT is turning into an antenna that absorbs light energy and funnels it to the doping site. We can make nanotubes in which 80 to 90% of the emission comes from doped sites," he said.

Lab tests found the doped nanotubes’ fluorescent properties to be stable for months.

Weisman said treated nanotubes could be detected without using visible light. "Why does that matter? In biological detection, any time you excite at visible wavelengths, there’s a little bit of background emission from the cells and from the tissues. By exciting instead in the infrared, we get rid of that problem," he said.

The researchers tested their ability to view doped nanotubes in a biological environment by adding them to cultures of human uterine adenocarcinoma cells. Later, images of the cells excited in the near-infrared showed single nanotubes shining brightly, whereas the same sample excited with visible light displayed a background haze that made the tubes much more difficult to spot.

His lab is refining the process of doping nanotubes, and Weisman has no doubt about their research potential. "There are many interesting scientific avenues to pursue," he said. "And if you want to see a single tube inside a cell, this is the best way to do it. The doped tubes can also be used for biodistribution studies.

"This isn’t an expensive or elaborate process," Weisman said. "Some reactions require days of work in the lab and transform only a small fraction of your starting material. But with this process, you can convert an entire nanotube sample very quickly."

The paper’s co-authors include Rice research scientist Sergei Bachilo, research technician Rebecca Simonette and Kathleen Beckingham, a Rice professor of biochemistry and cell biology.

The National Science Foundation, the Welch Foundation and NASA supported the research. Learn more at www.rice.edu.

Follow Small Times on Twitter.com by clicking www.twitter.com/smalltimes. Or join our Facebook group

(December 3, 2010) — DEK has launched an addition to its VectorGuard stencil range. VectorGuard 3D stencils are designed for specialist applications requiring multiple level printing. Facilitating printing on different levels with upward or downward steps, VectorGuard 3D enables a uniform stencil thickness.

Targeted at applications consisting of different levels on the PCB or substrate, the electroformed nickel VectorGuard 3D Stencil prints two levels at the same time, accommodating levels that differ by up to 3mm. Previously, devices such as power transistors requiring support on multiple levels, necessitated a dispensing operation following stencil print. VectorGuard 3D eliminates the dispenser requirement. VectorGuard 3D meets the challenges of providing coverage for dedicated areas on the board, such as chip on board (COB). Equally, the process can be used to protect bonding areas from contact with the stencil. Other applications particularly suited to VectorGuard 3D include printing of heatsink pockets for power components or printing of 3D mounting PCBs.

By avoiding the process of using thick stencils and milling down print areas, the 3D model is said to reduce stencil stress and increase process reliability.

VectorGuard 3D stencils will be individually engineered to meet specific application requirements.

Visit www.dek.com for more information.

Subscribe to Solid State Technology/Advanced Packaging.

Follow Advanced Packaging on Twitter.com by clicking www.twitter.com/advpackaging. Or join our Facebook group

December 2, 2010 — SAFC Hitech announced plans to build a new, dedicated facility in Kaohsiung, Taiwan for transfilling, technical service and production of chemical precursors used for high brightness LED and silicon semiconductor manufacturing. The new facility is expected to be operational by late 2011. The announcement follows the March 2010 production expansion of trimethylgallium (TMG) at its Bromborough, UK manufacturing site.

SAFC Hitech already operates a facility in Kaohsiung, designed to handle and characterize highly-specialized laboratory-scale chemicals and features a dedicated customer support center. This existing site is ISO 9001 certified for quality and ISO 14001 certified for safety and environmental protocols. The facility was originally built to service the semiconductor industry demands for ultra-high quality precursors using proprietary technologies. The site also provides integrated inert atmosphere transfilling stations, analytical instrumentation for the detection of ultra-low metallic and oxygen containing contaminants and dedicated cylinder preparation and packaging areas.

