Category Archives: Metrology

by James Montgomery, News Editor, Solid State Technology

Feb. 26, 2008 – The proposed combination of KLA-Tencor and ICOS Vision Systems makes sense for both sides, both financially and in market positioning, though as always some questions need to be answered about just how smooth any such M&A will be.

Days ago KLAC offered to buy ICOS for about $465M in cash. During ICOS’ conference call discussing its recent 4Q results, ICOS president/CEO Anton De Proft noted that board members holding ~20%-25% ownership stake have committed to the offer.

A Reuters report cited analysts indicating the price is right — ICOS’ shares are fresh off a 2.5-year low, and could take nearly as long to climb to KLAC’s proposed offer). The report also noted that a vast majority of ICOS shares are in “free-float,” meaning KLA-Tencor needs to win support from a large number of individual shareholders rather than a few large investor groups.

ICOS and RVSI have been speculated as other possible takeover targets in backend inspection going back at least to the multiparty tug-of-war for August Technologies two years ago.

Gartner Dataquest research VP Bob Johnson thinks the deal gives KLA-Tencor an entry into the backend part of the metrology sector, “one which they currently do not participate in, and one where Rudolph/August has a strong position,” having been the origin of the company’s macro systems, he told WaferNEWS. Further, “ICOS does have proven inspection capabilities for products which do not require sub-100nm capabilities – this is an area where KLAC has not been historically strong, so this technology can help there.” He added that there also may be some synergy between ICOS’ solar wafer inspection capabilities and KLA/ADE’s raw wafer inspection technology.

From a business standpoint, Johnson noted that KLAC is using its cash to grow faster than the overall market, “because the growth rates of their fundamental markets have slowed. This appears to be one of the few companies left with potential synergy with KLAC’s core technology (inspection),” he said. Also, since this is a cash transaction, KLAC gains revenue and profit with no stock dilution, so its EPS will go up, he pointed out.

One thing to watch for, as always in M&A deals, is how proposed synergies actually play out across the organizations, including mixing business cultures — something possibly more at play in this deal combining US and European organizations. “Whether there will be a culture clash remains to be seen,” Johnson noted.

Feb. 26, 2008 – Carl Zeiss and SEMATECH say they have completed final design for a next-generation photomask registration and overlay metrology system, dubbed “Prove,” that will enable production of advanced photomasks “with substantially improved image placement accuracy,” eyeing in particular the tighter placement control required for double-patterning technology.

The new system ascertains the accuracy of mask pattern alignment, and registration for 32nm half-pitch and beyond photomasks, they say in a statement. The metrology technology also forms part of the critical infrastructure of EUV. SEMATECH indicated the work has led to completion of design for quantifying image placement errors as small as 2.4nm. The tool itself is expected to be in production in 2009, targeting primarily mask manufacturers.

A key component of the system, the companies indicated, is a diffraction-limited, high-resolution imaging optics operating at 193nm corresponding to at-wavelength metrology for the majority of current and futures photomask applications. They also point to a “reasonable working distance” that allows through-pellicle measurements. Two illumination paths offer measurements both in transmission and reflection (e.g. for EUV), providing flexible illumination for maximum contrast imaging. The photomask resides on an ultra-precision stage, being the only movable part in the imaging path.

“Future lithographic scaling places a high reliance on very tight overlay control of the various device levels, and the photomask is a key component of the overlay error budget,” stated Michael Lercel, SEMATECH director of lithography and chairman of the ITRS Litho Working Group. “This new system will get us past several previously ‘no known solution’ challenges.”

February 25, 2008 — Steinmeyer Inc. has released its new high precision micro manipulator stage, MT 130-50-DC, geared toward nanotechnology, metrology, biomedical, and robotics applications.

Manufactured from high strength anodized aluminum, the standard table offers travel of 50 mm with positioning accuracy of 10 µm (micrometer), straightness/flatness runout of +/- 1µm and repeatability of +/- 1µm. With a sleek low profile design, it has a square footprint of 130 mm x 130 mm, height of 43 mm and weighs only 1.8 kg, the company announced in a news release.

Features include reloaded cross roller bearings, precision ground ball screw, limit switches, and integrated dc motor with rotary encoder. This product can be provided as a XY stage and can also be configured as a XYZ system-model MP 130-50-DC as a further enhancement. Motors, encoders and cabling are all hidden inside the table’s body.

Motor, limit switch and encoder interface are via SUB-D connectors located in a single area. This stage is suited for semiconductor metrology, biomedical, miniature robotics, and laser industry applications, the company says.

Feb. 21, 2008 – The latest move in metrology industry consolidation has occurred with KLA-Tencor’s proposed “friendly” acquisition of Belgium firm ICOS Vision Systems in a proposed €316.9M (US $465.8M) cash transaction.

The €36.50/share ($53.75) offer represented a 35% premium to ICOS’ three-month average closing price. KLA-Tencor also said will offer to purchase ICOS shares underlying all outstanding 2002 employee stock options and 2007 employee warrants.

The deal, anticipated to close sometime in 2Q08, requires approval from 85% of ICOS’ shareholders. Also, a clause indicated by both companies notes the bid must not be subject to review by government/jurisdictional antitrust authorities “beyond the initial phase of review.”

