Category Archives: Metrology

Micron Technology, Inc. (NASDAQ:MU), a developer of advanced semiconductor systems, today announced that on March 14 it successfully won the auction for Cando Corporation assets, which will be utilized in establishing a back-end site for Micron Taiwan. Micron has now completed the title acquisition process for the new site.

The acquisition includes the cleanroom and tools that are adjacent to Micron’s existing Taichung fab, bringing the company’s fabrication and back-end together in one location. The new site will be focused on establishing a centralized back-end operation.

“This marks a significant step in our plan to create a center of excellence for leading-edge DRAM in Taiwan,” said Wayne Allan, VP, Global Manufacturing. “Bringing fabrication and back end together, all in one location, builds an efficient support structure for end-to-end manufacturing with quicker cycle times that benefit our business and customers.”

The new back-end site is expected to begin production in August, and the new integrated center of excellence is expected to bring greater operational cost efficiency that will benefit Micron’s DRAM business on a global scale. These cost efficiencies are part of the overall US$500 million of ongoing operational enhancement opportunities cited at the company’s 2017 analyst conference.

The strategic acquisition, with a winning bid of US$89.2 million, also highlights Micron’s goal to grow its presence in Taiwan – where it is the largest foreign employer and investor – from its current wafer manufacturing function to a broader center of expertise in the global memory industry. The back-end site will further enhance the company’s strong presence on the island, which already includes 300mm wafer fabrication facilities in Taichung and Taoyuan, as well as sales and technical support offices in Taipei.

The back-end operation will be led by site director Mike Liang, who joined Micron in November 2016 with more than 35 years of experience in the semiconductor industry. Having previously served in leadership roles at Ti-Acer, KYEC and Amkor Taiwan, Liang brings significant expertise in both front-end wafer fabrication and back-end assembly and test manufacturing.

The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, this week announced its support for the House “Better Way” corporate tax reform proposal as an appropriate starting point for reform. The proposal is expected to be considered by Congress this year.

“The “Better Way” corporate tax reform blueprint would make America’s corporate tax system more competitive and allow U.S. semiconductor companies to grow, innovate, and create more jobs here in the United States,” said John Neuffer, president and CEO, Semiconductor Industry Association. “While there are many details of significance to our industry that need to be understood and addressed, we support the proposal as a framework for moving forward with tax reform.

“We recognize the debate is just getting underway. SIA intends to work closely with Congress and the Administration to pass corporate tax reform to improve the competitiveness of the United States as a location for semiconductor research, design, manufacturing, and export.”

North America-based manufacturers of semiconductor equipment posted $1.97 billion in billings worldwide in February 2017 (three-month average basis), according to the February Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI.

SEMI reports that the three-month average of worldwide billings of North American equipment manufacturers in February 2017 was $1.97 billion. The billings figure is 6.1 percent higher than the final January 2017 level of $1.86 billion, and is 63.8 percent higher than the February 2016 billings level of $1.20 billion.

“Billings levels remain elevated as memory and foundry manufacturers continue to invest in advanced semiconductor technologies,” said Ajit Manocha, president and CEO of SEMI. “These investments are paving the way for the ramp of 3D NAND and 1X-nm devices.”

The SEMI Billings report uses three-month moving averages of worldwide billings for North American-based semiconductor equipment manufacturers. Billings figures are in millions of U.S. dollars.

 

Billings
(3-mo. avg)

Year-Over-Year

September 2016

$1,493.3

-0.1%

October 2016

$1,630.4

20.0%

November 2016

$1,613.3

25.2%

December 2016

$1,869.8

38.5%

January 2017 (final)

$1,859.4

52.3%

February 2017 (prelim)

$1,973.1

63.8%

Source: SEMI (www.semi.org), March 2017

 

SEMI ceased publishing the monthly North America Book-to-Bill report in January 2017.  The decision to discontinue the Book-to-Bill report was based on changes in reporting by some participants where the reporting of orders/bookings into the data collection program is no longer considered a necessary component of their industry analysis.

Research information that will be posted in the March Update to the 20th anniversary 2017 edition of IC Insights’ McClean Report shows that fabless IC suppliers represented 30% of the world’s IC sales in 2016 (up from only 18% ten years earlier in 2006).  As the name implies, fabless IC companies do not have an IC fabrication facility of their own.