SAFC Hitech sees the LED manufacturing market growing rapidly, particularly HBLEDs that are used in applications such as backlighting in flat panel television sets and energy efficient lighting. “As mass manufacturing continues its rise, we are experiencing significant increases in customer and partnership activities in the Asia-Pacific region," said Philip Rose, SAFC Hitech President.

Strategies Unlimited, a market research firm, projects market growth for HBLEDs averaging 29.5% per year, reaching over $19 billion by 2014. The application with the highest forecast growth rate is signs/displays, with a CAGR of 60.6%.  Illumination has the next-highest growth rate, with a projected CAGR of 45.4%.

 

 

(December 1, 2010) — The recent difficulties in semiconductor sales and the unusually rapidly declining IC price/performance index are slowing semiconductor equipment demand. As a result VLSI research has revised its 2011 and 2012 forecasts for both integrated circuits (ICs) and semiconductor equipment. Essentially, 2010 has been a 2-for-1 deal for both chips and equipment with two years of growth in one year, resulting in overcapacity and declining chip prices, says VLSI.

IC forecast

IC sales are now expected to increase only 4.4% in 2011 to $248.6 billion, while 2012 will accelerate with an IC sales growth rate of 7.9%. VLSI Research cites the increasingly difficult pricing environment, resulting from the rapidly increasing production capacity as the major contributor for sluggish sales growth in 2011. This is not only limited to DRAM markets but also other major IC sectors as well.  Also read: Utilization slips, but still high in Q3

IC forecast scenarios (VLSI Research)
VLSI’s current forecast Electronics market ($B) IC market ($B) IC equipment market ($B) Electronics market (%) IC market (%) IC equipment market (%)
2008 1569.8 207.3 41.0 0.4 -4.8 -26.2
2009 1430.2 189.9 24.4 -8.9 -8.4 -40.4
2010 1617.1 248.6 48.8 13.1 30.9 99.7
2011 1743.6 259.6 46.3 7.8 4.4 -5.0
2012 1886.8 280.2 49.7 8.2 7.9 7.2

Semiconductor equipment forecast

VLSI Research has also downgraded the 2011 forecast for semiconductor manufacturing equipment.  Equipment sales are expected to decline 5% in 2011 to $46.3 billion. 2012 will bring a recovery to semiconductor equipment demand as sales are expected to reach $49.7 billion, 7.2% growth. Semiconductor equipment demand is slowing due to excess supply in DRAM markets and VLSI expects other major segments to experience a flat year in 2011. Also read: Seasonal softening now controls chip tool demand

VLSI Research inc provides market research and economic analysis on the technical, business, and economic aspects within nanotechnology and related industries. Learn more at https://www.vlsiresearch.com

Subscribe to Solid State Technology/Advanced Packaging. Follow Solid State Technology on Twitter.com via editors Pete Singer, twitter.com/PetesTweetsPW and Debra Vogler, twitter.com/dvogler_PV_semi. Or join our Facebook group

(November 26, 2010) — Di Ma, VP, field technical support at TSMC, gave a presentation at the IEEE Bay Area Nanotechnology Council’s Half-day Symposium (11/16/10, Santa Clara, CA) on technical challenges in 28nm CMOS and beyond.

Click to Enlarge
Figure. Transistor architecture beyond HK+MG. SOURCE: TSMC

Looking ahead, Ma summarized the company’s efforts with respect to transistor architecture beyond HK+MG (Figure) in a podcast interview with Debra Vogler, senior technical editor. The company has been working on doing depositions in different sequences to enhance the HK+MG stack, making it more stable.

Listen to Di Ma’s talk: Download (for iPod/iPhone) or Play Now

He outlined the company’s five factors that drove its decision to select the gate-last approach: speed, power, reliability, manufacturability, and scalability. Ma said that it was important to have an optimized solution that took each of these five considerations into account. TSMC’s data indicates that a gate-last approach enables process knobs that keep device power consumption low.