In a statement, KLA-Tencor CEO Rick Wallace noted “exceptional synergy” in markets and technologies, “with additional opportunities for both growth and diversification” — ICOS provides “a significant presence” in semiconductor packaging inspection, and inroads into growth sectors such as LED lighting and solar.

For ICOS, the proposed combination “would significantly increase our growth potential and provide remarkable resources for advanced technical development of our existing products and technologies,” stated president/CEO Anton De Proft.

Under the membership agreement, Rudolph and SEMATECH will jointly establish an International Process Characterization (IPC) program, aimed at the development of process, analysis, and characterization technology to address critical challenges in nanoelectronics research.

(February 21, 2008) — MEPTEC, the MicroElectronics Packaging and Test Engineering Council, has finalized the program for its 4th Annual Thermal Management symposium titled “The Heat Is On: Thermal Technology Solutions for Advanced Products.” This one-day technical event will be held on February 28, 2008, at the Wyndham Hotel, San Jose, CA.

Feb. 20, 2008 – Rudolph Technologies and SEMATECH are establishing an international process characterization program to develop process, analysis, and characterization technology targeting 32nm and beyond semiconductor manufacturing. Work will be headquartered at the U. of Albany’s College of Nanoscale Science and Engineering (CNSE). Rudolph says it is the first semiconductor equipment supplier to join SEMATECH’s metrology program at Albany.

The deal involves working with members of SEMATECH and subsidiary ISMI to accelerate development and application of measurement methods for advanced semiconductor technologies, particularly integrated metrology, inspection and yield enhancement software, under the goals of overcoming challenges of increased process complexity, shrinking sizes of systematic and extraneous defects, and harder-to-discern actionable information gleaned from raw data.

Initially the IPC program will addresses a range of issues, including the metrology of thin films and metal gate stacks; wafer front/back/edge macrodefect inspection; inspection and metrology for through-silicon vias (TSV) and 3D IC; immersion lithography process characterization; process modeling and optimization for yield enhancement; and automatic defect classification (ADC). Also, the program aims to establish benchmarks for cost-effective solutions by including cost-of-ownership criteria in all projects.

“The integration of advanced hardware and intelligent analytical software will be the key to meeting these challenges,” said Rudolph COO Alex Oscilowski, in a statement. “We’re looking forward to contributing our experience, front-end to back-end throughout the manufacturing process, and our broad expertise in metrology, inspection and data analysis technologies, to this important joint effort.”

Michael Polcari, president/CEO of SEMATECH, added that “ultimately, we believe the IPC program can serve as both a foundation and a model for expanded programs in this critical area of metrology and process characterization.”

The $7.5 million, three-year program, which is funded jointly by SRC and New York State, begins this month, with the UAlbany NanoCollege serving as home for the New York Center for Advanced Interconnect Science and Technology (NY CAIST). In addition to CNSE, universities contributing to the research results will be Columbia University, Cornell University, Lehigh University, Massachusetts Institute of Technology (MIT), Penn State, Rensselaer Polytechnic Institute (RPI), Stanford, SUNY Binghamton, University of Florida, University of Maryland, University of North Texas, University of Texas at Arlington, and the University of Texas at Austin.

(February 21, 2008) Flanders, NJ and Albany, NY — Rudolph Technologies Inc. and SEMATECH, have announced that Rudolph has become the first semiconductor equipment supplier company to join SEMATECH’s Metrology Program headquartered at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany.

Metris Acquires X-Tek Group


February 15, 2008

(February 15, 2008) Leuven, Belgium — The X-Tek Group, specialists in microfocus and CT X-ray systems, signed an agreement with Metris for the sale of 100% of the X-Tek stock at the end of 2007. The acquisition will enable Metris to expand X-Tek’s CT capabilities into various applications within the metrology industry.

January 28, 2008 — Veeco Instruments Inc., has introduced its new InSight 3D Automated Atomic Force Microscope (AFM) Platform.

According to the company, the new platform is “the only metrology system available with the accuracy and precision required for non-destructive, high resolution three-dimensional measurements of critical 45nm and 32nm semiconductor features, with the speed to qualify as a true fab tool.”

Veeco’s InSight 3DAFM was designed specifically to address Critical Dimension (CD), depth and chemical mechanical planarization (CMP) metrology in a production environment, the company said.

Jan. 10, 2008 – Coming off a year in which it significantly changed its focus and carved out multiple businesses, Nanometrics is starting the new year where it left off.

The move, a response increasing softness in semiconductor capital equipment demand, will reduce the company’s global workforce by about 7%, affecting each of its worldwide locations. Restructuring charges of about $600K will be recorded in 1Q08, but cost savings will be “fully realized ” by 2Q08, according to president/CEO Tim Stultz. “While this was a difficult decision for us to make, it came about as a result of our stated strategy to run our business with reduced sensitivity to revenue level,” he said in a statement.

Stultz added that the company still holds a positive longer-term outlook about the metrology sector, and that the company is well-positioned in its markets and will remain “committed to investing in R&D.”

Nanometrics has had a busy past year, after acquiring two metrology firms in the summer of 2006 (Soluris and Accent Optical Technologies). In March of 2007 its CEO left the company, followed by the CFO and April. In the fall it sold off its Yosemite CD-SEM and DiVA product lines, consolidated its overlay metrology production in Korea (and closed the Soluris site in Concord, MA), sold an idle FPD-related facility in Japan and a machine/plating shop in the US, and appointed former Imago top exec Stultz as its new CEO.