Figure 1 depicts the 2016 fabless company share of IC sales by company headquarters location.  As shown, at 53%, the U.S. companies held the dominant share of fabless IC sales last year, although this share was down from 69% in 2010 (due in part to the acquisition of U.S.-based Broadcom by Singapore-based Avago).  Although Avago, now called Broadcom Limited after its merger with fabless IC supplier Broadcom became official on February 1, 2016, has fabrication facilities that produce III-V discrete devices, it does not possess its own IC fabrication facilities and is considered by IC Insights to be a fabless IC supplier.

Figure 1

Figure 1

Figure 2 shows that in 2009, there was only one Chinese company in the top-50 fabless IC supplier ranking as compared to 11 in 2016.  Moreover, since 2010, the largest fabless IC marketshare increase has come from the Chinese suppliers, which held a 10% share last year as compared to only 5% in 2010. However, when excluding the internal transfers of HiSilicon (over 90% of its sales go to its parent company Huawei), ZTE, and Datang, the Chinese share of the fabless market drops to about 6%.

Figure 2

Figure 2

European companies held only 1% of the fabless IC company marketshare in 2016 as compared to 4% in 2010.  The reason for this loss of share was the acquisition of U.K.-based CSR, the second largest European fabless IC supplier, by U.S.-based Qualcomm in 1Q15 and the purchase of Germany-based Lantiq, the third largest European fabless IC supplier, by U.S.-based Intel in 2Q15.  These acquisitions left U.K.-based Dialog ($1.2 billion in sales in 2016) as the only Europe-headquartered fabless IC supplier in the fabless top 50-company ranking last year (Norway-based Nordic Semiconductor just missed making the top 50 ranking with 2016 sales of $198 million).

There is also only one major fabless Japanese firm—Megachips, which saw its sales increase by 20% in 2016 (8% using a constant 2015 exchange rate), one major South Korean fabless IC company (Silicon Works), and one major Singapore-based (Broadcom Ltd.) fabless supplier.

SEMI, the global association connecting and representing the worldwide electronics manufacturing supply chain, today reported that worldwide sales of semiconductor manufacturing equipment totaled $41.24 billion in 2016, representing a year-over-year increase of 13 percent. 2016 total equipment bookings were 24 percent higher than in 2015. The data are available in the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report, now available from SEMI.

Compiled from data submitted by members of SEMI and the Semiconductor Equipment Association of Japan (SEAJ), the Worldwide SEMS Report is a summary of the monthly billings and bookings figures for the global semiconductor equipment industry. The report, which includes data for seven major semiconductor producing regions and 24 product categories, shows worldwide billings totaled $41.24 billion in 2016, compared to $36.53 billion in sales posted in 2015. Categories cover wafer processing, assembly and packaging, test, and other front-end equipment. Other front-end includes mask/reticle manufacturing, wafer manufacturing, and fab facilities equipment.

Spending rates increased for Rest of World (primarily Southeast Asia), China, Taiwan, Europe and South Korea while the new equipment markets in North America and Japan contracted. Taiwan claimed the largest market for new semiconductor equipment for the fifth year in a row with $12.23 billion in equipment sales. South Korea remained the second largest market for the second year in a row. The market in China increased 32 percent, surpassing both Japan and North America to become the third largest market. The 2016 equipment markets in Japan and North America fell to fourth and fifth place, respectively. The global other front-end segment decreased 5 percent; the wafer processing equipment market segment increased 14 percent; total test equipment sales increased 11 percent; and the assembly and packaging segment increased 20 percent.

Semiconductor Capital Equipment Market by World Region (2015-2016)

2016
2015
% Change
Taiwan
12.23
9.64
27%
South Korea
7.69
7.47
3%
China
6.46
4.90
32%
Japan
4.63
5.49
-16%
North America
4.49
5.12
-12%
Rest of World
3.55
1.97
80%
Europe
2.18
1.94
12%
Total
41.24
36.53
13%

Source: SEMI (www.semi.org) and SEAJ, March 2017; Note: Figures may not add due to rounding.