And from a manufacturability standpoint, by using gate-last, all the thermal/high-temperature processes can be completed before depositing the HK+MG materials, which keeps the threshold voltage stable.

(November 24, 2010 – JCN Newswire) — Tokyo Electron Limited and Tanaka Kikinzoku Kogyo K.K. have developed a sucessful recycling process for ruthenium precursors (CVD-ruthenium material) used in next-generation semiconductor miniaturization technology.

Ruthenium precursors are currently disposed of without being collected as valuable resources. In this recycling program, ruthenium precursors can now be collected, refined, and re-used without returning them to ruthenium metal. Tokyo Electron Limited developed the recovery system, which collects residue of the ruthenium-CVD precursor not deposited on the wafer, and Tanaka Kikinzoku Kogyo K.K. developed the process to refine and re-use the collected ruthenium precursors.

In semiconductor fabrication there are challenges to scaling, such as improving the copper filling performance in a narrow interconnect. Tokyo Electron has proposed an improvement in copper filling performance by utilizing a ruthenium liner film with excellent adhesion and lower resistivity.

With the goal of lowering overall cost and ensuring a stable supply of ruthenium precursors, Tokyo Electron and Tanaka Kikinzoku Kogyo agreed to jointly develop the recycling process. The process will save almost 20% of ruthenium precursor cost and significantly lower the cost of consumables (COC) of the CVD-ruthenium process. Further, an almost 30% reduction in CO2 emissions is expected utilizing the new recycling process.

Ruthenium is produced primarily in South Africa and is found in platinum ore in amounts of about 10-20%. The annual output of ruthenium worldwide is approximately 30 tons. It is estimated that ruthenium reserve quantities are nearly 6,000 tons. Tanaka Kikinzoku Kogyo is engaged in business with the mining company Anglo Platinum Inc., which has over 40% of world market share in the PGM (Platinum Group Metals): Platinum, Palladium, Rhodium, Iridium, Ruthenium, Osmium metals.

Atomic Number: 44
Melting Point: 2,250 degrees Celsius
Resistivity: 7.6 micro ohm cm
                     – Ru Oxide is electroconductive.
Lattice parameter: Ru(002) 2.14 angstrom
                     – near Cu,  Cu(111) 2.09 angstrom
Chemical stability:  – No dissolution in the plating bath.
                     – Neither diffusion nor the alloy are in Cu.

For details of this release, please see: http://pdf.japancorp.net/english/clientreports/4294/TanakaMetals.pdf .

Tokyo Electron Limited (TSE: 8035) lies at the core of the Tokyo Electron Group, one of the world’s top manufacturers of semiconductor production equipment, LCD production equipment, computer systems and electronic components. More information about Tokyo Electron Limited is available at http://www.tel.co.jp.

Tanaka Precious Metals has built a diversified range of business activities focused on the use of precious metals. On April 1, 2010, the group was reorganized with Tanaka Holdings Co., Ltd. as the holding company (parent company) of the Tanaka Precious Metals. Learn more about Tanaka Holdings Co. Ltd. (Holding company of Tanaka Precious Metals) at http://www.tanaka.co.jp.

Subscribe to Solid State Technology/Advanced Packaging. Follow Solid State Technology on Twitter.com via editors Pete Singer, twitter.com/PetesTweetsPW and Debra Vogler, twitter.com/dvogler_PV_semi. Or join our Facebook group

(November 23, 2010) — IMAPS 2010 presenter Jae-Woong Nah, research staff member, Packaging Materials Technology, at IBM’s Thomas J. Watson Research Center, briefed ElectroIQ on his conference paper: "Mask and mask-less injection molded solder (IMS) technology for fine-pitch substrate bumping."