Over 60,000 attendees are expected at SEMICON China opening tomorrow at Shanghai New International Expo Centre (SNIEC). SEMICON China (March 14-16) offers the latest in technology and innovation for the electronics manufacturing industry. FPD China is co-located with SEMICON China, providing opportunities in this related market. Featuring nearly 900 exhibitors occupying nearly 3,000 booths, SEMICON China is the largest gathering of its kind in the world.

Worldwide fab equipment spending is expected to reach an industry all-time record, to more than US$46 billion in 2017, according to the latest version of the SEMI (www.semi.org) World Fab Forecast. In 2018, the record may break again, with spending close to the $50 billion mark.  SEMI forecasts that China will be third ($6.7 billion) for regional fab equipment spending in 2017, but its spending in 2018 may reach $10 billion – which would be a 55 percent increase year-over-year, placing China in second place for worldwide fab equipment spending in 2018.

On March 14, keynotes at SEMICON China include SMIC chairman of the Board Zhou Zixue. ASE Group director and COO Tien Wu, ASML president and CEO Peter Wennink, Intel VP Jun He, Lam Research CEO Martin Anstice, TEL CTO Sekiguchi Akihisa and imec president and CEO Luc Van den hove.

SEMICON China programs expand attendees’ knowledge, networking reach, and business opportunities. Programs this year feature a broad and deep range:

  • CSTIC: On March 12-13, the China Semiconductor Technology International Conference (CSTIC) precedes SEMICON China. CSTIC is organized by SEMI and imec and covers all aspects of semiconductor technology and manufacturing.
  • Technical and Business Programs: 
    • March 14: China Memory Strategic Forum.
    • March 15: Building China’s IC Ecosystem, Green High-Tech Facility Forum, and Smart Manufacturing Forum, in addition Power & Compound Semiconductor Forum (Day 1).
    • March 16: Smart Automotive Forum, MEMS & Sensors Conference Asia, plus Power & Compound Semiconductor Forum (Day 2)
  • Tech Investment Forum: On March 15, an international platform to explore investment, M&A, and China opportunities.
  • Theme Pavilions:  SEMICON China also features six exhibition floor theme pavilions: IC Manufacturing, LED and Sapphire, ICMTIA/Materials, MEMS, Touch Screen and OLED.
  • Networking Events: SEMI Industry Gala, China IC Night, and SEMI Golf Tournament

For additional information on sessions and events at SEMICON China 2017, please visit www.semiconchina.org/en/4.

Annual total semiconductor unit shipments (integrated circuits and opto-sensor-discrete, or O-S-D, devices) are forecast to continue their upward march in the next five years and are now expected to top one trillion units for the first time in 2018, according to data presented in IC Insights’ soon to be released March Update to the 2017 edition of The McClean Report—A Complete Analysis and Forecast of the Integrated Circuit Industry, and the 2017 O-S-D Report—A Market Analysis and Forecast for the Optoelectronics, Sensors/Actuators, and Discretes.

Semiconductor shipments totaled 868.8 billion in 2016 and are forecast to top one trillion units in 2018. Figure 1 shows that semiconductor unit shipments are forecast to climb to 1,002.6 billion devices in 2018 from 32.6 billion in 1978, which amounts to average annual growth of 8.9% over the 40 year period and demonstrates how dependent on semiconductors the world has become.

semiconductor unit growth

Figure 1

The largest annual increase in semiconductor unit growth during the timespan shown was 34% in 1984, and the biggest decline was 19% in 2001 following the dot-com bust.  The global financial meltdown and ensuing recession caused semiconductor shipments to fall in both 2008 and 2009; the only time that the industry experienced consecutive years in which unit shipments declined. Semiconductor unit growth then surged 25% in 2010, the second-highest growth rate across the time span.

Despite advances in integrated circuit technology and the blending of functions to reduce chip count within systems, the percentage split of IC and O-S-D shipments within total semiconductor units remains heavily weighted toward O-S-D devices.  In 2016, O-S-D devices accounted for 72% of total semiconductor units compared to 28% for ICs. Thirty-six years ago in 1980, O-S-D devices accounted for 78% of semiconductor units and ICs represented 22% (Figure 2).