Figure 1. Mask IMS method for substrate bumping. SOURCE: IBM

The paper describes the researchers’ work to develop a new pre-solder bumping technology of injection-molded solder (IMS) for fine pitch organic substrates (Figure 1). “Four years ago, IBM introduced C4NP (C4 new process) as a low cost and environmentally friendly process for applying C4s to wafers that are in volume production at IBM," said Nah. IMS is a variation of C4NP for solder deposition on fine-pitch laminates. The manufacturing technology currently in use for bumping on organic substrates is the solder paste stencil printing method. "However, the paste printing method is difficult to extend to <150µm pitch because the flux volume in the solder paste is about 50%," observed Nah. "The flux bridging after stencil printing leads to pre-solder bump bridging after solder reflow, especially with decreasing pitch and/or increasing pre-solder volume."

In an interview with Debra Vogler, senior technical editor, Nah explained how the researchers injected 100% pure molten solder instead of solder paste with a reusable film mask for forming high-volume solder on fine-pitch substrates.

Listen to Nah’s technical discussion: Download (for iPod/iPhone) or Play Now  

"Since only molten pure solder is used instead of solder paste, this method can achieve higher volume solder bumps for a given pitch, and can be used for fine-pitch applications," said Nah. Over the last year, the researchers ran hundreds of singulated laminates through the process and had no solder bridging and no missing bumps. The group demonstrated 70µm height solder bumps above the solder resist on 150µm pitch substrates (4,500 areal arrays in an 11 × 15mm area); it also demonstrated 35µm height solder bumps on an 80µm pitch substrate (15,000 bumps in a 10 × 10mm area).

 

Figure 2. Mask-less IMS method for substrate bumping. SOURCE: IBM

"In addition to the mask IMS process, we developed a mask-less solder bumping process — direct injection of molten solder without a mask,” said Nah (Figure 2). "It is a very simple and reliable process with low cost compared to any other bumping method," said Nah. He explained that the height of the solder bump is smaller than the mask IMS process because it is limited by the solder resist opening volume. "We demonstrated a 15µm solder height over the solder resist by using the mask-less IMS process."

Nah told ElectroIQ about technical challenges that had to be overcome. Because molten solder has a viscosity similar to water and the organic substrate warps, it is important to prevent leakage between the tool head and the mask as well as between the mask and the substrate. “We used a compliant material on the bottom of the tool head and flexible film mask,” explained Nah. “The compliant material creates a sliding seal between the tool head and the film mask, and the flexible mask follows any non-flat contours on the substrate under the influence of the compressive force that is distributed by the compliant material.” Nah also notes that in the mask-less IMS process, the low friction compliant material is important because the solder resist surface is very rough compared to the film mask. "The mask-less process today is perfect for applications that don’t require large solder volumes — and at a significant cost saving."

Nah believes that the IMS method redefines the role of solder bumping on a substrate. "The IMS method can provide a very large solder volume on substrates and it can reduce the chip bump volume, and potentially eliminate the wafer bumping process," observes Nah. As a result, the decrease in bump volume on the chip reduces the total package cost. "In the case of Cu pillars, the decrease in the Cu pillar height can reduce the stress on back-end-of-line during the flip-chip assembly process, in addition to decreasing the Cu die bumping cost."

Nah told ElectroIQ that IBM is working with another company to commercialize the process and they will have tooling available for large size substrate by sometime next year. "You will see a prototype tool using IMS technology next year," said Nah.

Subscribe to Solid State Technology/Advanced Packaging.

Follow Advanced Packaging on Twitter.com by clicking www.twitter.com/advpackaging. Or join our Facebook group

(November 22, 2010) — NovaCentrix announced that Metalon ICI-020, a new copper-based screen ink, will be featured at Printed Electronics USA 2010 in Santa Clara, CA, November 30-December 2, 2010. Pre-printed samples of Metalon ICI-020 screen ink on card stock will be distributed with the registration packs by IDTechEx staff, and attendees may bring their samples to the NovaCentrix exhibit area to cure the ink with NovaCentrix’s PulseForge process tool.
 