Figure 2

Figure 2

Surprisingly, shipments of commodity-filled discretes devices category (transistor products, diodes, rectifiers, and thyristors) accounted for 44% of all semiconductor unit shipments in 2016. The long-term resiliency of discretes is primarily due to their broad use in all types of electronic system applications. Consumer and communications applications remain the largest end-use segments for discretes, but increasing levels of electronics being packed into vehicles for greater safety and fuel efficiency have boosted shipments of discretes to the automotive market as well. Discretes are used for circuit protection, signal conditioning, power management, high current switching, and RF amplification. Small signal transistors are still used in and around ICs on board designs to fix bugs and tweak system performance.

Among ICs, analog products accounted for the largest number of shipments in 2016. Analog ICs represented 52% of IC unit shipments in 2016, but only 15% of total semiconductor units. Figure 3 shows the split of semiconductor unit shipments by product type in 2016.

2016 semiconductor unit shipments

For 2017, semiconductor products showing the strongest unit growth rates are those that are essential building-block components in smartphones, new automotive electronics systems, and within systems that are helping to build out of Internet of Things.  Some of the fast-growing IC unit categories for 2017 include Consumer—Special Purpose Logic, Signal Conversion (Analog), Auto—Application-Specific Analog, and flash memory.  Among O-S-D devices, CCDs and CMOS image sensors, laser transmitters, and every type of sensor product (magnetic, acceleration and yaw, pressure, and other sensors) are expected to enjoy strong double-digit unit growth this year. More coverage about these semiconductor products and end-use applications are included in the 2017 editions of IC Insights’ McClean Report and O-S-D Report.

Soitec, a designer and manufacturer of semiconductor materials for the electronics industry, announced that the ramp up to high-volume production of 200mm silicon-on-insulator (SOI) wafers – manufactured with Soitec’s Smart Cut technology – has begun at the manufacturing facility of its Chinese partner Shanghai Simgui Technology Co., Ltd. (Simgui) fully qualified by key Soitec customers. This successful implementation of a partnership model represents a key milestone for Soitec in managing its worldwide manufacturing capacity to meet market demand for 200mm SOI wafers used in fabricating semiconductors for the growing communications and power device markets.

“Establishing this second source in China allows us to ensure the needed capacity of 200mm SOI wafers from two sites in different regions of the world, with each facility producing exactly the same products from a specifications and quality standpoint,” said Dr. Bernard Aspar, executive senior vice president of Soitec’s Communication & Power Business Unit. “Our partnership with Simgui is now running in an efficient way and our customers have been supportive and instrumental in this strategic move, which fully validates Soitec’s technology-transfer expertise and manufacturing strategy.”

“Simgui has been working on SOI materials for 16 years in China. Partnering with Soitec, Simgui is fully ready to support Soitec’s ramp up of 200mm SOI wafers manufactured with the Smart Cut technology at our facility in Shanghai and to help in developing the SOI ecosystem in China,” said Dr. Jeffrey Wang, CEO of Simgui.

The first 200mm SOI wafers produced at Simgui’s manufacturing facility in Shanghai using Soitec’s proprietary Smart Cut technology were qualified by the initial customers at the end of last year. Additional customers are currently in the process of qualifying the wafers. Producing the wafers in China has been a key objective of Soitec’s and Simgui’s licensing and technology-transfer agreement, signed in May 2014, and validates Smart Cut as a standard process. This wafer production line in China will boost the industrial manufacturing capacity of 200mm SOI wafers to meet increasing worldwide usage and also will be a key element in establishing the SOI ecosystem in China.

Soitec’s 200mm RF-SOI and Power-SOI products are dedicated to the mobile and automotive markets respectively. As the leading SOI substrate innovator and manufacturer, Soitec has the largest worldwide capacity and produces both 200mm and 300mm wafers at multiple fabs in France.

Simgui will be exhibiting Soitec’s Smart Cut-based 200mm product line in booth W5 #5159 at SEMICON China in Shanghai, March 14-16.