"This new ink is the proper next step for printed electronics conductive materials development. By combining low cost, high performance, use with paper-based substrates and deposition by screen printing, the Metalon ICI-020 screen ink expands the practical utility of printed electronics,” said Stan Farnsworth, VP Marketing. "This event’s size and the diversity of attendees representing all aspects of the development and supply chain makes it the perfect venue to launch this revolutionary new screen-print ink."
 
The Metalon ICI-020 screen ink is based on the same functional principles as the Metalon ICI-003 inkjet ink.  Copper oxide particles are formulated with a reduction agent. After the ink is printed, a PulseForge tool is used to modulate a reduction reaction thereby converting the copper oxide into a thin film of highly conductive copper. Importantly, this process is performed in ambient air on low temperature substrates at speeds exceeding 100 meters/minute. NovaCentrix received an R&D 100 award in 2010 for its development of this technology as well as recognition by IDTechEx in April of this year at the Printed Electronics Europe event in Dresden, Germany.
 
NovaCentrix, based in Austin, Texas, is a leader in printed electronics manufacturing technologies. The Company’s PulseForge tools sinter functional inks in milliseconds on low-temperature, flexible substrates such as paper and plastic. NovaCentrix’s tools process a wide array of metal-based conductive inks, as well as non-metallic and semiconductor inks. NovaCentrix also offershigh-performance, economical Metalon conductive inks which work optimally with PulseForge tools. To learn more, please visit www.novacentrix.com.

Subscribe to Solid State Technology/Advanced Packaging.

Follow Advanced Packaging on Twitter.com by clicking www.twitter.com/advpackaging. Or join our Facebook group

November 19, 2010 – Good news: September numbers for semiconductor equipment demand were a little bit better than originally thought. Bad news: October numbers are worse. More bad news: It’s now pretty clear that we’re on the downslope of the peak in chip tool demand.

Inside SEMI’s October statistics:

  • Bookings were $1.65B, the industry’s first three-month sequential decline since early 2009. Orders are now close to May levels. Billings were $1.61B, barely flat (0.7%) from September; technically that’s an 18th consecutive month of rising, but it’s also fourth straight months of ≤4% sales growth, and nine out of 10 in the single digits.
  • Both orders and sales remain well above the same period a year ago, but falling noticeably: now ~111% and 134%, instead of the nearly 200% in August. The further we pull away from the downturn, of course, the closer those Y/Y comparisons will come to normalcy — and eventually we’ll be comparing them on the upside, too. Still, the bookings are above the average figure from 2006-2007, noted SEMI president/CEO Stanley Myers, in a statement.
  • Perhaps the most glaring indicator of slowing demand, the book-to-bill: is officially below the parity mark at 0.98, the first time that’s happened since July 2009 — meaning fewer orders ($98 worth) were received for every $100 billed. The B:B spent the past 15 months above the 1.0 parity mark, many of them in the "teens" and "twenties" range (1.13-1.23). Generally speaking, sales trail orders by six months or more (litho tools closer to a year, some say), so look for this downward tumble in bookings to eventually be reflected in the sales column.
  • With September numbers in, we can calculate prelim. 3Q10 totals: $5.27B in bookings and $4.63B in billings, growth of 12% and 13% respectively — but well below the 25%-33% Q/Q growth in 2Q10.

SEMI’s September numbers were retroactively improved by about 2% (adding roughly $35B) for both billings and bookings; that tweaked up the M/M comparisons to about 3.6% for billings (vs. 1.3%) and -9.1% for bookings (vs. -11%).

While acknowledging "a hesitation in new orders," Myers noted that the waning demand for chipmaking tools merely "reflects seasonal softening and near-term respite in capital spending in some segments of the industry."

Click to Enlarge

In Japan, the downward slide was even more pronounced — October sales of chip tools slipped about -4% to ¥107.56B ($1.29B), and orders slid nearly -6% to ¥120.41B ($1.44B), according to the SEAJ’s monthly statistics. The faster decline in orders, though, kept the book-to-bill ratio above parity at 1.12.