Today, SEMI announced updates to its World Fab Forecast report, revealing that fab equipment spending is expected to reach an industry all-time record − more than US$46 billion in 2017.  The record is expected to be broken again in 2018, nearing the $50 billion mark. These record-busting years are part of three consecutive years of growth (2016, 2017 and 2018), which has not occurred since the mid-1990s. The report has been the industry’s most trusted data source for 24 years, observing and analyzing spending, capacity, and technology changes for all front-end facilities worldwide. See Figure 1.

fab equipment spending

Figure 1: Fab Equipment Spending (Front End Facilities)

SEMI‘s World Fab Forecast report (end of February 2017) provides updates to 282 facilities and lines equipping in 2017, 11 of which are expected to spend over $1 billion each in 2017. In 2018, SEMI’s data reflect 270 fabs to equip, with 12 facilities spending over $1 billion each.  The spending is mainly directed towards memory (3D NAND and DRAM), Foundry and MPU.  Other strong product segments are Discretes (with LED and Power), Logic, MEMS (with MEMS/RF), and Analog/Mixed Signal.

SEMI (www.semi.org) forecasts that China will be third for regional spending in 2017, although China’s annual growth is minimal in 2017 (about 1 percent), as many of the new fab projects are in the construction phase.  China is busy constructing 14 new fabs in 2017 and these new fabs will be equipping in 2018. China’s annual spending growth rate in 2018 will be over 55 percent (more than $10 billion), and ranking in second place for worldwide spending in 2018.  In total for 2017, China is equipping 48 fabs, with equipment spending of $6.7 billion; looking ahead to 2018, SEMI predicts that 49 fabs to be equipped, with spending of about $10 billion.

Other regions also show solid growth rates.  The SEMI World Fab Forecast indicates that Europe/Mideast and Korea are expected to make the largest leaps in terms of growth rates this year with 47 percent growth and 45 percent growth, respectively, year-over-year (YoY).  Japan will increase spending by 28 percent, followed by the Americas with 21 percent YoY growth.

The SEMI Industry Research & Statistics team has made 195 changes on 184 facilities/lines in the last quarter, with eight new facilities added and three fab projects cancelled. SEMI’s World Fab Forecast provides detailed information about each of these fab projects, such as milestone dates, spending, technology node, products, and capacity information. The World Fab Forecast Report, in Excel format, tracks spending and capacities for over 1,100 facilities including future facilities across industry segments.  The SEMI World Fab Forecast and its related Fab Database reports track any equipment needed to ramp fabs, upgrade technology nodes, and expand or change wafer size, including new equipment, used equipment, in-house equipment, and spending on facilities for equipment. Also check out the Opto/LED Fab Forecast.

Cypress Semiconductor Corp. (Nasdaq:  CY) today announced it has sold the subsidiary that owns its semiconductor wafer fabrication facility in Bloomington, Minnesota to SkyWater Technology Foundry for $30 million. Backed by Minnesota-based holding company Oxbow Industries, LLC, SkyWater Technology has purchased the capital stock of the subsidiary and will operate the fab as a standalone business that will manufacture wafers for Cypress and for other semiconductor manufacturers. The transaction allows Cypress to reduce its manufacturing footprint and cost structure while increasing the utilization of its Fab 25 in Austin, Texas, in line with the company’s plan to improve gross margins. Seattle-based ATREG, Inc. acted as Cypress’ advisor in this operational fab sale.

“This transaction demonstrates our commitment to reshape Cypress and improve gross margin, in line with our long-term financial model,” said Hassane El-Khoury, Cypress President and CEO. “The sale of Fab 4 in Minnesota allows us to reduce our manufacturing costs as we exit the fab while using the proceeds to pay down debt. We will also be able to improve the utilization and efficiency of Fab 25 in Texas, into which we have been transitioning products over the last 18 months. We believe this agreement represents another milestone in our path to achieving higher gross margins.

“In addition to looking at a potential deal’s impact on Cypress’ bottom line, we set out to ensure uninterrupted supply for our customers,” continued El-Khoury. “This agreement allows Cypress to maintain uninterrupted wafer supply for our products manufactured at the fab, with no disruptions for our customers, and it gives our former employees in Minnesota the opportunity to help the new business flourish and continue the fab’s tradition of quality U.S.-based manufacturing.”

“Given the proven history of efficiency at Fab 4, the expertise and dedication of its workforce and its established success in delivering specialized wafers on time to a diverse customer base, the SkyWater management team sees a strong foundation for growing a standalone business,” said Dr. Scott Nelson, Chief Technology Officer of SkyWater Technology Foundry. “We are committed to continuing the fab’s support of Cypress and its customers with superior quality and on-time delivery.”